Electronic equipment

Abstract

Electronic equipment belongs to the technical field of electronic equipment. The electronic equipment comprises a cabinet, a chip module, a reactor and a radiator. A containing cavity is formed in the machine cabinet, the chip module and the electric reactor are both arranged in the containing cavity, the chip module is connected with the evaporator, the evaporator is communicated with the condenser through a pipeline, the condenser is arranged above the evaporator, and a draught fan capable of blowing air downwards to the containing cavity is arranged at the top of the machine cabinet. Due to the fact that the electric reactor is arranged on the side, away from the evaporator, of the chip module, air blown out of the draught fan can flow to the condenser for heat exchange and then flow to the electric reactor for heat exchange, the heat dissipation efficiency of the chip module and the electric reactor can be improved, and the overall size of the electronic equipment can be reduced. And moreover, the humidity of the air subjected to heat exchange with the condenser can be reduced, and the electric reactor is cooled by utilizing the low-humidity air, so that the influence of moisture on the electric reactor can be reduced, and the service life of the core electronic equipment can be prolonged.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more specifically, to an electronic device. Background Technology

[0002] Currently, high-power electronic devices typically contain numerous electronic components, which generate a significant amount of heat during operation. However, the efficiency of these components decreases as the heat increases.

[0003] Therefore, electronic devices typically require a heat dissipation system to cool various electronic components. For example, electronic devices usually contain chip modules and reactors, and the common cooling method is to set up separate, independent heat dissipation systems for the chip modules and reactors respectively.

[0004] However, the current practice of setting up multiple independent heat dissipation systems in electronic devices to dissipate heat from chip modules and reactors increases the overall size of the electronic device and the cost of heat dissipation. Utility Model Content

[0005] In view of the above-mentioned shortcomings, this application provides an electronic device to improve the problems of large overall size and high heat dissipation cost of electronic devices in the related art.

[0006] This application is implemented as follows:

[0007] An example of this application provides an electronic device including a cabinet, a chip module, a reactor, and a heat sink. The cabinet has an internal cavity containing both the chip module and the reactor, which are electrically connected to the chip module. The heat sink includes an evaporator, a condenser, and a fan, with the evaporator and condenser connected by a pipe. The evaporator is connected to the chip module, the reactor is located on the side of the chip module opposite to the evaporator, and the condenser is positioned above the evaporator. The fan is located at the top of the cabinet and above the condenser, for blowing air downwards into the cavity.

[0008] In the above implementation process, in the electronic device provided in this application example, since the chip module is connected to the evaporator, and the reactor is positioned on the side of the chip module away from the evaporator, and the evaporator is connected to the condenser above it via a pipe, with a fan positioned above the condenser, the heat generated by the chip module during operation can exchange with the working liquid in the evaporator, thus lowering the temperature of the chip module. The working liquid in the evaporator absorbs heat and becomes gaseous, which flows towards the condenser above under pressure difference. Since a fan is positioned above the condenser, the gas flowing towards the condenser can exchange heat with the air blown by the fan, thereby condensing into the working liquid. The condensed working liquid can then flow downwards into the evaporator to further dissipate heat from the chip module. Typically, the heat dissipation requirement of the reactor is less than that of the chip module. Therefore, by positioning the reactor on the side of the chip module away from the evaporator, below the condenser, the air dissipated by the fan from the condenser can continue to flow downwards to the reactor, further dissipating heat from it. Furthermore, the air blown out by the fan exchanges heat with the condenser, which can significantly reduce humidity. Using this low-humidity air to dissipate heat from the reactor can not only improve heat dissipation efficiency, but also reduce the impact of moisture on the reactor.

[0009] The electronic device provided in this application example uses a heat sink to dissipate heat from the chip module and the reactor, eliminating the need for a separate heat sink for the reactor, thus reducing the overall size and heat dissipation cost of the electronic device.

[0010] In one optional embodiment of this application, the condenser is arranged horizontally, the evaporator is arranged vertically at one end of the condenser, the reactor is located below the condenser, and the chip module is located on the side of the evaporator facing the reactor.

