Measuring system based on autoclave device

Abstract

The embodiment of the utility model discloses a measuring system based on an autoclave device. The autoclave device comprises an autoclave and a prepreg lamination layer, the autoclave includes a chamber in which a prepreg stack is placed. The measuring system comprises a flexible sensor and a data acquisition device. The prepreg lamination layer comprises a plurality of layers of prepreg layers which are arranged in a lamination manner, the flexible sensor is attached between any two adjacent prepreg layers, the data acquisition device is arranged in the cavity, and the flexible sensor is electrically connected with the data acquisition device. Therefore, since the flexible sensor has the characteristics of light weight, thinness, smaller volume and bending deformation, the flexible sensor is further attached between any two adjacent prepreg layers, the influence on the structure of the finally formed composite material is reduced on the basis of accurately obtaining the environmental parameters in the process of forming the composite material by laminating the prepreg layers through hot pressing, and the product quality is improved. And therefore, the subsequent optimization of a composite material forming process is facilitated.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to the field of aviation composite material manufacturing, and particularly relates to an environment measuring system based on a hot press tank device. BACKGROUND

[0002] Fiber reinforced resin matrix composite materials are widely used in the field of aerospace due to their high strength, large specific modulus, low thermal expansion coefficient, strong designability and stable structure size. The composite material consumption of the domestic large passenger plane CR929 will exceed 50%, and the quality of composite material forming is crucial to the manufacturing of the passenger plane. Among them, the performance of the composite material is closely related to the environmental parameter setting in the hot press tank forming process of the prepreg, and complete and accurate acquisition of the environmental parameters in the prepreg forming process will directly determine the optimization method of the composite material forming process, and can provide accurate material parameters for simulation of the composite material forming process. However, the conventional sensor is a rigid device with large weight and volume, which cannot be completely arranged between the layers of the prepreg, and thus the environmental parameters in the prepreg forming process cannot be accurately acquired. Even if it can be arranged between the layers of the prepreg, the rigid device with large volume and hardness will cause serious deformation of the composite material in the final forming, thereby affecting the subsequent analysis. CONTENT OF THE UTILITY MODEL

[0003] The utility model provides a kind of measurement system based on hot press tank device, by attaching flexible sensor between any two adjacent prepreg layers, since flexible sensor has the characteristics of light, small volume and bendable deformation, thereby on the basis of accurately acquiring the environmental parameters in the process that prepreg stack is hot-pressed into composite material, reduce the influence on the structure of the finally formed composite material, so as to be conducive to the optimization of subsequent composite material forming process.

[0004] In the first aspect, the utility model embodiment provides a kind of measurement system based on hot press tank device, and the hot press tank device includes hot press tank and prepreg stack, and the hot press tank includes chamber, and the prepreg stack is placed in the chamber;

[0005] The measurement system includes flexible sensor and data acquisition device;

[0006] The prepreg stack includes a plurality of prepreg layers arranged in layers, and the flexible sensor is attached between any two adjacent prepreg layers, and the data acquisition device is arranged in the chamber;

[0007] The flexible sensor is electrically connected with the data acquisition device.

[0008] Optionally, the flexible sensor includes flexible pressure sensor.

[0009] Optionally, the flexible pressure sensor comprises a first encapsulation layer, a second encapsulation layer, a first electrode layer, a second electrode layer and a piezoresistive layer.

[0010] Any two adjacent prepreg layers comprise a first prepreg layer and a second prepreg layer, the first prepreg layer is closer to the center of the prepreg than the second prepreg layer.

[0011] The first encapsulation layer is attached to the first prepreg layer, and the second encapsulation layer is attached to the second prepreg layer.

[0012] The first electrode layer, the second electrode layer and the piezoresistive layer are located between the first encapsulation layer and the second encapsulation layer, and the piezoresistive layer is located between the first electrode layer and the second electrode layer, and the first electrode layer is located on one side of the piezoresistive layer close to the first encapsulation layer.

[0013] Optionally, the flexible sensor comprises a flexible temperature sensor.

