Section polishing device with cleaning function for wafer processing

Abstract

The utility model discloses a wafer processing tangent plane polishing device with a cleaning function, which comprises a box body, a processing table board and a polishing table, the top of the processing table board is provided with a vertical plate, the top of one side of the vertical plate is provided with an air cylinder through a fixing frame, and the output end of the air cylinder is provided with the polishing table through a suspension frame. A center sleeve is installed in the middle of the machining table top through a bearing, a bearing table is arranged on the top of the center sleeve, and a vacuum suction cup is arranged on the inner side of the bearing table. The multi-stage segmented polishing technology is adopted, the polishing head is divided into a plurality of modules, different polishing parameters are adopted for all the modules, orderly connection of rough polishing and fine polishing is achieved, the harmony and unification of high efficiency and high cleanliness are successfully achieved by accurately adjusting the polishing time and strength of the two stages, and the polishing efficiency is improved. This is difficult to achieve in the conventional polishing technology.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, concretely is a section polishing device with clean function for wafer processing. BACKGROUND

[0002] In the current wafer processing industry, the traditional wafer polishing process generally adopts single-stage polishing technology, which mainly carries out planarization treatment on the wafer surface through a single polishing step, aiming to achieve the predetermined polishing effect. This method meets the basic requirements of polishing efficiency and polishing quality to some extent, but through in-depth analysis, we find that it has the following shortcomings:

[0003] Firstly, single-stage polishing technology has an irreconcilable contradiction between improving polishing speed and ensuring surface cleanliness. In actual operation, if higher polishing speed is pursued, the cleanliness of the wafer surface will be reduced, thereby affecting the smooth progress of subsequent processes; on the contrary, if surface cleanliness is overemphasized, polishing speed will be limited, resulting in reduced overall processing efficiency.

[0004] Secondly, the energy consumption of single-stage polishing technology is relatively high, which not only increases production cost, but also easily causes wear of the wafer surface during polishing. Long-term wear will cause scratches, pits and other defects on the wafer surface, thereby affecting the processing quality of the wafer and the performance of the final product.

[0005] Therefore, in order to overcome the above shortcomings and improve wafer polishing efficiency and processing quality, it is necessary to optimize and improve the traditional polishing technology. SUMMARY

[0006] The utility model aims at providing a section polishing device with clean function for wafer processing to solve the problems raised in the above background technology.

[0007] In order to achieve the above object, the utility model provides the following technical scheme: a section polishing device for wafer processing with cleaning function, including box, processing mesa and polishing table, the top of processing mesa is provided with vertical board, the top of vertical board one side is installed with cylinder through fixed support, the output of cylinder is installed with polishing table through suspension, and it is installed with pressure sensor at the junction of cylinder output and suspension, the bottom of polishing table is provided with coarse polishing head and fine polishing head in parallel, and one end of polishing table is provided with motor no.

[0008] Preferably, the two sides of the vertical plate are provided with protective guards, and the other ends of the two protective guards extend to the outside of the motor and the cleaning roller respectively.

[0009] Preferably, the top of the coarse polishing head and the fine polishing head is connected with the polishing table through the mounting seat, the inner side of the mounting seat is provided with the clamping groove, the top of the coarse polishing head and the fine polishing head is provided with the clamping block, and the coarse polishing head and the fine polishing head are detachably installed at the bottom of the clamping groove of the mounting seat through the clamping block.

[0010] Preferably, the conduit one and the conduit two are provided with electromagnetic valves, and the two electromagnetic valves are controlled separately.

[0011] Preferably, the top of the processing mesa is provided with a moving groove, and one end of the processing mesa is provided with a motor, the drive shaft of the motor extends to the inside of the moving groove and is fixedly connected with a lead screw, the lead screw is provided with a movable block, and the movable block is fixedly connected with the bottom of the vertical plate.

[0012] Preferably, the inner wall of one side of the box is provided with a motor, the output end of the motor is provided with a driving gear, the center sleeve is provided with a driven gear, and the driving gear and the driven gear are engaged with each other.

