Semiconductor sealing device and semiconductor apparatus
The design of the clamping components and sealing assemblies enables convenient assembly and disassembly of the semiconductor sealing device, solving the problem of complex assembly and disassembly of traditional sealing devices, and improving work efficiency and sealing effect.
Patent Information
- Application Number
- CN202520036513.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-01-07
AI Technical Summary
Traditional sealing devices have complex structures, making disassembly and assembly difficult, affecting work efficiency and increasing the risk of misoperation, which may damage semiconductor devices.
The design incorporates clamping and sealing components. The clamping components move along the side wall of the base housing to fix or release the sealing cover. Combined with lifting and transmission components, the sealing cover can be easily installed and removed. The sealing airbag provides an effective seal.
It simplifies the disassembly and assembly of the sealing cover, improves work efficiency, avoids product damage caused by tedious disassembly and assembly, and ensures sealing effect and equipment stability.
Smart Images

Figure CN223648526U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor sealing device and semiconductor equipment. Background Technology
[0002] In semiconductor manufacturing technology, sealing devices are typically used to provide sealed cavities to seal the semiconductor devices being processed, allowing for various technological treatments such as deposition, etching, and oxidation. To ensure product quality and performance, the sealing effectiveness of the sealing device must be guaranteed.
[0003] However, traditional sealing devices typically employ complex structures to ensure a tight seal. Because these structures are often difficult to disassemble, the installation and securing of the sealing devices during the assembly and disassembly of semiconductor devices becomes complicated, leading to reduced work efficiency.
[0004] Therefore, there is an urgent need for a sealing device that can be easily and quickly disassembled and assembled. Utility Model Content
[0005] Based on this, embodiments of this application provide a semiconductor sealing device and a semiconductor equipment, which can at least be easily and quickly disassembled and assembled.
[0006] According to some embodiments, this application provides a semiconductor sealing device, which includes a fixed base, a sealing assembly, and a sealing cover; the fixed base includes a base housing and a plurality of clamping members; the sealing cover is embedded in the top of the base housing; the clamping members are disposed on the inner side of the side wall of the base housing and move in a direction perpendicular to the side wall of the base housing to fix the sealing cover; the sealing assembly is disposed on the top of the clamping members and surrounds the sealing cover.
[0007] In the semiconductor sealing device of the above embodiment, the sealing cover is embedded in the top of the base housing, and the clamping member is disposed on the inner side wall of the base housing. The clamping member can move in a direction perpendicular to the side wall of the base housing to fix the sealing cover. The movement of the clamping member can realize the fixing or release of the sealing cover. The sealing assembly is disposed on the top of the clamping member and surrounds the sealing cover, which can achieve effective sealing of the sealing cover. In this way, through the cooperation between the sealing assembly and the various components in the fixed base, the sealing cover can be quickly clamped and fixed while ensuring effective sealing of the sealing cover. Furthermore, the sealing cover can be easily installed and removed by moving the clamping member, thereby simplifying the installation and removal of the sealing cover and improving work efficiency.
[0008] In some embodiments, the fixed base further includes a lifting assembly and a transmission assembly; the lifting assembly is disposed at the bottom of the base housing and moves in a direction perpendicular to the bottom surface of the base housing; one end of the transmission assembly is connected to the lifting assembly and the other end is connected to the clamping member.
[0009] In some embodiments, the lifting assembly includes a lead screw, a threaded sleeve, and a rotating ring; the lead screw is disposed at the bottom of the base housing; the threaded sleeve is sleeved on the outside of the lead screw and rotates circumferentially along the lead screw; the rotating ring is disposed at the top of the threaded sleeve and moves axially along the lead screw as the threaded sleeve rotates; a transmission assembly is connected to the rotating ring.
[0010] In some embodiments, a transmission hole is provided on the side wall of the base housing; one end of the transmission component is disposed in the transmission hole and connected to the clamping member, so as to drive the clamping member to move in a direction perpendicular to the side wall of the base housing.
[0011] In some embodiments, the transmission assembly includes a plurality of sliding rods and a plurality of connecting rods; the plurality of sliding rods pass through the transmission hole and are correspondingly connected to a plurality of clamping members, and reciprocate along the direction perpendicular to the side wall of the base housing; one end of the plurality of connecting rods is correspondingly connected to the plurality of sliding rods, and the other end is connected to the lifting device.
