Heat dissipation device and electronic equipment
By combining air cooling and liquid cooling in electronic devices and utilizing the phase changes of the coolant, the problem of the single heat dissipation method in the existing technology is solved, achieving efficient and low-cost heat dissipation and ensuring the reliable operation of the equipment.
Patent Information
- Application Number
- CN202520128232.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing electronic devices rely on a single heat dissipation method. Air cooling has high requirements for ambient temperature, while liquid cooling is costly and difficult to maintain. There is an urgent need for a simple, efficient, and convenient heat dissipation device.
The device employs a combined heat dissipation system, which combines heat exchange components and heat dissipation components on the heat-generating element. It utilizes the phase change of the coolant to dissipate heat, combining air cooling and liquid cooling modes to achieve efficient heat dissipation.
It improves heat dissipation efficiency and reliability, ensures temperature uniformity in electronic devices, reduces costs, and enhances operational reliability.
Smart Images
Figure CN223626208U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation, and in particular to a heat dissipation device and electronic equipment. Background Technology
[0002] For heat dissipation in electronic devices, common methods are relatively simple. One method involves air cooling by installing cooling fans near the heat-generating components to transfer heat to the heatsink, where the fan blows the hot air away. Therefore, ambient temperature is a crucial factor affecting heat dissipation efficiency. Liquid cooling also exists, using liquid to cool the device. While air cooling is highly sensitive to ambient temperature, liquid cooling offers high cooling efficiency and low power consumption, but it is expensive and difficult to maintain. Therefore, there is an urgent need for a simple, efficient, and convenient heat dissipation device to improve the reliability of heat dissipation in electronic devices. Utility Model Content
[0003] The purpose of this invention is to provide a heat dissipation device and electronic equipment. By utilizing the principles of evaporation heat absorption and liquefaction heat dissipation during the phase change process, the physical state of the coolant in the heat dissipation device is changed, thereby improving the heat dissipation efficiency of the heat dissipation device and electronic equipment. At the same time, it combines air cooling and liquid cooling modes to improve heat dissipation efficiency and reliability.
[0004] According to one aspect of the present invention, a heat dissipation device is provided, comprising: a heat exchange component and a heat dissipation component; the heat exchange component is disposed above a heat-generating element, and coolant is stored in the heat exchange component and circulates within the heat exchange component to dissipate heat from the heat-generating element; the heat dissipation component is disposed above and connected to the heat exchange component, and is arranged along the length direction of the heat exchange component; the heat dissipation component includes: a liquid-cooled plate assembly and a fin assembly; the liquid-cooled plate assembly includes at least two liquid-cooled plates communicating with the heat exchange component, and the liquid-cooled plates are vertically disposed on the heat exchange component; the liquid-cooled plates are used to cool the evaporated coolant; the fin assembly includes at least two fins, and the fins are spaced apart from the liquid-cooled plates; the fins are used to increase the heat dissipation area between adjacent liquid-cooled plates.
[0005] By setting up heat exchange components and heat dissipation components, a combination of liquid cooling and air cooling is achieved. The heat exchange components conduct heat to the heat-generating elements, and the heat dissipation components liquefy the evaporated coolant and circulate it with the coolant in the heat exchange components, resulting in high heat dissipation efficiency of the product.
[0006] Preferably, the heat exchange assembly includes a substrate and a cover plate. The substrate is disposed above the heating element to dissipate heat from the heating element. The cover plate covers the substrate and is connected to the substrate. The substrate includes a liquid storage tank. The cover plate is closed to the substrate, and the liquid storage tank forms a liquid storage cavity for storing coolant to dissipate heat from the heating element.
[0007] The heat dissipation substrate and the cover plate form a reservoir for storing coolant. The coolant stored in the reservoir evaporates and carries away the heat from the heating element. The coolant vapor then passes through the liquid cooling plate to liquefy and dissipate heat. The coolant then flows back to the reservoir. In this way, the heat dissipation efficiency of the heating element is improved, and the reliability of the heat dissipation of the heating element is ensured.
[0008] Preferably, the liquid storage cavity is provided with uniformly arranged bumps, and the bumps are spaced apart to form a first flow channel; the liquid storage cavity includes a chip heat dissipation area corresponding to the chip setting position.
[0009] By setting up the first flow channel, the coolant in the storage chamber is ensured to circulate and flow, so that the temperature of the coolant in the storage chamber is balanced, thus ensuring the heat dissipation effect and reliability of the chip.
