Device for disassembling and assembling memory bank

Abstract

The utility model discloses a device for disassembling and assembling a memory bank. The device for disassembling and assembling the memory bank comprises a fixing base, a disassembling assembly and a pressing assembly, the disassembling assembly is installed in the vertical direction of the fixing base, the pressing assembly is installed in the horizontal direction of the fixing base, the disassembling assembly is used for disassembling or placing the memory bank, and the pressing assembly is used for pressing the memory bank. The fixing base is in transmission connection with an external mechanical arm, and the mechanical arm is used for controlling and switching the disassembling assembly or the pressing assembly to work. According to the utility model, the dismounting assembly and the pressing assembly are integrated and are respectively responsible for dismounting and mounting the memory bank, and switching and control of the dismounting assembly and the pressing assembly are realized through the mechanical arm on the fixed seat, so that the integrated design greatly simplifies the operation process, can realize quick dismounting of the memory bank without an additional tool or an adapter card, and improves the working efficiency.

Description

Technical Field

[0001] This utility model relates to the field of memory module disassembly and assembly technology, and in particular to a device for disassembling and assembling memory modules. Background Technology

[0002] In current computer hardware maintenance and upgrade practices, memory module removal typically relies on adapter cards as an auxiliary tool. Adapter cards were originally designed to provide a compatibility solution, allowing different sizes or types of memory modules to be fitted into specific memory slots. This solution, to some extent, expands hardware flexibility, allowing users to upgrade memory without replacing the motherboard. However, existing methods lack the functionality to simultaneously open the memory slot and retrieve the memory module; furthermore, using adapter cards increases testing instability and additional costs, and there are scenarios where adapter cards cannot be used, thus failing to meet usage needs. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a device for disassembling and assembling memory modules.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] This utility model provides a device for disassembling and assembling memory modules, including: a fixing base, a disassembly component, and a pressing component. The disassembly component is installed in the vertical direction of the fixing base, and the pressing component is installed in the horizontal direction of the fixing base. The disassembly component is used to disassemble or place the memory module, and the pressing component is used to press the memory module to complete the installation of the memory module. The fixing base is drivenly connected to an external robotic arm, and the robotic arm is used to control and switch the operation of the disassembly component or the pressing component.

[0006] In one specific embodiment, the disassembly assembly includes a mounting base, a disassembly cylinder, and two disassembly claws. The mounting base is connected to the fixed base, the disassembly cylinder is connected to the mounting base, and the two disassembly claws are respectively driven to both sides of the disassembly cylinder. The disassembly cylinder operates to cause the two disassembly claws to form an open or closed state.

[0007] In one specific embodiment, the end of the disassembly claw is provided with an angled shovel, which is used to pry open the latch of the memory slot or hook the notch of the memory module.

[0008] In one specific embodiment, the outer side of the inclined shovel is also provided with an anti-slip layer.

[0009] In one specific embodiment, the disassembly cylinder is also connected to a mounting plate, both ends of which are connected to limit plates, and the disassembly claw is located between the two limit plates.

[0010] In one specific embodiment, the limiting plate is provided with a sliding groove, the disassembly claw is slidably connected to the sliding groove by a pin, a tension spring is sleeved on the pin, and the tension spring is also connected to the limiting plate.

[0011] In one specific embodiment, a linear bearing is further provided between the mounting base and the fixed base, and a spring is sleeved on the linear bearing.

[0012] In one specific embodiment, the pressing assembly includes a pressing seat and a pressing block, the pressing seat being connected to the fixed base, and the pressing block being connected to the pressing seat.

[0013] In one specific embodiment, a connecting post is further provided between the pressing seat and the fixing seat, and a spring is sleeved on the connecting post.

[0014] The advantages of this utility model for disassembling and installing memory modules compared with the prior art are: by integrating a disassembly component and a pressing component, the disassembly and installation operations of memory modules are respectively handled, and the switching and control of the two are realized by the mechanical arm on the fixed base. This integrated design greatly simplifies the operation process, and memory modules can be quickly disassembled and installed without additional tools or adapter cards, thus improving work efficiency.

