Water washing type semiconductor equipment tail gas treatment device

Abstract

The utility model provides a washing type semiconductor equipment tail gas treatment device which comprises a first washing unit, a second washing unit, a third washing unit and a fourth washing unit, tail gas can enter the first washing unit and the second washing unit at the same time for washing, and then enters the third washing unit and the fourth washing unit through a water tank; in this way, the contact time between the tail gas and the washing liquid is prolonged through two-stage washing, and the tail gas treatment effect can be improved; the tail gas can enter the two washing units at the same time to be washed, the washing efficiency can be improved, meanwhile, the density of the tail gas can be reduced, the tail gas can be fully washed, harmful substances in the tail gas can be fully removed, and the tail gas treatment effect is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor exhaust gas treatment technology, and in particular to a water-washing semiconductor equipment exhaust gas treatment device. Background Technology

[0002] In semiconductor manufacturing, processes such as chemical vapor deposition, physical vapor deposition, and etching generate large amounts of exhaust gases containing harmful substances. If these exhaust gases are released directly into the atmosphere without proper treatment, they will not only pollute the environment but may also harm human health. Therefore, effective exhaust gas treatment devices are crucial for ensuring the safety and environmental friendliness of the production process. Traditional exhaust gas treatment methods mainly include combustion, adsorption, and water washing. Among these, water washing is widely used due to its low cost, simple operation, and good removal effect on various pollutants. However, existing water washing exhaust gas treatment devices often suffer from low treatment efficiency and unsatisfactory treatment results. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides a water-washing semiconductor equipment exhaust gas treatment device, comprising a water tank, a first water washing unit, a second water washing unit, a third water washing unit, a fourth water washing unit, an air intake unit, an air intake pipe, an exhaust unit, and an exhaust pipe; the first, second, third, and fourth water washing units are all fixedly connected above the water tank and are interconnected with the water tank; the air intake unit is positioned above the first and second water washing units; the air intake pipe is positioned above the air intake unit; the exhaust unit is positioned above the third and fourth water washing units; and the exhaust pipe is positioned above the exhaust unit.

[0004] In some embodiments of this application, the first water washing unit includes a first water washing cavity, and multiple sets of spray components are disposed in the first water washing cavity, with porous filter plates disposed between the multiple sets of spray components.

[0005] In some embodiments of this application, the second water washing unit includes a second water washing chamber, and multiple sets of spray components are disposed in the second water washing chamber, with porous filter plates disposed between the multiple sets of spray components.

[0006] In some embodiments of this application, a first partition is provided at the connection between the second water washing cavity and the water tank, and a first solenoid valve is provided on the first partition.

[0007] In some embodiments of this application, the air intake unit includes an air intake cavity, and a second partition is disposed in the air intake cavity. The second partition divides the air intake unit into a first air intake unit that communicates with the first water washing unit and a second air intake unit that communicates with the second water washing unit; a second solenoid valve is disposed on the second partition.

[0008] In some embodiments of this application, the third water washing unit includes a third water washing cavity, and multiple sets of spray components are arranged in the third water washing cavity, with porous filter plates arranged between the multiple sets of spray components.

[0009] In some embodiments of this application, the fourth water washing unit includes a fourth water washing cavity, in which multiple sets of spray components are arranged, and a porous filter plate is arranged between the multiple sets of spray components; a third partition is also provided at the connection between the fourth water washing cavity and the water tank, and a third solenoid valve is provided on the third partition.

[0010] In some embodiments of this application, the exhaust unit includes an exhaust chamber, a porous filter plate is disposed inside the exhaust chamber, and alternating and spaced condenser plates are disposed above the porous filter plate.

[0011] In some embodiments of this application, the inner diameter of the exhaust pipe gradually decreases and then gradually increases from top to bottom.

[0012] In some embodiments of this application, a circulation pump and a drainage pump are also included; the circulation pump and the drainage pump are respectively disposed below the water tank; the drainage pump is connected to the water tank; the circulation pump is connected to both the water tank and the spray assembly.

[0013] Compared with the prior art, the present invention has the following advantages and beneficial effects: The water-washing semiconductor equipment exhaust gas treatment device of this application includes a first water washing unit, a second water washing unit, a third water washing unit, and a fourth water washing unit. The exhaust gas can simultaneously enter the first water washing unit and the second water washing unit for water washing, and then enter the third water washing unit and the fourth water washing unit through a water tank. In this way, the two-stage water washing increases the contact time between the exhaust gas and the washing liquid, which can improve the treatment effect of the exhaust gas. The exhaust gas can simultaneously enter the two water washing units for water washing, which not only improves the efficiency of water washing, but also reduces the density of the exhaust gas, so that the exhaust gas can be fully washed, fully remove harmful substances in the exhaust gas, and improve the treatment effect of the exhaust gas.

