Packaging structure and laser product

Abstract

The utility model provides a packaging structure and a laser product, the packaging structure comprises a bowl-cup support, and a light-emitting chip and a light reflecting piece which are arranged in the bowl-cup support, the bowl-cup support is provided with a support bottom and a support side part, the light-emitting chip and the light reflecting piece are both arranged on a first surface of the support bottom, and the light-emitting chip and the light reflecting piece are arranged on a second surface of the support side part. And the first surface is a plane. Therefore, solid welding of the light-emitting chip is facilitated, the light-emitting chip can be better attached to the bottom of the support, heat of the light-emitting chip can be better transmitted out through the bottom of the support, and then the service life of the light-emitting chip can be prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED product, in particular to a packaging structure and a laser product. BACKGROUND

[0002] In the existing point light source (such as laser), a 30-45 degree step is usually arranged on the two sides or the periphery of the bottom of the support, which is used for bearing the light emitting chip and the circuit conduction. Since the power of the light emitting chip is large, arranging the light emitting chip on the step will result in poor heat dissipation of the light emitting chip, which affects the product life. Moreover, the step is inclined, which greatly increases the difficulty of solid welding of the light emitting chip and increases the manufacturing cost. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides a packaging structure and a laser product, which is beneficial to improve the mounting efficiency and heat dissipation performance of the light emitting chip.

[0004] In order to achieve the above purpose, the present application provides the following technical scheme:

[0005] A packaging structure, comprising a bowl cup support, and a light emitting chip and a light reflecting member arranged in the bowl cup support, the bowl cup support has a support bottom and a support side, the light emitting chip and the light reflecting member are arranged on a first surface of the support bottom, and the first surface is arranged as a plane.

[0006] Optionally, an inclined reflecting surface is arranged on the side of the light reflecting member close to the light emitting chip, so as to reflect the light emitted by the light emitting chip out of the bowl cup support; and a first fluorescent film piece is arranged on the reflecting surface.

[0007] Optionally, the included angle between the reflecting surface and the first surface is 30-60 degrees.

[0008] Optionally, a top cover is arranged on the top of the bowl cup support, so as to seal the light emitting chip and the light reflecting member in the bowl cup support.

[0009] Optionally, the top cover is arranged as a second fluorescent film piece.

[0010] Optionally, an annular groove is arranged on the inner wall of the support side, and the edge of the top cover is embedded in the annular groove.

[0011] Optionally, the light reflecting member is arranged in the middle of the first surface, and the light emitting chip is arranged in multiple and surrounds the outer periphery of the light reflecting member.

[0012] Optionally, the light emitting chip is arranged in four, and the shape of the light reflecting member is arranged as a quadrangular pyramid or a quadrangular platform.

[0013] Optionally, the bracket bottom and the light reflection member are made of copper and are integrally formed.

[0014] Optionally, the bracket side is made of ceramic.

[0015] A laser product comprising the packaging structure as claimed in any one of the preceding claims.

[0016] The packaging structure and the laser product provided in the application have the light emitting chip and the light reflection member arranged on the first surface of the bracket bottom and inside the bracket side. The first surface of the bracket bottom is arranged as a plane so that the light emitting chip and the light reflection member are arranged on the same plane. This is conducive to soldering the light emitting chip and makes the light emitting chip more closely attached to the bracket bottom, which is conducive to transferring the heat of the light emitting chip through the bracket bottom and thus improves the service life of the light emitting chip. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0018] Fig. 1 A cross-sectional view of the packaging structure shown in some embodiments;

[0019] Fig. 2 A top view of the packaging structure shown in some embodiments;

[0020] Fig. 3 A cross-sectional view of the packaging structure shown in some other embodiments.

[0021] In the figure: 1, bracket bottom; 2, bracket side; 3, light reflection member; 4, light emitting chip; 5, first fluorescent film; 6, top cover. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] As Figs. 1-3As shown, the embodiment of the present application provides a packaging structure, which comprises a bowl cup support, a light emitting chip 4 and a light reflecting element 3. The light emitting chip 4 and the light reflecting element 3 are both packaged in the interior of the bowl cup support. Here, the light emitting chip 4 is preferably a laser chip, so that the packaging structure can be applied to laser products. In addition, the light emitting chip 4 can also be preferably other chips, so as to be applicable to other different forms of point light source products.

[0024] The bowl cup support has a support bottom 1 and a support side 2. The support side 2 is provided in a cylindrical shape and is connected to the first surface of the support bottom 1 (i.e. the upper surface of the support bottom 1), so as to constitute a bowl cup shaped bowl cup support.

