Grinding disc

Abstract

The utility model provides a grinding disc, and relates to the technical field of semiconductor equipment. The grinding disc comprises a base and a grinding head. The grinding head is arranged on the base; the grinding head can rotate relative to the base. A grinding tool and a liquid discharging groove are arranged on the side, away from the base, of the grinding head, and the width of the liquid discharging groove is gradually increased in the direction from the center to the edge of the grinding head. According to the grinding disc, grinding liquid and grinding particles can be discharged in time, and the risk of scratch damage or subfissure caused by the grinding particles to the surface of a wafer is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a grinding disc. Background Technology

[0002] With the rapid development of the semiconductor industry, chemical mechanical polishing (CMP) is required for wafers during the wafer packaging process. CMP is an ultra-precision surface processing technology that achieves global planarization. Chemical agents and abrasive particles are added to the wafer surface, and a polishing disc rotates relative to the wafer surface in a pressing and rotating manner, achieving planarization through rotational motion. The particles generated during polishing mainly come from abrasive particles in the slurry and material particles removed from the wafer surface. Particles detached from the wafer surface during polishing can easily cause scratches and microcracks, affecting polishing accuracy and quality. Utility Model Content

[0003] The purpose of this invention is to provide a grinding disc that reduces the risk of scratches and microcracks on the wafer surface during the grinding process, thereby improving grinding accuracy and quality.

[0004] In a first aspect, this utility model provides a grinding disc, comprising:

[0005] Base;

[0006] A grinding head is mounted on the base; the grinding head is rotatable relative to the base.

[0007] The grinding head is provided with a grinding tool and a drainage groove on the side away from the base. The width of the drainage groove gradually increases from the center of the grinding head to the edge.

[0008] In an optional embodiment, the grinding head is provided with a plurality of grinding cutters, and the drainage groove is formed between adjacent grinding cutters.

[0009] In an optional embodiment, the grinding tool is fan-shaped, and its width gradually increases from the center of the grinding head to its edge.

[0010] In an optional embodiment, the grinding tool includes a first tool and a second tool, and the grinding head is provided with a top shaft. The first tool and / or the second tool are connected to the top shaft so that the first tool and / or the second tool can move along the axial direction of the grinding head.

[0011] In an optional embodiment, the top spindle includes a first top spindle and a second top spindle, wherein the first top spindle is connected to the first tool and the second top spindle is connected to the second tool.

[0012] In an optional embodiment, the grinding mesh number of the first tool is smaller than that of the second tool;

[0013] And / or, the number of the first cutting tools is greater than the number of the second cutting tools.

[0014] In an optional embodiment, the drainage channel includes a first drainage channel and a second drainage channel; a first drainage channel is formed between adjacent first cutters, and a second drainage channel is formed between adjacent second cutters, wherein the average width of the second drainage channel is greater than the average width of the first drainage channel.

[0015] In an optional embodiment, one of the base and the grinding head is provided with a mounting hole, and the other is provided with a mounting shaft, the mounting shaft being disposed in the mounting hole.

[0016] In an optional embodiment, a drive unit is also included, which is drively connected to the mounting shaft.

[0017] In an optional embodiment, a control box is also included, which is connected to the drive component to control the rotation of the mounting shaft.

[0018] The beneficial effects of the grinding disc provided by this utility model include:

[0019] The grinding disc provided in this embodiment of the invention features a grinding tool and a drainage groove on the grinding head. The width of the drainage groove gradually increases from the center to the edge of the grinding head. This allows for the rapid discharge of particulate matter during the grinding process, facilitating the removal of grinding particles and preventing their accumulation on the wafer surface, which could cause scratches and microcracks. The grinding disc in this embodiment reduces the risk of scratches and microcracks on the wafer surface during the grinding process, improving grinding accuracy and quality. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the grinding disc provided in an embodiment of the present utility model;

[0022] Figure 2 A schematic diagram showing the disassembled structure of the grinding disc provided in an embodiment of this utility model;

[0023] Figure 3 A schematic diagram from a first perspective of a first structure of the grinding head of the grinding disc provided in an embodiment of the present utility model;

[0024] Figure 4 A schematic diagram of a second structure of the grinding head of the grinding disc provided in an embodiment of this utility model;

[0025] Figure 5 This is a schematic diagram from a second perspective of a first structure of the grinding head of the grinding disc provided in an embodiment of the present invention.