[0014] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit this document. Attached Figure Description

[0015] The accompanying drawings, which form part of this document, are used to provide a further understanding of the document. The illustrative embodiments and descriptions herein are used to explain the document and do not constitute an undue limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the structure of a water-washing semiconductor device exhaust gas treatment apparatus provided in an exemplary embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of a water-washing semiconductor device exhaust gas treatment device (hidden housing) provided in an exemplary embodiment of this application;

[0018] Figure 3 This is a front view of a water-washing semiconductor device exhaust gas treatment apparatus provided in an exemplary embodiment of this application;

[0019] Figure 4 This is a side view of a water-washing semiconductor device exhaust gas treatment apparatus provided in an exemplary embodiment of this application;

[0020] Figure 5 This is a top view of a water-washing semiconductor device exhaust gas treatment apparatus provided in an exemplary embodiment of this application;

[0021] Figure 6 This is the book Figure 5 Sectional view at point BB;

[0022] Figure 7 This is the book Figure 5 Sectional view at point CC.

[0023] 10. Housing; 201. Intake pipe; 202. Intake unit; 2021. Intake chamber; 2022. Second partition; 2023. Second solenoid valve; 203. First water washing unit; 2031. First water washing chamber; 2032. Porous filter plate; 204. Second water washing unit; 2041. Second water washing chamber; 2042. First partition; 2043. First solenoid valve; 205. Water tank; 206. Third water washing unit; 2061. Third water washing chamber; 207. Fourth water washing unit; 2071. Fourth water washing chamber; 2072. Third partition; 2073. Third solenoid valve; 208. Exhaust unit; 2081. Exhaust chamber; 2082. Condensate plate; 209. Exhaust pipe. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

[0025] In semiconductor manufacturing, processes such as chemical vapor deposition, physical vapor deposition, and etching generate large amounts of exhaust gases containing harmful substances. If these exhaust gases are released directly into the atmosphere without proper treatment, they will not only pollute the environment but may also harm human health. Therefore, effective exhaust gas treatment devices are crucial for ensuring the safety and environmental friendliness of the production process. Traditional exhaust gas treatment methods mainly include combustion, adsorption, and water washing. Among these, water washing is widely used due to its low cost, simple operation, and good removal effect on various pollutants. However, existing water washing exhaust gas treatment devices often suffer from low treatment efficiency and unsatisfactory treatment results.

[0026] Based on this, an exemplary embodiment of this application provides a water-washing semiconductor device exhaust gas treatment apparatus. The apparatus includes a first water washing unit, a second water washing unit, a third water washing unit, and a fourth water washing unit. The exhaust gas can simultaneously enter the first and second water washing units for water washing, and then enter the third and fourth water washing units through a water tank. In this way, the two-stage water washing increases the contact time between the exhaust gas and the washing liquid, thereby improving the treatment effect of the exhaust gas. The fact that the exhaust gas can simultaneously enter the two water washing units for water washing not only improves the efficiency of water washing, but also reduces the density of the exhaust gas, allowing the exhaust gas to be thoroughly washed, effectively removing harmful substances from the exhaust gas, and improving the treatment effect of the exhaust gas.

[0027] Example 1:

[0028] An exemplary embodiment of this application provides a water-washing semiconductor device exhaust gas treatment apparatus, such as... Figure 1 As shown, the device includes a housing 10. The top of the housing 10 has a mounting hole for a pipe connecting the intake pipe 201 and the exhaust pipe 209. An alarm light is also installed on the top of the housing 10. A door is formed on one side wall of the housing 10 to facilitate inspection and maintenance of the internal components. Figures 2 to 5As shown, the housing 10 contains a water tank 205, a first water washing unit 203, a second water washing unit 204, a third water washing unit 206, a fourth water washing unit 207, an air intake unit 202, an air intake pipe 201, an exhaust unit 208, and an exhaust pipe 209. The first water washing unit 203, the second water washing unit 204, the third water washing unit 206, and the fourth water washing unit 207 are all fixedly connected above the water tank 205 and are interconnected with the water tank 205. The air intake unit 202 is located above the first water washing unit 203 and the second water washing unit 204. The air intake pipe 201 is located above the air intake unit 202. The exhaust unit 208 is located above the third water washing unit 206 and the fourth water washing unit 207. The exhaust pipe 209 is located above the exhaust unit 208. Thus, the exhaust gas entering the device through the intake pipe 201 can simultaneously enter the first water washing unit 203 and the second water washing unit 204 for washing, and then enter the third water washing unit 206 and the fourth water washing unit 207 through the water tank 205. The two-stage water washing increases the contact time between the exhaust gas and the washing liquid, which can improve the treatment effect of the exhaust gas. The first water washing unit 203 and the second water washing unit 204, the third water washing unit 206 and the fourth water washing unit 207 can work simultaneously, so that the exhaust gas can enter the two water washing units for washing at the same time. This not only improves the efficiency of water washing, but also reduces the density of the exhaust gas by distributing it to the two water washing units, so that the exhaust gas can be thoroughly washed, effectively removing harmful substances from the exhaust gas and improving the treatment effect of the exhaust gas.

[0029] like Figure 2 As shown, the device also includes a circulation pump and a drain pump; the circulation pump and the drain pump are respectively located below the water tank 205; the drain pump is connected to the water tank 205 to discharge the washing liquid to be replaced and replace it with new washing liquid; the circulation pump is connected to the water tank 205 and the spray assembly respectively to realize the recycling of the washing liquid.

[0030] like Figure 7As shown, the first washing unit 203 includes a first washing chamber 2031, within which multiple sets of spray components are arranged, and porous filter plates 2032 are arranged between the multiple sets of spray components. The second washing unit 204 includes a second washing chamber 2041, within which multiple sets of spray components are arranged, and porous filter plates 2032 are arranged between the multiple sets of spray components. The porous filter plates 2032 can effectively prevent the passage of some large particles, or cause some other particulate matter to be trapped between the pores, and then flushed into the water tank 205 under the action of the spray components, effectively removing particulate matter from the exhaust gas. The intake unit 202 includes an intake cavity 2021. The lower part of the intake cavity 2021 is connected to the first water washing cavity 2031 and the second water washing cavity 2041, so that the exhaust gas entering the intake unit 202 can simultaneously enter the first water washing cavity 2031 and the second water washing cavity 2041, thereby increasing the water washing space, reducing the density of the exhaust gas, and allowing harmful substances or particulate matter in the exhaust gas to fully contact with the washing liquid, thereby fully removing harmful substances or particulate matter in the exhaust gas and improving the cleanliness of the exhaust gas.

[0031] like Figure 6 As shown, the third water washing unit 206 includes a third water washing chamber 2061, within which multiple sets of spray components are arranged, and porous filter plates 2032 are arranged between the multiple sets of spray components. The fourth water washing unit 207 includes a fourth water washing chamber 2071, within which multiple sets of spray components are arranged, and porous filter plates 2032 are arranged between the multiple sets of spray components. The exhaust unit 208 includes an exhaust chamber 2081, within which a porous filter plate 2032 is arranged, and alternating and spaced condensation plates 2082 are arranged above the porous filter plates 2032. The exhaust gas entering the exhaust chamber 2081, after undergoing two stages of water washing, meets the standards for continued discharge into the downstream plant treatment system, and the particulate matter in the exhaust gas has been largely removed. Therefore, the main purpose of the porous filter plate 2032 inside the exhaust chamber 2081 is to block water vapor from passing through the water-washed exhaust gas, increase the contact area between water vapor and the porous filter plate, and promote water vapor condensation to dry the exhaust gas. Furthermore, alternating and spaced condenser plates 2082 are arranged above the porous filter plate 2032, with the free ends of the condenser plates 2082 tilted downwards. This allows the exhaust gas passing through the condenser plates 2082 to collide with the lower surface of the condenser plates 2082, and the condensed liquid can fall downwards along the lower surface of the condenser plates 2082 to further dry the exhaust gas and remove moisture.

