Detection device and current detection equipment

Abstract

The utility model relates to the field of detection equipment, in particular to a detection device and current detection equipment. The detection device comprises a substrate, a sampling resistor and a plurality of reserved bonding pads. The plurality of reserved bonding pads are arranged on the substrate, the plurality of reserved bonding pads are connected in parallel, and at least one reserved bonding pad is welded with a sampling resistor; the reserved bonding pad comprises bonding pad assemblies which are oppositely arranged; the bonding pad assembly comprises a first bonding pad and a second bonding pad which are arranged at an interval; the first bonding pads of the bonding pad assemblies on the same side are connected with each other and are used for connecting a circuit to be detected; the second bonding pads of the bonding pad assemblies on the same side are connected with each other and used for being connected with a voltage detection line. One end of the sampling resistor is connected with the first bonding pad and the second bonding pad of the bonding pad assembly on one side of the reserved bonding pad, and the other end of the sampling resistor is connected with the first bonding pad and the second bonding pad of the bonding pad assembly on the other side of the reserved bonding pad. According to the detection device provided by the invention, the influence of the line resistance of the reserved bonding pad which is not welded with the sampling resistor on voltage detection can be avoided, so that the detection precision is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of detection equipment, in particular to a detection device and a current detection equipment. BACKGROUND

[0002] As shown in Figure 6 and Figure 7 In the field of current detection, generally, a sampling resistor 102' of a certain resistance value is connected in series in a loop, and the loop current value I' is obtained by measuring the voltage U0' of the sampling resistor.

[0003] When measuring the loop current value of a lithium battery protection plate, the resistance R' of the sampling resistor is small (usually in the order of milliohms), which results in a large influence of the line resistances R1' and R2' on the sampling accuracy. To solve the above problem, the conventional solution is to lead the voltage detection line of the detection device from the middle of the inside of the sampling resistor pad, so as to avoid the influence of the line resistance on the detection accuracy.

[0004] As shown in Figure 6 To increase the application range of the detection device, two or more sampling resistors can be connected in parallel, the loop current value I' is the sum of the currents I1' and I2' flowing through the multiple sampling resistors, and U0'=(I1'×R'+I2'×R')2=(I1'+I2')R' / 2=I'R' / 2. Given the value of R', I' can be obtained according to the detected U0'. In actual measurement, a part of the sampling resistors can be welded to the pads of the detection circuit according to the requirements to be connected to the detection circuit, so as to change the resistance value of the sampling resistor connected to the detection circuit. However, the voltage detection line connected to the pad of the sampling resistor not welded will also be connected to the detection circuit, thereby introducing the voltage inside the pad of the non-sampling resistor, resulting in a larger detected voltage than the voltage across the actual precision resistor, and affecting the detection accuracy. CONTENT OF THE INVENTION

[0005] The present application aims to provide a detection device and a current detection equipment, which can avoid introducing the voltage inside the pad of the non-sampling resistor, thereby improving the detection accuracy.

[0006] The present application provides a detection device, which comprises a substrate, a sampling resistor and multiple reserved pads.

[0007] The multiple reserved pads are arranged on the substrate, and the multiple reserved pads are connected in parallel, and at least one of the reserved pads is welded with the sampling resistor.

[0008] The reserved pads include oppositely arranged pad assemblies; the pad assemblies include first pads and second pads arranged at intervals; the first pads of the pad assemblies on the same side are connected to each other and used for connecting to-be-detected circuits; and the second pads of the pad assemblies on the same side are connected to each other and used for connecting voltage detection lines.

[0009] One end of the sampling resistor is connected to the first pads and the second pads of the pad assemblies on one side of the reserved pads, and the other end of the sampling resistor is connected to the first pads and the second pads of the pad assemblies on the other side of the reserved pads.

[0010] In the technical solution, further, the area of the conductive area of the first pad is greater than the area of the conductive area of the second pad.

[0011] In the technical solution, further, the sampling resistor covers at least part of the conductive area of the first pad and at least part of the conductive area of the second pad.

[0012] In the technical solution, further, the sampling resistor covers part of the conductive area of the first pad and the whole conductive area of the second pad.

[0013] In the technical solution, further, in the two oppositely arranged pad assemblies, the two first pads are arranged at intervals, and the two second pads are located between the two first pads.

[0014] Or in the two oppositely arranged pad assemblies, the two second pads are arranged at intervals, and the two first pads are located between the two second pads.