[0025] Here, the light emitting chip 4 and the light reflecting element 3 are both arranged on the first surface of the support bottom 1 (i.e. the upper surface of the support bottom 1) and are located on the inner side of the support side 2. The first surface of the support bottom 1 is provided in a plane, so that the light emitting chip 4 and the light reflecting element 3 are arranged on the same plane. In this way, it is not only beneficial to solder the light emitting chip 4, but also can make the light emitting chip 4 more closely fit the support bottom 1, which is more conducive to transferring the heat of the light emitting chip 4 through the support bottom 1, thereby improving the service life of the light emitting chip 4.

[0026] In the present scheme, the light reflecting element 3 is provided with a reflecting surface. The reflecting surface is arranged on the side of the light reflecting element 3 close to the light emitting chip 4, and is arranged obliquely relative to the first surface of the support bottom 1, so that the light reflecting element 3 can reflect the light emitted by the light emitting chip 4 to the outside of the bowl cup support through the reflecting surface. In a specific scheme, the angle formed by the reflecting surface relative to the first surface of the support bottom 1 is 30-60 degrees, and here it is preferably 45 degrees. In this way, it is beneficial to reflect the light emitted by the light emitting chip 4 in a direction perpendicular to the first surface out of the bowl cup support.

[0027] A first fluorescent film sheet 5 is covered on the reflecting surface of the light reflecting element 3. In application, the light emitting chip 4 emits blue light towards the reflecting surface of the light reflecting element 3. The first fluorescent film sheet 5 on the reflecting surface is excited by the blue light and converts the blue light into white light. Finally, the white light is reflected by the reflecting surface to the outside of the bowl cup support. In this way, the form of excitation and then reflection is adopted, which can improve the excitation efficiency of the light emitted by the light emitting chip 4 and is beneficial to improve the light intensity.

[0028] Here, the first fluorescent film sheet 5 is provided as a ceramic fluorescent film sheet, which is beneficial to improve the heat dissipation efficiency in the interior of the bowl cup support and improve the service life of the product.

[0029] In some embodiments, the light reflecting element 3 is arranged at the middle position of the first surface of the support bottom 1, i.e. the light reflecting element 3 is located on the central axis of the support side 2, which can reduce the blocking of the light by the support side 2 and is more conducive to reflecting the light emitted by the light emitting chip 4 out of the bowl cup support.

[0030] The light emitting chip 4 is provided with a plurality of, for example, two, three or four, the plurality of light emitting chips 4 are arranged around the outer periphery of the light reflecting member 3, and the light reflecting member 3 is provided with a plurality of reflecting surfaces corresponding to the light emitting chip 4, and the reflecting surface is provided one by one with the light emitting chip 4. Since the reflecting surface is inclined with respect to the first surface of the support bottom 1, the light reflecting member 3 forms a prism shape or a pyramid shape. In this way, the space utilization inside the bowl cup support can be improved, and the light emitting intensity of the laser product can be improved.

[0031] In specific schemes, the light emitting chip 4 is provided with four and is arranged in four directions of the light reflecting member 3, and is centrally symmetric with respect to the light reflecting member 3. The shape of the light reflecting member 3 is set to be a four-prism or a four-prism, so that the four reflecting surfaces on the light reflecting member 3 correspond to the four light emitting chips 4 one by one.

[0032] As shown in Fig. 1 , 2 , the support bottom 1 and the light reflecting member 3 are provided as an integrated structure, and when the support bottom 1 is processed, the light reflecting member 3 can be formed in the middle of the first surface of the support bottom 1, which is beneficial to improve the structural stability and reduce the connecting process of the parts. Moreover, the support bottom 1 and the light reflecting member 3 are both made of copper material, the heat dissipation effect of the light reflecting member 3 is good, and the reflection efficiency is high.

[0033] Here, the support side 2 is made of ceramic material, which has the functions of insulation and heat conduction. Moreover, the support side 2 and the support bottom 1 are a split structure, which is convenient for installing the light emitting chip 4 and other structures on the support bottom 1.

[0034] In some embodiments, the top of the bowl cup support is provided with a top cover 6, which is closed and connected at the top opening position of the bowl cup support, so as to close the light emitting chip 4 and the light reflecting member 3 in the interior of the bowl cup support, and improve the overall structure and stability. In application, the blocking effect of the top cover 6 can avoid the direct emission of the light emitting chip 4 into the eyes, and protect the eyes.

