Wafer front protective film cutting device

By designing an adjustable support rod and limit rod structure for the wafer protective film cutting device, the problem of cutting wafers of different sizes has been solved, improving production efficiency and reducing environmental pollution.

CN223630497UActive Publication Date: 2025-12-05SING LEONG TECH (JIANGSU) CO LTD
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Patent Information

Application Number
CN202422653884.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2025-12-05
Estimated Expiration
2034-10-31

AI Technical Summary

Technical Problem

Existing wafer protective film cutting equipment cannot adapt to wafers of different sizes, resulting in low production efficiency, high costs, and adverse environmental impacts.

Method used

A wafer front protective film cutting device was designed. Through an adjustable support rod and limiting rod structure, combined with a cutting assembly and a dust removal system, it can achieve precise cutting of wafers of different sizes and recycling of waste materials.

Benefits of technology

It enables flexible cutting of wafers of different sizes, improves production efficiency, reduces costs, and reduces environmental pollution through waste recycling.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of wafer film pasting, and discloses a wafer front protective film cutting device which comprises a working table, the bottom of the working table is fixedly connected with a base, the top of the working table is fixedly connected with a plurality of supporting plates, and the tops of the supporting plates are fixedly connected with a protective shell. A sliding rail is fixedly connected to the interior of the protective shell, a plurality of pulleys are rotationally connected to the interior of the sliding rail, a first connecting plate is fixedly connected to the tops of the pulleys, a plurality of supporting rods are fixedly connected to the top of the first connecting plate, and limiting rods are fixedly connected to the interiors of the supporting rods. According to the protective film cutting device, a handle is pushed to enable a connecting plate to drive a sliding block to slide, a first spring is extruded, meanwhile, a pressing plate is pressed to extrude a second spring, and then the pressing plate can be placed in a proper clamping groove, so that protective films of different sizes can be cut, and the flexibility is enhanced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to wafer film sticking technical field especially relates to a wafer front surface protection film cutting device. BACKGROUND

[0002] A wafer front surface protection film cutting device is a device specially used for accurately cutting the protection film attached to the front surface of the wafer in the wafer processing process, aiming to solve the problem that the traditional cutting method is difficult to control the cutting of different wafer sizes, thus mis-cutting the protection film, due to the close attachment of the protection film to the wafer surface.

[0003] In the prior art, part of the wafer protection film cutting device is mainly used for accurately cutting the protection film attached to the front surface of the wafer in the wafer processing process, to protect the wafer circuit structure from being damaged and to improve the processing efficiency and yield, but in the specific use process, it cannot cut different sizes of wafers, which will seriously affect the production efficiency, increase the cost, reduce the market adaptability and hinder the technological innovation, and will also have adverse effects on the environment, therefore, a wafer front surface protection film cutting device is proposed to solve the above problems. SUMMARY

[0004] The wafer front surface protection film cutting device provided by the utility model aims to improve the problem that part of the wafer front surface protection film cutting cannot cut different sizes of protection films.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A wafer front surface protection film cutting device, comprising a workbench, the bottom of the workbench is fixedly connected with a base, the top of the workbench is fixedly connected with a plurality of supporting plates, the top of the supporting plate is fixedly connected with a protective shell, the inside of the protective shell is fixedly connected with a sliding rail, a plurality of pulleys are rotatably connected in the sliding rail, the top of the pulley is fixedly connected with a connecting plate one, the top of the connecting plate one is fixedly connected with a plurality of supporting rods, the inside of the supporting rod is fixedly connected with a limiting rod, the outside of the limiting rod is provided with a clamping groove, the outside of the limiting rod is sleeved with a spring one, a plurality of sliding blocks are slidably connected to the outside of the limiting rod, the outside of the sliding block is fixedly connected with a connecting plate, the bottom of the connecting plate is provided with a cutting assembly for cutting the protection film, the top of the connecting plate is fixedly connected with a fixed rod one, the top of the fixed rod one is fixedly connected with a handle, the top of the sliding block is provided with a spring two, the top of the spring two is fixedly connected with a pressing plate.

[0007] As a further description of the above technical scheme:

[0008] The cutting assembly comprises a connecting plate II, which is fixedly connected to the outside of the adapter plate, and a blade fixedly connected to the outside of the connecting plate II;

[0009] As a further description of the above technical solution:

[0010] The protective shell is fixedly connected with a limiting plate, the limiting plate is fixedly connected with a second fixing block on the outside, and the limiting plate is fixedly connected with a handle on the outside.