[0014] Optionally, the flexible temperature sensor comprises a first flexible substrate and a platinum resistance layer located on one side of the first flexible substrate.

[0015] The platinum resistance layer is in contact with the prepreg layer.

[0016] Optionally, the flexible sensor comprises a flexible pressure sensor and a flexible temperature sensor.

[0017] The flexible temperature sensor and the flexible pressure sensor are located between the same two adjacent prepreg layers.

[0018] Optionally, the measurement system further comprises a heat insulation device, and the heat insulation device is located in the chamber.

[0019] The heat insulation device comprises a protective shell, a vacuum insulation inner shell and a heat insulation layer.

[0020] The heat insulation layer is located between the protective shell and the vacuum insulation inner shell.

[0021] The data acquisition device is located in the vacuum insulation inner shell.

[0022] Optionally, the heat insulation layer comprises a first heat insulation layer and a second heat insulation layer.

[0023] The second heat insulation layer is located between the first heat insulation layer and the vacuum insulation inner shell.

[0024] Optionally, the protective shell comprises a top cover and a protective shell body, and the top cover is fixedly connected with the protective shell body by a lock buckle.

[0025] The heat insulation device further comprises a via hole.

[0026] The via penetrates the top cover, the thermal insulation layer and the vacuum insulation inner shell;

[0027] The measurement system further comprises a cable;

[0028] One end of the cable is electrically connected with the flexible sensor, and the other end of the cable is electrically connected with the data acquisition device through the via.

[0029] Optionally, the data acquisition device comprises a second flexible substrate, a sensor interface, an operational amplifier chip and a storage unit integrated on one side of the second flexible substrate;

[0030] The sensor interface is electrically connected with the flexible sensor;

[0031] The operational amplifier chip is electrically connected with the sensor interface and the storage unit respectively.

[0032] The utility model discloses an embodiment of a kind of measurement system based on hot press tank device, which comprises hot press tank and prepreg stack. The hot press tank comprises a chamber, and the prepreg stack is placed in the chamber. The measurement system comprises a flexible sensor and a data acquisition device. The prepreg stack comprises a plurality of prepreg layers arranged in a stack, and the flexible sensor is attached between any two adjacent prepreg layers. The data acquisition device is arranged in the chamber, and the flexible sensor is electrically connected to the data acquisition device. As the flexible sensor is thin, light, small in size and bendable, the flexible sensor is attached between any two adjacent prepreg layers. Based on accurately obtaining the environmental parameters during the hot pressing of the prepreg stack into a composite material, the structure of the final composite material is not affected, which facilitates the optimization of the composite material forming process. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a structural diagram of a measurement system based on a hot press tank device provided by an embodiment of the utility model;

[0034] Figure 2 is a structural diagram of a flexible pressure sensor provided by an embodiment of the utility model;

[0035] Figure 3 is a structural diagram of a flexible temperature sensor provided by an embodiment of the utility model;

[0036] Figure 4 is a structural diagram of a heat insulation device provided by an embodiment of the utility model;

[0037] Figure 5 is a structural diagram of a data acquisition device provided by an embodiment of the utility model. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the present application clearer, the following will combine the drawings in the embodiments of the present application, and through specific implementation manners, the technical scheme of the present application will be described completely. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0039] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0040] Figure 1 is a structural diagram of a measurement system based on a hot press tank device provided by an embodiment of the present application, as shown in Figure 1 The measurement system 02 includes a flexible sensor 10 and a data acquisition device 20. The prepreg stack 200 includes a plurality of prepreg layers 201 arranged in a multi-layer stack, the flexible sensor 10 is attached between any two adjacent prepreg layers 201, and the data acquisition device 20 is arranged in the chamber 101. The flexible sensor 10 is electrically connected to the data acquisition device 20.