[0015] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A front perspective view of the device for disassembling and assembling memory modules provided by this utility model;

[0018] Figure 2 A three-dimensional view of the back of the device for disassembling and assembling memory modules provided by this utility model;

[0019] Figure 3 An exploded view of the device for disassembling and assembling memory modules provided by this utility model;

[0020] Figure 4 An exploded view of the disassembly components provided by this utility model;

[0021] Figure 5 A schematic diagram of the pressing component provided by this utility model;

[0022] Figure 6 A schematic diagram illustrating an application scenario of the device for disassembling and assembling memory modules provided by this utility model;

[0023] Figure 7 A flowchart illustrating the usage of the device for disassembling and assembling memory modules provided by this utility model. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0031] See Figures 1 to 6 The specific embodiment shown in this utility model discloses a device for disassembling and assembling memory modules, including: a fixing base 10, a disassembly component 20, and a pressing component 30. The disassembly component 20 is installed in the vertical direction of the fixing base 10, and the pressing component 30 is installed in the horizontal direction of the fixing base 10. The disassembly component 20 is used to disassemble or place the memory module, and the pressing component 30 is used to press the memory module to complete the installation of the memory module. The fixing base 10 is tractively connected to an external robotic arm, and the robotic arm is used to control and switch the operation of the disassembly component 20 or the pressing component 30.

[0032] Specifically, the integrated disassembly component 20 and pressing component 30 are responsible for the disassembly and installation of memory modules, respectively. A robotic arm on the mounting base 10 switches between and controls these two operations. This integrated design greatly simplifies the operation process, enabling rapid disassembly and installation of memory modules without the need for additional tools or adapter cards, thus improving work efficiency. Furthermore, the disassembly component 20 has a dedicated mechanism that automatically opens the memory slot's latches and simultaneously and securely grips the memory module, avoiding the risk of damage that may occur with manual operation. Meanwhile, the pressing component 30 precisely presses the memory module into the memory slot, ensuring proper installation and improving operational accuracy and safety. In addition, this device directly supports standard memory modules without the need for an adapter card as an intermediary, eliminating the need to purchase and maintain adapter cards and reducing costs.

[0033] More specifically, the mounting base 10 is connected to the robotic arm via the mounting head 40. The disassembly component 20 and the pressing component 30 are offset at 90 degrees to prevent mutual interference. In other words, by offsetting the disassembly component 20 and the pressing component 30 at 90 degrees, potential mutual interference during operation is effectively avoided. This design not only optimizes the overall spatial layout of the device but also ensures that each component can operate independently and efficiently, improving overall stability and reliability. Furthermore, while maintaining functionality, this offset design also enhances the device's structural compactness. By making efficient use of space, the device becomes smaller and lighter. Additionally, the mounting base 10 is connected to the robotic arm via the mounting head 40. This connection method not only ensures a stable connection between the mounting base 10 and the robotic arm but also allows for more precise positioning and operation. The mounting head 40 may include a locking mechanism or an adjustment mechanism to further increase the stability and flexibility of the connection.

[0034] See Figures 1 to 4 As shown, in one embodiment, the disassembly assembly 20 includes a mounting base 21, a disassembly cylinder 22, and two disassembly claws 23. The mounting base 21 is connected to the fixed base 10, the disassembly cylinder 22 is connected to the mounting base 21, and the two disassembly claws 23 are respectively driven to both sides of the disassembly cylinder 22. The disassembly cylinder 22 operates to make the two disassembly claws 23 open or closed.

[0035] Specifically, driven by the disassembly cylinder 22, the two disassembly claws 23 can quickly and accurately open or close. This design ensures the stability and accuracy of the memory module during disassembly and assembly, effectively preventing damage to the memory module or memory slot due to improper operation. Furthermore, the disassembly assembly 20 consists of a mounting base 21, a disassembly cylinder 22, and two disassembly claws 23. Its compact and rationally designed structure not only makes the entire device lighter and more flexible but also facilitates integration with other components or systems, improving overall compatibility and adaptability. In addition, the automated control of the disassembly cylinder 22 makes the opening and closing of the disassembly claws 23 simple and quick, eliminating the need for manual operation. This not only improves work efficiency but also reduces operational errors caused by human factors, enhancing the overall level of automation. Furthermore, the two disassembly claws 23 are respectively driven and connected to both sides of the disassembly cylinder 22, ensuring even force distribution and sufficient stability and reliability when gripping the memory module. Simultaneously, the shape and material of the disassembly claws 23 can be customized according to the specific size and characteristics of the memory module to further improve the accuracy and firmness of the gripping.

