Sand blasting placing tool for diode chip production

Abstract

The utility model belongs to the field of diode chip production equipment, and provides a sand blasting placing tool for diode chip production, which comprises a carrier plate, a plurality of support rollers are arranged at the bottom of the carrier plate, a pair of clamping plate assemblies are arranged on two sides of the carrier plate, each clamping plate assembly comprises a lower clamping plate, an upper clamping plate, an upper clamping bulge, a lower clamping bulge, a clamping groove and a clamping shaft, the two ends of the clamping shaft penetrate through the upper clamping plate and are provided with rotating heads, a handle is arranged at the top of the upper clamping plate, and the upper clamping plate and the lower clamping plate are connected with clamping springs. The carrier plate provided by the utility model is used for placing a wafer and a paper supporting sheet of the wafer, the upper clamping plate and the lower clamping plate which are arranged in pairs are used for clamping the paper supporting sheet, the clamping shaft is driven to rotate by adjusting the rotating head, and the clamping shaft adjusts the smoothness of the paper supporting sheet in a friction manner, so that the sand blasting quality is favorably improved; and the wafer can be conveniently transferred on a station along with the device by using the supporting rollers at the bottom of the carrier plate, so that the production efficiency is improved, and the device is suitable for large-scale popularization.

Description

Technical Field

[0001] This utility model belongs to the field of diode chip production equipment, and in particular relates to a sandblasting placement fixture for diode chip production. Background Technology

[0002] Zener diodes are categorized based on their breakdown voltage. Due to this characteristic, Zener diodes are primarily used as voltage regulators or voltage reference components. A key feature of Zener diodes is that the current across them remains essentially constant until breakdown occurs during reverse current flow. Traditional diode chip manufacturing processes include the following steps: silicon wafer cleaning, phosphorus removal paper removal, phosphorus diffusion, wafer slitting, single-sided sandblasting, pre-boron coating cleaning, boron coating, boron diffusion, and double-sided sandblasting. During the sandblasting process, ensuring wafer stability requires proper clamping of the wafer and its support paper to guarantee sandblasting quality. Utility Model Content

[0003] This invention addresses the stability requirements in wafer sandblasting operations by proposing a reasonably designed, simple, easy-to-clamp, and easy-to-transfer sandblasting placement fixture for diode chip production.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: The sandblasting placement fixture for diode chip production provided by this utility model includes a carrier plate. The bottom of the carrier plate is provided with a groove, and multiple support rollers evenly distributed along its length are provided in the groove. A pair of clamping plate assemblies are provided on both sides of the carrier plate. The clamping plate assembly includes a lower clamping plate. An upper clamping plate is provided on the side of the lower clamping plate facing away from the carrier plate and is hinged thereto. The upper clamping plate and the lower clamping plate are respectively provided with an upper clamping protrusion and a lower clamping protrusion in the direction towards the center of the carrier plate. The upper clamping protrusion is provided with a clamping groove, and a clamping shaft is provided in the clamping groove. Both ends of the clamping shaft pass through the upper clamping plate and are provided with rotating heads. A handle is provided on the top of the upper clamping plate, and clamping springs connected to the lower clamping plate are provided at both ends of the upper clamping plate.

[0005] Preferably, an open clamping opening is provided between the upper clamping plate and the lower clamping plate, and the clamping opening is located on the rear side of the upper clamping protrusion and the lower clamping protrusion.

[0006] Preferably, a horizontal pulley is provided at each corner of the carrier plate, and the two ends of the pulley axle are connected to the carrier plate and the lower clamping plate, respectively.

[0007] Preferably, the bottom of the lower clamping plate is provided with a plurality of threaded holes distributed along its length, and the bottom of the carrier plate is provided with countersunk holes, the countersunk holes and the threaded holes being connected by countersunk screws.

[0008] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0009] 1. The diode chip production sandblasting placement fixture provided by this utility model has a carrier plate for placing wafers and wafer support sheets. The paired upper and lower clamping plates are used to clamp the support sheets. The clamping shaft is driven to rotate by adjusting the rotating head. The clamping shaft adjusts the smoothness of the support sheets by friction, which is beneficial to improving the sandblasting quality. The support roller at the bottom of the carrier plate can facilitate the transfer of wafers at the work station with this device, which is beneficial to improving production efficiency and is suitable for large-scale promotion. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 An isometric view of a sandblasting placement fixture for diode chip manufacturing provided in an embodiment;

[0012] Figure 2 A bottom view of a sandblasting placement fixture for diode chip manufacturing provided in an embodiment;

[0013] Figure 3 A front view of a sandblasting placement fixture for diode chip manufacturing provided in an embodiment;

[0014] Figure 4 An open isometric view of the clamping plate assembly provided in the embodiment;

[0015] Figure 5 The clamp assembly provided in the embodiment is shown in the open front view.

[0016] In the above figures, 1. Carrier plate; 11. Countersunk hole; 2. Support roller; 3. Clamping plate assembly; 31. Lower clamping plate; 32. Upper clamping plate; 33. Upper clamping protrusion; 34. Lower clamping protrusion; 35. Clamping shaft; 36. Rotating head; 37. Handle; 38. Clamping spring; 39. Clamping port; 4. Horizontal pulley; 5. Wafer. Detailed Implementation

[0017] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other. For ease of description, the terms "upper," "lower," "left," and "right" appearing below only indicate that they correspond to the upper, lower, left, and right directions in the accompanying drawings and do not limit the structure.