[0041] Specifically, as Figure 1As shown, the autoclave device 01 includes an autoclave 100 and a prepreg stack 200. Among them, the autoclave 100 is a process equipment specially used for composite material forming, which makes the composite material curing forming by providing a specific temperature and pressure environment. Such equipment has a wide application in many high-tech fields such as aerospace, military, automobile manufacturing and sports goods. And the prepreg stack 200 is an intermediate material for forming a composite material. That is, by placing the prepreg stack 200 in the cavity 101 of the autoclave 100, and under the high temperature and high pressure of the closed environment, the prepreg stack 200 is hot-pressed to form a composite material. Among them, the performance of the finally formed composite material is related to the environmental parameter setting of the prepreg stack 200 in the cavity 101 during the forming process, such as the temperature parameter and the pressure parameter inside the prepreg stack 200 in the cavity 101, and thus accurately obtaining the temperature parameter and the pressure parameter inside the prepreg stack 200 during the hot-pressing process can provide conditions for the optimization of the composite material forming process. However, in the prior art, the environmental parameters of the prepreg stack are collected by using a conventional rigid sensor. The rigidity of the rigid sensor is large, and the weight and volume are large, and thus the rigid sensor cannot be completely arranged in the prepreg stack, and the internal environmental parameters (pressure or temperature) during the forming process of the prepreg cannot be accurately obtained. Even if the rigid sensor can be arranged inside the prepreg stack, due to the large volume and rigidity of the rigid sensor, the composite material will be severely deformed when finally formed into a composite material, thereby affecting the subsequent analysis of the composite material.

[0042] Therefore, the embodiment of the utility model replaces the rigid sensor with a flexible sensor. Specifically, when preparing the prepreg stack 200, a plurality of prepreg layers 201 can be laid to form the overall prepreg stack 200, and the flexible sensor 10 is attached between any two adjacent prepreg layers 201 during the laying process of the plurality of prepreg layers 201, so that the flexible sensor 10 is located inside the prepreg stack 200. In this way, due to the characteristics of lightness, thinness, small volume and bendable deformation of the flexible sensor 10, on the one hand, the small volume of the flexible sensor 10 can be completely arranged inside the prepreg layer 201, i.e. between the layers of the prepreg stack 200, so as to accurately measure the internal environmental parameters (pressure and temperature) of the prepreg stack 200 during the forming process, and on the other hand, due to the lightness and bendable deformation of the flexible sensor 10, the influence on the structure of the finally formed composite material can be reduced, in other words, the deformation of the finally formed composite material caused by the flexible sensor 10 is reduced, thereby reducing the analysis and optimization of the composite material forming process.

[0043] It should be noted that, since the chamber 101 of the autoclave 100 is a closed environment, the environmental parameters collected by the flexible sensor 10 cannot be transmitted outside the chamber 101, and therefore a data acquisition device 20 needs to be arranged in the chamber 101, and the data acquisition device 20 is electrically connected to the flexible sensor 10, so as to process and store the environmental parameters collected by the flexible sensor 10.

[0044] It can be understood that, since the data acquisition device 20 has a large volume, the data acquisition device 20 is arranged outside the prepreg stack 200, that is, the data acquisition device 20 and the prepreg stack 200 are located at different positions in the chamber 101.

[0045] In summary, the utility model discloses an embodiment of a measuring system based on an autoclave device, and the autoclave device includes an autoclave and a prepreg stack. The autoclave includes a chamber, and the prepreg stack is placed in the chamber. The measuring system includes a flexible sensor and a data acquisition device. The prepreg stack includes a plurality of prepreg layers arranged in a stack, and the flexible sensor is attached between any two adjacent prepreg layers. The data acquisition device is arranged in the chamber, and the flexible sensor is electrically connected to the data acquisition device. In this way, since the flexible sensor has the characteristics of being light, thin, small in volume and bendable and deformable, the flexible sensor is attached between any two adjacent prepreg layers. On the basis of accurately obtaining environmental parameters in the process of hot-pressing the prepreg stack into a composite material, the influence on the structure of the finally formed composite material is reduced, thereby facilitating the optimization of the subsequent composite material forming process.