[0036] See Figures 1 to 4 As shown, in one embodiment, the end of the disassembly claw 23 is provided with an oblique shovel 231, which is used to pry open the latch of the memory slot or hook the notch of the memory module.

[0037] Specifically, the angled spatula 231 at the end of the disassembly claw 23 can precisely pry open the latches of the memory slot or hook the notch of the memory module. This design significantly improves the accuracy and efficiency of the disassembly process, ensuring that the memory module can be smoothly and without damage removed from the memory slot. Furthermore, the angled spatula 231 allows the disassembly claw 23 to apply force more gently and evenly when prying open the latches or hooking the notch. This not only avoids damage to the memory module or memory slot caused by direct, forceful disassembly but also extends the lifespan of the memory module and memory slot. In addition, the presence of the angled spatula 231 simplifies the disassembly process, reduces the difficulty of operation, and allows for easy removal of the memory module without the need for additional tools or skills, improving operational convenience. Moreover, the angled spatula 231 is typically made of high-strength, wear-resistant materials, capable of withstanding multiple disassembly operations without damage. This enhances the durability and reliability of the disassembly claw 23, ensuring the stability and longevity of the disassembly process.

[0038] See Figure 4 As shown, in one embodiment, the outer side of the inclined shovel 231 is further provided with an anti-slip layer 232.

[0039] Specifically, the presence of the anti-slip layer 232 significantly enhances the friction of the angled shovel 231 when opening the memory slot latch, effectively preventing slippage caused by smooth surfaces or improper operation. This improvement ensures that the disassembly claw 23 can perform disassembly actions stably and accurately, improving overall operational stability. Furthermore, reduced slippage means a significantly lower probability of operational errors. This not only avoids damage to the memory module or memory slot due to improper operation but also reduces additional wear caused by repeated disassembly attempts, extending the lifespan of the memory module and memory slot. Additionally, the design of the anti-slip layer 232 makes the disassembly process smoother and easier to control, reducing the difficulty and complexity for operators. This improves the user experience and enhances operator satisfaction and trust in the product. Moreover, the design of the anti-slip layer 232 ensures that the disassembly claw 23 maintains good operational performance under various working environments and conditions. Whether in humid, oily, or dusty environments, the anti-slip layer 232 provides sufficient friction to ensure a smooth disassembly process. In addition, since the anti-slip layer 232 reduces the direct friction and wear between the angled shovel 231 and the memory slot clip, it also indirectly extends the service life of the disassembly claw 23, which reduces the maintenance cost for operators and improves the cost-effectiveness of the product.

[0040] See Figures 1 to 4 As shown, in one embodiment, the disassembly cylinder 22 is also connected to a mounting plate 24, both ends of which are connected to limit plates 25, and the disassembly claw 23 is located between the two limit plates 25.

[0041] Specifically, a stable frame structure is formed by connecting a disassembly cylinder 22 to a mounting plate 24, with limiting plates 25 connected to both ends of the mounting plate 24. The disassembly claw 23 is located between the two limiting plates 25. This design effectively limits the lateral movement of the disassembly claw 23 during the disassembly process, enhancing the overall structural stability and ensuring the accuracy and reliability of the disassembly action. Furthermore, the limiting plates 25 not only restrict the movement range of the disassembly claw 23 but also protect the disassembly claw 23 and surrounding components. During disassembly, even in the event of an accident, the limiting plates 25 prevent the disassembly claw 23 from moving excessively and damaging the memory module, slot, or other adjacent components. Additionally, the stable frame structure allows the disassembly claw 23 to more accurately position itself at the memory slot's latch, reducing disassembly errors caused by shaking or misalignment, improving the precision and efficiency of the disassembly, and ensuring that the memory module can be smoothly and without damage removed from the memory slot.

[0042] See Figure 4As shown, in one embodiment, the limiting plate 25 is provided with a sliding groove 251, the disassembly claw 23 is slidably connected to the sliding groove 251 by a pin 26, a tension spring 27 is sleeved on the pin 26, and the tension spring 27 is also connected to the limiting plate 25.

