Chemical nickel plating tank for processing printed circuit board

Abstract

The utility model discloses a chemical nickel plating tank for processing a printed circuit board, which comprises a base, the top of the base is fixedly connected with a nickel plating tank body, the left end of the nickel plating tank body is provided with a motor, and a liquid adding pipe is fixedly arranged above the right side of the nickel plating tank body; a stirring rod is connected to the lower portion of the interior of the nickel plating tank body, a reciprocating lead screw and a fixed rod are connected to the left side and the right side of the upper portion of the interior of the base correspondingly, and the outer side of the reciprocating lead screw and the outer side of the fixed rod are sleeved with a movable net plate. According to the chemical nickel plating tank for treating the printed circuit board, the motor is used for driving the stirring rod to rotate, nickel liquid in the nickel plating tank body can be stirred, the nickel liquid is prevented from precipitating, and the uniformity and activity of the nickel liquid are kept; and the reciprocating screw rod rotates and drives the movable screen plate to move upwards, so that a worker can conveniently take the printed circuit board.

Description

TECHNICAL FIELD

[0001] The utility model relates to printed circuit board processing technical field, concretely is a kind of printed circuit board processing with chemical nickel plating tank. BACKGROUND

[0002] The main role of the chemical nickel plating tank is to deposit a uniform and dense nickel plating layer on the copper surface of the printed circuit board. This nickel plating layer not only has excellent electrical conductivity and wear resistance, but also effectively prevents oxidation and corrosion of copper, thereby improving the reliability and service life of the printed circuit board. However, the chemical nickel plating tank on the market cannot better increase the contact area of the reactants during use, cannot better improve the work efficiency, and cannot timely treat the sewage after use, which is easy to cause pollution and cannot meet the needs in actual work. To solve the above problems, the prior art (Chinese patent with application number 201820308427.1 and authorization announcement date of October 12, 2018) discloses a chemical nickel plating tank. Three first reaction tanks and three second reaction tanks are arranged inside the device body. The contact area of the reactants can be better increased during use, and the work efficiency can be better improved. A slot is arranged on the first reaction tank and the second reaction tank. By inserting the blocking plate, the amount of reactants can be timely adjusted, which is suitable for more situations. An extraction groove with a waste liquid storage box is arranged inside the base. The sewage can be timely left in the waste liquid storage box, reducing the pollution of waste liquid to the environment.

[0003] The prior art can better increase the contact area of the reactants by arranging the first reaction tank and the second reaction tank. However, some components (such as boric acid) in the nickel solution in the nickel plating tank may crystallize at low temperature when the nickel solution is stationary for a long time, causing problems such as filter blockage and slow liquid feeding speed. These crystalline substances may also react with other components to generate water-insoluble precipitates, further affecting the performance of the nickel solution. In addition, the printed circuit board needs to be manually retrieved by the staff after the plating is completed, which makes the use not convenient enough. Therefore, the chemical nickel plating tank for printed circuit board processing can well solve the above problems. UTILITY MODEL CONTENTS

[0004] The utility model aims to provide a chemical nickel plating tank for printed circuit board processing to solve the problem that some components (such as boric acid) in the nickel solution may crystallize at low temperature when the nickel solution is stationary for a long time, causing problems such as filter blockage and slow liquid feeding speed. These crystalline substances may also react with other components to generate water-insoluble precipitates, further affecting the performance of the nickel solution. In addition, the printed circuit board needs to be manually retrieved by the staff after the plating is completed, which makes the use not convenient enough.

[0005] In order to achieve the above object, the utility model provides the following technical scheme: A kind of chemical nickel plating tank for printed circuit board processing, including base, the top of the base is fixedly connected with nickel plating tank body, and motor is installed at the left end of nickel plating tank body, and fixed with liquid adding pipe being arranged in the upper right side of nickel plating tank body;Stirring rod is connected at the lower portion of the inside of nickel plating tank body, and the upper portion of the inside of base is respectively connected with reciprocating screw rod and fixed rod, and movable mesh plate is sleeved on the outside of reciprocating screw rod and fixed rod;Sleeve is sleeved on the outside of the lower end of reciprocating screw rod, and ratchet assembly is connected between sleeve and reciprocating screw rod, and the bottom end of sleeve and the outside of the left end of stirring rod are connected by bevel gear set transmission.