[0011] As a further description of the above technical solution:

[0012] The top of the workbench is fixedly connected with a plurality of supporting blocks, the inside of the supporting block is fixedly connected with a second fixing rod, the outside of the second fixing rod is fixedly connected with a third fixing rod, and the outside of the third fixing rod is slidably connected with a cutting knife.

[0013] As a further description of the above technical solution:

[0014] The outside of the second fixing rod is slidably connected with a dust removal plate, and the outside of the dust removal plate is fixedly connected with a follow-up rod.

[0015] As a further description of the above technical solution:

[0016] The outside of the workbench is fixedly connected with a fixing plate, the outside of the fixing plate is fixedly connected with a wafer film, the outside of the workbench is fixedly connected with a waste box, and the bottom of the waste box is fixedly connected with a heating plate.

[0017] As a further description of the above technical solution:

[0018] The top of the base is fixedly connected with a hydraulic cylinder, and the driving end of the hydraulic cylinder is fixedly connected with a lifting plate.

[0019] As a further description of the above technical solution:

[0020] The elastic component comprises a second spring, the top of the second spring is fixedly connected with a pressing plate, and the outside of the second spring is fixedly connected to the bottom of the pressing plate.

[0021] The utility model has the advantages of the following beneficial effects:

[0022] 1、The utility model discloses a pushing handle makes the adapter plate drive the sliding block to slide, presses the spring I, simultaneously presses the pressing plate, makes the spring II be pressed, then makes the pressing plate can be put into the appropriate clamping groove, thereby realizes the protection film of different size can be cut, and the flexibility is enhanced.

[0023] 2. The utility model discloses, through the follow -up rod is pushed, make follow -up rod drive dust plate and move, push the waste material into the waste material box, and then make the heating plate to the waste material and carry out processing to can save resources, reduce pollution, realized to the effect of waste recycling. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A kind of wafer front surface protection film cutting device's three-dimensional schematic view is proposed for the utility model;

[0025] Figure 2 A kind of wafer front surface protection film cutting device's hydraulic cylinder structure schematic view is proposed for the utility model;

[0026] Figure 3 A kind of wafer front surface protection film cutting device's dust plate structure schematic view is proposed for the utility model;

[0027] Figure 4 A kind of wafer front surface protection film cutting device's slide rail structure schematic view is proposed for the utility model.

[0028] Legend:

[0029] 1, workbench;2, base;3, support leg;4, support plate;5, protective shell;6, slide rail;7, pulley;8, connecting plate one;9, support rod;10, limit rod;11, clamping groove;12, spring one;13, sliding block;14, link plate;15, fixed rod one;16, handle;17, spring two;18, pressing plate;19, connecting plate two;20, blade;21, fixed block two;22, limit plate;23, handle;24, support block;25, fixed rod two;26, fixed rod three;27, cutting knife;28, follow-up rod;29, dust plate;30, fixed plate;31, wafer film;32, waste material box;33, heating plate;34, hydraulic cylinder;35, lifting plate. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0031] REFERENCE Figures 1 to 4The utility model provides a kind of embodiment: a wafer front side protective film cutting device, the bottom of workbench 1 is fixedly connected with pedestal 2, pedestal 2 is usually made of high-strength steel material, to ensure the stability of entire device.The bottom of pedestal 2 has multiple support legs 3, the top of workbench 1 is fixedly connected with multiple support plates 4, support plate 4 usually adopts lightweight alloy material, to reduce overall weight while maintaining sufficient strength.The top of support plate 4 is fixedly connected with protective shell 5, protective shell 5 is generally made of transparent or translucent material, such as polycarbonate, so that operator can clearly see internal situation.The inside of protective shell 5 is fixedly connected with slide rail 6, slide rail 6 is usually made of wear-resistant metal material, such as stainless steel, to ensure the durability of long-term use.The inside of slide rail 6 is rotatably connected with multiple pulleys 7, pulley 7 can be made of nylon or other low friction coefficient material, to reduce resistance when moving.The top of pulley 7 is fixedly connected with connecting plate one 8, connecting plate one 8 is usually made of metal or hard plastic, for transmitting and dispersing pressure from above;