[0013] The section polishing device for wafer processing with cleaning function provided by the utility model has the following advantages on the basis of the prior art:

[0014] Firstly, the utility model discloses a multistage segmented polishing technology, through the division of polishing head into a plurality of modules, and for each module adopts different polishing parameters, realizes the orderly link of rough polishing and fine polishing.In the rough polishing stage, use rough polishing wheel to remove material quickly, effectively improve the polishing speed, greatly shorten the processing cycle, and in the fine polishing stage, adopt fine polishing wheel to carry out fine polishing, significantly improve the surface cleanliness, ensure the smoothness and neatness of wafer surface.Through accurate adjustment polishing time and strength of two stages, the utility model discloses successfully realized the harmonious unity of high efficiency and high cleanliness, which is difficult to achieve in the polishing technology of the past.

[0015] Secondly, the pressure of the polishing head is controllable, so that the polishing head has better contact area and pressure distribution during polishing, which not only improves the polishing effect, but also effectively reduces the risk of scratching and damage on the wafer surface. In addition, by changing the key parameters such as polishing pressure and polishing speed, the utility model can adapt to the processing needs of wafers of different types and sizes, greatly improving the flexibility and application range of processing.

[0016] Furthermore, the polishing device and the cleaning equipment are integrated. This integrated design allows the wafer to be cleaned in time after polishing, maintaining the surface clean in real time and avoiding secondary deposition of pollutants, thereby improving the yield and quality of wafer processing.

[0017] In summary, the utility model has the following advantages compared with the prior art:

[0018] 1. The polishing efficiency is significantly improved, the processing cycle is shortened, which helps to improve production efficiency and reduce production cost.

[0019] 2. The polishing quality is guaranteed, and the surface cleanliness is greatly improved, which is beneficial to the subsequent wafer processing procedure and improves the reliability and service life of the final product.

[0020] 3. The processing flexibility is enhanced, which can adapt to various wafer processing needs and improve the applicability of the equipment.

[0021] 4. The polishing and cleaning are integrated.

[0022] Therefore, the utility model has obvious advantages and positive effects in improving wafer processing efficiency, ensuring processing quality, and improving processing flexibility. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a front view structural schematic diagram of the utility model;

[0024] Figure 2 is a polishing table structure schematic diagram of the utility model;

[0025] Figure 3 It is a side view structural schematic view of the utility model;

[0026] Figure 4 It is a top view structural schematic view of the utility model;

[0027] In the figure: 1, box; 2, air pump; 3, conduit one; 4, center sleeve; 5, conduit two; 501, spring hose; 6, vacuum chuck; 7, motor one; 8, processing table top; 9, cleaning cylinder; 10, protective shield; 11, vertical plate; 12, fixed frame; 13, air cylinder; 14, polishing table; 15, motor two; 16, bearing table; 17, driving gear; 18, driven gear; 19, motor three; 20, electromagnetic valve; 21, pressure sensor; 22, suspension; 23, connecting rod; 24, soft brush; 25, mounting seat; 26, clamping groove; 27, rough polishing head; 28, fine polishing head; 29, clamping block; 30, moving groove; 31, movable block; 32, screw rod. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described in connection with the drawings in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0029] Please refer to Figures 1-4 The utility model provides an embodiment: a section polishing device with cleaning function for wafer processing, including box 1, processing table top 8 and polishing table 14, the top of processing table top 8 is provided with vertical plate 11, and the top of one side of vertical plate 11 is installed with air cylinder 13 through fixed frame 12, and the output end of air cylinder 13 is installed with polishing table 14 through suspension 22, and the connecting place of air cylinder 13 output end and suspension 22 is installed with pressure sensor 21.

[0030] Air cylinder 13: set in the main body structure of the device, for driving the movement of polishing head;

[0031] Suspension 22: connected to the output end of air cylinder 13, for supporting polishing head;

[0032] Pressure sensor 21: installed at the connecting place of air cylinder 13 output end and suspension 22, for real-time monitoring of polishing pressure;

[0033] Rough polishing head 27 and fine polishing head 28: respectively set in the corresponding position of polishing device, for executing polishing operation.

[0034] The specific implementation is as follows:

[0035] A pressure sensor 21 is installed at the connection between the output end of the air cylinder 13 and the suspension 22. The installation position of the pressure sensor 21 should ensure that the pressure change generated during the polishing process can be accurately monitored.

[0036] The pressure sensor 21 monitors the polishing pressure in real time and transmits the monitored pressure data to the control unit. The control unit adjusts the air pressure output of the air cylinder 13 in real time according to the pressure data.