[0011] In the above implementation process, the condenser is set horizontally and the evaporator is set vertically at one end of the condenser, which can form an L-shaped heat dissipation structure. The chip module and reactor can be placed in the space below the condenser and the chip module can be connected to the evaporator. By making reasonable use of the remaining installation space in the heat sink, the heat dissipation efficiency can be improved while further reducing the overall size of the electronic device.

[0012] In one optional embodiment of this application, the distance between the reactor and the condenser is 7-10 cm, and the distance between the reactor and the evaporator is 5-7 cm.

[0013] In the above implementation process, setting the distance between the reactor and the condenser to 7-10cm is a suitable distance. This appropriate distance reduces the mutual interference between the reactor and the condenser, improving heat dissipation efficiency while reducing the overall size of the electronic device. If the distance between the reactor and the condenser is too close, the heat generated by the reactor during operation will affect the heat dissipation of the condenser, which in turn will affect the heat dissipation of the chip module. If the distance between the reactor and the condenser is too far, it will increase the overall size of the electronic device.

[0014] Similarly, the distance between the reactor and the evaporator should be 5-7 cm. A suitable distance reduces the mutual interference between the reactor and the chip module, improving heat dissipation efficiency while reducing the overall size of the electronic device. If the distance between the reactor and the evaporator is too close, the chip module will be too close to the reactor, resulting in a higher reactor temperature and affecting the heat dissipation of the chip module. If the distance between the reactor and the evaporator is too far, it will increase the overall size of the electronic device.

[0015] In one optional embodiment of this application, the distance between the lower end of the reactor and the lower end of the evaporator is 5-7 cm.

[0016] In the above implementation process, the distance between the lower end of the reactor and the lower end of the evaporator is set to 5-7cm. An appropriate interval distance can improve heat dissipation efficiency while reducing the overall size of the electronic equipment.

[0017] In one optional embodiment of this application, a first mounting plate is provided inside the cabinet, and a first air duct is formed between the circumferential outer wall of the first mounting plate and the inner wall of the cabinet so that the air blown out by the fan can pass through the first air duct; a condenser is provided on the first mounting plate.

[0018] In the above implementation process, a first mounting plate is installed inside the cabinet to fix the condenser, thereby improving the structural stability of the electronic equipment. Furthermore, since a first air duct is formed between the outer circumferential wall of the first mounting plate and the inner wall of the cabinet, the air blown by the fan, after exchanging heat with the condenser on the first mounting plate, can flow downwards through the first air duct to dissipate heat from the reactor located below the first mounting plate.

[0019] In one optional embodiment of this application, the first mounting plate has a hollowed-out portion in the middle; the condenser has a condensation chamber inside, and heat dissipation fins are provided on the top and bottom outer walls of the condenser; the condenser is disposed on the first mounting plate, and the heat dissipation fins on the bottom outer wall of the condenser are located in the hollowed-out portion.

[0020] In the above implementation process, heat dissipation fins are provided on both the top and bottom outer walls of the condenser, which can further improve the condensation efficiency of the working gas in the condensation chamber, thereby improving the heat dissipation efficiency. Setting the middle part of the first mounting plate as a hollow section allows the heat dissipation fins on the bottom outer wall of the condenser, placed on the first mounting plate, to be located in the hollow section, facilitating heat exchange between the heat dissipation fins and the air, and improving heat dissipation efficiency.

[0021] In one optional embodiment of this application, a second mounting plate is provided inside the cabinet, which is located below the first mounting plate. A second air duct is formed between the outer circumferential wall of the second mounting plate and the inner wall of the cabinet, and the second air duct is connected to the first air duct. A reactor is disposed on the second mounting plate.

[0022] In the above implementation process, a second mounting plate is installed below the first mounting plate, which can fix the reactor at the second mounting plate. Since a second air duct is formed between the outer circumferential wall of the second mounting plate and the inner wall of the cabinet, and the second air duct is connected to the first air duct, the air blown out by the fan can flow through the first air duct to the reactor below the first mounting plate after heat exchange with the condenser, and after heat exchange with the reactor, it can flow out through the second air duct to the area below the second mounting plate for discharge.