[0006] Preferably, the reciprocating screw rod is rotatably connected in the inside of the nickel plating tank body, the fixed rod is bolted in the inside of the nickel plating tank body, the movable mesh plate is threadedly connected with the reciprocating screw rod, and the movable mesh plate is slidably connected with the fixed rod.

[0007] Preferably, the left end of the stirring rod extends out of the left side of the nickel plating tank body, and the left end of the stirring rod is fixedly connected with the output end of the motor, the shaft end of the stirring rod is connected in the inside of the nickel plating tank body, and the sleeve is rotatably connected in the inside of the nickel plating tank body.

[0008] Preferably, heating pipes are bolted on the upper portions of the left and right sides in the inside of the nickel plating tank body.

[0009] Preferably, a collecting box is slidably engaged in the inside of the base, a sewage pipe is fixed on the upper portion of the left side in the inside of the base, and an electromagnetic valve is installed in the inside of the sewage pipe.

[0010] Preferably, one end of the sewage pipe is fixedly connected with the bottom of the nickel plating tank body, the lower end of the sewage pipe is located at the opening position of the top of the collecting box, and the sewage pipe is connected with the inside of the nickel plating tank body.

[0011] Preferably, a sealing cover is engaged on the opening position of the top of the nickel plating tank body.

[0012] Compared with the prior art, the printed circuit board processing chemical nickel plating tank has the beneficial effects that: the printed circuit board processing chemical nickel plating tank adopts a novel structure design, and the specific contents are as follows: (1) the motor drives the stirring rod to rotate, the nickel liquid in the nickel plating tank body can be stirred, the nickel liquid is prevented from depositing, the uniformity and activity of the nickel liquid are maintained, when the stirring rod reversely rotates, the bevel gear set drives the sleeve to rotate, the sleeve drives the reciprocating screw rod to rotate through the ratchet assembly, the movable mesh plate is moved upwards, the printed circuit board is moved upwards, and then the staff can conveniently take the printed circuit board; further, the movable mesh plate can drive the printed circuit board to move downwards and enter the inside of the nickel plating tank body, and a uniform and dense nickel plating layer is deposited on the copper surface of the printed circuit board.

[0013] (2) the waste liquid in the nickel plating tank body is discharged into the collecting box through the blowdown pipe, is collected, then the collecting box is pulled, the collecting box is taken off from the base, and the waste liquid in the collecting box is poured out, so that the waste liquid pollutes the environment is reduced, the sealing cover plate is covered on the opening of the nickel plating tank body, dust and impurities in the outside are prevented from entering the nickel liquid, and the nickel plating effect on the printed circuit board is affected.

[0014] (3) the plurality of separation mesh plates arranged on the movable mesh plate can arrange the plurality of printed circuit boards, the nickel plating work is facilitated, and the heating pipe is arranged to heat the nickel liquid in the nickel plating tank body, and the nickel liquid is ensured to be kept in a constant temperature state. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a main sectional structure schematic view of the utility model;

[0016] Figure 2 It is a collecting box pull-out structure schematic view of the utility model;

[0017] Figure 3 It is a cover plate and nickel plating tank body connecting structure schematic view of the utility model;

[0018] Figure 4 It is a movable mesh plate and separation mesh plate three-dimensional structure schematic view of the utility model;

[0019] Figure 5 It is a ratchet assembly bottom view structure schematic view of the utility model;

[0020] Figure 6 It is a Figure 1 It is an enlarged structure schematic view of A in the utility model.