[0026] Icons: 100-Grinding disc; 110-Base; 111-Mounting shaft; 120-Grinding head; 121-Grinding tool; 122-First side; 123-Arc surface; 124-Mounting hole; 130-Drainage groove; 131-First drainage groove; 132-Second drainage groove; 141-First tool; 142-Second tool; 143-Top shaft; 150-Control box. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0033] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] Combination Figures 1 to 3 This utility model provides a polishing disc 100, including a base 110 and a polishing head 120. The polishing head 120 is disposed on the base 110 and is rotatable relative to the base 110. A polishing cutter 121 and a drain groove 130 are provided on the side of the polishing head 120 away from the base 110. The width of the drain groove 130 gradually increases from the center to the edge of the polishing head 120. This polishing disc 100 can promptly discharge polishing fluid and polishing particles, reducing the risk of scratches or microcracks caused by polishing particles on the wafer surface, and improving polishing accuracy and quality.

[0035] Optionally, the grinding head 120 is provided with multiple grinding cutters 121, and a drainage groove 130 is formed between adjacent grinding cutters 121. The multiple grinding cutters 121 are evenly distributed to improve the grinding quality. The drainage grooves 130 are distributed to fully discharge the grinding fluid and grinding particles, reducing damage to the wafer surface caused by the grinding particles. The drainage grooves 130 and the grinding cutters 121 are alternately spaced in the circumferential direction of the grinding head 120, resulting in more complete and smoother drainage.

[0036] Optionally, the grinding cutter 121 is fan-shaped, with its width gradually increasing from the center to the edge of the grinding head 120. In this embodiment, the grinding cutter 121 has a first side surface 122 and a second side surface extending from the center of the grinding head 120 towards the edge, and an arc surface 123 connecting the first side surface 122 and the second side surface, the arc surface 123 being arranged along the edge contour line of the grinding head 120. The first side surface 122 and the second side surface are arranged opposite to each other. It can be understood that the first side surface 122 and the second side surface also serve as the walls of the drainage groove 130. Optionally, the first side surface 122 and the second side surface can be planar or curved. In this embodiment, the first side surface 122 and the second side surface are curved arc surfaces. This arrangement is more conducive to the smooth drainage of the grinding fluid.

[0037] Optionally, the number of grinding tools 121 is eight, evenly spaced in the circumferential direction. Each grinding tool 121 extends outward from the center of the grinding head 120. In some embodiments, the number of grinding tools 121 may also be two, three, four, five, six, seven, nine, ten or more. The shape and size of each grinding tool 121 may be the same or different, and their shape and size can be flexibly set according to actual needs, without specific limitations here.

[0038] Combination Figure 4 Optionally, the grinding tool 121 includes a first tool 141 and a second tool 142 that are independent of each other. A top shaft 143 is provided on the grinding head 120. The first tool 141 and / or the second tool 142 are connected to the top shaft 143 so that the first tool 141 and / or the second tool 142 can move along the axial direction of the grinding head 120. The top shaft 143 may be connected only to the first tool 141, driving the first tool 141 to move. Alternatively, the top shaft 143 may be connected only to the second tool 142, driving the second tool 142 to move.

[0039] Alternatively, the top shaft 143 includes a first top shaft and a second top shaft, with the first top shaft connected to the first cutting tool 141 and the second top shaft connected to the second cutting tool 142. The first top shaft drives the first cutting tool 141 to move axially along the grinding head 120, and the second top shaft drives the second cutting tool 142 to move axially along the grinding head 120.

[0040] Optionally, one end of the top shaft 143 is fixedly connected to either the first tool 141 or the second tool 142, while the other end of the top shaft 143 is movably mounted on the base 110. The axis of the top shaft 143 is parallel to the axis of the grinding head 120. By setting the top shaft 143, the first tool 141 and the second tool 142 can be located at different height planes. Thus, depending on different working conditions, it is possible to select only the first tool 141 or only the second tool 142 for grinding operations.

[0041] Optionally, the grinding mesh size of the first tool 141 is smaller than that of the second tool 142. The first tool 141 is suitable for fine grinding and polishing, while the second tool 142 is suitable for rough grinding to reduce the wafer thickness. Thus, in the actual grinding process, the second tool 142 can be used first for rough grinding of the wafer surface, and then the first tool 141 can be used for fine grinding. It can be understood that if only the first tool 141 is used for grinding, the top shaft 143 pushes the first tool 141 out above the surface of the second tool 142, so that there is no interference between the first tool 141 and the second tool 142 during grinding. Similarly, if only the second tool 142 is used for grinding, the top shaft 143 pushes the second tool 142 out above the surface of the first tool 141, so that there is no interference between the second tool 142 and the first tool 141 during grinding.