[0043] Specifically, different memory modules have varying height tolerances. When the disassembly claw 23 reaches the predetermined position, if the memory slot latch is too high, the disassembly claw 23 can be moved upwards through the cooperation of the sliding groove 251, the pin 26, and the tension spring 27, preventing damage to the memory slot latch. In other words, by setting a sliding groove 251 on the limiting plate 25 and sliding the disassembly claw 23 within the sliding groove 251 via the pin 26, along with the tension spring 27, this design gives the disassembly claw 23 the ability to adaptively adjust its height. When the disassembly claw 23 reaches the predetermined position, if the memory slot latch is too high due to tolerance, the disassembly claw 23 can automatically move upwards under the action of the tension spring 27, ensuring accurate engagement with the latch and avoiding damage to the latch due to hard contact. Furthermore, due to the tolerance in the height of memory modules, traditional disassembly methods may cause damage due to inaccurate matching. This design, through the ingenious cooperation of the sliding groove 251, pin 26, and tension spring 27, effectively improves the fault tolerance rate of the disassembly process. Even if the memory module's position is slightly off, disassembly can be completed smoothly, reducing operational difficulty and the risk of error. In addition, this design automatically adjusts the height of the disassembly claw 23, avoiding friction and damage caused by hard collisions between the claw 23 and the latch, effectively protecting the integrity of the memory slot and latch, and extending the lifespan of the memory module and memory slot. Moreover, the design of the sliding groove 251 and pin 26 allows the disassembly claw 23 to move flexibly during disassembly, while the tension spring 27 ensures the stability of the claw 23 during movement, preventing disassembly errors caused by shaking or misalignment. Furthermore, the disassembly claw 23 automatically adapts to memory modules of different heights without the need for manual adjustment, simplifying the operation and improving disassembly efficiency. This is especially important for repair or upgrade work that requires the disassembly of a large number of memory modules.

[0044] See Figure 3 As shown, in one embodiment, a linear bearing 28 is further provided between the mounting base 21 and the fixed base 10, and a spring is sleeved on the linear bearing 28.

[0045] Specifically, the spring fitted on the linear bearing 28 plays a crucial role in buffering and shock absorption. During disassembly or installation, when encountering impact or vibration, the spring can absorb and disperse this energy, effectively reducing the impact and damage to the mounting base 21, the fixed base 10, and connected components, thus improving the stability and reliability of the entire device. In addition to buffering and shock absorption, the spring also provides overpressure protection; when subjected to excessive pressure or force, the spring can undergo elastic deformation, thereby absorbing and dispersing this additional pressure, preventing components from being damaged due to excessive load. This is of great significance for protecting precision components and extending the life of the device.

[0046] See Figures 1 to 6 As shown, in one embodiment, a first photoelectric sensor 50 is also provided between the two limiting plates 25, and the first photoelectric sensor 50 is located between the two disassembly claws 23 to detect the memory module in real time and avoid abnormal drops during transportation. In other words, by setting the first photoelectric sensor 50 between the two limiting plates 25 and positioning it between the two disassembly claws 23, the presence status of the memory module can be detected in real time. This real-time monitoring mechanism ensures the safety and reliability of the memory module during transportation, effectively preventing damage or loss caused by abnormal drops. Furthermore, the application of the first photoelectric sensor 50 improves the accuracy of the memory module transportation process. When the sensor detects the memory module, it ensures that the disassembly claws 23 have correctly gripped the memory module and are ready for transportation. This confirmation mechanism reduces transportation errors caused by improper operation or equipment failure, improving the overall reliability and efficiency of the operation. In addition, the integration of the first photoelectric sensor 50 enables the device to better support automated and intelligent control. Through integration with the control system, the first photoelectric sensor 50 can transmit the status information of the memory module in real time, thereby achieving precise control and optimization of the transportation process. This integrated design helps improve the overall performance and flexibility of the system.

[0047] See Figures 1 to 6As shown, in one embodiment, the mounting base 10 is further provided with a second photoelectric sensor 60, and the mounting base 21 is provided with a sensing plate 70 corresponding to the second photoelectric sensor 60. If the memory module is misaligned or in other abnormal states, causing the robotic arm to press down, the disassembly claw 23 may fail to grasp the memory module, potentially damaging the memory slot. By setting the second photoelectric sensor 60, when the memory module is not grasped, the disassembly claw 23 will lift up, causing the sensing plate 70 to trigger the second photoelectric sensor 60, and the robotic arm will stop working, thus protecting the memory slot. In other words, by setting the second photoelectric sensor 60 on the mounting base 10 and the corresponding sensing plate 70 on the mounting base 21, it is possible to accurately detect whether the memory module has been correctly grasped. When the memory module is misaligned or in other abnormal states, the second photoelectric sensor 60 can respond quickly, ensuring that the robotic arm and the disassembly claw 23 will not continue to press down without a memory module, thereby avoiding potential damage to the memory slot. When the disassembly claw 23 fails to successfully grasp the memory module, the robotic arm immediately stops its downward pressing action and triggers the second photoelectric sensor 60 via the sensing plate 70. This mechanism effectively prevents damage to the memory slot due to misoperation or equipment failure, protecting the integrity and reliability of the computer hardware. Furthermore, the introduction of the second photoelectric sensor 60 not only improves operational accuracy but also significantly enhances operational safety. Through real-time monitoring and feedback mechanisms, the system can stop operation in time before potential dangers occur, avoiding accidental damage or personal injury caused by equipment failure or human error.