[0032] The top of connecting plate one 8 is fixedly connected with multiple support rods 9, support rod 9 is designed to be adjustable, to adapt to protective film of different thicknesses.The inside of support rod 9 is fixedly connected with limit rod 10, clamping groove 11 is formed in limit rod 10, for adjusting and fixing the position of sliding block 13.Limit rod 10 is externally provided with clamping groove 11, spring one 12 is sleeved on the outside of limit rod 10, spring one 12 is used to provide buffering action, reduce vibration in cutting process.The outside of limit rod 10 is slidably connected with multiple sliding blocks 13, sliding block 13 can move freely along limit rod 10, to adapt to wafer of different widths.The outside of sliding block 13 is fixedly connected with link plate 14, link plate 14 is usually made of lightweight but high-strength material, such as aluminum alloy.The bottom of link plate 14 is provided with cutting assembly for cutting protective film, the top of link plate 14 is fixedly connected with fixed rod one 15, the top of fixed rod one 15 is fixedly connected with handle 16, handle 16 is usually ergonomically designed, so that operator can comfortably hold and operate the cutting assembly, which includes connecting plate two 19, the outside of connecting plate two 19 is fixedly connected outside link plate 14, the outside of connecting plate two 19 is fixedly connected with blade 20.

[0033] Refer to Figures 2 to 4The outer part of the protective shell 5 is fixedly connected with a limiting plate 22, which is usually a flat metal sheet with several fixed holes to facilitate fixation with the protective shell 5. The outer part of the limiting plate 22 is fixedly connected with a fixed block two 21, and the outer part of the limiting plate 22 is fixedly connected with a handle 23, which is designed in accordance with ergonomics and is usually wrapped with soft rubber material to allow the operator to hold and apply force comfortably. The top of the workbench 1 is fixedly connected with a plurality of support blocks 24, which are cubic blocks with threaded holes and can be made of stainless steel or hard plastic to increase the stability and support capacity of the workbench 1. The inner part of the support block 24 is fixedly connected with a fixed rod two 25, the outer part of the fixed rod two 25 is fixedly connected with a fixed rod three 26, the outer part of the fixed rod three 26 is slidingly connected with a cutting knife 27, which is a very sharp blade 20 usually made of single crystal diamond or other superhard materials, designed to be detachable for easy replacement and maintenance. The outer part of the fixed rod three 26 is slidingly connected with the cutting knife 27, the outer part of the fixed rod two 25 is slidingly connected with a dust removal plate 29, which is a planar component usually made of soft bristle material or electrostatic dust removal material for cleaning dust on the wafer surface during cutting. The outer part of the dust removal plate 29 is fixedly connected with a follow-up rod 28;

[0034] The follow-up rod 28 is a rod that can adjust its position with the movement of the cutting knife 27, which ensures that the dust removal plate 29 always maintains contact with the wafer surface. The outer part of the workbench 1 is fixedly connected with a fixed plate 30, the outer part of the fixed plate 30 is fixedly connected with a wafer film 31, the outer part of the workbench 1 is fixedly connected with a waste box 32, the bottom of the waste box 32 is fixedly connected with a heating plate 33, which is an electric heating element for heating the inside of the waste box 32 to prevent the waste from hardening due to low temperature, affecting subsequent processing. The top of the base 2 is fixedly connected with a hydraulic cylinder 34, which is a powerful driving device that can provide a large amount of linear motion power, usually made of high-strength steel to withstand huge working pressure. The bottom of the waste box 32 is fixedly connected with the heating plate 33, the top of the base 2 is fixedly connected with the hydraulic cylinder 34, the driving end of the hydraulic cylinder 34 is fixedly connected with a lifting plate 35, which is a thick metal plate whose up and down movement is controlled by the hydraulic cylinder 34, used to adjust the height of the cutting knife 27. The elastic component includes a spring two 17, the top of the spring two 17 is fixedly connected with a pressing plate 18, and the outer part of the spring two 17 is fixedly connected to the bottom of the pressing plate 18.