[0018] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0019] Examples, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the sandblasting placement fixture for diode chip production provided by this utility model includes a carrier plate 1. The bottom of the carrier plate 1 is provided with a groove, and multiple support rollers 2 are evenly distributed along its length in the groove. A pair of clamping plate assemblies 3 are provided on both sides of the carrier plate 1. The clamping plate assembly 3 includes a lower clamping plate 31. An upper clamping plate 32 is provided on the side of the lower clamping plate 31 facing away from the carrier plate 1 and is hinged thereto. The upper clamping plate 32 and the lower clamping plate 31 are respectively provided with an upper clamping protrusion 33 and a lower clamping protrusion 34 in the direction towards the center of the carrier plate 1. The upper clamping protrusion 33 is provided with a clamping groove, and a clamping shaft 35 is provided in the clamping groove. Both ends of the clamping shaft 35 pass through the upper clamping plate 32 and are provided with rotating heads 36. A handle 37 is provided on the top of the upper clamping plate 32, and clamping springs 38 connected to the lower clamping plate 31 are provided at both ends of the upper clamping plate 32.

[0020] Specifically, the carrier plate 1 is used to place the wafer 5 and the wafer 5 support paper. The paper surface of the support paper is in contact with the plate surface of the carrier plate 1. The upper clamping plate 32 and the lower clamping plate 31, which are arranged in pairs, clamp the support paper from both sides. If the handle 37 is manually flipped to flip up the upper clamping plate 32, the upper clamping plate 32 will be returned to its original position by the clamping spring 38 when the upper clamping plate 32 is released, pressing the two ends of the support paper between the upper clamping protrusion 33 and the lower clamping protrusion 34. The clamping shaft 35 is driven to rotate by adjusting the rotating head 36. The clamping shaft 35 adjusts the smoothness of the support paper by friction, which is beneficial to improving the sandblasting quality. Furthermore, the support roller 2 at the bottom of the carrier plate 1 can facilitate the transfer of the wafer with this device at the work station. For example, the carrier plate 1 can be moved along the workbench to the adjacent work station by sliding. The front and rear connection performance is good, which is beneficial to improving production efficiency.

[0021] To improve the clamping effect of the clamping plate assembly 3 on the paper support sheet, an open clamping opening 39 is provided between the upper clamping plate 32 and the lower clamping plate 31 provided by this utility model. The clamping opening 39 is located behind the upper clamping protrusion 33 and the lower clamping protrusion 34. In this way, since the two ends of the paper support sheet being clamped extend towards the open direction of the clamping opening 39, the portion of the paper support sheet that exceeds the upper clamping protrusion 33 and the lower clamping protrusion 34 can pass through the clamping opening 39 without folding inside the upper clamping plate 32 and the lower clamping plate 31 and affecting subsequent operations such as gluing, polishing, and sheet separation.

[0022] Furthermore, this invention provides a horizontal pulley 4 at each corner of the carrier plate 1, with the two ends of the pulley 4's axle connected to the carrier plate 1 and the lower clamping plate 31, respectively. The horizontal pulley 4 serves as an anti-collision device, preventing the carrier plate 1 from violently colliding with other structures on the worktable and causing wrinkles in the wafer support sheets.

[0023] To improve the utilization rate of this tooling, the present invention provides multiple threaded holes distributed along its length at the bottom of the lower clamping plate 31, and a countersunk hole 11 at the bottom of the carrier plate 1. The countersunk hole 11 and the threaded holes are connected by countersunk screws. On the one hand, the threaded connection can improve the connection reliability between the clamping plate assembly 3 and the carrier plate 1, and on the other hand, it facilitates the fine adjustment of the front and rear positions of the clamping plate and the replacement of the clamping plate.

[0024] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A sandblasting placement fixture for diode chip manufacturing, comprising a carrier board, characterized in that, The bottom of the carrier plate is provided with a groove, and multiple support rollers are evenly distributed along its length in the groove. A pair of clamping plate assemblies are provided on both sides of the carrier plate. The clamping plate assembly includes a lower clamping plate. An upper clamping plate is provided on the side of the lower clamping plate facing away from the carrier plate and is hinged thereto. The upper clamping plate and the lower clamping plate are respectively provided with an upper clamping protrusion and a lower clamping protrusion in the direction towards the center of the carrier plate. The upper clamping protrusion is provided with a clamping groove. A clamping shaft is provided in the clamping groove. Both ends of the clamping shaft pass through the upper clamping plate and are provided with rotating heads. A handle is provided on the top of the upper clamping plate. Clamping springs connected to the lower clamping plate are provided at both ends of the upper clamping plate.

2. The sandblasting placement fixture for diode chip production according to claim 1, characterized in that, An open clamping opening is provided between the upper clamping plate and the lower clamping plate, and the clamping opening is located on the rear side of the upper clamping protrusion and the lower clamping protrusion.

3. The sandblasting placement fixture for diode chip production according to claim 2, characterized in that, Each corner of the carrier plate is provided with a horizontal pulley, and the two ends of the pulley axle are connected to the carrier plate and the lower clamping plate, respectively.

4. The sandblasting placement fixture for diode chip production according to claim 3, characterized in that, The bottom of the lower clamping plate is provided with a plurality of threaded holes distributed along its length, and the bottom of the carrier plate is provided with countersunk holes, which are connected to the threaded holes by countersunk screws.

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