[0048] See Figure 5 As shown, in one embodiment, the pressing assembly 30 includes a pressing seat 31 and a pressing block 32, the pressing seat 31 being connected to the fixed seat 10, and the pressing block 32 being connected to the pressing seat 31.

[0049] Specifically, the designed pressing component 30, especially the pressing block 32, precisely aligns with the latching position of the memory slot and applies sufficient pressure to ensure the memory module is securely locked in the latch. This precise installation method avoids loosening or damage to the memory module due to improper manual operation, improving the accuracy and reliability of the installation. Furthermore, the introduction of the pressing component 30 greatly simplifies the memory module installation process. Operators no longer need to perform complex operations or alignment steps; they simply insert the memory module into the slot and then complete the installation using the pressing component 30. This not only improves installation efficiency but also reduces operational difficulty, allowing even non-professionals to easily complete the installation. In addition, because the pressing component 30 can quickly and accurately complete the pressing and locking action of the memory module, it greatly improves installation efficiency. This is particularly important for computer assembly lines or repair work that require installing a large number of memory modules, significantly reducing working time and labor costs.

[0050] See Figure 5 As shown, in one embodiment, a connecting post 33 is provided between the pressing seat 31 and the fixing seat 10, and a spring is sleeved on the connecting post 33.

[0051] Specifically, the spring fitted on the connecting post 33 plays a crucial role in buffering and shock absorption between the pressing base 31 and the fixed base 10. When the pressing base 31 is subjected to external force, the spring can absorb and disperse this energy, effectively reducing the impact on the fixed base 10 and its connected components, thereby protecting the stability and integrity of the entire device. In addition, the introduction of the spring gives the pressing base 31 a certain degree of floating during the pressing process, which can better adapt to memory modules of different specifications and sizes. Even if there are slight size differences or installation deviations between the memory module and the memory slot, the spring can compensate for these differences through its elastic deformation, ensuring that the memory module can be installed smoothly and securely. Furthermore, due to the buffering effect of the spring, pressure can be applied more smoothly and slowly when pressing the memory module, avoiding installation errors or damage caused by rapid or violent pressing actions. This helps to improve the installation accuracy of the memory module and ensures that the memory module can be correctly and reliably locked in the memory slot.

[0052] See Figure 2 and Figure 5 As shown, in one embodiment, a pressure sensor 80 is also provided on the pressing base 31. When the pressing block 32 presses the memory module, the pressure sensor 80 can monitor the pressure data in real time. When the pressure data matches the set data, the robotic arm stops working. To prevent damage to the memory module caused by overpressure due to pressure sensor 80 failure, the spring on the connecting post 33 plays a role in preventing damage due to excessive pressure. In other words, by setting the pressure sensor 80 on the pressing base 31, the system can monitor the pressure data applied to the memory module by the pressing block 32 in real time. When the pressure reaches the preset value, the robotic arm will automatically stop working, thereby ensuring that the pressure on the memory module during installation is precisely controlled within a safe range. This precise control helps to avoid damage to the memory module due to excessive pressure. In addition, the introduction of the pressure sensor 80 significantly improves the safety of the memory module installation process. By monitoring the pressure data in real time, the system can stop working in time when the pressure is abnormal, preventing damage to the memory module due to overpressure. In addition, besides the pressure sensor 80, the spring on the connecting post 33 also provides an additional overpressure protection mechanism. Even if the pressure sensor 80 fails for some reason, the spring can absorb and disperse the additional pressure through its elastic deformation, thereby preventing the memory module from being damaged by excessive pressure. This dual protection mechanism further enhances the reliability and stability of the system.