[0010] Preferably, the cover plate is provided with a first connecting groove corresponding to the number of liquid cooling plates; the bottom of the liquid cooling plate is provided with a first connecting part; the first connecting part is embedded in the first connecting groove and communicates with the liquid storage cavity.
[0011] Preferably, the liquid cooling plate is inflated to form an evaporation tank; an evaporation port is provided at the bottom of the liquid cooling plate; the evaporation tank and the liquid storage chamber are connected through the evaporation port to achieve evaporative heat dissipation.
[0012] Preferably, the heat dissipation device includes at least one set of heat dissipation components; the heat dissipation components are arranged along the length direction of the substrate and heat dissipation gaps are provided between the heat dissipation components.
[0013] Preferably, the heat dissipation device includes a fan for enhancing airflow; the fan is disposed between the heat dissipation gaps.
[0014] By installing exhaust fans, the circulation of cold air between the fins is increased, thereby improving the heat dissipation effect and ensuring the heat dissipation efficiency of the heat dissipation device.
[0015] Preferably, the liquid cooling plate includes a fin connection area and a convection area; the convection area is provided with a recess for fan heat dissipation; the fins include multiple heat dissipation surfaces; the heat dissipation surfaces face the heat dissipation gap; the heat dissipation surfaces are arranged in a cross pattern to form heat dissipation openings.
[0016] By changing the structure of the fins and increasing the heat dissipation surface area, the larger the heat dissipation area of the fins, the better the heat dissipation effect, thereby improving the heat dissipation efficiency of the heat dissipation device and ensuring the safe and reliable operation of electronic equipment.
[0017] Preferably, the heat dissipation device includes at least one liquid inlet pipe for liquid intake and maintenance; the cover plate is provided with a corresponding number of liquid inlets.
[0018] By installing an inlet pipe, the volume of coolant in the storage chamber can be monitored, and the pressure in the storage chamber of the heat dissipation device can also be monitored, ensuring the stable operation of the heat dissipation device.
[0019] This invention also provides an electronic device, including the heat dissipation device as described above.
[0020] By combining liquid cooling and air cooling, heat dissipation of electronic devices is improved, heat dissipation efficiency is enhanced, temperature balance is ensured during operation, and reliability of equipment operation is improved. Attached Figure Description
[0021] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:
[0022] Figure 1 A perspective view of a heat dissipation device provided by this utility model.
[0023] Figure 2 A schematic diagram of a heat dissipation device provided by this utility model Figure 1 .
[0024] Figure 3 A schematic diagram of a heat dissipation device provided by this utility model Figure 2 .
[0025] Figure 4 A schematic diagram of a heat dissipation device provided by this utility model Figure 3 .
[0026] Figure 5 A schematic diagram of a heat dissipation device provided by this utility model Figure 4 .
[0027] Figure 6 A schematic diagram of a heat dissipation device provided by this utility model Figure 5 .
[0028] Figure 7 for Figure 6 A magnified view of a portion of the image.
[0029] Figure 8 A schematic diagram of a heat dissipation device provided by this utility model Figure 6 .
[0030] Explanation of icon numbers:
[0031] 100 - Heat dissipation device;
[0032] 1-Heat exchange assembly; 11-Substrate; 111-Liquid reservoir; 1111-Bump; 1112-First flow channel; 1113-Chip heat dissipation area; 112-Liquid reservoir cavity; 12-Cover plate; 121-First connecting groove; 122-Liquid inlet;
[0033] 2-Inlet pipe;
[0034] 3-Heat dissipation assembly; 31-Liquid cooling plate assembly; 31(a)-Liquid cooling plate; 311-First connecting part; 312-Evaporation tank; 313-Evaporation port; 314-Fin connection area; 315-Convection area; 32-Fin assembly; 32(a)-Fin; 321-Heat dissipation surface; 322-Heat dissipation port; 4-Heat dissipation gap; 41-Recess. Detailed Implementation
[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0036] To keep the drawings concise, only the parts relevant to this invention are shown schematically in each figure, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some figures, only one of the components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."
[0037] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.
[0038] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0039] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0040] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.