[0012] In some embodiments, the transmission assembly further includes a plurality of hinges; the sliding rod and the connecting rod, and the connecting rod and the lifting device are all connected by hinges; one end of the connecting rod connected to the sliding rod reciprocates along the direction perpendicular to the side wall of the base housing with the sliding rod, and the other end of the connecting rod connected to the lifting device moves along the direction perpendicular to the bottom surface of the base housing with the lifting device.
[0013] In some embodiments, the sealing assembly includes a sealing ring and a sealing airbag; the sealing ring is disposed on the inner side wall of the base housing and surrounds the sealing cover; the sealing airbag is disposed between the sealing ring and the sealing cover.
[0014] In some embodiments, a sealing groove is provided on the outer side wall of the sealing cover; a sealing airbag is disposed within the sealing groove.
[0015] In some embodiments, the sealing assembly further includes an air inlet switch and an air outlet switch disposed on the sealing ring, both of which are connected to the sealing airbag; the air inlet switch is used to control the expansion of the sealing airbag to seal the sealing cover; the air outlet switch is used to control the contraction of the sealing airbag to release the sealing cover.
[0016] According to some embodiments, this application also provides a semiconductor device including the semiconductor sealing device in any of the above embodiments, the semiconductor device being used to perform a preset process.
[0017] In the semiconductor device of the above embodiments, since a portable and detachable semiconductor sealing device is used, the workflow can be simplified, the overall work efficiency and flexibility can be improved, and product damage caused by cumbersome disassembly can be avoided while ensuring the sealing effectiveness during the execution of the preset process. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of a semiconductor sealing device provided in an embodiment of the present invention;
[0019] Figure 2 This is a cross-sectional schematic diagram of a portion of the structure of a semiconductor sealing device according to an embodiment of the present invention;
[0020] Figure 3 This is a schematic diagram of a transmission component in a semiconductor device according to an embodiment of the present invention.
[0021] Explanation of reference numerals in the attached drawings: 1. Fixed base; 101. Base shell; 102. Lead screw; 103. Screw sleeve; 104. Rotating ring; 105. Hinge; 106. Connecting rod; 107. Sliding rod; 108. Clamping component; 2. Sealing assembly; 201. Sealing ring; 202. Sealing airbag; 203. Air inlet switch; 204. Air release switch; 3. Sealing cover; 4. Bracket. Detailed Implementation
[0022] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0024] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.
[0025] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] Furthermore, the terms “first”, “second”, etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.
[0027] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.
[0028] Embodiments of the present invention are described herein with reference to schematic diagrams as preferred embodiments (and intermediate structures), thus allowing for the anticipation of variations in the shown shape due to, for example, manufacturing techniques and / or tolerances. Therefore, embodiments of the present invention should not be limited to the specific shape of the area shown herein, but rather include shape deviations due to, for example, manufacturing techniques.
[0029] In semiconductor manufacturing technology, sealing devices are typically used to provide sealed cavities to enclose semiconductor devices and perform various processing steps within them, such as deposition, etching, and oxidation. To ensure product quality and performance, the sealing effectiveness of the sealing device must be guaranteed. Specifically, deposition is one of the main methods for growing monocrystalline and polycrystalline silicon, and it usually requires a sealing device. Monocrystalline silicon is the basic material for manufacturing integrated circuits (ICs), while polycrystalline silicon is commonly used in the fabrication of solar cells. In the sealing device used for deposition, a ceramic temperature-controlled led-dome (CDR) is typically used to cover the wafer, sealing the deposition equipment cavity and forming a closed chamber environment. Around the bell-shaped dome are coiled antenna components that generate plasma by applying high-frequency power to create an induced electric field. This plasma is then introduced into the chamber through the CDR for plasma treatment and to protect the deposition process. The ceramic chamber cover plays a crucial role in ensuring the sealing of the reaction chamber, the pressure difference between the inside and outside, and the cleanliness of the reaction chamber. It is one of the most critical core components of the deposition equipment.
