Semiconductor packaging detection structure
By designing an automated semiconductor packaging inspection structure, utilizing conveyor belt positioning and inspection rack mobility, and combining cameras and lighting, the problem of low accuracy in manual inspection is solved, achieving efficient packaging inspection.
Patent Information
- Application Number
- CN202422817721.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-11-19
AI Technical Summary
Existing semiconductor packaging inspection equipment relies on manual inspection, resulting in low inspection accuracy, easy misjudgment and missed detection, extended production cycle and reduced production efficiency.
A semiconductor packaging inspection structure was designed, including an inspection stage, a conveyor belt, a limiting component, an inspection frame, and a lighting lamp. By utilizing the limiting function of the conveyor belt and the mobility of the inspection frame, combined with a camera and a signal image processor, automated inspection is achieved.
It improved detection accuracy, reduced false positives and false negatives, shortened the production cycle, and increased production efficiency.
Smart Images
Figure CN223637408U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor packaging, especially relates to a semiconductor packaging detection structure. BACKGROUND
[0002] Semiconductor packaging refers to the process that the wafer that passes through the test is processed into independent chips according to product model and functional demand, and the packaging process is as follows: the wafer from wafer front-end process is cut into small dies (Die) after scribing process, then the cut die is attached to the corresponding island of the substrate (lead frame) frame by glue, and the bonding pad (Bond Pad) of the die is connected to the corresponding lead of the substrate by using superfine metal (gold, tin, copper and aluminum) wire or conductive resin, and the required circuit is formed.
[0003] The existing semiconductor packaging detection equipment adopts manual quality detection, but manual detection affects the detection accuracy, leading to misjudgment and missed detection, which not only causes the packaging to need rework and remeasurement, prolongs the production cycle and reduces the production efficiency. UTILITY MODEL CONTENTS
[0004] The utility model discloses a semiconductor packaging detection structure to solve the problem that the existing semiconductor packaging detection equipment adopts manual quality detection, but manual detection affects the detection accuracy, leading to misjudgment and missed detection, which not only causes the packaging to need rework and remeasurement, prolongs the production cycle and reduces the production efficiency.
[0005] To achieve the above object, the utility model provides the following technical scheme: a semiconductor packaging detection structure, including the detection table, the bottom of detection table is opened in the material collecting groove, the inside of material collecting groove is equipped with the material collecting board, and the side surface of detection table is equipped with the support frame, the top of support frame is swingly connected with the conveyer belt, the right side surface of conveyer belt is equipped with the auxiliary roller in the top of detection table, the inside of detection table is equipped with the limiting piece in the top of conveyer belt, the top of detection table is opened in the guide rail, the top of guide rail is swingly connected with the detection frame, the bottom of detection frame is fixedly connected with the fixed sleeve, the inside of fixed sleeve is screwly connected with the lead screw, the top of detection frame is fixedly connected with the signal image processor, the top of lead screw is fixedly connected with the conical pulley one.
[0006] As a preferred technical scheme of the utility model, the bottom of material collecting groove is equipped with the ball, and the top of ball is slidably connected with the bottom of material collecting board.
[0007] As a preferred technical scheme of the utility model, the top inner side of the detection table is fixedly connected with a lighting lamp located at the side of the auxiliary roller.
[0008] As a preferred technical scheme of the utility model, the limiting piece comprises a limiting plate, a bearing, a screw rod and a hand wheel one, the limiting plate is located above the conveying belt, the side surface of the limiting plate is rotatably connected with the screw rod through the bearing, the screw rod is threadedly connected with the side surface of the detection table, and the top of the screw rod is fixedly connected with the hand wheel one.
[0009] As a preferred technical scheme of the utility model, the fixing sleeve is slidably connected to the inner side of the guide rail.
[0010] As a preferred technical scheme of the utility model, the bottom of the detection frame is fixedly connected with a detection camera, and the detection camera is electrically connected with a signal image processor.
[0011] As a preferred technical scheme of the utility model, the top of the detection frame is movably connected with a sliding rod, and the sliding rod is located at the inner side of the guide rail.
[0012] As a preferred technical scheme of the utility model, the right top of the detection table is movably connected with a hand wheel two, the inner side of the hand wheel two is fixedly connected with a conical wheel two, and the conical wheel two is meshingly connected with the side surface of the conical wheel one.