[0041] See Figures 1 to 8As shown, this embodiment provides an electronic device that uses a heat dissipation device combining air cooling and liquid cooling to dissipate heat from heat-generating elements, thereby ensuring stable operating temperatures of electronic components within the electronic device. The heat dissipation device in this embodiment includes a heat exchange component 1 and a heat dissipation component 3. The heat exchange component 1 is connected to the heat-generating element and exchanges heat with it, while the heat dissipation component 3 cools the heat exchange component 1. The heat exchange component 1 includes a substrate 11 connected to the heat-generating element. The substrate 11 is positioned above the heat-generating element and absorbs the heat dissipated by the heat-generating element during operation of the electronic device, thereby reducing the operating temperature of the electronic device. A cover plate 12 is positioned above the substrate 11 and covers it. The substrate 11 has a liquid storage tank 111. When the cover plate 12 covers the substrate 11, it forms a liquid storage cavity 112 for storing coolant, which dissipates heat from the heat-generating element through changes in the phase of the coolant. It should be noted that the coolant here can be a water-cooled liquid, such as a mixture of 50% ethylene glycol and water, or a refrigerant, such as a coolant. In this embodiment, the heat dissipation liquid in the liquid storage chamber 112 is not limited, and the description is based on coolant. The heat dissipation assembly 3 is disposed above the cover plate 12 and connected to the cover plate 12. The heat dissipation assembly 3 is arranged along the length of the substrate 11 to better achieve heat dissipation. The heat dissipation assembly 3 includes a liquid cooling plate assembly 31 and a fin assembly 32. The liquid cooling plate assembly 31 includes a plurality of liquid cooling plates 31(a) connected to the cover plate 12, and the liquid cooling plates 31(a) are in communication with the liquid storage chamber 112. The liquid cooling plates 31(a) are used to cool the evaporated coolant and then return the liquefied coolant to the liquid storage chamber 112. The fin assembly 32 includes a plurality of fins 32(a), which are spaced apart from the liquid cooling plate 31(a) for heat dissipation between the liquid cooling plates 31(a), increasing the heat dissipation surface area 321 between adjacent liquid cooling plates 31(a) and improving heat dissipation efficiency. To ensure reliable connection of the heat dissipation device, the base plate 11, cover plate 12, and liquid cooling plate 31(a) of the heat dissipation device are connected by brazing to enhance the airtightness of the heat dissipation device. In a specific embodiment, the coolant stored in the liquid storage chamber 112 evaporates into a gaseous state after sensing the heat of the heating element. The gaseous coolant is transferred to the liquid cooling plate 31(a). After the liquid cooling plate 31(a) collects the vaporized coolant, the vaporized coolant liquefies upon cooling due to the low temperature of the liquid cooling plate 31(a). During this process, the liquid cooling plate 31(a) dissipates heat through the spaced fins 32(a), and the liquefied coolant flows back into the liquid storage chamber 112 through the liquid cooling plate 31(a). The process of heat dissipation by heat-generating elements is a repeated process of coolant evaporation absorbing heat and liquefaction dissipating heat.By combining a substrate 11, a cover plate 12, and a heat dissipation assembly 3, the heat dissipation of the heating element is achieved through the phase changes of coolant evaporation (absorbing heat) and liquefaction (dissipating heat). During this process, because the coolant circulates in the storage chamber 112 and the liquid cooling plate 31(a), the operating temperature of the heating element is relatively uniform, and there is no local overheating. This achieves uniform heat dissipation of the heating element. Using this heat dissipation device can also ensure the reliability and efficiency of heat dissipation. In addition, by using a coolant circulation mode, costs can be saved while ensuring heat dissipation effect.
[0042] Specifically, to ensure the flow of coolant within the reservoir 112, bumps 1111 are evenly distributed within the reservoir 112, forming a first flow channel 1112. This first flow channel 1112 ensures the circulation of coolant within the reservoir 112, maintaining a balanced coolant temperature. The coolant's flow within the first flow channel 1112 also ensures a uniform operating temperature. A chip heat dissipation area 1113 is provided within the reservoir 112, positioned corresponding to the chip's location. For different electronic devices, the chip heat dissipation area 1113 is positioned differently. Within the chip heat dissipation area 1113, the first flow channel 1112 between the bumps 1111 is relatively large, resulting in a higher coolant content and thus a faster thermal circulation speed and better heat dissipation, ensuring the chip's performance and reliability.