[0030] However, traditional sealing devices typically employ complex structures to ensure sealing performance. Their often difficult disassembly leads to complicated installation and fixation operations during semiconductor device assembly and disassembly, resulting in reduced work efficiency. While this complexity improves sealing performance to some extent, it also introduces operational inconvenience. In practice, especially during semiconductor device assembly and disassembly, operators often face the following problems: First, the disassembly and assembly of sealing devices is very cumbersome, often requiring specialized tools and equipment, which wastes time. Operators may need to spend a significant amount of time ensuring that each component can be successfully disassembled and installed. Second, traditional sealing device designs are often not user-friendly, and operators are prone to fatigue during repetitive disassembly and assembly operations, increasing the risk of misoperation. This can not only lead to a decrease in sealing performance but also damage to the semiconductor devices being processed. Furthermore, during repeated disassembly and assembly, components of the sealing device may wear or age, which also affects its sealing performance and negatively impacts subsequent production processes. Therefore, developing more convenient and efficient sealing devices has become one of the urgent problems to be solved in the field of semiconductor manufacturing technology.
[0031] In a prior art cavity sealing device, a hydraulic sealing ring structure replaces the traditional silicone sealing ring, significantly improving the sealing ring's oxidation resistance, thereby extending its service life, reducing equipment maintenance frequency, and lowering labor costs. Through the cooperation of a lead screw, hydraulic piston, and hydraulic sleeve, even when the sealing ring is worn, the lead screw can drive the hydraulic piston to increase the downward pressure on the annular sealing ring, ensuring that the sealing ring can still maintain a seal. This reduces the probability of product defects after the sealing ring wears out, improving product quality. However, while ensuring sealing performance, the aforementioned sealing device is difficult to disassemble and cumbersome to install and fix.
[0032] Based on this, this application provides a semiconductor sealing device and a semiconductor equipment.
[0033] Please see Figures 1 to 3 This application provides a semiconductor sealing device. The semiconductor sealing device includes a fixed base 1, a sealing assembly 2, and a sealing cover 3; the fixed base 1 includes a base housing 101 and a plurality of clamping members 108; the sealing cover 3 is embedded in the top of the base housing 101; the clamping members 108 are disposed on the inner side wall of the base housing 101 and move in a direction perpendicular to the side wall of the base housing 101 to fix the sealing cover 3; the sealing assembly 2 is disposed on the top of the clamping members 108 and surrounds the sealing cover 3.
[0034] In the semiconductor sealing device of the above embodiment, the sealing cover 3 is embedded in the top of the base housing 101, and the clamping member 108 is disposed on the inner side wall of the base housing 101. The clamping member 108 can move in a direction perpendicular to the side wall of the base housing 101 to fix the sealing cover 3. The movement of the clamping member 108 can realize the fixing or release of the sealing cover 3. The sealing assembly 2 is disposed on the top of the clamping member 108 and surrounds the sealing cover 3, which can realize the effective sealing of the sealing cover 3. In this way, through the cooperation between the sealing assembly 2 and the components in the fixed base 1, the sealing cover 3 can be quickly clamped and fixed while ensuring the effective sealing of the sealing cover 3, and the sealing cover 3 can be easily disassembled and assembled by moving the clamping member 108, thereby simplifying the disassembly and assembly operation of the sealing cover 3 and improving work efficiency.
[0035] In some embodiments, the mounting base 1 can be made of metal. Due to the high density of metal, it has a greater weight for the same volume, thus providing stability and robustness. Using a metal mounting base 1 effectively increases the overall weight of the semiconductor sealing device, thereby improving its stability and preventing it from wobbling due to insufficient mass. This ensures that the mounting base 1 can firmly secure the sealing cover 3 in practical applications and accurately perform testing and processing.
[0036] In some embodiments, the sealing cover 3 is made of a transparent material. For example, the sealing cover 3 may be made of transparent glass coated with an ITO film. Alternatively, the sealing cover 3 may be made of other materials, such as ordinary glass, transparent resin, etc. Using a transparent material for the sealing cover 3 allows workers to observe the sealing cavity inside, thus clearly understanding the process execution and improving product yield.
[0037] In some embodiments, the sealing cover 3 may include a cavity sidewall and a top cover. For example, the cavity sidewall has a cylindrical structure with an internal hollow area serving as the sealing cavity. The top cover has a hemispherical structure and is fixed to the top of the cavity sidewall. In one embodiment, the cavity sidewall and the top cover are integrally formed.
[0038] In some embodiments, both the fixing base 1 and the sealing assembly 2 are annular in shape. It is understood that when the cavity sidewall of the sealing cover 3 is cylindrical, setting the fixing base 1 to an annular shape improves the compatibility between the fixing base 1 and the sealing cover 3. Furthermore, the sealing assembly 2 is also annular in shape, which improves the compatibility between the sealing assembly 2 and the sealing cover 3, and is beneficial for improving the sealing effect of the sealing assembly 2 on the sealing cover 3.