[0035] The material of the top cover 6 can be glass, which can reduce the cost because the first fluorescent film 5 can convert the light emitted by the light emitting chip 4 into white light. The top cover 6 can also be provided with a second fluorescent film, which can convert the blue light not excited and converted by the first fluorescent film 5 into white light, further improving the conversion efficiency and the utilization rate of the light emitted by the light emitting chip 4. Here, the second fluorescent film is made of glass, which has good light transmission and can reduce the blocking of the light.

[0036] In combination, the top cover 6 can include a glass sheet and a fluorescent film sheet attached to the glass sheet, so that the fluorescent film sheet can convert the blue light not converted by the first fluorescent film 5 into white light. In addition, asFig. 3 As shown in the figure, the reflecting surface of the light reflection member 3 can not be provided with the first fluorescent film 5, and only the light emitted by the light emitting chip 4 is excited by the top cover 6 to convert the blue light into white light.

[0037] As shown in FIGS. 1 and 3, the inner wall of the bracket side part 2 is provided with an annular groove, which is located on the side of the bracket side part 2 away from the bracket bottom part 1, and the size and shape of the annular groove match the size and shape of the top cover 6, so that the edge of the top cover 6 can be embedded in the inside of the annular groove. In this way, the top cover 6 and the bracket side part 2 are connected in a lap joint manner, which has good connection stability, and the annular groove can limit the top cover 6 to avoid deviation of the top cover 6.

[0038] The embodiment of the present application provides a laser product comprising the packaging structure in the above embodiment. In this way, the first surface of the bracket bottom part 1 is provided as a plane, so that the light emitting chip 4 and the light reflection member 3 are arranged on the same plane, which is conducive to the solid welding of the light emitting chip 4, and can make the light emitting chip 4 more closely attached to the bracket bottom part 1, which is more conducive to the heat of the light emitting chip 4 being transferred away through the bracket bottom part 1, thereby improving the service life of the light emitting chip 4.

[0039] The basic principles of the present application are described above in combination with specific embodiments, but it should be pointed out that the advantages, advantages, effects and the like mentioned in the present application are only examples and not limitations, and these advantages, advantages, effects and the like cannot be considered as the must-have of each embodiment of the present application. In addition, the above specific details are only for the purpose of example and understanding, and are not limited to the above specific details to realize the present application.

[0040] The block diagrams of the devices, apparatuses, equipment, systems involved in the present application are only illustrative examples and are not intended to require or imply the connection, arrangement, configuration shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, systems can be connected, arranged, configured in any way. Words such as "include", "contain", "have" and the like are open-ended words, which mean "include but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0041] It should also be noted that in the devices, equipment and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombination should be considered as equivalent solutions of the present application.

[0042] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0043] It should be understood that the adjectives "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiments description of the present application are only used for more clearly describing the technical solutions, and cannot be used to limit the protection scope of the present application.

[0044] The above description has been presented for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the application to the forms disclosed herein. Although several example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A package structure, characterized by, The bowl cup support, the light emitting chip and the light reflecting member are arranged in the bowl cup support, the bowl cup support has a support bottom and a support side, the light emitting chip and the light reflecting member are arranged on a first surface of the support bottom, and the first surface is arranged as a plane.

2. The package structure of claim 1, wherein, An inclined reflecting surface is arranged on a side of the light reflecting member close to the light emitting chip to reflect the light emitted by the light emitting chip out of the bowl cup support, and a first fluorescent film is arranged on the reflecting surface.

3. The package structure of claim 2, wherein, The angle between the reflecting surface and the first surface is 30-60 degrees.

4. The package structure of claim 1, wherein, A top cover is arranged on the top of the bowl cup support to seal the light emitting chip and the light reflecting member in the bowl cup support.

5. The package structure of claim 4, wherein, The top cover is arranged as a second fluorescent film.

6. The package structure of claim 4, wherein, An annular groove is arranged on the inner wall of the support side, and the edge of the top cover is embedded in the annular groove.

7. The package structure of claim 1, wherein, The light reflecting member is arranged in the middle of the first surface, and the light emitting chip is arranged as a plurality of and surrounds the outer periphery of the light reflecting member.

8. The package structure of claim 7, wherein, The light emitting chip is arranged as four, and the shape of the light reflecting member is arranged as a quadrangular pyramid or a quadrangular platform.

9. The package structure of claim 1, wherein, The support bottom and the light reflecting member are arranged as copper material and are integrally formed, and the support side is arranged as ceramic material.

10. A laser product, characterized by The package structure of any one of claims 1-9 is arranged.

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