[0043] See Figure 4 A first connecting groove 121, corresponding to the number of liquid cooling plates 31(a), is provided on the cover plate 12. The first connecting grooves 121 are evenly arranged laterally along the cover plate 12. A first connecting part 311 for connecting the cover plate 12 is provided at the bottom of the liquid cooling plate 31(a). The first connecting part 311 is embedded in the first connecting groove 121. Since the liquid cooling plate 31(a) is blown up, an evaporation groove 312 is formed in the liquid cooling plate 31(a). The liquid cooling plate 31(a) is then connected to the liquid storage chamber 112 through the first connecting groove 121. The evaporation groove 312 is displayed on one side of the liquid cooling plate 31(a). An evaporation port 313 is also provided at the bottom of the liquid cooling plate 31(a). One or more evaporation ports 313 are provided according to the slotting specifications of the first connecting groove 121 to collect the evaporated coolant. It should be noted that in the heat dissipation assembly 3, the liquid cooling plates 31(a) are arranged in the same direction, that is, the side where the evaporation groove 312 is located is all facing the same direction.
[0044] See Figure 1 , Figure 2In one embodiment, the heat dissipation device includes at least one set of heat dissipation components 3, which are arranged along the length of the substrate 11. To facilitate heat dissipation, heat dissipation gaps 4 are provided between the heat dissipation components 3 to allow airflow. A fan is installed between the heat dissipation gaps 4 of the heat dissipation components 3, and airflow flows along these gaps. The fan accelerates the circulation of cold air, improving the heat dissipation efficiency of the fins 32(a) on the liquid cooling plate 31(a), thereby accelerating the liquefaction of the coolant vapor in the liquid cooling plate 31(a) into coolant. When installing the fan, since the airflow needs to be transmitted from one side of the heat dissipation component 3 to the other, i.e., the airflow needs to flow longitudinally along the heat dissipation device, to facilitate increasing the airflow speed and the heat dissipation surface area 321 of the flowing cold airflow and the heat dissipation component 3, the liquid cooling plate 31(a) is typically provided with a fin connection area 314 and a convection area 315. The fin connection area 314 is used to house the fins 32(a). Since the convection area 315 does not have fins 32(a), the spacing between liquid cooling plates 31(a) in the same group of heat dissipation components 3 is relatively large, resulting in better airflow. In different groups of heat dissipation components 3, the convection areas 315 of the liquid cooling plates 31(a) are also arranged adjacently. See also... Figure 7 The fins 32(a) are connected to the fin connection area 314 of the liquid cooling plate 31(a) to achieve heat transfer. In this embodiment, to facilitate airflow conduction and increase airflow efficiency, since the convection area 315 is lower than the fin connection area 314 in the vertical direction and its area is also smaller than that of the fin connection area 314, the liquid cooling plate 31(a) is provided with an air guide notch for airflow guidance. The convection area 315 of the heat dissipation assembly 3 is provided with a recess 41 to facilitate airflow and heat dissipation.
[0045] See Figures 6-7 In the embodiment provided in this example, the size of the fin area 32(a) also affects the heat conduction effect. For the sealed area inside the heat dissipation device, with the airflow remaining constant, the smaller the wave pitch of the fin 32(a), the larger the heat exchange area and the greater the heat exchange capacity for the same volume. To improve the heat dissipation effect of the heat dissipation component 3, it is advisable to increase the contact surface between the fin 32(a) and the air. Common methods to increase the area of the heat dissipation surface 321 include folding the fin 32(a) or using corrugated fins or straight fins. However, since it is necessary to maintain the uniform temperature of each heat dissipation surface 321 of the heat dissipation component 3, airflow should also be achieved between the fin 32(a) and the liquid cooling plate 31(a). See also Figure 8In this embodiment, the fin 32(a) includes multiple heat dissipation surfaces 321. These surfaces 321 face the heat dissipation gap 4, allowing the flowing airflow to carry away heat from the fin 32(a). Thus, the fin 32(a) appears as an "opening" structure from a side view. The heat dissipation surface 321 facing the heat dissipation gap 4 is bent and recessed in the opposite direction to the gap, increasing the surface area. The heat dissipation surfaces 321 intersect each other, forming heat dissipation openings 322. The airflow from the rotating fan flows through these openings, achieving cooling. Therefore, the fin 32(a) in this embodiment has a rectangular staggered tooth structure. This type of fin 32(a) has more welding surfaces and a higher welding rate, resulting in reliable product quality. Furthermore, the fin 32(a) has a small wave pitch, typically 3mm-5mm, leading to excellent heat dissipation.