[0013] Compared with the prior art, the utility model has the advantages of:
[0014] 1、the utility model discloses a detection table top through support frame installation conveying belt, and the top of the conveying belt is equipped with the limiting piece located at the side of the detection table, and the limiting piece is located in the limiting plate side surface through bearing installation the screw rod located at the side of the detection table, and the top of the screw rod is installed hand wheel one, and rotates hand wheel one, can make the position of two limiting plates move, can limit the transmission direction of the semiconductor, makes it keep in the middle part of the auxiliary roller when blanking, and the detection camera is convenient for detecting and detecting.
[0015] 2, the utility model discloses a guide rail top through the fixed cover and screw rod cooperation installation detection frame is seted on the top of detection platform, the taper wheel one installed on the top of screw rod and the taper wheel two on the side of runner two meshing connection can make detection frame move to the upper of auxiliary roll and carry out detection to semiconductor, and the illumination lamp of detection platform top fixed connection is located in the oblique upper of auxiliary roll, and the illumination lamp can provide illumination for detection equipment, avoids the situation of not accurate detection. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the structure main view of the utility model;
[0017] Figure 2 It is the structure local main view of the utility model;
[0018] Figure 3 It is the structure detection frame diagram of the utility model;
[0019] Figure 4 It is the structure limiting piece diagram of the utility model.
[0020] In the drawing: 1, detection platform;2, material collecting groove;3, material collecting plate;4, support frame;5, transmission belt;6, limiting piece;61, limiting plate;62, bearing;63, screw;64, hand wheel one;7, auxiliary roll;8, illumination lamp;9, guide rail;10, detection frame;11, signal image processor;12, detection camera;13, slide bar;14, fixed cover;15, screw rod;16, taper wheel one;17, taper wheel two;18, hand wheel two. DETAILED DESCRIPTION
[0021] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the scope of protection of the utility model.
[0022] Please refer to Figures 1-4The utility model provides a kind of semiconductor packaging detection structure, including detection table 1, the bottom of detection table 1 is equipped with material collecting groove 2, the inside of material collecting groove 2 is equipped with material collecting plate 3, and the side of detection table 1 is equipped with support frame 4, the top of support frame 4 is movably connected with transmission belt 5, the right side of transmission belt 5 is equipped with auxiliary roller 7 located in the top of detection table 1, the inside of detection table 1 is equipped with limiting piece 6 located in the top of transmission belt 5, the top of detection table 1 is equipped with guide rail 9, the top of guide rail 9 is movably connected with detection frame 10, the bottom of detection frame 10 is fixedly connected with fixed sleeve 14, the inside of fixed sleeve 14 is threadedly connected with lead screw 15, the top of detection frame 10 is fixedly connected with signal image processor 11, the top of lead screw 15 is fixedly connected with conical pulley one 16.
[0023] The bottom of material collecting groove 2 is equipped with ball, the top of ball is slidably connected with the bottom of material collecting plate 3, the inside of the top of detection table 1 is fixedly connected with illuminating lamp 8 located in the side of auxiliary roller 7;Detection table 1 top fixedly connected in the oblique upper side of auxiliary roller 7's illuminating lamp 8, illuminating lamp 8 can provide illumination for detection equipment, avoid the situation of inaccurate detection, limiting piece 6 includes limiting plate 61, bearing 62, screw rod 63 and hand wheel one 64, limiting plate 61 is located above transmission belt 5, and the side of limiting plate 61 is rotatably connected with screw rod 63 through bearing 62, screw rod 63 is threadedly connected with the side of detection table 1, and the top of screw rod 63 is fixedly connected with hand wheel one 64;Detection table 1 top installs transmission belt 5 through support frame 4, the top of transmission belt 5 is equipped with limiting piece 6 located in the side of detection table 1, the side of limiting plate 61 in limiting piece 6 is installed screw rod 63 located in the side of detection table 1 through bearing 62, the top of screw rod 63 installs hand wheel one 64, rotates hand wheel one 64, can make the position of two limiting plates 61 be moved, can limit semiconductor transmission direction, make it keep in the middle part of auxiliary roller 7 when blanking, facilitate detection camera 12 to detect it, fixed sleeve 14 is slidably connected in the inside of guide rail 9.
