Forced air cooling data acquisition management processor in rigid connection

Abstract

The utility model belongs to the technical field of avionics, and particularly relates to a rigid connection forced air cooling data acquisition management processor. Module boards are vertically inserted into a case, an air inlet is formed in the bottom of a case part, an air outlet is designed in the top face of the case, the area of the air inlet is smaller than that of the air outlet, and it is guaranteed that a ventilation air path is reasonable and smooth.

Description

Technical Field

[0001] This utility model belongs to the field of avionics technology, specifically relating to a rigidly connected forced air-cooled data acquisition, management and processing machine. Background Technology

[0002] With the development of information technology, the types and volume of onboard data are increasing. As the data management subsystem stores and manages data recorded by various onboard systems, its data acquisition and processing capabilities need to be expanded. The data acquisition and management processor is the core product of the data management subsystem, serving as the center for signal acquisition, management, processing, and data transmission. The increase in data types and data channels leads to increased cabling workload and places higher demands on the quality of cabling work. Furthermore, the increased power consumption resulting from enhanced data processing capabilities makes heat dissipation a key design consideration. Utility Model Content

[0003] Purpose of the utility model: To provide a rigidly connected forced air-cooled data acquisition, management and processing machine.

[0004] Technical solution:

[0005] A rigidly connected forced air-cooled data acquisition and management processor includes: each module board is vertically inserted into the chassis, the bottom of the chassis components is provided with an air inlet, the top surface of the chassis is designed with an air outlet, the area of ​​the air inlet is smaller than the area of ​​the air outlet, to ensure that the ventilation path is reasonable and smooth.

[0006] Furthermore, the heat-dissipating components on each module board are distributed to prevent heat from concentrating in one place. A heat channel is formed inside the PCB, ensuring that the heat inside the PCB is transferred to the outside through a unified path.

[0007] Furthermore, the external structural components of each module board enclose the internal printed circuit board, and the heat source devices on the internal printed circuit board transfer the generated heat to the external structural components through thermal pads.

[0008] Furthermore, each module board's external structural components employ heat dissipation fins to increase the heat dissipation area. The direction of the heat dissipation fins is consistent with the direction of gravity, and the heat dissipation fins themselves and adjacent fins are discontinuous, improving external heat dissipation efficiency and ensuring that more heat is carried away when the external heat dissipation airflow passes over the outside of the module.

[0009] Furthermore, a maintenance port is designed at the top of the module board, and the maintenance port is sealed with a pressure plate.

[0010] Furthermore, sealing strips and electromagnetic sealing strips are installed at all joints of structural components on the module board.

[0011] Beneficial effects:

[0012] a) The rigid connection-based, wire-free structure reduces wiring workload and difficulty, and increases signal transmission reliability;

[0013] b) The forced air cooling design increases heat dissipation capacity, allowing the module board to use stronger computing power without being damaged by overheating;

[0014] c) The rear cover assembly has four non-removable screws, which allow the rear cover assembly to be disassembled, installed, tested, or repaired without opening the front panel or loosening the locking strips of each module board. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the external appearance of this utility model;

[0016] Figure 2 This is an exploded view of the structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the internal cross-linking relationship of this utility model;

[0018] Figure 4 This is a schematic diagram of the air inlet and outlet of the chassis component of this utility model;

[0019] Figure 5 This is a demonstration of the internal ventilation path of the chassis of this utility model. The cooling air will carry away heat through the gaps between the circuit boards, and the fins on the heat sink of the printed circuit board can improve the heat exchange efficiency.

[0020] Figure 6 This is a simulation diagram illustrating the heat dissipation effect of the new invention after adopting forced air cooling;

[0021] Figure 7 This is a schematic diagram of the rear cover plate component with rigid connection according to this utility model, and four non-removable screws are shown in the figure;

[0022] Figure 8 This is an exploded view of the rear cover plate component of this utility model from the front view, and the docking connector on the docking module is shown in the figure.

[0023] Figure 9 This is an exploded view of the rear cover plate component of this utility model from the rear view direction. The mating connector on the motherboard module is shown in the figure. Detailed Implementation

[0024] This utility model provides a data acquisition and management processor that uses a rigid connection without wiring and forced air cooling for heat dissipation. It can collect various types of data information, process, distribute, and record the data, and can perform time-unified data acquisition and management for all components in the system.