[0039] In some embodiments, the clamping member 108 adopts an inwardly curved arc-shaped sheet structure, with its sidewall facing the sealing cover 3 closely fitting the outer sidewall of the sealing cover 3. It is understood that when the cavity sidewall of the sealing cover 3 is cylindrical, the clamping member 108 with its inwardly curved arc-shaped sheet structure can improve the fixing effect of the clamping member 108 on the sealing cover 3. For example, multiple clamping members 108 are evenly distributed along the circumference of the sealing cover 3, thereby ensuring uniform force application when clamping the sealing cover 3, making the application of force to the sealing cover 3 more uniform, and further improving the fixing effect of the clamping member 108 on the sealing cover 3.
[0040] In one embodiment, a buffer (not shown) may also be provided between the clamping member 108 and the sealing cover 3. The buffer is made of a soft material and can prevent collision damage to the sealing cover 3 when the clamping member 108 moves.
[0041] like Figure 1 As shown, in some embodiments, the semiconductor sealing device further includes a support 4 disposed at the bottom of the fixed base 1 for supporting the components above it. For example, the support 4 may consist of multiple support columns evenly distributed along the circumference of the fixed base 1, thereby maintaining the balance of the semiconductor sealing device, reducing swaying and instability caused by imbalance, and ensuring that the semiconductor sealing device is not easily tilted or moved during use, thus guaranteeing the accuracy of testing and processing.
[0042] In some embodiments, the fixed base 1 further includes a lifting assembly and a transmission assembly. The lifting assembly is disposed at the bottom of the base housing 101 and moves in a direction perpendicular to the bottom surface of the base housing 101. One end of the transmission assembly is connected to the lifting assembly, and the other end is connected to the clamping member 108. Thus, through the cooperation of the lifting assembly and the transmission assembly, the clamping member 108 can be moved in a direction perpendicular to the side wall of the base housing 101 to fix the sealing cover 3.
[0043] like Figure 3 As shown, in some embodiments, the lifting assembly includes a lead screw 102, a threaded sleeve 103, and a rotating ring 104. The lead screw 102 is disposed at the bottom of the base housing 101. The threaded sleeve 103 is sleeved on the outside of the lead screw 102 and rotates circumferentially along the lead screw 102. The threaded sleeve 103 has a fine thread design to ensure smooth and efficient driving of other components for lifting movements during rotation. The rotating ring 104 is disposed on the top of the threaded sleeve 103 and moves axially along the lead screw 102 as the threaded sleeve 103 rotates. For example, the rotating ring 104 is sleeved on the outside of the lead screw 102 and spirals up or down on the lead screw 102 as the threaded sleeve 103 rotates, so as to achieve linear displacement through rotational motion, thereby effectively converting rotation into linear motion and improving the accuracy of lifting. A transmission assembly is connected to the rotating ring 104. Thus, through the mutual cooperation of the lead screw 102, the threaded sleeve 103, and the rotating ring 104 in the lifting assembly, efficient and stable lifting movements can be achieved.
[0044] For example, the lead screw 102 is fixedly connected to the bottom of the base housing 101 to ensure that it does not shift during operation. Furthermore, the extension direction of the lead screw 102 is perpendicular to the bottom surface of the base housing 101, thus forming a robust foundation. This vertical configuration leverages the mechanical advantages of the lead screw 102, enabling it to effectively convert rotational power into linear motion, supporting subsequent lifting operations.
[0045] For example, the threaded sleeve 103 is located at the end of the lead screw 102 away from the base housing 101, which facilitates the rotation and sliding of the threaded sleeve 103 and provides sufficient space for the lifting assembly. The transmission assembly is movably connected to the rotating ring 104, and the rotating ring 104 moves along the axial direction of the lead screw 102, which can drive the transmission assembly to move.
[0046] In some embodiments, the outer wall of the lead screw 102 may be provided with external threads, and the inner wall of the threaded sleeve 103 and the drive ring may be provided with internal threads. For example, the external thread on the outer wall of the lead screw 102 may be a right-hand thread (also called a positive thread), a left-hand thread (also called a reverse thread), or a multi-start thread, etc. Figure 3 As shown, when the external thread on the outer wall of the lead screw 102 is a positive thread, when the screw sleeve 103 rotates to the right, the transmission ring can rotate clockwise and rise on the lead screw 102; when the screw sleeve 103 rotates to the left, the transmission ring can rotate counterclockwise and descend on the lead screw 102.