[0023] In one optional embodiment of this application, the electronic device is further provided with a waterproof sheet metal, which is disposed between the reactor and the chip module.

[0024] In the above implementation process, a waterproof sheet metal is installed between the reactor and the chip module. The waterproof sheet metal can be used to shield and protect the chip module, reducing the impact of humidity on the chip module.

[0025] In one optional embodiment of this application, the waterproof sheet metal includes a vertical plate and a horizontal plate connected to the upper end of the vertical plate, with the horizontal plate protruding towards the chip module. The end of the horizontal plate away from the vertical plate is connected to the chip module. In another optional embodiment of this application, the electronic device includes two chip modules; an evaporator has an evaporation chamber inside, and the evaporator includes two vertically arranged substrates, which are closed to form the evaporation chamber; each substrate has porous capillaries on its inner wall facing the other substrate; the two chip modules are connected to the two substrates one-to-one, and the two substrates are disposed between the two chip modules.

[0026] In the above implementation process, an evaporation chamber is formed by two substrates overlapping each other. A working liquid can be filled within the evaporation chamber, and porous capillaries are provided on the inner wall of each substrate facing the other. Therefore, when the substrate absorbs heat generated by the chip module and transfers it to the porous capillaries, the capillaries can adsorb the working liquid and exchange heat with it. Using two substrates instead of a single traditional substrate further reduces the size of the evaporator and improves its heat exchange efficiency, thereby further reducing the overall size of the electronic device. By connecting two chip modules one-to-one to the two substrates, with the two substrates located between the two chip modules, a single evaporator can be used to dissipate heat from both chip modules, avoiding the need for a separate evaporator for each chip module, further reducing the overall size of the electronic device and improving heat dissipation efficiency. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0028] Figure 1 A bottom view of the structure of the electronic device provided as an example in this application;

[0029] Figure 2 A front view of the electronic device provided as an example in this application;

[0030] Figure 3 A schematic diagram showing the connection between the chip module and the heat sink provided as an example in this application.

[0031] Icons: 1-Electronic device; 10-Rack; 11-Receiving cavity; 12-First mounting plate; 121-Kull-out section; 13-First air duct; 14-Second mounting plate; 15-Second air duct; 16-Third air duct; 20-Chip module; 30-Reactor; 40-Heat sink; 41-Evaporator; 411-Substrate; 42-Condenser; 421-Heat sink fins; 43-Fan; 50-Waterproof sheet metal; 51-Horizontal plate; 52-Vertical plate. Detailed Implementation

[0032] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this application; the terms “comprising” and “having”, and any variations thereof, in the specification and the foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0034] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0035] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0036] In the description of the embodiments of this application, the technical terms "middle", "upper", "lower", "front", "rear", "left", "right", "bottom", "inner" etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0037] Currently, high-power electronic devices typically contain numerous electronic components, which generate a significant amount of heat during operation. To reduce the temperature of these components and improve their efficiency, a cooling system is usually required to dissipate heat from them.

[0038] For example, electronic device 1 usually includes chip module 20 and reactor 30. The common cooling method is to set up a separate heat dissipation system for chip module 20 and reactor 30 to dissipate heat from each other.

[0039] For example, two sets of cooling fans are installed in the electronic device, and a set of siphon heat sinks are installed at both the chip module and the reactor. One set of cooling fans blows air from bottom to top, and the other set of cooling fans is located at the top of the electronic device to blow the hot air after heat exchange inside the electronic device out of the electronic device.

[0040] However, the current practice of using multiple cooling systems to cool chip modules and reactors in electronic devices increases the overall size and cost of the devices.

[0041] Therefore, this application further improves the electronic device, thereby mitigating the problems of large overall size and high heat dissipation cost of the electronic device to a certain extent. To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0042] Please combine Figures 1 to 3 The electronic device 1 provided in this application example includes a cabinet 10, a chip module 20, a reactor 30, and a heat sink 40.

[0043] Please continue reading for more details. Figure 1 The cabinet 10 has an internal cavity 11.

[0044] In this regard, please combine Figure 1 and Figure 3 The chip module 20 is disposed in the receiving cavity 11, and the reactor 30 is disposed in the receiving cavity 11. The reactor 30 is electrically connected to the chip module 20.