[0015] In the technical solution, further, the conductive area of the first pad forms a groove structure.

[0016] The second pad is located in a groove of the groove structure, and there is a gap between the second pad and the first pad.

[0017] In the technical solution, further, the first pads of the pad assemblies on the same side are connected through first branch lines; and the second pads of the pad assemblies on the same side are connected through second branch lines.

[0018] The second branch line is led out from the middle of the second pad.

[0019] The application further provides a current detection device including the detection device.

[0020] In the technical solution, further comprising a voltage detection device, the voltage detection device is used for connecting the voltage detection line.

[0021] Compared with the prior art, the application has the following beneficial effects:

[0022] The detection device provided by the application can avoid the influence of the line resistance of the reserved solder pad of the un-soldered sampling resistor on voltage detection, thereby improving the accuracy of voltage detection and further improving the accuracy of current detection.

[0023] The application also provides a current detection device comprising the detection device described in the above solution. Based on the above analysis, the current detection device also has the beneficial effects described above, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the specific embodiments of the application or the prior art, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0025] Figure 1 The structure schematic diagram of the detection device provided by the application is shown in the figure;

[0026] Figure 2 The assembly structure schematic diagram of the sampling resistor and the reserved solder pad provided by the application is shown in the figure;

[0027] Figure 3 The first structure schematic diagram of the reserved solder pad provided by the application is shown in the figure;

[0028] Figure 4 The second structure schematic diagram of the reserved solder pad provided by the application is shown in the figure;

[0029] Figure 5 The circuit structure schematic diagram of the detection device provided by the application is shown in the figure;

[0030] Figure 6 The first circuit structure schematic diagram of the existing detection device is shown in the figure;

[0031] Figure 7 The second circuit structure schematic diagram of the existing detection device is shown in the figure.

[0032] In the figure: 101-substrate; 102-sampling resistor; 103-reserved pad; 104-pad assembly; 105-first pad; 106-second pad; 107-first branch line; 108-second branch line; 109-circuit to be detected; 110-voltage detection line; 111-resistor body; 112-resistor pin. DETAILED DESCRIPTION

[0033] The technical solutions of the present application will be described clearly and completely below in combination with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] Embodiment one

[0037] Referring to Figures 1 to 4 As shown in the figure, the detection device provided by the present application comprises a substrate 101, a sampling resistor 102 and a plurality of reserved pads 103.

[0038] The substrate 101 is a PCB, and is provided with a plurality of spaced-apart soldering areas. A plurality of reserved pads 103 are arranged in parallel on the substrate 101, and the plurality of reserved pads 103 are arranged one by one on the plurality of soldering areas. The reserved pads 103 are used to connect the sampling resistors 102, and at least one reserved pad 103 is soldered with a sampling resistor 102. The number of sampling resistors 102 can be set according to the detection requirements. For example, for a large-current circuit to be detected 109, a plurality of sampling resistors 102 are arranged to be soldered to a plurality of reserved pads 103, so as to achieve the purpose of shunting large current.

[0039] As shown in Figure 2 , the reserved pad 103 includes oppositely arranged pad assemblies 104. The pad assembly 104 on the left is connected to the current inflow end of the circuit to be detected 109, and the pad assembly 104 on the right is connected to the current outflow end of the circuit to be detected 109. Specifically, the pad assembly 104 includes a first pad 105 and a second pad 106 arranged at intervals, i.e., the first pad 105 and the second pad 106 are not connected. The first pads 105 of the pad assemblies 104 on the same side are connected to each other by a first branch circuit 107, and are used to connect the circuit to be detected 109. The second pads 106 of the pad assemblies 104 on the same side are connected to each other by a second branch circuit 108, and are used to connect a voltage detection line 110.

[0040] One end of the sampling resistor 102 is connected to the first pad 105 and the second pad 106 of one side of the pad assembly 104 of the reserved pad 103, and the other end of the sampling resistor 102 is connected to the first pad 105 and the second pad 106 of the other side of the pad assembly 104 of the reserved pad 103. The sampling resistor 102 can be connected to the circuit to be detected 109 and the voltage detection line 110, so that the sampling resistor 102 is connected to the circuit to be detected 109, and the voltage of the sampling resistor 102 can be detected. Specifically, the sampling resistor 102 includes a resistor body 111 and a resistor pin 112. The resistor body 111 is provided with a resistor pin 112 at both ends, so as to be soldered to the oppositely arranged pad assemblies 104, respectively.