[0047] In some embodiments, a transmission hole (not shown) is provided on the side wall of the base housing 101; one end of the transmission component is disposed in the transmission hole and connected to the clamping member 108, so as to drive the clamping member 108 to move in a direction perpendicular to the side wall of the base housing 101.
[0048] like Figure 3 As shown, in some embodiments, the transmission assembly includes multiple sliding rods 107 and multiple connecting rods 106. The multiple sliding rods 107 pass through the transmission hole and are correspondingly connected to multiple clamping members 108, and reciprocate along the direction perpendicular to the side wall of the base housing 101. When the sliding rods 107 reciprocate, the clamping members 108 can effectively fix or release the sealing cover 3, achieving rapid operation. One end of each of the multiple connecting rods 106 is correspondingly connected to the multiple sliding rods 107, and the other end is connected to a lifting device to achieve linkage between the lifting device and the sliding rods 107. Through this multi-layered, multi-part design, the transmission assembly can provide excellent flexibility in relatively complex working environments, ensuring efficient collaboration among all components. The combination of multiple sliding rods 107, connecting rods 106, and clamping members 108 helps improve operational accuracy and increase equipment stability.
[0049] For example, the connecting rod 106 is movably connected to the sliding rod 107, and the connecting rod 106 is movably connected to the lifting device. In some embodiments, the extending direction of the sliding rod 107 is perpendicular to the side wall of the base housing 101, and the extending direction of the connecting rod 106 is at an angle to the extending direction of the lead screw 102, and the angle can change as the connecting rod 106 moves.
[0050] In some embodiments, the transmission assembly further includes a plurality of hinges 105; the sliding rod 107 and the connecting rod 106, and the connecting rod 106 and the lifting device are all connected by hinges 105; one end of the connecting rod 106 connected to the sliding rod 107 moves back and forth along the direction of the sliding rod 107 along the side wall of the vertical base housing 101, and one end of the connecting rod 106 connected to the lifting device moves along the direction of the lifting device along the bottom surface of the vertical base housing 101.
[0051] In some embodiments, one end of the connecting rod 106 can be rotated about the direction perpendicular to the sidewall of the transmission ring via the hinge 105. Thus, when the transmission ring moves axially along the lead screw 102 as the screw sleeve 103 rotates, it can drive one end of the connecting rod 106 to rotate.
[0052] In some embodiments, the other end of the connecting rod 106 can be rotated around one end of the sliding rod 107 via the hinge 105. Thus, by rotating the connecting rod 106, the sliding rod 107 can reciprocate within the transmission hole along the direction perpendicular to the side wall of the base housing 101, thereby causing the clamping member 108 to fix or release the sealing cover 3. For example, when the transmission ring moves downward along the axial direction of the lead screw 102, the angle between the connecting rod 106 and the lead screw 102 decreases with the movement of the transmission ring and the connecting rod 106. At this time, as the angle decreases, the distance between the end of the connecting rod 106 connected to the sliding rod 107 and the side wall of the base housing 101 decreases, thereby causing the sliding rod 107 to move inward, and subsequently causing the clamping member 108 to clamp the sealing cover 3 for fixation. Through the above operations, the sealing cover 3 can be easily disassembled and reassembled, which helps to improve the safety and stability of the operation. With the help of the rotatable connecting rod 106, the operator can flexibly adjust the angle between the connecting rod 106 and the lead screw 102 to adapt to the sealing cover 3 of different sizes and shapes, thereby improving the flexibility and accuracy of the device.
[0053] In some embodiments, the sealing assembly 2 includes a sealing ring 201 and a sealing airbag 202; the sealing ring 201 is disposed on the inner side wall of the base housing 101 and surrounds the sealing cover 3; the sealing airbag 202 is disposed between the sealing ring 201 and the sealing cover 3. This design enables the sealing assembly 2 to effectively form a tight sealed area, preventing external pollutants and moisture from entering the interior of the sealing cover 3.
[0054] For example, the sealing ring 201 is typically made of wear-resistant and corrosion-resistant rubber or polymer to ensure that it maintains good sealing performance during long-term use.