[0046] Optionally, on the basis of the above embodiment, Figure 2 is a structural schematic diagram of a flexible pressure sensor provided by the utility model embodiment. Referring to Figure 2 The flexible sensor 10 includes a flexible pressure sensor 110. Specifically, the flexible pressure sensor 110 is an electronic device that senses and measures pressure, and is usually made of flexible materials and unique designs to detect and respond to changes in external pressure. The flexible sensor 110 includes a piezoresistive sensor, a capacitive sensor and a piezoelectric sensor. As Figure 2In the embodiment shown, the flexible pressure sensor 110 is taken as an example of a piezoresistive sensor. The flexible pressure sensor 110 includes a first encapsulation layer 111, a second encapsulation layer 112, a first electrode layer 113, a second electrode layer 114, and a piezoresistive layer 115. Any two adjacent prepreg layers include a first prepreg layer (not shown in the figure) and a second prepreg layer (not shown in the figure), and the first prepreg layer is closer to the center of the prepreg than the second prepreg layer. The first encapsulation layer 111 is attached to the first prepreg layer, and the second encapsulation layer 112 is attached to the second prepreg layer. The first electrode layer 113, the second electrode layer 114, and the piezoresistive layer 115 are located between the first encapsulation layer 111 and the second encapsulation layer 112, and the piezoresistive layer 115 is located between the first electrode layer 113 and the second electrode layer 114, and the first electrode layer 113 is located on the side of the piezoresistive layer 115 close to the first encapsulation layer 111.

[0047] Specifically, as shown in the figure, Figure 2 the first encapsulation layer 111 and the second encapsulation layer 112 are protective and pressure transmission layers of the flexible pressure sensor 110, and thus the first encapsulation layer 111 and the second encapsulation layer 112 are in contact with the prepreg layers, so as to transmit the pressure inside the prepreg layers to the piezoresistive layer 115. The piezoresistive layer 115 is composed of a matrix material and an active material, the active material is composed of carbon nanotubes (CNT), and the matrix material is composed of polydimethylsiloxane (PDMS). Further, as shown in the figure, Figure 2 when no pressure is applied to the flexible pressure sensor 110, the distance between the first electrode layer 113 and the second electrode layer 114 is the largest, that is, the piezoresistive layer 115 is not compressed, and the resistance of the flexible pressure sensor 110 is in the maximum state, and as shown in the figure, Figure 2 when pressure is applied to the flexible pressure sensor 110, the piezoresistive layer 115 is compressed, the distance between the first electrode layer 113 and the second electrode layer 114 is reduced, and the resistance of the flexible pressure sensor 110 is reduced. When the pressure is removed, the sensor returns to the initial state, so as to realize the detection of the pressure parameter inside the prepreg stack. In this way, by setting the flexible pressure sensor 110 as a piezoresistive sensor, the pressure parameter in the process of hot pressing the prepreg stack into a composite material can be accurately obtained, and the measurement method is simple.

[0048] Optionally, Figure 3 is a structural diagram of a flexible temperature sensor according to an embodiment of the present application. Referring to Figure 3 , the flexible sensor 10 includes a flexible temperature sensor 120. The flexible temperature sensor 120 is an electronic device made of flexible material, which is used for sensing and measuring temperature changes. Specifically, the flexible temperature sensor 120 usually includes film layers such as a temperature-sensitive layer and a flexible substrate, and is prepared by using advanced technologies such as inkjet printing and screen printing.

[0049] For example, such as Figure 3 In the illustrated embodiment, the flexible temperature sensor 120 includes a first flexible substrate 121 and a platinum resistance layer 122 located on one side of the first flexible substrate 121, the platinum resistance layer 122 being in contact with a prepreg layer. Specifically, as shown... Figure 1 and Figure 3 As shown, the platinum resistance layer 122 is the temperature-sensitive layer. By placing the platinum resistance layer 122 in contact with the prepreg layer 201, i.e., by placing the platinum resistance layer 122 within the prepreg stack 200, the temperature within the prepreg stack 200 can be accurately measured, minimizing the impact on the final composite material structure. This facilitates subsequent optimization of the composite material molding process. Furthermore, the platinum resistance layer 122 has high temperature sensitivity; therefore, incorporating the flexible temperature sensor 120, including the platinum resistance layer 122, can improve the accuracy of temperature parameter measurement.