[0037] By adjusting the air pressure output of the air cylinder 13, the polishing intensity of the coarse polishing head 27 and the fine polishing head 28 is accurately controlled. During the coarse polishing stage, the air cylinder 13 outputs higher air pressure, so that the coarse polishing head 27 has greater polishing intensity; during the fine polishing stage, the air cylinder 13 outputs lower air pressure, so that the fine polishing head 28 has smaller polishing intensity.

[0038] During the polishing process, the pressure sensor 21 continuously monitors the polishing pressure and adjusts the air pressure output of the air cylinder 13 according to the pressure change, so as to ensure that the pressure distribution of the coarse polishing head 27 and the fine polishing head 28 during the polishing process is more uniform, and the polishing effect is improved.

[0039] The bottom of the polishing table 14 is provided with the coarse polishing head 27 and the fine polishing head 28 side by side, and one end of the polishing table 14 is provided with a motor two 15. The output end of the motor two 15 is connected with a connecting rod 23 penetrating through the polishing table 14, and the top end of the connecting rod 23 is provided with a cleaning roller 9. The outer side of the cleaning roller 9 is uniformly provided with soft bristles 24.

[0040] The coarse polishing head 27 is used for the coarse polishing stage, and the fine polishing head 28 is used for the fine polishing stage.

[0041] The output end of the motor two 15 is connected with the connecting rod 23, and the connecting rod 23 drives the cleaning roller 9 to rotate.

[0042] Operation process

[0043] During the movement of the polishing table 14, the motor two 15 is started to drive the cleaning roller 9 to rotate through the connecting rod 23. The specific operation steps are as follows:

[0044] The polishing table 14 moves to the position of the wafer, and the motor two 15 is started.

[0045] The coarse polishing head 27 first contacts the wafer to perform the coarse polishing stage. At this time, the coarse polishing wheel is used to quickly remove the material, effectively improving the polishing speed.

[0046] After the coarse polishing stage is completed, the fine polishing head 28 contacts the wafer to perform the fine polishing stage. The fine polishing wheel is used for fine polishing, which significantly improves the surface cleanliness and ensures the smoothness and cleanliness of the wafer surface.

[0047] The motor two 15 drives the cleaning roller 9 to rotate through the connecting rod 23, and the cleaning roller 9 cleans the surface of the wafer during rotation.

[0048] The bottom of the processing table 8 is provided with the box body 1, and the middle position of the processing table 8 is provided with the central sleeve 4 through the bearing, and the top of the central sleeve 4 is provided with the bearing table 16.

[0049] The motor three 19 is started, and the driven gear 18 is driven to rotate through the driving gear 17, so that the bearing table 16 drives the wafer to rotate through the central sleeve 4.

[0050] The inner side of the bearing table 16 is provided with the vacuum chuck 6, and the vacuum chuck 6 is connected with the air pump 2 arranged in the box body 1 through the pipe one 3, and the air pump 2 is also connected with the pipe two 5, and the other end of the pipe two 5 is connected with the air cylinder 13 through the spring hose 501.

[0051] The air pump 2 is started, and the air inside the vacuum chuck 6 is extracted through the pipe one 3, so as to realize the vacuum adsorption and fixation of the wafer.

[0052] The two sides of the vertical plate 11 are provided with the protective fence 10, and the other ends of the two protective fences 10 respectively extend to the outer sides of the motor two 15 and the cleaning roller 9.

[0053] The protective fence 10 is made of elastic material and has certain flexibility and impact resistance, so as to buffer the impact force and protect the polishing table 14 from damage and external impact and damage.

[0054] The top of the rough polishing head 27 and the fine polishing head 28 is connected with the polishing table 14 through the mounting seat 25, the inner side of the mounting seat 25 is provided with the clamping groove 26, the top of the rough polishing head 27 and the fine polishing head 28 is provided with the clamping block 29, and the rough polishing head 27 and the fine polishing head 28 are detachably installed at the bottom of the clamping groove 26 of the mounting seat 25 through the clamping block 29.

[0055] The mounting seat 25 is made of high-strength material and has good stability and wear resistance. The polishing table 14 is provided with a plane for placing the workpiece to be polished.

[0056] Specifically, the inner side of the mounting seat 25 is provided with the clamping groove 26, and the shape of the clamping groove 26 corresponds to the clamping block 29 on the top of the rough polishing head 27 and the fine polishing head 28. The clamping groove 26 is arranged so that the rough polishing head 27 and the fine polishing head 28 can be conveniently installed and detached.