[0055] For example, the sealing airbag 202 is typically made of an elastic material that expands after being inflated internally, thereby applying uniform pressure to the sealing cover 3 and enhancing the sealing performance. The elastic properties of the sealing airbag 202 enable it to adapt to different operating conditions, such as pressure differential changes or equipment vibration, thereby maintaining a continuous and stable sealing effect.
[0056] In some embodiments, a sealing groove is provided on the outer sidewall of the sealing cover 3; the sealing airbag 202 is disposed within the sealing groove. The sealing groove on the outer sidewall of the sealing cover 3 provides a dedicated receiving space for the sealing airbag 202, facilitating its embedding into the groove to form a sealing interface. This sealing allows the airbag to maximize its elasticity after inflation, achieving optimal sealing performance. The sealing airbag 202 being placed within the sealing groove helps maintain stability during use, preventing displacement and ensuring that the sealing airbag 202 effectively applies pressure to the outer side of the sealing cover 3, thus improving overall sealing performance. Those skilled in the art can determine the shape and depth of the sealing groove based on the dimensions of the sealing airbag 202 to ensure that the sealing airbag 202 can fully expand and contact its surroundings to form a uniform sealing surface.
[0057] In some embodiments, the sealing assembly 2 further includes an air inlet switch 203 and an air release switch 204 disposed on the sealing ring 201. Both the air inlet switch 203 and the air release switch 204 are connected to the sealing airbag 202. The air inlet switch 203 is used to control the expansion of the sealing airbag 202 so as to seal the sealing cover 3. The air release switch 204 is used to control the contraction of the sealing airbag 202 so as to release the sealing cover 3.
[0058] like Figure 2 As shown, for example, when using the above-described sealing device, when fixing the sealing cover 3, taking the outer wall of the lead screw 102 as having a positive thread as an example, the sealing cover 3 is placed on top of the base housing 101, and an external force to the left is applied to the threaded sleeve 103, causing it to rotate to the left along the lead screw 102. At this time, the rotation of the threaded sleeve 103 can drive the transmission ring to descend counterclockwise on the lead screw 102. When the transmission ring moves downward along the axial direction of the lead screw 102, the end of the connecting rod 106 connected to the transmission ring moves downward accordingly, so that the included angle between the connecting rod 106 and the lead screw 102 decreases with the movement of the transmission ring and the connecting rod 106. At this time, as the included angle decreases, since the length of the connecting rod 106 remains unchanged, the distance between the end of the connecting rod 106 connected to the sliding rod 107 and the side wall of the base housing 101 decreases accordingly, thereby driving the sliding rod 107 to move inward, and then driving the clamping member 108 to clamp the sealing cover 3 to achieve the fixation of the sealing cover 3. Open the air intake switch 203 to control the expansion of the sealing airbag 202. Sealing is achieved through a flexible connection via the expansion of the sealing airbag 202. Utilizing the flexible sealing characteristic of the sealing airbag 202, its deformation allows it to tightly fit against the sealing groove of the sealing cover 3, thus achieving a good seal. This completes the installation of the sealing cover 3.
[0059] For example, when releasing the sealing cover 3, the venting switch 204 is opened, controlling the sealing airbag 202 to contract, thereby releasing the seal of the sealing cover 3. Again, taking the lead screw 102 with a positive thread on its outer wall as an example, a rightward outward force is applied to the threaded sleeve 103, causing it to rotate to the right along the lead screw 102. At this time, the rotation of the threaded sleeve 103 drives the transmission ring to rotate clockwise and rise on the lead screw 102. As the transmission ring moves upward along the axial direction of the lead screw 102, the end of the connecting rod 106 connected to the transmission ring moves upward accordingly, causing the angle between the connecting rod 106 and the lead screw 102 to increase with the movement of the transmission ring and the connecting rod 106. At this time, as the angle increases, since the length of the connecting rod 106 remains constant, the distance between the end of the connecting rod 106 connected to the sliding rod 107 and the side wall of the base housing 101 increases, thereby causing the sliding rod 107 to move outward, which in turn causes the clamping member 108 to release the seal of the sealing cover 3, thus releasing the sealing cover 3. Through the above operations, the sealing cover 3 can be easily disassembled and assembled, which helps to improve the safety and stability of the operation. In this way, through the cooperation between the sealing component 2 and the various components in the fixed base 1, the sealing cover 3 can be quickly clamped and fixed while ensuring effective sealing. Furthermore, the sealing cover 3 can be easily disassembled and assembled by moving the clamping part 108, thereby simplifying the disassembly and assembly of the sealing cover 3 and improving work efficiency.