[0024] The bottom of detection frame 10 is fixedly connected with detection camera 12, detection camera 12 is electrically connected with signal image processor 11, the top of detection frame 10 is movably connected with slide rod 13, slide rod 13 is located in the inside of guide rail 9, the right top of detection table 1 is movably connected with hand wheel two 18, the inside of hand wheel two 18 is fixedly connected with conical pulley two 17, conical pulley two 17 is meshingly connected with the side of conical pulley one 16;The top of guide rail 9 opened in the top of detection table 1 is installed detection frame 10 through fixed sleeve 14 and lead screw 15 cooperation, the top of lead screw 15 installed conical pulley one 16 is meshingly connected with the conical pulley two 17 of the side of runner two, can make detection frame 10 move to the upper side of auxiliary roller 7 and detect semiconductor.
[0025] In specific use, first, the top of the detection table 1 is installed with the conveying belt 5 through the support frame 4, the top of the conveying belt 5 is provided with the limiting piece 6 located at the side of the detection table 1, the side of the limiting plate 61 in the limiting piece 6 is installed with the screw rod 63 located at the side of the detection table 1 through the bearing 62, the top of the screw rod 63 is installed with the hand wheel one 64, rotating the hand wheel one 64 can move the position of the two limiting plates 61, the semiconductor conveying direction can be limited, so that it can be kept in the middle part of the auxiliary roller 7 when falling, and the detection camera 12 can conveniently detect it, the top of the detection table 1 is installed with the detection frame 10 through the fixed sleeve 14 and the screw rod 15, the top of the screw rod 15 is installed with the conical wheel one 16, the conical wheel two 17 on the side of the rotating wheel two is engagedly connected, so that the detection frame 10 can be moved above the auxiliary roller 7 to detect the semiconductor, and the top of the detection table 1 is fixedly connected with the illuminating lamp 8 located obliquely above the auxiliary roller 7, the illuminating lamp 8 can provide illumination for the detection equipment, so that the inaccuracy of detection can be avoided.
[0026] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A semiconductor package inspection structure comprising an inspection table (1), characterized in that: The bottom of the detection table (1) is provided with a material collecting groove (2), the inner side of the material collecting groove (2) is provided with a material collecting plate (3), and the side of the detection table (1) is provided with a support frame (4), the top of the support frame (4) is movably connected with a conveying belt (5), the right side of the conveying belt (5) is provided with an auxiliary roller (7) located on the top of the detection table (1), the inner side of the detection table (1) is provided with a limiting piece (6) located on the top of the conveying belt (5), the top of the detection table (1) is provided with a guide rail (9), the top of the guide rail (9) is movably connected with a detection frame (10), the bottom of the detection frame (10) is fixedly connected with a fixed sleeve (14), the inner side of the fixed sleeve (14) is threadedly connected with a lead screw (15), the top of the detection frame (10) is fixedly connected with a signal image processor (11), and the top end of the lead screw (15) is fixedly connected with a conical pulley (16).
2. The semiconductor package inspection structure of claim 1, wherein: The bottom of the material collecting groove (2) is provided with a ball, and the top of the ball is movably connected with the bottom of the material collecting plate (3).
3. The semiconductor package inspection structure of claim 1, wherein: The top inner side of the detection table (1) is fixedly connected with a lighting lamp (8) located on the side of the auxiliary roller (7).
4. The semiconductor package inspection structure of claim 1, wherein: The limiting piece (6) comprises a limiting plate (61), a bearing (62), a screw rod (63) and a hand wheel (64), the limiting plate (61) is located above the conveying belt (5), the side of the limiting plate (61) is rotatably connected with the screw rod (63) through the bearing (62), the screw rod (63) is threadedly connected with the side of the detection table (1), and the top of the screw rod (63) is fixedly connected with the hand wheel (64).
5. The semiconductor package inspection structure of claim 1, wherein: The fixed sleeve (14) is movably connected on the inner side of the guide rail (9).
6. The semiconductor package inspection structure of claim 1, wherein: The bottom of the detection frame (10) is fixedly connected with a detection camera (12), and the detection camera (12) is electrically connected with the signal image processor (11).
7. The semiconductor package inspection structure of claim 1, wherein: The top of the detection frame (10) is movably connected with a sliding rod (13), and the sliding rod (13) is located on the inner side of the guide rail (9).
8. The semiconductor package inspection structure of claim 1, wherein: The right top of the detection table (1) is movably connected with a hand wheel (18), the inner side of the hand wheel (18) is fixedly connected with a conical pulley (17), and the conical pulley (17) is meshingly connected with the side of the conical pulley (16).