[0050] It should be noted that the flexible temperature sensor 120 can be fabricated using photolithography and thin-film deposition processes. For example, photolithography is used to create small-sized patterned structures on photoresist on a flexible substrate to meet the miniaturization requirements of the device. Subsequently, platinum resistance material is deposited on the first flexible substrate 121 after photolithography using thin-film deposition technology. After the photoresist is peeled off, the platinum resistance layer 122 has a special patterned structure, which improves the response performance of the flexible temperature sensor 120.

[0051] Optionally, based on the above embodiments, see [link to relevant documentation]. Figures 1-3 The flexible sensor 10 includes a flexible pressure sensor 110 and a flexible temperature sensor 120. The flexible temperature sensor 110 and the flexible pressure sensor 120 are located between two adjacent prepreg layers 201.

[0052] Specifically, the flexible sensor 10 is attached between any two adjacent prepreg layers 201. Furthermore, by positioning the flexible temperature sensor 110 and the flexible pressure sensor 120 between the same two adjacent prepreg layers 201, pressure and temperature parameters at the same location (same layer) within the prepreg stack 200 can be measured, which facilitates subsequent optimization of the composite material molding process. It is understood that this embodiment of the invention only exemplifies the use of the flexible temperature sensor 110 and the flexible pressure sensor 120 located within the same layer of the prepreg stack 200. However, this is not a limitation; in other embodiments, the flexible temperature sensor 110 and the flexible pressure sensor 120 may be located in different layers within the prepreg stack 200, and those skilled in the art can configure them as needed.

[0053] Optionally, based on the above embodiments, Figure 4This is a structural schematic diagram of a heat insulation device provided in an embodiment of this utility model. See also... Figure 1 and Figure 4 The measurement system also includes a heat insulation device 30, which is located within the chamber 101. The heat insulation device 30 includes a protective outer shell 310, a vacuum-insulated inner shell 320, and a heat insulation layer 330. The heat insulation layer 330 is located between the protective outer shell 310 and the vacuum-insulated inner shell 320. The data acquisition device 20 is located within the vacuum-insulated inner shell 320.

[0054] Specifically, such as Figure 4 In the illustrated embodiment, since the data acquisition device 20 is located inside the chamber 101, i.e., the data acquisition device 20 is in a high-temperature and high-pressure enclosed environment, it may malfunction when the temperature is high. Therefore, this embodiment of the invention places the data acquisition device 20 inside the heat insulation device 30, which isolates the data acquisition device 20 from the high temperature inside the chamber 101, thereby ensuring the normal operation of the data acquisition device 20.

[0055] For example, the heat insulation device 30 includes a protective outer shell 310, a vacuum-insulated inner shell 320, and a heat insulation layer 330. The protective outer shell 310 is located on the outermost side of the heat insulation device 30 and can be made of stainless steel, primarily serving a protective function. Both the vacuum-insulated inner shell 320 and the heat insulation layer 330 provide heat insulation. A space is provided inside the vacuum-insulated inner shell 320, and the data acquisition device 20 is located within this space. Thus, the heat insulation layer 330 and the vacuum-insulated inner shell 320 further isolate the data acquisition device 20 from the high temperatures within the chamber 101, ensuring its normal operation.