[0021] In the figure: 1, base; 2, nickel plating tank body; 3, sealing cover; 4, liquid adding pipe; 5, collection box; 6, sewage pipe; 7, bevel gear set; 8, movable mesh plate; 9, partition mesh plate; 10, stirring rod; 11, reciprocating screw rod; 12, fixed rod; 13, heating pipe; 14, sleeve; 15, ratchet assembly. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0023] Please refer to Figures 1-6 The utility model provides the following technical scheme: a chemical nickel plating tank for printed circuit board processing,

[0024] Embodiment one: in order to solve the problem that in the prior art, some components (such as boric acid) in the nickel solution in the nickel plating tank may crystallize at low temperature when the nickel solution is static for a long time, causing the filter to be blocked, the liquid feeding speed to be reduced and other problems, and these crystalline substances may react with other components to generate water-insoluble precipitates, further affecting the performance of the nickel solution, and the printed circuit board needs to be manually fished after the plating solution is completed, causing the use to be inconvenient, therefore the following scheme is disclosed, and specific reference is made to Figures 1-6 As shown in the figure, it comprises a base 1, the top of the base 1 is fixedly connected with a nickel plating tank body 2, a motor is installed at the left end of the nickel plating tank body 2, and a liquid adding pipe 4 is fixedly arranged at the upper right side of the nickel plating tank body 2; a stirring rod 10 is connected to the lower part inside the nickel plating tank body 2, reciprocating screw rods 11 and fixed rods 12 are respectively connected to the left and right sides of the upper part inside the base 1, a movable mesh plate 8 is sleeved outside the reciprocating screw rods 11 and the fixed rods 12, the reciprocating screw rods 11 are rotationally connected inside the nickel plating tank body 2, the fixed rods 12 are bolted inside the nickel plating tank body 2, the movable mesh plate 8 is threadedly connected between the reciprocating screw rods 11, and the movable mesh plate 8 is slidably connected between the fixed rods 12; a sleeve 14 is sleeved outside the lower end of the reciprocating screw rods 11, a ratchet assembly 15 is connected between the sleeve 14 and the reciprocating screw rods 11, the bottom end of the sleeve 14 is in transmission connection with the outside of the left end of the stirring rod 10 through a bevel gear set 7, the left end of the stirring rod 10 protrudes out of the left side surface of the nickel plating tank body 2, the left end of the stirring rod 10 is fixedly connected with the output end of the motor, the shaft end of the stirring rod 10 is connected inside the nickel plating tank body 2, and the sleeve 14 is rotationally connected inside the nickel plating tank body 2.

[0025] In use, the workers will be placed on the movable mesh plate 8 respectively multiple printed circuit board, and can be used to separate the mesh plate 9, can be placed separately multiple printed circuit board, facilitate subsequent in the nickel plating multiple printed circuit board each other interference, and then start the motor, the motor drive stirring rod 10 reverse rotation, so that the stirring rod 10 with bevel gear set 7 driven sleeve 14 reverse rotation, while the sleeve 14 with ratchet assembly 15 drive reciprocating screw rod 11 rotation, so that the movable mesh plate 8 rises to the top point after the automatic downward movement, and drive printed circuit board to move up to the inside of the nickel plating tank body 2, then through the liquid adding pipe 4 to the inside of the nickel plating tank body 2 adds nickel liquid, make it on the copper surface of printed circuit board deposited a layer of uniform, dense nickel plating layer, after the nickel liquid for a long time, start the motor, the motor drive stirring rod 10 forward rotation (at this time the reciprocating screw rod 11 will not rotate), can be stirred in the nickel plating tank body 2 of nickel liquid, prevent the nickel liquid precipitation, to maintain its uniformity and activity, finally when the printed circuit board nickel plating is completed, again through the motor drive stirring rod 10 reverse rotation, at this time the movable mesh plate 8 upward movement, and drive printed circuit board to move up, so as to facilitate the workers to take printed circuit board.

[0026] Example two: different from example one, this embodiment utilizes the setting of the sealing cover 3 can prevent the dust and impurities from the outside into the nickel liquid, and affect the effect of printed circuit board on the nickel plating, specific reference Figures 1-3 As shown in the figure, the opening position of the nickel plating tank body 2 top is connected with sealing cover 3, the inside of the nickel plating tank body 2 left and right two sides of the upper bolt connection has heating pipe 13.