[0025] The chassis can accommodate 7 independent, sealed module boards. Each module board works independently and can be replaced individually. Different types of data are collected through different module boards, which improves data acquisition efficiency and compatibility with different data. By adjusting the motherboard, different module boards can be inserted to accommodate more data types.

[0026] To process large amounts of data, the chips used within the chassis need to have stronger processing capabilities, resulting in higher power consumption. This new design employs forced air cooling to reduce the internal temperature of the chassis. Since the external chassis is no longer sealed after adopting air cooling, board-to-board connectors with shielded and sealed designs are selected. The rear cover plate containing the motherboard and each module board are individually sealed and electromagnetically shielded, ensuring the environmental adaptability and electromagnetic compatibility of each module under chassis ventilation conditions. The airflow from the cooling system passes through the board-to-board area, carrying away heat. Furthermore, the layout of high-power power conversion modules, task processing modules, and audio / video acquisition modules is distributed while fully considering the internal wiring of the chassis, avoiding heat concentration. The height, density, and structure of the heat sink fins are adjusted according to the different heat dissipation requirements of different boards, so that the cooling airflow is distributed according to the heat generation, with a larger airflow passing near modules with higher heat generation, enhancing the heat dissipation effect and maximizing the utilization of cooling airflow resources.

[0027] Due to the increase in data volume, especially the increase in non-bus data, the number of data paths will increase significantly, making wired layout work more difficult and labor-intensive, and placing higher demands on reliability. The inspection and troubleshooting of wiring will also become more challenging. This utility model adopts a rigid connection, wire-free design. A mating board is added between the motherboard and the connectors. Printed circuit board connectors are soldered onto the board, and the connectors are directly connected to the mating board. On-board signals are connected to the PCB board, and high-density mating connectors are used to lead the signals out to the motherboard. The motherboard then enables electrical connections with the mating modules and between various interface modules, reducing the difficulty of wiring work and increasing the accuracy and reliability of wiring.

[0028] Furthermore, four non-removable screws have been added to the rear cover assembly. After removing the remaining screws between the rear cover assembly and the chassis, sufficient force can be applied by sequentially rotating the four non-removable screws marked "H" to simultaneously separate the motherboard from the seven connectors between each module board. This eliminates the need to remove the front panel, loosen the locking strips one by one, and then remove all the boards using a board puller before disassembling the rear cover assembly. The debugging, testing, and maintenance of the rear cover assembly are now much simpler. During the installation of the rear cover assembly, these four non-removable screws can also be used to simultaneously align the connectors between the motherboard and each module board. Finally, the connector between the rear cover assembly and the chassis is installed, completing the installation of the rear cover assembly.

[0029] The following is a detailed explanation with reference to the accompanying drawings.

[0030] The appearance of this utility model is as follows Figure 1 As shown. It can accommodate 7 module boards, such as... Figure 2 As shown. Each module board is interconnected with other modules and with external signals via a rear cover plate. Under the current functional performance requirements, six boards are installed in the chassis, and the interconnection relationship is as follows: Figure 3 As shown.

[0031] The chassis employs forced air cooling to handle the heat generated by the module boards. Air inlets are located at the bottom of the chassis components, and air outlets are located on the top. The internal air inlet area is smaller than the exhaust area to ensure a reasonable and unobstructed airflow path. A schematic diagram of the chassis component air inlets is shown below. Figure 4 As shown,

[0032] Each module board is vertically inserted into the chassis and consists of structural components, module boards, a board removal device, and a locking device. The main heat within the equipment is generated by heat-dissipating components on the internal module boards. To reduce the generated heat, functional, derating, and environmental protection designs were implemented for the components. During PCB layout, heat-dissipating components are distributed to prevent heat from concentrating in one place, creating heat channels within the PCB and ensuring a unified path for heat transfer to the outside.