[0046] In this embodiment, the heat dissipation device is provided with at least one liquid inlet pipe 2, which connects to the liquid storage chamber 112 and is used for supplying coolant and for maintenance. A cover plate 12 is provided with a number of liquid inlets 122 corresponding to the number of liquid inlet pipes 2, and the liquid inlet pipes 2 are fixed in place. The liquid inlet pipe 2 is sealed during use and can be used to monitor the air pressure inside the pipe and the coolant volume in the liquid storage chamber 112 to ensure the reliable operation of the heat dissipation device.
[0047] Electronic devices using the heat dissipation device provided in this embodiment employ a combination of air cooling and liquid cooling. Compared with traditional electronic device heat dissipation devices, the operating temperature of the electronic device is more balanced, avoiding excessively high local temperatures that could affect its use. As a result, the electronic product has excellent heat dissipation performance, high operational robustness, and low heat dissipation cost.
[0048] It will be apparent to those skilled in the art that various modifications and variations can be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the present invention. Therefore, it is intended that the present invention cover modifications and variations falling within the scope of the appended claims and their equivalents.
Claims
1. A heat dissipation device, characterized in that, include: A heat exchange assembly is disposed above a heating element. The heat exchange assembly stores coolant and circulates within the heat exchange assembly to dissipate heat from the heating element. A heat dissipation component is disposed above and communicates with the heat exchange component, and the heat dissipation component is disposed along the length direction of the heat exchange component; The heat dissipation component includes: Liquid cooling plate assembly; The liquid cooling plate assembly includes at least two liquid cooling plates that are connected to the heat exchange component, and the liquid cooling plates are vertically arranged on the heat exchange component; the liquid cooling plates are used to cool the evaporated coolant; A fin assembly; the fin assembly includes at least two fins, the fins being spaced apart from the liquid cooling plate; the fins are used to increase the heat dissipation area between adjacent liquid cooling plates.
2. The heat dissipation device as described in claim 1, characterized in that, The heat exchange assembly includes a substrate and a cover plate. The substrate is disposed above the heating element to dissipate heat from the heating element. The cover plate covers the substrate and is connected to the substrate. The substrate includes a liquid storage tank. The cover plate is closed to the substrate, and the liquid storage tank forms a liquid storage cavity for storing coolant to dissipate heat from the heating element.
3. A heat dissipation device as described in claim 2, characterized in that, The liquid storage cavity is provided with uniformly arranged bumps, and the bumps are spaced apart to form a first flow channel; the liquid storage cavity includes a chip heat dissipation area corresponding to the chip setting position.
4. A heat dissipation device as described in claim 3, characterized in that, The cover plate is provided with a first connecting groove corresponding to the number of liquid cooling plates; the bottom of the liquid cooling plate is provided with a first connecting part; the first connecting part is embedded in the first connecting groove and communicates with the liquid storage cavity.
5. A heat dissipation device as described in claim 4, characterized in that, The liquid cooling plate is inflated to form an evaporation tank; an evaporation port is provided at the bottom of the liquid cooling plate; the evaporation tank and the liquid storage chamber are connected through the evaporation port to achieve evaporation and heat dissipation.
6. A heat dissipation device as described in claim 5, characterized in that, The heat dissipation device includes at least one set of heat dissipation components; the heat dissipation components are arranged along the length direction of the substrate and heat dissipation gaps are provided between the heat dissipation components.
7. A heat dissipation device as described in claim 6, characterized in that, The heat dissipation device includes a fan for enhancing airflow; the fan is disposed between the heat dissipation gaps.
8. A heat dissipation device as described in claim 7, characterized in that, The liquid cooling plate includes a fin connection area and a convection area; the convection area is provided with a recess for fan heat dissipation; the fins include multiple heat dissipation surfaces; the heat dissipation surfaces face the heat dissipation gaps; the heat dissipation surfaces are arranged in a cross pattern to form heat dissipation openings.
9. A heat dissipation device as described in claim 8, characterized in that, The heat dissipation device includes at least one liquid inlet pipe, which is used for liquid intake and maintenance; the cover plate is provided with a corresponding number of liquid inlets.
10. An electronic device, characterized in that, Includes the heat dissipation device as described in any one of claims 1-9.