[0041] As shown in Figure 1 and Figure 5 , when detecting the current of the circuit to be detected 109, the plurality of reserved pads 103 are connected to the circuit to be detected 109 Figure 1Two reserved pads 103 are shown in the figure, one of which is provided with a sampling resistor 102, and a voltage detection device is connected with a voltage detection line 110 to detect the voltage across the sampling resistor 102. The voltage detection line 110 is connected with a second pad 106 of the plurality of reserved pads 103, and since the first pad 105 and the second pad 106 are not connected, a disconnection exists between the first pad 105 and the second pad 106, so that the second branch line 108 of the un-welded sampling resistor 102 is disconnected from the circuit 109 to be detected, and the voltage detected by the voltage detection device does not contain the line resistance of the first branch line 107 and the second branch line 108, thereby improving the detection accuracy. Figure 5 As shown in the figure, the voltage U0 detected by the voltage detection device is the product of the current I and the resistance R.

[0042] The detection device provided in the application can avoid the influence of the line resistance of the reserved pad 103 of the un-welded sampling resistor 102 on voltage detection by connecting the first pad 105 with the circuit 109 to be detected and connecting the second pad 106 with the voltage detection line 110, and by not connecting the first pad 105 and the second pad 106 with each other, thereby improving the accuracy of voltage detection and further improving the accuracy of current detection.

[0043] In an optional scheme of the embodiment, the area of the conductive region of the first pad 105 is greater than the area of the conductive region of the second pad 106.

[0044] In the embodiment, as shown in the figures, Figure 3 and Figure 4 Since the first pad 105 connected with the circuit 109 to be detected needs to pass a large current, the first pad 105 is set as a large pad to have a large conductive area. The second pad 106 connected with the voltage detection line 110 does not need to pass a large current, so the second pad 106 is set as a small pad and has a small conductive area, which is more cost-saving and reduces the space occupation.

[0045] In an optional scheme of the embodiment, the sampling resistor 102 covers at least part of the conductive region of the first pad 105 and at least part of the conductive region of the second pad 106, thereby realizing the electrical connection of the sampling resistor 102 with the first pad 105 and the second pad 106.

[0046] Preferably, the sampling resistor 102 covers part of the conductive region of the first pad 105 and the entire conductive region of the second pad 106.

[0047] In this embodiment, the pad is generally larger than the element pin in view of actual welding effect, to ensure reliable welding. Since the first pad 105 has a large area, the sampling resistor 102 is welded to a part of the first pad 105, which can meet the welding requirement. Since the second pad 106 has a small area, the sampling resistor 102 covers the second pad 106 entirely, to ensure good connection.

[0048] In an optional solution of this embodiment, as shown in Figure 3 , the arrangement of the first pad 105 and the second pad 106 is as follows: in the two oppositely arranged pad assemblies 104, the two first pads 105 are arranged at intervals, and the two second pads 106 are located between the two first pads 105, that is, two large pads are on both sides, and two small pads are in the middle.

[0049] Or as shown in Figure 4 , the arrangement of the first pad 105 and the second pad 106 is as follows: in the two oppositely arranged pad assemblies 104, the two second pads 106 are arranged at intervals, and the two first pads 105 are located between the two second pads 106, that is, two small pads are on both sides, and two large pads are in the middle.

[0050] That is, the specific arrangement of the first pad 105 and the second pad 106 can be adjusted adaptively according to the PCB layout and wiring.

[0051] In an optional solution of this embodiment, the conductive area of the first pad 105 is in a groove shape; the second pad 106 is located in the groove structure formed by the first pad 105, and the second pad 106 has a gap with the first pad 105.

[0052] In this embodiment, as shown in Figure 2 and Figure 3 , in the two oppositely arranged pad assemblies 104, the notches of the groove structures formed by the two first pads 105 are opposite, and the two second pads 106 are respectively located in the two groove structures. When the resistance pin 112 of the sampling resistor 102 is welded to the first pad 105 and the second pad 106, the second pad 106 can be closer to the center of the resistance pin 112, to reduce the detection error, and the first pad 105 can pass a large current without being affected.

[0053] Embodiment Two

[0054] The detection device in this embodiment is an improvement on the basis of the above-mentioned embodiment. The technical content disclosed in the above-mentioned embodiment is not repeated, and the content disclosed in the above-mentioned embodiment also belongs to the content disclosed in this embodiment two.