[0027] The nickel liquid in the nickel plating tank body 2 is heated by heating pipe 13, so that the nickel liquid keeps in constant temperature state, then through the sealing cover 3 cover in the opening position of the nickel plating tank body 2, so as to be in a relatively sealed environment, can prevent the dust and impurities from the outside into the nickel liquid, and affect the effect of printed circuit board on the nickel plating.

[0028] Example three: different from example two, this embodiment utilizes the setting of the collection box 5 can collect waste liquid, reduce waste liquid pollution environment, specific reference Figures 1-3 As shown in the figure, the inside of the base 1 is connected with the collection box 5, the inside of the base 1 left side of the upper fixed has drain pipe 6, the inside of the drain pipe 6 is installed with electromagnetic valve, one end of the drain pipe 6 and the bottom of the nickel plating tank body 2 is fixedly connected, and the lower end of the drain pipe 6 is located in the opening position of the top of the collection box 5, the drain pipe 6 and the inside of the nickel plating tank body 2 is connected.

[0029] When the plating solution of the printed circuit board is finished, the electromagnetic valve is opened, so that the used waste liquid in the plating nickel tank body 2 is discharged into the collecting box 5 through the drain pipe 6, and is collected.

[0030] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art.

[0031] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A printed circuit board processing electroless nickel plating tank, comprising a base (1), the top of the base (1) is fixedly connected with a nickel plating tank body (2), and a motor is installed at the left end of the nickel plating tank body (2), and a liquid adding pipe (4) is fixedly arranged at the upper right side of the nickel plating tank body (2); characterized in that A stirring rod (10) is connected to the lower part of the inside of the nickel plating tank body (2), and reciprocating screw rods (11) and fixed rods (12) are respectively connected to the upper left and right sides of the inside of the base (1), and movable mesh plates (8) are sleeved on the outer sides of the reciprocating screw rods (11) and the fixed rods (12); A sleeve (14) is sleeved on the outer side of the lower end of the reciprocating screw rod (11), and a ratchet assembly (15) is connected between the sleeve (14) and the reciprocating screw rod (11), and the bottom end of the sleeve (14) is drivingly connected to the outer side of the left end of the stirring rod (10) through a bevel gear set (7).

2. The electroless nickel plating bath for printed circuit board processing according to claim 1, characterized in that: The reciprocating screw rod (11) is rotationally connected in the inside of the nickel plating tank body (2), the fixed rod (12) is bolted in the inside of the nickel plating tank body (2), the movable mesh plate (8) is threadedly connected between the reciprocating screw rod (11), and the movable mesh plate (8) is slidingly connected with the fixed rod (12).

3. The electroless nickel plating bath for printed circuit board processing according to claim 1, characterized in that: The left end of the stirring rod (10) extends out of the left side of the nickel plating tank body (2), and the left end of the stirring rod (10) is fixedly connected to the output end of the motor, the shaft end of the stirring rod (10) is connected in the inside of the nickel plating tank body (2), and the sleeve (14) is rotationally connected in the inside of the nickel plating tank body (2).

4. The electroless nickel plating bath for printed circuit board processing according to claim 1, wherein: Heating pipes (13) are bolted on the upper parts of the left and right sides of the inside of the nickel plating tank body (2).

5. The electroless nickel plating bath for printed circuit board processing according to claim 1, wherein: A collecting box (5) is slidingly and clampingly connected in the inside of the base (1), a sewage pipe (6) is fixedly arranged on the upper left side of the inside of the base (1), and a solenoid valve is installed in the inside of the sewage pipe (6).

6. A plating bath for electroless nickel plating of printed circuit boards according to claim 5, characterized in that: One end of the sewage pipe (6) is fixedly connected to the bottom of the nickel plating tank body (2), the lower end of the sewage pipe (6) is located at the opening position of the top of the collecting box (5), and the sewage pipe (6) is connected with the inside of the nickel plating tank body (2).

7. The electroless nickel plating bath for printed circuit board processing according to claim 1, wherein: A sealing cover (3) is clampingly connected to the opening position of the top of the nickel plating tank body (2).

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