[0056] It should be noted that the insulation layer 330 can be a multi-layered structure. For examples, see [link to example]. Figure 4The thermal insulation layer 330 includes a first thermal insulation layer 331 and a second thermal insulation layer 332. The second thermal insulation layer 332 is located between the first thermal insulation layer 331 and the vacuum thermal insulation inner shell 320. Specifically, the materials of the first thermal insulation layer 331 and the second thermal insulation layer 332 are different. The material of the first thermal insulation layer 331 can be a ceramic polymer material. The material of the second thermal insulation layer 332 can include silica aerogel and paraffin phase change material. It can be understood that the aerogel is a nanoporous material with nanoparticles as the skeleton and gas as the dispersion medium. It is also known as "solid smoke" due to its low density (as low as 3 mg / cm3), high porosity (as high as more than 99%) and high specific surface area (as high as more than 1000 m2 / g). Due to the unique skeleton morphology and pore size structure of the aerogel, the aerogel is currently the solid material with the lowest thermal conductivity. Its advantages are that the extremely low solid volume ratio and the complex three-dimensional porous network structure greatly inhibit the solid-phase heat conduction of the material; the pore size in the mesoporous range is smaller than the average free path of gas molecules, effectively reducing the gas heat conduction caused by the movement of gas molecules; the introduction of light shielding agent can improve the specific extinction coefficient of the aerogel, avoiding the significant increase of radiation heat transfer at high temperature. According to different material systems, the aerogel can be generally divided into inorganic oxide aerogel (SiO2, Al2O3, ZrO2, TiO2, etc.), organic aerogel (phenolic, polyimide, polyurethane, etc.), carbon aerogel and carbide aerogel (SiC, SiCO, ZrCO, etc.). Among them, silica aerogel is the most widely studied and most maturely applied aerogel type in thermal insulation. It is composed of nanoscale colloidal particles, and the porosity generally reaches more than 80%. Due to its low density characteristics and open structure, it is widely used in building energy saving, sensors, aerospace, etc. The paraffin phase change material has excellent thermal stability and high latent heat value, and can store and release heat energy through its solid-liquid phase change process, thereby further improving the thermal insulation capacity of the thermal insulation structure 30 by setting the material of the second thermal insulation layer 332 to include silica aerogel and paraffin phase change material, and ensuring the normal operation of the data acquisition device 20.

[0057] Optionally, on the basis of the above embodiment, continuing to refer to Figure 4 The protective shell 310 includes a top cover (not shown in the figure) and a protective shell body (not shown in the figure), and the top cover is fixedly connected with the protective shell body through a lock buckle. The thermal insulation device 30 further includes a through hole (not shown in the figure). The through hole penetrates the top cover, the thermal insulation layer 330 and the vacuum thermal insulation inner shell 320. The measurement system further includes a cable 40. One end of the cable 40 is electrically connected with the flexible sensor 10, and the other end of the cable is electrically connected with the data acquisition device 20 through the through hole.

[0058] Specifically, the top cover is detachably and fixedly connected with the protective shell body through the buckles, so that the heat insulation layer 330 and the vacuum heat preservation inner shell 320 are arranged in the protective shell body, and the data acquisition device 20 is arranged in the vacuum heat preservation inner shell 320, and in addition, the through hole penetrates through the top cover, the heat insulation layer 330 and the vacuum heat preservation inner shell 320, so as to facilitate the electrical connection between one end of the cable 40 and the flexible sensor 10, and the electrical connection between the other end of the cable and the data acquisition device 20 through the through hole, so as to ensure that the temperature parameters and the pressure parameters collected by the flexible sensor 10 can be transmitted and stored in the data acquisition device 20.

[0059] Optionally, Figure 5 is a structural schematic diagram of a data acquisition device provided by the embodiment of the utility model. Referring to Figure 5 , the data acquisition device 20 comprises a second flexible substrate 210 and a sensor interface 220, an operational amplifier chip 230 and a storage unit 240 integrated on one side of the second flexible substrate 210. The sensor interface 220 is electrically connected with the flexible sensor 10, and the operational amplifier chip 230 is electrically connected with the sensor interface 220 and the storage unit 240 respectively.

[0060] Specifically, as shown in the embodiment, Figure 5 Because the sensor is a flexible sensor, the data acquisition device 20 can also be arranged as a flexible data acquisition device 20. That is, the data acquisition device 20 comprises a second flexible substrate 210. The sensor interface 220, the operational amplifier chip 230 and the storage unit 240 are all integrated on the second flexible substrate 210. In addition, the sensor interface 220 is electrically connected with the flexible sensor 10, so as to receive the environmental parameters collected by the flexible sensor 10 through the sensor interface 220, and the operational amplifier chip 230 is electrically connected with the sensor interface 220 and the storage unit 240 respectively, so that the environmental parameters received by the sensor interface 220 are output to the storage unit 240 for storage after being amplified and processed by the operational amplifier chip 230, thereby ensuring the normal work of the data acquisition device 20.