[0045] In this regard, please combine Figure 1 and Figure 3 The radiator 40 includes an evaporator 41, a condenser 42, and a fan 43. The evaporator 41 and the condenser 42 are connected by a pipe. The evaporator 41 is connected to the chip module 20. The reactor is located on the side of the chip module opposite to the evaporator. The condenser 42 is located above the evaporator 41.

[0046] Please continue to combine Figure 1 and Figure 2 The fan 43 is located at the top of the cabinet 10 and above the condenser 42, and is used to blow air downwards into the housing cavity 11.

[0047] The electronic device 1 provided in this application example allows the chip module 20 to exchange heat generated during operation with the working liquid in the evaporator 41, thereby reducing the temperature of the chip module 20. The working liquid in the evaporator 41 absorbs heat and turns into a gaseous state, flowing upwards to the condenser 42 under pressure difference. A fan 43 is installed above the condenser 42, allowing the gas flowing towards the condenser 42 to exchange heat with the air blown by the fan 43, thus condensing back into the working liquid. The condensed working liquid then flows downwards into the evaporator 41, re-cooling the chip module 20, and this cycle repeats continuously.

[0048] Typically, the heat dissipation requirement of reactor 30 is less than that of chip module 20. Therefore, in the electronic device 1 provided in this application example, reactor 30 is disposed on the side of chip module 20 away from evaporator 41, so that reactor 30 is located below condenser 42. After the air blown out by fan 43 flows to condenser 42 for heat exchange, it can continue to flow downward to reactor 30 located below condenser 42 to dissipate heat from reactor 30.

[0049] Furthermore, the humidity of the air blown out by the fan 43 will be greatly reduced after it flows to the condenser 42 for heat exchange. Therefore, by using the fan 43 to first exchange heat with the condenser 42 and then with the reactor 30, the influence of moisture on the reactor 30 can be reduced.

[0050] The electronic device 1 provided in this application example can not only efficiently cool the chip module 20 using the heat sink 40, but also cool the reactor 30. It eliminates the need to set up a separate heat sink 40 for the reactor 30, thereby reducing the overall size and heat dissipation cost of the electronic device 1.

[0051] The following describes in further detail, with reference to the accompanying drawings, the cabinet 10, chip module 20, reactor 30 and heat sink 40 in the electronic device 1 provided in this application example.

[0052] The cabinet 10 has an internal cavity 11 for accommodating the chip module 20, reactor 30 and heat sink 40, and for protecting the relevant components inside the cavity 11.

[0053] For example, please continue reading Figure 1 The cabinet 10 has a rectangular frame structure. The cabinet 10 is formed by four cabinet panels connected end to end to enclose a cavity 11. The front end of the cabinet 10 has an opening that communicates with the cavity 11.

[0054] The chip module 20 is located in the receiving cavity 11 of the cabinet 10 and is disposed on the evaporator 41. This application does not limit the specific type of the chip module 20, and relevant personnel can make corresponding settings according to the purpose of the electronic device 1.

[0055] In some possible embodiments, the chip module 20 can be applied to 5G base stations, servers, medical devices, new energy sources, rail transportation, or large aircraft.

[0056] Furthermore, to facilitate heat dissipation of the chip module 20 using the heat sink 40, please refer to the following in some possible embodiments. Figures 1 to 3 A first mounting plate 12 can be installed inside the cabinet 10. A condenser 42 can be installed on the first mounting plate 12. An evaporator 41 can be connected to the condenser 42 through a pipe. A chip module 20 can be installed on the evaporator 41.

[0057] The first mounting plate 12 is located below the fan 43, so the fan 43 can dissipate heat from the condenser 42 placed on the first mounting plate 12.

[0058] To facilitate heat dissipation from the condenser 42, the fan 43 provided in this application example is located at the top of the cabinet 10, and the fan 43 can blow air downwards onto the housing 11.

[0059] In some possible embodiments, the condenser 42 has a condensation chamber inside, and heat dissipation fins 421 are provided on the top and bottom outer walls of the condenser 42.