[0060] According to some embodiments, this application also provides a semiconductor device including the semiconductor sealing device in any of the above embodiments, the semiconductor device being used to perform a preset process.
[0061] In the semiconductor device of the above embodiments, since a portable and detachable semiconductor sealing device is used, the workflow can be simplified, the overall work efficiency and flexibility can be improved, and product damage caused by cumbersome disassembly can be avoided while ensuring the sealing effectiveness during the execution of the preset process.
[0062] In some embodiments, the preset process may include, but is not limited to, single crystal silicon growth process, wafer dicing process, oxidation process, deposition process, photolithography process, etching process, ion implantation process, heat treatment process, metallization process, packaging process, testing process, etc.
[0063] It is understood that, for example, depending on different preset processes, the semiconductor equipment in the embodiments of this application can be used as a wafer dicing machine, oxidation furnace, chemical vapor deposition equipment, lithography machine, dry etching machine, wet etching equipment, ion implanter, heat treatment furnace, metallization equipment, evaporator, sputtering machine, testing equipment, cleaning equipment, packaging equipment, etc.
[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0065] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A semiconductor sealing device, characterized in that, Includes a fixed base, sealing components, and a sealing cover; The fixed base includes a base shell and a plurality of clamping components; the sealing cover is embedded in the top of the base shell; the clamping components are disposed on the inner side of the side wall of the base shell and move in a direction perpendicular to the side wall of the base shell to fix the sealing cover; The sealing assembly is disposed on top of the clamping member and surrounds the sealing cover.
2. The semiconductor sealing device according to claim 1, characterized in that, The fixed base also includes: A lifting assembly is disposed at the bottom of the base housing and moves in a direction perpendicular to the bottom surface of the base housing; The transmission component is connected at one end to the lifting component and at the other end to the clamping component.
3. The semiconductor sealing device according to claim 2, characterized in that, The lifting assembly includes: A lead screw is located at the bottom of the base housing; A threaded sleeve is fitted onto the outside of the lead screw and rotates circumferentially along the lead screw; A rotating ring is disposed at the top of the threaded sleeve and moves axially along the lead screw as the threaded sleeve rotates; the transmission assembly is connected to the rotating ring.
4. The semiconductor sealing device according to claim 2, characterized in that, A transmission hole is provided on the side wall of the base shell; One end of the transmission component is disposed in the transmission hole and connected to the clamping member, so as to drive the clamping member to move in a direction perpendicular to the side wall of the base housing.
5. The semiconductor sealing device according to claim 4, characterized in that, The transmission assembly includes: Multiple sliding rods pass through the transmission hole and are correspondingly connected to the multiple clamping members, and reciprocate along a direction perpendicular to the side wall of the base housing; Multiple connecting rods, one end of which is connected to the multiple sliding rods, and the other end of which is connected to the lifting device.
6. The semiconductor sealing device according to claim 5, characterized in that, The transmission assembly also includes multiple hinges; the sliding rod and the connecting rod, as well as the connecting rod and the lifting device, are all connected through the hinges. One end of the connecting rod connected to the sliding rod moves back and forth along the direction perpendicular to the side wall of the base shell with the sliding rod, and the other end of the connecting rod connected to the lifting device moves along the direction perpendicular to the bottom surface of the base shell with the lifting device.
7. The semiconductor sealing device according to claim 1, characterized in that, The sealing assembly includes: A sealing ring is disposed on the inner side wall of the base housing and surrounds the sealing cover; A sealing airbag is disposed between the sealing ring and the sealing cover.
8. The semiconductor sealing device according to claim 7, characterized in that, A sealing groove is provided on the outer side wall of the sealing cover; The sealing airbag is disposed within the sealing groove.
9. The semiconductor sealing device according to claim 8, characterized in that, The sealing assembly also includes an air inlet switch and an air release switch disposed on the sealing ring, and both the air inlet switch and the air release switch are connected to the sealing airbag; The air intake switch is used to control the expansion of the sealing airbag to seal the sealing cover; the air release switch is used to control the contraction of the sealing airbag to release the sealing cover.
10. A semiconductor device, characterized in that, Includes a semiconductor sealing device as described in any one of claims 1-9, wherein the semiconductor device is used to perform a preset process.