[0061] It should be noted that the above are only preferred embodiments of the utility model and the technical principles applied. Those skilled in the art will understand that the utility model is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments, mutual combinations and substitutions without departing from the protection scope of the utility model. Therefore, although the utility model has been described in more detail through the above embodiments, the utility model is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the utility model concept, and the scope of the utility model is determined by the appended claims.

Claims

1. A measurement system based on a hot press tank device, the hot press tank device comprising a hot press tank and a prepreg stack, the hot press tank comprising a chamber, the prepreg stack being placed in the chamber, characterized in that, the measurement system comprises a flexible sensor and a data acquisition device; the prepreg stack comprises a plurality of prepreg layers arranged in a stack, the flexible sensor being attached between any two adjacent prepreg layers, the data acquisition device being arranged in the chamber; the flexible sensor is electrically connected to the data acquisition device.

2. The measurement system of claim 1, wherein, the flexible sensor comprises a flexible pressure sensor.

3. The measurement system of claim 2, wherein, the flexible pressure sensor comprises a first encapsulation layer, a second encapsulation layer, a first electrode layer, a second electrode layer, and a piezoresistive layer; any two adjacent prepreg layers comprise a first prepreg layer and a second prepreg layer, the first prepreg layer being closer to a center position of the prepreg than the second prepreg layer; the first encapsulation layer is attached to the first prepreg layer, and the second encapsulation layer is attached to the second prepreg layer; the first electrode layer, the second electrode layer, and the piezoresistive layer are all located between the first encapsulation layer and the second encapsulation layer, and the piezoresistive layer is located between the first electrode layer and the second electrode layer, and the first electrode layer is located on a side of the piezoresistive layer closer to the first encapsulation layer.

4. The measurement system of claim 1, wherein, the flexible sensor comprises a flexible temperature sensor. 5.The measurement system of claim 4, characterized in that, the flexible temperature sensor comprises a first flexible substrate and a platinum resistance layer located on a side of the first flexible substrate; the platinum resistance layer is in contact with the prepreg layer.

6. The measurement system of claim 1, wherein, the flexible sensor comprises a flexible pressure sensor and a flexible temperature sensor; the flexible temperature sensor and the flexible pressure sensor are located between the same two adjacent prepreg layers.

7. The measurement system of claim 1, wherein, the measurement system further comprises a heat insulation device, the heat insulation device being located in the chamber; the heat insulation device comprises a protective shell, a vacuum insulation inner shell, and a heat insulation layer; the heat insulation layer is located between the protective shell and the vacuum insulation inner shell; the data acquisition device is located in the vacuum insulation inner shell.

8. The measurement system of claim 7, wherein, the heat insulation layer comprises a first heat insulation layer and a second heat insulation layer; the second heat insulation layer is located between the first heat insulation layer and the vacuum insulation inner shell.

9. The measurement system of claim 7, wherein, the protective shell comprises a top cover and a protective shell body, the top cover being fixedly connected to the protective shell body by a lock buckle; the heat insulation device further comprises a via hole; the via hole penetrates through the top cover, the heat insulation layer, and the vacuum insulation inner shell; the measurement system further comprises a cable; one end of the cable is electrically connected to the flexible sensor, and the other end of the cable is electrically connected to the data acquisition device through the via hole. 10.The measurement system of claim 1, characterized in that, the data acquisition device comprises a second flexible substrate, a sensor interface, an operational amplifier chip, and a storage unit integrated on a side of the second flexible substrate; the sensor interface is electrically connected to the flexible sensor; the operational amplifier chip is electrically connected to the sensor interface and the storage unit, respectively.

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