[0057] The top of the rough polishing head 27 and the fine polishing head 28 is provided with the clamping block 29, and the clamping block 29 is made of wear-resistant material and has good wear resistance and stability. The rough polishing head 27 and the fine polishing head 28 are detachably installed at the bottom of the clamping groove 26 of the mounting seat 25 through the clamping block 29.

[0058] In the polishing process, the rough polishing head 27 and the fine polishing head 28 can be quickly replaced to meet the polishing needs of different workpieces. The rough polishing head 27 is used for rough polishing of the workpiece to improve the surface roughness of the workpiece; and the fine polishing head 28 is used for fine polishing of the workpiece to improve the surface smoothness of the workpiece.

[0059] The electromagnetic valve 20 is arranged on the catheter one 3 and the catheter two 5, and the two electromagnetic valves 20 are controlled separately.

[0060] The top of the machining table 8 is provided with a moving groove 30, and one end of the machining table 8 is provided with a motor one 7. The driving shaft of the motor one 7 extends into the inside of the moving groove 30 and is fixedly connected with a lead screw 32. The lead screw 32 is provided with a movable block 31, and the movable block 31 is fixedly connected with the bottom of the vertical plate 11.

[0061] The driving shaft of the motor one 7 is fixedly connected with the lead screw 32. The lead screw 32 is arranged along the length direction of the moving groove 30 and can freely slide in the moving groove 30. The lead screw 32 is provided with the movable block 31. The movable block 31 can freely slide on the lead screw 32 and is fixedly connected with the bottom of the vertical plate 11.

[0062] The specific structure is as follows:

[0063] The machining table 8 is a rectangular flat plate, which is used for carrying workpieces and tools in the machining process. The moving groove 30 arranged on the top of the machining table 8 is a T-shaped groove, which is convenient for the installation and movement of the lead screw 32 and the movable block 31.

[0064] The moving groove 30 is located on the top of the machining table 8 and extends along the length direction of the machining table 8. The internal space is sufficient to accommodate the lead screw 32 and the movable block 31.

[0065] The motor one 7 is installed at one end of the machining table 8. The driving shaft of the motor one 7 extends into the inside of the moving groove 30 and is fixedly connected with the lead screw 32.

[0066] The lead screw 32 is located in the inside of the moving groove 30. One end of the lead screw 32 is fixedly connected with the driving shaft of the motor one 7, and the other end freely slides. The lead screw 32 is provided with the movable block 31.

[0067] The movable block 31 is located on the lead screw 32 and can freely slide on the lead screw 32. The movable block 31 is fixedly connected with the bottom of the vertical plate 11.

[0068] The motor three 19 is installed on the inner wall of one side of the box body 1. The output end of the motor three 19 is provided with a driving gear 17. The central sleeve 4 is provided with a driven gear 18. The driving gear 17 and the driven gear 18 are meshed with each other.

[0069] When the motor three 19 starts and rotates, the driving gear 17 rotates. Since the driving gear 17 and the driven gear 18 are engaged with each other, the driven gear 18 also rotates. The rotation of the driven gear 18 is transmitted to the bearing table 16 through the center sleeve 4, so as to realize the power output of the whole bearing table 16.

[0070] In use, the wafer to be processed is placed on the top of the bearing table 16, the electromagnetic valve 20 on the conduit one 3 is opened, the air pump 2 is started, the air inside the vacuum chuck 6 is pumped away through the conduit one 3, the vacuum adsorption and fixation of the wafer is realized, the motor three 19 is started, the driven gear 18 is driven to rotate through the driving gear 17, the bearing table 16 is driven to rotate through the center sleeve 4, and the wafer is driven to rotate, at the same time, the motor one 7 drives the screw rod 32 to rotate, the vertical plate 11 drives the polishing table 14 at the bottom of the air cylinder 13 to move from one end to the other end of the bearing table 16, in the moving process of the polishing table 14, the motor two 15 drives the cleaning roller 9 to rotate through the connecting rod 23, the coarse polishing head 27 first contacts the wafer, in the coarse polishing stage, the coarse polishing wheel is used to remove material quickly, the polishing speed is effectively improved, then the fine polishing head 28 contacts the wafer, in the fine polishing stage, the fine polishing wheel is used for fine polishing, the surface cleanliness is significantly improved, the smoothness and cleanliness of the wafer surface are ensured, the polishing pressure is monitored in real time through the pressure sensor 21, the air pressure output of the air cylinder 13 is controlled, the polishing intensity of the two stages is accurately adjusted, the polishing process of the coarse polishing head 27 and the fine polishing head 28 has better pressure distribution, the polishing effect is improved, finally, the soft brush on the surface of the cleaning roller 9 cleans the surface of the polished wafer, secondary deposition of pollutants is avoided, and the yield and quality of wafer processing are improved.