[0053] See Figure 7 As shown in the figure, this utility model embodiment provides a method for using a device for disassembling and assembling memory modules, including the following steps:

[0054] S1. If it is necessary to remove the memory module, the robotic arm moves the disassembly component to the memory slot area. Then, the disassembly cylinder works to open the two disassembly claws to open the memory slot latch. Then, the disassembly cylinder works to close the two disassembly claws to hook the notch of the memory module. Then, the robotic arm moves the disassembly component upward to remove the memory module, thus completing the disassembly of the memory module.

[0055] S2. If a memory module needs to be installed, the robotic arm moves the disassembly component to the new memory module placement station. Then, the disassembly cylinder closes the two disassembly claws to hook the notch of the new memory module. The robotic arm then moves the disassembly component to the memory slot area and moves it downward to insert the new memory module into the memory slot. The disassembly cylinder then opens the two disassembly claws to release the new memory module. The robotic arm then switches to the pressing component and moves the pressing block downward to press the new memory module until the memory slot's latch locks the new memory module in place, thus completing the memory module installation.

[0056] Specifically, through the coordinated work of the robotic arm, disassembly components, and pressing components, rapid and automated disassembly and installation of memory modules are achieved. Both disassembly and installation are completed through precise mechanical movements, significantly improving work efficiency and reducing the tediousness and time-consuming nature of manual operations. Furthermore, during disassembly, the disassembly claws, through precise opening and closing movements, first pry open the memory slot's latches and then hook onto the memory module's notch, preventing damage to the memory module or memory slot due to improper operation. Similarly, during installation, the precise pressing of the pressing components ensures that the memory module is securely inserted and locked in the memory slot, protecting the integrity of the hardware. In addition, the automated and mechanized operation greatly simplifies the memory module disassembly and installation process. Operators do not need professional skills and experience; they only need to follow simple instructions to complete the disassembly and installation of memory modules. This reduces the skill requirements for operators and improves the convenience and ease of use of the operation.

[0057] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A device for installing and removing memory modules, characterized in that, include: The device includes a mounting base, a disassembly assembly, and a pressing assembly. The disassembly assembly is mounted vertically on the mounting base, and the pressing assembly is mounted horizontally on the mounting base. The disassembly assembly is used to disassemble or place a memory module, and the pressing assembly is used to press the memory module to complete its installation. The mounting base is driven to an external robotic arm, which is used to control and switch the operation of the disassembly assembly or the pressing assembly.

2. The apparatus for disassembling and assembling memory modules according to claim 1, characterized in that, The disassembly assembly includes a mounting base, a disassembly cylinder, and two disassembly claws. The mounting base is connected to the fixed base, the disassembly cylinder is connected to the mounting base, and the two disassembly claws are respectively driven to both sides of the disassembly cylinder. The disassembly cylinder operates to make the two disassembly claws open or close.

3. The apparatus for disassembling and assembling memory modules according to claim 2, characterized in that, The end of the disassembly claw is equipped with an angled shovel, which is used to pry open the latch of the memory slot or hook the notch of the memory module.

4. The apparatus for disassembling and assembling memory modules according to claim 3, characterized in that, The outer side of the slanted shovel is also provided with an anti-slip layer.

5. The apparatus for disassembling and assembling memory modules according to claim 3, characterized in that, The disassembly cylinder is also connected to a mounting plate, and both ends of the mounting plate are connected to limit plates. The disassembly claw is located between the two limit plates.

6. The apparatus for disassembling and assembling memory modules according to claim 5, characterized in that, The limiting plate is provided with a sliding groove, and the disassembly claw is slidably connected to the sliding groove by a pin. A tension spring is sleeved on the pin, and the tension spring is also connected to the limiting plate.

7. The apparatus for disassembling and assembling memory modules according to claim 2, characterized in that, A linear bearing is also provided between the mounting base and the fixed base, and a spring is sleeved on the linear bearing.

8. The apparatus for disassembling and assembling memory modules according to claim 1, characterized in that, The pressing assembly includes a pressing base and a pressing block, wherein the pressing base is connected to the fixed base and the pressing block is connected to the pressing base.

9. The apparatus for disassembling and assembling memory modules according to claim 8, characterized in that, A connecting post is provided between the pressing seat and the fixing seat, and a spring is sleeved on the connecting post.

Images