[0060] For example, the heat dissipation fins 421 in the condenser 42 are arranged in a wavy shape. The heat dissipation fins 421 have good heat transfer effect, and the wavy shape can increase the heat exchange area, thereby increasing the heat dissipation efficiency and effect.

[0061] For example, the heat dissipation fins 421 are arranged vertically and extend vertically to the top and bottom of the condenser 42.

[0062] Furthermore, to ensure that the airflow after dissipating heat from the condenser 42 can continue to flow downwards to the reactor 30, please refer to [further details needed]. Figure 2 In this application example, a first air duct 13 is formed between the circumferential outer wall of the first mounting plate 12 and the inner wall of the cabinet 10.

[0063] For example, a support beam is provided on the side of the first mounting plate 12 facing the vertical inner wall of the cabinet 10, and the other end of the support beam is fixedly connected to the inner wall of the cabinet 10 so that a first air duct 13 for air circulation can be formed between the circumferential outer wall of the first mounting plate 12 and the inner wall of the cabinet 10.

[0064] Furthermore, in order to improve the heat dissipation efficiency of the heat dissipation fins 421 at the bottom of the condenser 42, please refer to the following in some possible embodiments. Figure 1 The middle part of the first mounting plate 12 can be set as a hollow part 121. The condenser 42 is set on the first mounting plate 12, and the heat dissipation fins 421 at the bottom outer wall of the condenser 42 are located in the hollow part 121.

[0065] To further improve installation stability, multiple support beams can be installed at the hollow section 121, with gaps between the support beams allowing for gas flow.

[0066] Furthermore, to facilitate the connection between the evaporator 41 and the condenser 42, in some possible embodiments, the condenser 42 can be arranged horizontally, and the evaporator 41 can be arranged vertically at one end of the condenser. That is, the condenser 42 and the evaporator 41 are arranged in an L-shape.

[0067] The condenser 42 and evaporator 41 are arranged in an L-shape. The space below the condenser 42 can be used to install the reactor 30 and the chip module 20. The reactor 30 and the chip module 20 can be placed in the installation space below the condenser 42, and the chip module 20 can be connected to the vertically arranged evaporator 41. This can improve heat dissipation efficiency while reducing the overall size of the electronic device 1.

[0068] Furthermore, in some possible embodiments, the distance between the reactor 30 and the condenser 42 is 7-10 cm, and the distance between the reactor 30 and the evaporator 41 is 5-7 cm.

[0069] Furthermore, in some possible embodiments, the distance between the lower end of the reactor 30 and the lower end of the evaporator 41 is 5-7 cm.

[0070] This application does not limit how the evaporator 41 is vertically arranged on one side of the condenser 42. In some possible embodiments, a pipe can be provided at the top of the evaporator 41, and the pipe communicates with the vertically arranged side of the condenser 42. Furthermore, in some possible embodiments, an evaporation chamber is provided inside the evaporator 41. Please continue reading. Figure 3 The evaporator 41 includes two vertically arranged substrates 411, which are closed to form an evaporation chamber. Each substrate 411 has a porous capillary on its inner wall facing the other substrate 411, and a chip module 20 is connected to the side of the substrate 411 away from the evaporation chamber.

[0071] For example, the top of the two substrates 411 is provided with a pipe, and the outer wall of the pipe can be integrally formed with the substrate 411. The top outer wall of the pipe is connected to a side wall of the condenser 42 that is vertically arranged.

[0072] Furthermore, the electronic device 1 may be provided with two sets of chip modules 20, which are connected to two substrates 411 in a one-to-one correspondence, and the two substrates 411 are located between the two sets of chip modules 20.

[0073] Furthermore, to facilitate the placement of the reactor 30 within the receiving cavity 11, please refer to the following in some possible embodiments. Figure 1 and Figure 2 A second mounting plate 14 can be installed inside the receiving cavity 11 of the cabinet 10, and the second mounting plate 14 is located below the first mounting plate 12.

[0074] The reactor 30 is mounted on the second mounting plate 14, and the vertical side of the reactor 30 is positioned opposite the evaporator 41 in the L-shaped heat sink 40, so that the chip module 20 is located between the substrate 411 of the reactor 30 and the evaporator 41, which can further reduce the overall size of the electronic device 1.