[0055] In an alternative scheme of the embodiment, the first pads 105 of the pad assemblies 104 on the same side are connected by the first branch circuit 107; the second pads 106 of the pad assemblies 104 on the same side are connected by the second branch circuit 108; the second branch circuit 108 is led out from the middle of the second pad 106.

[0056] In the embodiment, during the test, the current in the first branch circuit 107 flows through the first pad 105 on the left side, the corresponding side resistance pin 112, the resistance body 111, the resistance pin 112 on the right side and the first pad 105 on the corresponding side in sequence. At the resistance pin 112 on the left side, the current flows from the circumferential center to the resistance body 111; at the resistance pin 112 on the right side, the current flows in the opposite direction, i.e., the current flows into the center of the resistance pin 112 on the left side and flows out of the center of the resistance pin 112 on the right side.

[0057] The second pad 106 is closer to the center of the resistance pin 112, and the second branch circuit 108 connected with the voltage detection line 110 is led out from the middle of the second pad 106, so that the access point of the second branch circuit 108 is closer to the center of the resistance pin 112, thereby the detected voltage is the potential difference between the resistance pin 112 on the left side and the resistance pin 112 on the right side, and the actual resistance value of the sampling resistance 102 is known (i.e., the resistance value between the center of the resistance pin 112 on the left side and the center of the resistance pin 112 on the right side), so that the current flowing through the sampling resistance 102 can be accurately measured, and the detection accuracy can be improved.

[0058] Embodiment Three

[0059] The embodiment three of the application provides a current detection device, which comprises the detection device of any one of the above embodiments, and thus has all the beneficial technical effects of the detection device of any one of the above embodiments, which will not be described herein again.

[0060] In an alternative scheme of the embodiment, the current detection device further comprises a voltage detection device, which is used to connect the voltage detection line 110, so as to measure the voltage of the sampling resistance 102, and then the current of the to-be-detected circuit 109 can be obtained.

[0061] It should be noted that the above-mentioned embodiments are only used to illustrate but not to limit the technical solutions of the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still make modifications to the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application. In addition, those skilled in the art can understand that the combination of features of different embodiments means that it is within the scope of the present application and forms different embodiments, although some embodiments herein include certain features rather than other features included in other embodiments.

Claims

1. A detection device, characterized in that, The detection device comprises a substrate, a sampling resistor and a plurality of reserved pads; The plurality of reserved pads are arranged on the substrate, and the plurality of reserved pads are connected in parallel, and at least one reserved pad is welded with the sampling resistor; The reserved pad comprises oppositely arranged pad assemblies; the pad assembly comprises a first pad and a second pad arranged at intervals; the first pads of the pad assemblies on the same side are connected to each other and used for connecting to be detected circuits; the second pads of the pad assemblies on the same side are connected to each other and used for connecting voltage detection lines; One end of the sampling resistor is connected with the first pad and the second pad of the pad assembly on one side of the reserved pad, and the other end of the sampling resistor is connected with the first pad and the second pad of the pad assembly on the other side of the reserved pad.

2. The detection device of claim 1, wherein, The area of the conductive area of the first pad is larger than the area of the conductive area of the second pad.

3. The detection device of claim 2, wherein, The sampling resistor covers at least part of the conductive area of the first pad and at least part of the conductive area of the second pad.

4. The detection device of claim 3, wherein, The sampling resistor covers part of the conductive area of the first pad and all of the conductive area of the second pad.

5. The detection device of claim 2, wherein, In the two oppositely arranged pad assemblies, the two first pads are arranged at intervals, and the two second pads are located between the two first pads. Or in the two oppositely arranged pad assemblies, the two second pads are arranged at intervals, and the two first pads are located between the two second pads.

6. The detection device of claim 2, wherein, The conductive area of the first pad forms a groove structure; The second pad is located in the groove of the groove structure, and there is a gap between the second pad and the first pad.

7. The detection device of claim 1, wherein, The first pads of the pad assemblies on the same side are connected through first branch lines; the second pads of the pad assemblies on the same side are connected through second branch lines; The second branch line is led out from the middle of the second pad.

8. A current detection device, characterized by, The detection device comprises a substrate, a sampling resistor and a plurality of reserved pads; 9. The current sensing device of claim 8, wherein, The detection device comprises a substrate, a sampling resistor and a plurality of reserved pads; The detection device comprises a substrate, a sampling resistor and a plurality of reserved pads;

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