Wafer cutting or processing platform
By improving the structure of the dicing axis and stepper axis assemblies in the wafer dicing platform and adopting a sunken motor and guide rail design, the problem of high center of gravity of the imaging assembly was solved, resulting in higher dicing speed and equipment stability, and reduced costs.
Patent Information
- Application Number
- CN202423176327.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-23
AI Technical Summary
In existing laser cutting platforms, the imaging components are fixed on both sides of the marble beam base, resulting in a high center of gravity, which affects high-speed cutting and equipment stability.
The wafer dicing platform structure was improved so that the imaging components installed in the dicing axis assembly and stepper axis assembly are perpendicular to the platform. A sunken motor and guide rail design was adopted to lower the center of gravity and improve stability.
It improves the acceleration and equipment stability of the dicing shaft assembly, reduces component costs, and enhances the operability and reliability of the cutting platform.
Smart Images
Figure CN223642993U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer dicing or processing platform. Background Technology
[0002] With the rapid development of semiconductor technology, the performance requirements for chips are becoming increasingly stringent. Gold-backed wafers have important applications in fields such as semiconductor packaging. During chip packaging, the manufacturing precision and quality control of gold-backed wafers become crucial for achieving better electrical connections and heat dissipation.
[0003] Common laser cutting platforms are XY high-precision cutting platforms with stepper axes superimposed with dicing axes. They use a side-axis image capture method with a light source to capture the image before cutting. Gold-backed wafers, on the other hand, are special wafers with a metal layer deposited on the back side (the side without the chip circuitry). Because the circuitry is on the back side, the laser processing requires capturing the precise cutting position through the back-side circuitry, necessitating the use of a lower image and a lower light source.
[0004] The currently used imaging components are fixed on both sides of the marble beam base. The dicing axis slide is made of a hollow, one-piece casting, with the imaging components passing through the middle and placed horizontally. After one reflection, it is positioned directly below the upper axis machining point. The hollow parts result in a high overall center of gravity, which is detrimental to high-speed cutting and equipment stability.
[0005] In view of the above-mentioned shortcomings, the designer has actively researched and innovated in order to create a wafer dicing or processing platform that has greater industrial value. Utility Model Content
[0006] To solve any of the above-mentioned technical problems, the purpose of this utility model is to provide a wafer cutting or processing platform.
[0007] To achieve the above objectives, the present invention adopts the following technical solution:
[0008] A wafer dicing or processing platform, from top to bottom, includes a dicing axis assembly and a stepper axis assembly;
[0009] The dicing shaft assembly includes an adsorption platform, a hollow motor, an upper shaft marble, and an upper shaft motor. A recessed upper shaft cavity is formed in the middle of the upper shaft marble, and upper shaft motors are installed in the upper shaft marbles on both the front and rear sides of the upper shaft cavity. The two upper shaft motors synchronously drive the hollow motors inside to move in the left and right directions. An adsorption platform is installed on the top of the hollow motor.
[0010] The stepper axis assembly includes a lower axis marble, a lower axis slide plate, and a lower axis motor. Two lower axis motors are mounted side by side on the lower axis marble along the left-right direction. The two lower axis motors synchronously drive the upper lower axis slide plate to move in the forward-backward direction.
[0011] A first recessed cavity is formed in the lower shaft marble between the two lower shaft motors, and the first recessed cavity is distributed along the front-to-back direction. A lower imaging component is installed in the first recessed cavity. A lower shaft through hole is formed on the lower shaft slide plate directly above the first recessed cavity, and an upper shaft through hole is formed on the upper shaft marble directly above the lower shaft through hole.
[0012] As a further improvement of this utility model, an upper shaft guide rail distributed along the left and right direction is installed on the upper shaft marble inside the upper shaft motor, and the bottom of the hollow motor is connected to the lower upper shaft guide rail through the upper shaft slider.
[0013] As a further improvement of this utility model, a lower shaft guide rail distributed along the front-to-back direction is installed on the lower shaft marble on one side of the lower shaft motor, and the bottom of the lower shaft slide is connected to the lower shaft guide rail below through the lower shaft slider.