[0033] The external structural components of the module board enclose the internal printed circuit board. Heat-generating components on the internal printed circuit board transfer heat to the external structural components via thermal pads. Heat is then dissipated through heat exchange with the forced-airflow on the surface of the structural components. The external structural components employ a heat dissipation fin design to increase the heat dissipation area. The fins are aligned with the direction of gravity, and the discontinuous design between the fins and adjacent fins enhances external heat dissipation efficiency. This ensures that the external cooling airflow carries away more heat as it passes over the module. Simulations are performed to monitor the heat generation. Based on these simulations, adjustments are made to the spacing between the module boards and the height, density, and shape of the heat dissipation fins to ensure that the cooling airflow distribution matches the heat generation situation. Modules with higher heat generation receive more airflow, thus ensuring that the module board's heat dissipation meets the heat requirements of the components and that performance is stable and reliable. Cooling air enters from the bottom air inlet of the chassis and flows upwards. After heat exchange, the hot air exits the equipment from the top air outlet. The internal airflow path of the chassis is as follows... Figure 5 As shown. The adjusted thermal simulation diagram is as follows. Figure 6 As shown, the cooling airflow rate is 50 kg / h, the inlet air temperature is +40℃, and the highest internal temperature of the component is +72.5℃, indicating good heat dissipation.

[0034] The top of the module panel has a maintenance port, which is sealed with a small pressure plate. All structural components on the module panel are fitted with sealing strips and electromagnetic sealing strips to ensure effective sealing and electromagnetic sealing. The rear cover plate is also a sealed, integrated design. Figure 7As shown, the docking module board and the motherboard module board are installed in the rear cover assembly. External S6 connectors are designed on the docking module board, while connectors that interface with internal chassis modules are designed on the motherboard module board. All connectors are shielded with electromagnetic shielding, and electromagnetic shielding sealing strips are press-fitted between them and the rear cover structural components. All structural components are treated with conductive anodized aluminum alloy to ensure electromagnetic leakage prevention between the structural components and the connectors. This ensures the environmental adaptability and electromagnetic compatibility of the entire equipment even when the chassis cannot be sealed due to ventilation limitations.

[0035] The rear cover assembly also features four non-removable screws, such as... Figure 7 As shown. After removing the remaining screws between the rear cover assembly and the chassis, sufficient force can be applied by sequentially rotating the four non-removable screws marked "H" to simultaneously separate the motherboard from each of the seven connectors on the module boards. This eliminates the need to remove the front panel, loosen the locking strips one by one, and then remove all the boards using a board puller before removing the rear cover assembly. This simplifies the debugging, testing, and maintenance of the rear cover assembly. When installing the rear cover assembly, these four non-removable screws can also be used to simultaneously align the connectors between the motherboard and each module board. Finally, install the connector between the rear cover assembly and the chassis to complete the installation of the rear cover assembly.

[0036] Exploded view of the rear cover assembly as follows Figure 8 , 9 As shown, the rear cover assembly employs a no-wiring design, eliminating most of the wiring work. A docking module is added between the motherboard and the external S6 connector. The external S6 connector connects directly to the docking module, connecting the on-board signals to the PCB board, and then the signals are led out through a high-density inter-board docking connector to connect to the motherboard module board. The motherboard realizes the electrical connection with the docking module and the electrical connection between various interface modules. This reduces the difficulty of wiring work and increases the accuracy and reliability of wiring.

Claims

1. A rigidly connected forced air-cooled data acquisition, management, and processing machine, characterized in that, include: Each module board is vertically inserted into the chassis. The chassis components have air inlets at the bottom and air outlets on the top. The area of ​​the air inlets is smaller than that of the air outlets to ensure smooth ventilation.

2. The rigidly connected forced air-cooled data acquisition and management processor according to claim 1, characterized in that, The heat-dissipating components on each module board are distributed to prevent heat from concentrating in one place. A heat channel is formed inside the PCB to ensure that the heat inside the PCB is transferred to the outside through a unified path.

3. The rigidly connected forced air-cooled data acquisition and management processor according to claim 1, characterized in that, Each module board has an external structural component that encloses the internal printed circuit board. Heat source components on the internal printed circuit board transfer the heat generated to the external structural component through thermal pads.

4. The rigidly connected forced air-cooled data acquisition and management processor according to claim 1, characterized in that, Each module board's external structural components use heat dissipation fins to increase the heat dissipation area. The direction of the heat dissipation fins is consistent with the direction of gravity, and the heat dissipation fins themselves and adjacent fins are discontinuous, which improves the external heat dissipation efficiency and ensures that more heat is carried away when the external heat dissipation airflow blows across the outside of the module.

5. The rigidly connected forced air-cooled data acquisition and management processor according to claim 1, characterized in that, The module board has a maintenance port at the top, which is sealed with a pressure plate.

6. The rigidly connected forced air-cooled data acquisition and management processor according to claim 1, characterized in that, All structural components on the module board are fitted with sealing strips and electromagnetic sealing strips at their joints.

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