[0032] Example 2:

[0033] Based on the above-described embodiment 1, the difference between this embodiment and embodiment 1 is that, as follows: Figure 7As shown, in this embodiment, a first partition 2042 is also provided at the connection between the second water washing chamber 2041 and the water tank 205, and a first solenoid valve 2043 is provided on the first partition 2042. A second partition 2022 is provided inside the air intake chamber 2021, dividing the air intake unit 202 into a first air intake unit 202 communicating with the first water washing unit 203 and a second air intake unit 202 communicating with the second water washing unit 204; a second solenoid valve 2023 is provided on the second partition 2022. Figure 6 As shown, a third partition 2072 is also provided at the connection between the fourth water washing chamber 2071 and the water tank 205, and a third solenoid valve 2073 is provided on the third partition 2072. Thus, when the exhaust gas volume is low, only the first solenoid valve 2043, the second solenoid valve 2023, and the third solenoid valve 2073 need to be closed, and only the first water washing unit 203 and the third water washing unit 206 are used for water washing, which can save energy and does not reduce the exhaust gas treatment effect. When the exhaust gas volume increases, only the first solenoid valve 2043, the second solenoid valve 2023, and the third solenoid valve 2073 need to be opened to restore the state of dual-chamber dual-water washing as in Embodiment 1.

[0034] Example 3:

[0035] Based on Embodiment 1 or 2 described above, in this embodiment, the inner diameter of the exhaust pipe 209 gradually decreases from top to bottom and then gradually increases. At this time, the exhaust pipe 209 forms a Venturi tube structure, which can accelerate exhaust gas discharge and effectively prevent exhaust gas backflow.

[0036] In this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0037] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0038] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations fall within the scope of the claims of this application and their equivalents, the intent of this application also includes these modifications and variations.

Claims

1. A water-washing semiconductor equipment exhaust gas treatment device, characterized in that, The system includes a water tank, a first water washing unit, a second water washing unit, a third water washing unit, a fourth water washing unit, an air intake unit, an air intake pipe, an exhaust unit, and an exhaust pipe. The first, second, third, and fourth water washing units are all fixedly connected above the water tank and are interconnected with it. The air intake unit is located above the first and second water washing units. The air intake pipe is located above the air intake unit. The exhaust unit is located above the third and fourth water washing units. The exhaust pipe is located above the exhaust unit.

2. The water-washing semiconductor equipment exhaust gas treatment device according to claim 1, characterized in that, The first water washing unit includes a first water washing chamber, and multiple sets of spray components are arranged in the first water washing chamber, with porous filter plates arranged between the multiple sets of spray components.

3. The water-washing semiconductor equipment exhaust gas treatment device according to claim 1, characterized in that, The second water washing unit includes a second water washing chamber, and multiple sets of spray components are arranged inside the second water washing chamber, with porous filter plates arranged between the multiple sets of spray components.

4. The water-washing semiconductor equipment exhaust gas treatment device according to claim 3, characterized in that, A first partition is also provided at the connection between the second water washing chamber and the water tank, and a first solenoid valve is provided on the first partition.

5. The water-washing semiconductor equipment exhaust gas treatment device according to claim 1, characterized in that, The air intake unit includes an air intake cavity, and a second partition is provided in the air intake cavity. The second partition divides the air intake unit into a first air intake unit that communicates with the first water washing unit and a second air intake unit that communicates with the second water washing unit. A second solenoid valve is provided on the second partition.

6. The water-washing semiconductor equipment exhaust gas treatment device according to claim 1, characterized in that, The third water washing unit includes a third water washing chamber, in which multiple sets of spray components are arranged, and porous filter plates are arranged between the multiple sets of spray components.

7. The water-washing semiconductor equipment exhaust gas treatment device according to claim 1, characterized in that, The fourth water washing unit includes a fourth water washing chamber, which is equipped with multiple sets of spray components, and a porous filter plate is arranged between the multiple sets of spray components; a third partition is also provided at the connection between the fourth water washing chamber and the water tank, and a third solenoid valve is provided on the third partition.

8. The water-washing semiconductor equipment exhaust gas treatment device according to claim 1, characterized in that, The exhaust unit includes an exhaust chamber, in which a porous filter plate is disposed, and above the porous filter plate are alternating and spaced condenser plates.

9. The water-washing semiconductor equipment exhaust gas treatment device according to claim 1, characterized in that, The inner diameter of the exhaust pipe gradually decreases from top to bottom and then gradually increases again.

10. The water-washing semiconductor equipment exhaust gas treatment device according to claim 2, characterized in that, It also includes a circulation pump and a drainage pump; the circulation pump and the drainage pump are respectively located below the water tank; the drainage pump is connected to the water tank; the circulation pump is connected to both the water tank and the spray assembly.

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