[0014] As a further improvement of this utility model, a second recessed cavity for the lower shaft is provided on the lower shaft marble outside the lower shaft motor, which is distributed along the front-back direction. A tank chain distributed along the front-back direction is installed in the second recessed cavity for the lower shaft. The bottom of the lower shaft slide is connected to the tank chain below through a tank chain bracket.
[0015] As a further improvement of this utility model, the lower imaging component can move freely along the front-to-back direction on the lower axis marble inside the first sunken cavity of the lower axis.
[0016] As a further improvement of this utility model, the lower imaging component includes a camera lens and a light source, with the light source located above the camera lens, and the camera lens being finely adjustable in the vertical and horizontal directions.
[0017] By means of the above solution, this utility model has at least the following advantages:
[0018] This invention lowers the center of gravity of the dicing shaft assembly, thereby improving the acceleration of the dicing shaft assembly and the stability of the equipment.
[0019] This invention replaces the long-span lower imaging component, which requires one reflection for observation, with a vertically installed internal lower component, improving stability and operability while reducing component costs.
[0020] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of a wafer cutting or processing platform according to this utility model;
[0023] Figure 2 yes Figure 1 The main view;
[0024] Figure 3 yes Figure 1 Schematic diagram of the scribe shaft assembly;
[0025] Figure 4 yes Figure 1 A schematic diagram of the structure of a stepper axis assembly.
[0026] The meanings of the labels in the figures are as follows.
[0027] Sliding axis assembly 1, stepper axis assembly 2, lower imaging assembly 3, adsorption stage 4, hollow motor 5, upper axis marble 6, upper axis guide rail 7, upper axis motor 8, lower axis marble 9, lower axis slide plate 10, lower axis motor 11, lower axis guide rail 12. Detailed Implementation
[0028] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.
[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0030] like Figures 1-4 As shown, a wafer dicing or processing platform includes, from top to bottom, a dicing axis assembly 1 and a stepper axis assembly 2.
[0031] 1. The dicing shaft assembly 1 includes an adsorption platform 4, a hollow motor 5, an upper shaft marble 6, and an upper shaft motor 8. An upper shaft recessed cavity is provided in the middle of the upper shaft marble 6 facing downward. Upper shaft motors 8 are installed in the upper shaft marble 6 on both the front and rear sides of the upper shaft recessed cavity. The two upper shaft motors 8 synchronously drive the hollow motor 5 inside to move in the left and right direction. An adsorption platform 4 is installed on the top of the hollow motor 5.
[0032] An upper shaft guide rail 7, distributed along the left and right direction, is installed on the upper shaft marble 6 inside the upper shaft motor 8. The bottom of the hollow motor 5 is connected to the lower upper shaft guide rail 7 through the upper shaft slider.
[0033] 2. The stepper axis assembly 2 includes a lower axis marble 9, a lower axis slide plate 10 and a lower axis motor 11. Two lower axis motors 11 are installed side by side on the lower axis marble 9 along the left and right direction. The two lower axis motors 11 synchronously drive the upper lower axis slide plate 10 to move in the front and back direction.
[0034] A lower shaft guide rail 12 distributed along the front-to-back direction is installed on the lower shaft marble 9 on one side of the lower shaft motor 11. The bottom of the lower shaft slide plate 10 is connected to the lower shaft guide rail 12 below through the lower shaft slider.
[0035] A second recessed cavity, distributed along the front-to-back direction, is also provided on the lower shaft marble 9 outside the lower shaft motor 11. A tank chain, distributed along the front-to-back direction, is installed in the second recessed cavity. The bottom of the lower shaft slide plate 10 is connected to the tank chain below through a tank chain bracket.
[0036] 3. A first recessed cavity is provided in the lower shaft marble 9 between the two lower shaft motors 11, and the first recessed cavity is distributed along the front-back direction. A lower imaging component 3 is installed in the first recessed cavity. A lower shaft through hole is provided on the lower shaft slide plate 10 directly above the first recessed cavity, and an upper shaft through hole is provided on the upper shaft marble 6 directly above the lower shaft through hole.
[0037] 4. The lower imaging component 3 can move freely along the front-to-back direction on the lower shaft marble 9 within the first recessed cavity of the lower shaft. The lower imaging component 3 achieves its movement and adjustment in the front-to-back direction through adjustment blocks distributed along the front-to-back direction.