[0042] Optionally, the number of first cutting tools 141 is greater than the number of second cutting tools 142. Having more first cutting tools 141 and fewer second cutting tools 142 results in a wider drainage channel 130 between the second cutting tools 142, which facilitates the discharge of large abrasive particles. In this embodiment, the drainage channel 130 includes a first drainage channel 131 and a second drainage channel 132; a first drainage channel 131 is formed between adjacent first cutting tools 141, and a second drainage channel 132 is formed between adjacent second cutting tools 142. The average width of the second drainage channel 132 is greater than the average width of the first drainage channel 131. This facilitates the discharge of large abrasive particles during the operation of the second cutting tools 142, preventing large abrasive particles from damaging the wafer surface or causing microcracks in the wafer.

[0043] It should be noted that, depending on actual needs, the grinding tool 121 can also be equipped with three or more tools with different grinding meshes to meet different grinding requirements.

[0044] Combination Figure 5Optionally, of the base 110 and the grinding head 120, one has a mounting hole 124, and the other has a mounting shaft 111, with the mounting shaft 111 disposed within the mounting hole 124. In this embodiment, the base 110 has a mounting shaft 111, and the grinding head 120 has a mounting hole 124. The mounting hole 124 of the grinding head 120 is fitted onto the mounting shaft 111 of the base 110 to achieve relative rotation between the grinding head 120 and the base 110. Optionally, the mounting shaft 111 passes through the base 110, and the mounting shaft 111 can drive the grinding head 120 to rotate.

[0045] Optionally, the polishing disc 100 in this embodiment further includes a drive unit (not shown) and a control box 150. The drive unit is connected to the mounting shaft 111 and is used to drive the mounting shaft 111 to rotate, thereby driving the polishing head 120 to rotate, so as to realize the polishing of the wafer surface by the polishing tool 121. The drive unit includes, but is not limited to, a motor or electric motor. The control box 150 is used to control the start, stop, acceleration and deceleration of the drive unit, so as to control the rotation of the mounting shaft 111 and adjust the rotation speed of the mounting shaft 111.

[0046] Of course, in some other embodiments, other methods can be used to drive the grinding head 120 to rotate, which are not specifically limited here.

[0047] In summary, the grinding disc 100 provided by this utility model has the following beneficial effects, including:

[0048] The grinding disc 100 provided in this embodiment of the invention features a grinding tool 121 and a drain groove 130 on a grinding head 120. The width of the drain groove 130 gradually increases from the center to the edge of the grinding head 120. This allows for the rapid discharge of particulate matter during the grinding process, facilitating particle removal and preventing particle accumulation on the wafer surface, which could cause scratches and microcracks. The grinding disc 100 in this embodiment reduces the risk of scratches and microcracks on the wafer surface during the grinding process, improving grinding accuracy and quality. Furthermore, by using a first tool 141 and a second tool 142 with different grinding mesh sizes, coarse and fine grinding can be achieved on the same grinding head 120, resulting in high grinding efficiency and good grinding quality.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A grinding disc, characterized in that, include: Base; A grinding head is mounted on the base; the grinding head is rotatable relative to the base. The grinding head is provided with a grinding tool and a drainage groove on the side away from the base. The width of the drainage groove gradually increases from the center of the grinding head to the edge.

2. The grinding disc according to claim 1, characterized in that, The grinding head is provided with a plurality of grinding cutters, and the drainage groove is formed between adjacent grinding cutters.

3. The grinding disc according to claim 1, characterized in that, The grinding tool is fan-shaped, and its width gradually increases from the center of the grinding head to the edge.

4. The grinding disc according to claim 1, characterized in that, The grinding tool includes a first tool and a second tool. The grinding head is provided with a top shaft. The first tool and / or the second tool are connected to the top shaft so that the first tool and / or the second tool can move along the axial direction of the grinding head.

5. The grinding disc according to claim 4, characterized in that, The top shaft includes a first top shaft and a second top shaft, the first top shaft is connected to the first tool, and the second top shaft is connected to the second tool.

6. The grinding disc according to claim 4, characterized in that, The grinding mesh number of the first tool is smaller than that of the second tool; And / or, the number of the first cutting tools is greater than the number of the second cutting tools.

7. The grinding disc according to claim 4, characterized in that, The drainage channel includes a first drainage channel and a second drainage channel; a first drainage channel is formed between adjacent first cutters, and a second drainage channel is formed between adjacent second cutters, wherein the average width of the second drainage channel is greater than the average width of the first drainage channel.

8. The grinding disc according to any one of claims 1 to 7, characterized in that, Of the base and the grinding head, one is provided with a mounting hole and the other is provided with a mounting shaft, the mounting shaft being disposed in the mounting hole.

9. The grinding disc according to claim 8, characterized in that, It also includes a drive component, which is connected to the mounting shaft via a transmission.

10. The grinding disc according to claim 9, characterized in that, It also includes a control box, which is connected to the drive unit to control the rotation of the mounting shaft.

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