[0035] Working principle: first, by pushing the handle 16, so that the support rod 15 driven by the adapter plate 14 movement, so that the adapter plate 14 driven by the slider 13 sliding, so that the spring 12 is extruded in turn to reach the appropriate position, so that by pressing the press plate 18, so that the press plate 18 on the spring 17 compression, in turn, the press plate 18 into the appropriate slot 11, in the movement of the push handle 16, so that the pulley 7 on the slide rail 6 rotation, at the same time, the connecting plate 19 driven by the blade 20 rotation, so that you can control the cutting of different size wafer, can maximize the reduction of production cost, improve production efficiency.

[0036] By cutting knife 27 on the fixed rod two 26 sliding, cutting knife 27 to achieve the cutting of the protective film 31, in turn, push the follower rod 28, so that the follower rod 28 driven by the dust plate 29 movement, so that the dust plate 29 through the fixed rod one 25 sliding, in turn, can push the waste to the waste box 32, by starting the heating plate 33 can be treated waste, so as to promote the recycling of resources, reduce environmental impact, improve safety.

[0037] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the foregoing detailed description of the present application, for the skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of the present application.

Claims

1. A wafer front side protection film cutting device comprising a worktable (1), characterized in that: The bottom of the workbench (1) is fixedly connected with a base (2), the bottom of the base (2) is fixedly connected with a plurality of supporting legs (3), the top of the workbench (1) is fixedly connected with a plurality of supporting plates (4), the top of the supporting plate (4) is fixedly connected with a protective shell (5), the inside of the protective shell (5) is fixedly connected with a sliding rail (6), a plurality of pulleys (7) are rotatably connected in the sliding rail (6), the top of the pulley (7) is fixedly connected with a connecting plate (8), the top of the connecting plate (8) is fixedly connected with a plurality of supporting rods (9), the inside of the supporting rod (9) is fixedly connected with a limiting rod (10), the outside of the limiting rod (10) is provided with a clamping groove (11), the outside of the limiting rod (10) is sleeved with a spring (12), a plurality of sliding blocks (13) are slidably connected to the outside of the limiting rod (10), the outside of the sliding block (13) is fixedly connected with an adapter plate (14), the bottom of the adapter plate (14) is provided with a cutting assembly for providing a cutting protective film, the top of the adapter plate (14) is fixedly connected with a fixed rod (15), the top of the fixed rod (15) is fixedly connected with a handle (16), the top of the sliding block (13) is provided with an elastic force assembly for providing a reaction.

2. The wafer front side protection film cutting device according to claim 1, characterized in that: The cutting assembly comprises a connecting plate (19), which is fixedly connected outside the adapter plate (14), and a blade (20) is fixedly connected outside the connecting plate (19).

3. The wafer front side protection film cutting device according to claim 1, characterized in that: The outside of the protective shell (5) is fixedly connected with a limiting plate (22), the outside of the limiting plate (22) is fixedly connected with a fixed block (21), and the outside of the limiting plate (22) is fixedly connected with a handle (23).

4. The wafer front side protection film cutting device according to claim 1, characterized in that: The top of the workbench (1) is fixedly connected with a plurality of supporting blocks (24), the inside of the supporting block (24) is fixedly connected with a fixed rod (25), the outside of the fixed rod (25) is fixedly connected with a fixed rod (26), and the outside of the fixed rod (26) is slidably connected with a cutting knife (27).

5. The wafer front side protection film cutting device according to claim 4, characterized in that: The outside of the fixed rod (25) is slidably connected with a dust removal plate (29), and the outside of the dust removal plate (29) is fixedly connected with a follow-up rod (28).

6. The wafer front side protection film cutting device according to claim 1, wherein: The outside of the workbench (1) is fixedly connected with a fixed plate (30), the outside of the fixed plate (30) is fixedly connected with a wafer film (31), the outside of the workbench (1) is fixedly connected with a waste box (32), and the bottom of the waste box (32) is fixedly connected with a heating plate (33).

7. The wafer front side protection film cutting device according to claim 1, characterized in that: The top of the base (2) is fixedly connected with a hydraulic cylinder (34), and the driving end of the hydraulic cylinder (34) is fixedly connected with a lifting plate (35).

8. The wafer front side protection film cutting device according to claim 1, characterized in that: The elastic force assembly comprises a spring (17), the top of the spring (17) is fixedly connected with a pressing plate (18), and the outside of the spring (17) is fixedly connected to the bottom of the pressing plate (18).