[0038] The lower imaging component 3 includes a camera lens and a light source, with the light source located above the camera lens. The camera lens can be finely adjusted in both the vertical and horizontal directions. The camera lens achieves this fine-tuning through two one-dimensional platforms.
[0039] This utility model uses a lower imaging component 3 with a longer working distance to cooperate with the platform. The lower imaging component 3 is placed below the dicing axis component 1, and the upper axis marble 6 is directly opened.
[0040] Even with the increased working distance of the lower imaging component 3, it is still necessary to minimize the thickness of the slicing shaft component 1 to achieve long-distance image grasping. The original standard hollow motor was changed to a recessed installation, with a non-standard hollow flange integrated recessed hollow motor 5 further lowering the worktable. Secondly, the motor avoids the lower imaging component 3, adopting a vertical installation on both sides. The lower shaft marble 9 was thickened and raised to create space for the lower imaging component 3.
[0041] The working principle and process of this utility model: The product is placed on the adsorption stage 4 (a transparent material such as quartz glass). The back circuit board is observed through the lower image component 3 to determine the position of the cutting track. The dicing axis component 1 and the stepping axis component 2 move the wafer as required in the left-right and front-back plane movement to cooperate with the laser for cutting.
[0042] This invention lowers the center of gravity of the scriber assembly, improving its acceleration and overall equipment stability. By replacing the long-span lower imaging component, which requires a single reflection for observation, with a vertically mounted internal lower component, stability and operability are improved, while component costs are reduced.
[0043] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0044] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A wafer dicing or processing platform, comprising, from top to bottom, a dicing axis assembly (1) and a stepper axis assembly (2); characterized in that: The dicing shaft assembly (1) includes an adsorption platform (4), a hollow motor (5), an upper shaft marble (6), and an upper shaft motor (8). A recessed upper shaft cavity is provided in the middle of the upper shaft marble (6). Upper shaft motors (8) are installed in the upper shaft marble (6) on both the front and rear sides of the upper shaft cavity. The two upper shaft motors (8) synchronously drive the hollow motor (5) on the inner side to move in the left and right direction. An adsorption platform (4) is installed on the top of the hollow motor (5). The stepper axis assembly (2) includes a lower axis marble (9), a lower axis slide plate (10), and a lower axis motor (11). Two lower axis motors (11) are mounted side by side on the lower axis marble (9) in the left-right direction. The two lower axis motors (11) synchronously drive the upper lower axis slide plate (10) to move in the front-back direction. A first recessed cavity is provided in the lower shaft marble (9) between the two lower shaft motors (11), and the first recessed cavity is distributed along the front-back direction. A lower imaging component (3) is installed in the first recessed cavity. A lower shaft through hole is provided on the lower shaft slide plate (10) directly above the first recessed cavity, and an upper shaft through hole is provided on the upper shaft marble (6) directly above the lower shaft through hole.
2. The wafer dicing or processing platform as described in claim 1, characterized in that, An upper shaft guide rail (7) distributed along the left and right direction is installed on the upper shaft marble (6) inside the upper shaft motor (8). The bottom of the hollow motor (5) is connected to the lower upper shaft guide rail (7) through the upper shaft slider.
3. The wafer dicing or processing platform as described in claim 1, characterized in that, A lower shaft guide rail (12) distributed along the front-to-back direction is installed on the lower shaft marble (9) on one side of the lower shaft motor (11). The bottom of the lower shaft slide plate (10) is connected to the lower shaft guide rail (12) below through the lower shaft slider.
4. The wafer dicing or processing platform as described in claim 1, characterized in that, A second sinking cavity for the lower shaft is also provided on the lower shaft marble (9) outside the lower shaft motor (11) along the front-back direction. A tank chain along the front-back direction is installed in the second sinking cavity for the lower shaft. The bottom of the lower shaft slide plate (10) is connected to the tank chain below through the tank chain bracket.
5. The wafer dicing or processing platform as described in claim 1, characterized in that, The lower imaging component (3) can move freely along the front-to-back direction on the lower axis marble (9) inside the first sunken cavity of the lower axis.
6. The wafer dicing or processing platform as described in claim 1, characterized in that, The lower imaging component (3) includes a camera lens and a light source, the light source being located above the camera lens, and the camera lens being adjustable in both the vertical and horizontal directions.