[0071] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the protection scope of the present application.

[0072] It should be noted that the terms used herein are only intended to describe specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in the specification, there is a feature, step, work, device, component and / or combination thereof.

[0073] It should be noted that the terms "first", "second", and the like in the description and in the claims of the present application and in the above-described drawings are used only for distinguishing between similar objects and do not necessarily have to describe a specific sequential or chronological order. It is to be understood that the data so distinguished can be interchanged, under appropriate circumstances, such that the embodiments of the present application described herein can be practiced in other than the illustrated or described order.

[0074] The preferred embodiments of the present application have been described above with the preferred embodiments; the present application is not limited to the above and can be variously changed and modified by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer processing surface polishing apparatus with cleaning function, characterized in that: The assembly includes a housing (1), a processing table (8), and a polishing table (14). A vertical plate (11) is mounted on the top of the processing table (8). A cylinder (13) is mounted on one side of the top of the vertical plate (11) via a mounting bracket (12). The output end of the cylinder (13) is mounted on the polishing table (14) via a suspension (22). A pressure sensor (21) is installed at the connection between the output end of the cylinder (13) and the suspension (22). A coarse polishing head (27) and a fine polishing head (28) are arranged side-by-side on the bottom of the polishing table (14). A second motor (15) is mounted at one end of the polishing table (14). The output end of the second motor (15) is connected to a connecting rod that passes through the polishing table (14). (23) A cleaning roller (9) is provided at the top of the connecting rod (23). Soft bristles (24) are evenly arranged on the outer side of the cleaning roller (9). A box (1) is provided at the bottom of the processing table (8). A central sleeve (4) is installed in the middle of the processing table (8) through a bearing. A support platform (16) is provided at the top of the central sleeve (4). A vacuum suction cup (6) is provided on the inner side of the support platform (16). The vacuum suction cup (6) is connected to the air pump (2) provided inside the box (1) through a first conduit (3). The air pump (2) is also connected to a second conduit (5). The other end of the second conduit (5) is connected to the cylinder (13) through a spring hose (501).

2. The wafer processing surface polishing apparatus with cleaning function according to claim 1, characterized in that: Both sides of the upright plate (11) are provided with protective barriers (10), and the other ends of the two protective barriers (10) extend to the outside of the motor (15) and the cleaning roller (9), respectively.

3. The wafer processing face polishing apparatus with cleaning function according to claim 1, characterized in that: The tops of both the coarse polishing head (27) and the fine polishing head (28) are connected to the polishing table (14) via a mounting base (25). The inner side of the mounting base (25) is provided with a snap-fit ​​groove (26). The tops of both the coarse polishing head (27) and the fine polishing head (28) are provided with snap-fit ​​blocks (29). The coarse polishing head (27) and the fine polishing head (28) can be detachably installed at the bottom of the snap-fit ​​groove (26) of the mounting base (25) via the snap-fit ​​blocks (29).

4. The wafer processing face polishing apparatus with cleaning function according to claim 1, characterized in that: Both the first conduit (3) and the second conduit (5) are equipped with solenoid valves (20), and the two solenoid valves (20) are controlled separately.

5. A wafer processing surface polishing apparatus with cleaning function according to claim 1, characterized in that: The top of the processing table (8) is provided with a moving groove (30), and a motor (7) is installed at one end of the processing table (8). The drive shaft of the motor (7) extends into the interior of the moving groove (30) and is fixedly connected to a lead screw (32). A movable block (31) is provided on the lead screw (32), and the movable block (31) is fixedly connected to the bottom of the upright plate (11).

6. The wafer processing face polishing apparatus with cleaning function according to claim 1, characterized in that: A motor (19) is installed on the inner wall of one side of the housing (1). A drive gear (17) is installed at the output end of the motor (19). A driven gear (18) is provided on the central sleeve (4). The drive gear (17) and the driven gear (18) mesh with each other.

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