[0075] Furthermore, please continue reading Figure 2 A second air duct 15 is formed between the outer circumferential wall of the second mounting plate 14 and the inner wall of the cabinet 10. The second air duct 15 is connected to the first air duct 13, so that the air after heat exchange with the reactor 30 can flow from the second air duct 15 to the bottom of the second mounting plate 14.

[0076] Furthermore, a third air duct is formed between the bottom of the second mounting plate 14 and the bottom of the cabinet 10, and the air blown out from the second air duct 15 can flow out of the cabinet 10 through the third air duct 16.

[0077] Furthermore, in some possible embodiments, please continue to refer to... Figure 3 The electronic device 1 is also equipped with a waterproof sheet metal 50, which is located between the reactor 30 and the chip module 20.

[0078] For example, the waterproof sheet metal 50 may include a horizontal plate 51 and a vertical plate 52. The horizontal plate 51 may be provided protruding from the side of the chip module 20 facing the reactor 30, and the vertical plate 52 may be provided at the end of the horizontal plate 51 away from the chip module 20.

[0079] Using waterproof sheet metal 50 to shield and protect the chip module 20 can further reduce the impact of moisture on the chip module 20.

[0080] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: A server rack, wherein the interior of the server rack is provided with a receiving cavity; A chip module, wherein the chip module is disposed within the receiving cavity; A reactor is disposed within the receiving cavity and is electrically connected to the chip module; The radiator includes an evaporator, a condenser, and a fan. The evaporator and the condenser are connected by a pipe. The evaporator is connected to the chip module. The reactor is located on the side of the chip module opposite to the evaporator. The condenser is located above the evaporator. The fan is located at the top of the cabinet and above the condenser, and is used to blow air downwards into the housing cavity.

2. The electronic device according to claim 1, characterized in that, The condenser is arranged horizontally, the evaporator is arranged vertically at one end of the condenser, the reactor is located below the condenser, and the chip module is located on the side of the evaporator facing the reactor.

3. The electronic device according to claim 2, characterized in that, The distance between the reactor and the condenser is 7-10cm, and the distance between the reactor and the evaporator is 5-7cm.

4. The electronic device according to claim 3, characterized in that, The distance between the lower end of the reactor and the lower end of the evaporator is 5-7 cm.

5. The electronic device according to any one of claims 1-4, characterized in that, The cabinet is equipped with a first mounting plate inside, and a first air duct is formed between the outer circumferential wall of the first mounting plate and the inner wall of the cabinet so that the air blown by the fan can pass through the first air duct; the condenser is disposed on the first mounting plate.

6. The electronic device according to claim 5, characterized in that, The first mounting plate has a hollowed-out portion in the middle; the condenser has a condensation chamber inside, and heat dissipation fins are provided on the top and bottom outer walls of the condenser; the condenser is mounted on the first mounting plate, and the heat dissipation fins on the bottom outer wall of the condenser are located in the hollowed-out portion.

7. The electronic device according to claim 5, characterized in that, The cabinet is equipped with a second mounting plate located below the first mounting plate. A second air duct is formed between the outer circumferential wall of the second mounting plate and the inner wall of the cabinet, and the second air duct is connected to the first air duct. The reactor is mounted on the second mounting plate.

8. The electronic device according to any one of claims 1-4, characterized in that, The electronic device is also provided with a waterproof sheet metal, which is disposed between the reactor and the chip module.

9. The electronic device according to claim 8, characterized in that, The waterproof sheet metal includes a vertical plate and a horizontal plate connected to the upper end of the vertical plate, with the horizontal plate protruding toward the chip module and the end of the horizontal plate away from the vertical plate connected to the chip module.

10. The electronic device according to claim 1, characterized in that, The electronic device includes two chip modules; the evaporator has an evaporation chamber inside, and the evaporator includes two vertically arranged substrates, which are closed to form the evaporation chamber; each substrate has a porous capillary on its inner wall facing the other substrate; the two chip modules are connected to the two substrates in a one-to-one correspondence, and the two substrates are disposed between the two chip modules.

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