Integrated circuit support plate adsorption carrying platform and integrated circuit support plate detection equipment

Abstract

The utility model discloses an integrated circuit carrier plate adsorption carrying platform and integrated circuit carrier plate detection equipment, the integrated circuit carrier plate adsorption carrying platform comprises a carrying platform main body, the carrying platform main body is internally provided with an air distribution cavity, the carrying platform main body is provided with an adsorption surface, the adsorption surface is provided with a plurality of adsorption holes suitable for adsorbing a carrier plate, and the adsorption holes are communicated with the air distribution cavity. A plurality of air distribution ports are formed in the surface, opposite to the adsorption surface, of the carrying table main body, and the air distribution ports and the adsorption holes are all communicated with the air distribution cavity; the gas distributing pipe comprises a gas distributing main pipe and a plurality of gas distributing branch pipes, the gas distributing branch pipes are connected with the gas distributing ports respectively, one end of the gas distributing main pipe is connected with the gas distributing branch pipes, and the other end of the gas distributing main pipe is communicated with a vacuumizing device. According to the embodiment of the utility model, the integrated circuit carrier plate adsorption carrying platform has the advantages of uniform adsorption, high reliability and the like.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and more specifically, to an integrated circuit substrate adsorption stage and an integrated circuit substrate testing device having the integrated circuit substrate adsorption stage. Background Technology

[0002] In the manufacturing process of IC (integrated circuit) substrates, it is necessary to accurately and quickly detect and identify scratches, dents, and other defects on the substrate surface and other areas, and promptly screen out defective products. As an indispensable and important component of electronic products, IC substrates are gradually developing towards miniaturization, densification, and integration. Manual inspection can no longer meet the needs of IC substrate production.

[0003] Integrated circuit substrate testing equipment in related technologies uses a vacuum adsorption stage to generate a vacuum negative pressure to adsorb the substrate, thereby achieving the positioning and transfer of the substrate. However, uneven force on the substrate can easily lead to damage or detachment. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an integrated circuit substrate adsorption stage, which has advantages such as uniform adsorption and high reliability.

[0005] This invention also proposes an integrated circuit carrier board testing device having the aforementioned integrated circuit carrier board adsorption stage.

[0006] To achieve the above objectives, according to an embodiment of the first aspect of this utility model, an integrated circuit substrate adsorption stage is provided. The integrated circuit substrate adsorption stage includes: a stage body, the stage body having a gas distribution chamber, the stage body having an adsorption surface, the adsorption surface having a plurality of adsorption holes suitable for adsorbing the substrate, and a plurality of gas distribution ports on the surfaces opposite to the adsorption surface of the stage body, the gas distribution ports and the adsorption holes being connected to the gas distribution chamber; and a gas distribution pipe, the gas distribution pipe including a main gas distribution pipe and a plurality of branch gas distribution pipes, the plurality of branch gas distribution pipes being respectively connected to the plurality of gas distribution ports, one end of the main gas distribution pipe being connected to the plurality of branch gas distribution pipes and the other end being connected to a vacuum pumping device.

[0007] The integrated circuit carrier adsorption stage according to the embodiments of this utility model has the advantages of uniform adsorption and high reliability.

[0008] In addition, the integrated circuit carrier adsorption stage according to the above embodiments of the present invention may also have the following additional technical features:

[0009] According to one embodiment of the present invention, the platform body includes: a gas distribution cavity, with a plurality of gas distribution ports disposed on the gas distribution cavity; an adsorption perforated plate, with an adsorption surface formed on the adsorption perforated plate and adsorption holes formed on the adsorption perforated plate, the adsorption perforated plate being mounted on the gas distribution cavity and together with the gas distribution cavity defining the gas distribution cavity.

[0010] According to one embodiment of the present invention, a sealing ring is provided between the gas distribution chamber and the adsorption plate.

[0011] According to one embodiment of the present invention, the gas distribution chamber and the adsorption orifice plate are connected by threaded fasteners.

[0012] According to one embodiment of the present invention, the adsorption plate is made of Teflon material.

[0013] According to one embodiment of the present invention, a plurality of gas distribution ports are spaced apart along the length of the main body of the platform, and a plurality of adsorption holes are arranged in an array at equal intervals on the adsorption surface.

[0014] According to one embodiment of the present invention, there are two air distribution ports and two air distribution branch pipes, the two air distribution branch pipes are coaxially arranged, and the axial direction of the main air distribution pipe is perpendicular to the axial direction of the air distribution branch pipe.

[0015] According to one embodiment of the present invention, the integrated circuit carrier adsorption stage further includes a rotating shaft, which is mounted on the stage body. The rotating shaft has an airflow channel inside, and a first air port and a second air port communicating with the airflow channel are provided on the rotating shaft. The first air port is connected to the other end of the gas distribution main pipe, and the second air port is connected to the vacuum device.

[0016] According to one embodiment of the present invention, the first air port is formed in the middle part of the shaft in the axial direction, and the second air port is provided at the end of the shaft.

[0017] According to a second aspect of the present invention, an integrated circuit substrate testing device is provided, the integrated circuit substrate testing device including the integrated circuit substrate adsorption stage according to a first aspect of the present invention.

[0018] The integrated circuit carrier board testing equipment according to the embodiments of the present invention has the advantages of uniform adsorption and high reliability by utilizing the integrated circuit carrier board adsorption stage according to the first aspect of the present invention.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of the structure of the integrated circuit carrier adsorption stage according to an embodiment of the present utility model.

[0022] Figure 2 This is a schematic diagram of the structure of the integrated circuit carrier adsorption stage according to an embodiment of the present utility model.

[0023] Reference numerals: integrated circuit carrier adsorption stage 1, stage body 10, adsorption surface 11, air distribution port 12, air distribution cavity 13, adsorption perforated plate 14, air distribution pipe 20, main air distribution pipe 21, branch air distribution pipe 22, rotating shaft 30, first air port 31, second air port 32. Detailed Implementation

[0024] This application is based on the inventor's discoveries and understanding of the following facts and problems:

[0025] Integrated circuit substrate testing equipment in related technologies uses a vacuum adsorption stage to generate a vacuum negative pressure to adsorb the substrate, thereby achieving the positioning and transfer of the substrate. However, uneven force on the substrate can easily lead to damage or detachment.

[0026] To address this, some integrated circuit substrate adsorption platforms are equipped with multiple air distribution ports to distribute vacuum airflow in order to improve the uniformity of the platform's adsorption force. However, each of these multiple air distribution ports needs to be connected to a vacuum generator via pipelines, which leads to complex pipeline connections and difficult maintenance. Furthermore, if the adsorption platform needs to be moved, the pipelines are prone to interference with the platform's movement. If flexible hoses are used to avoid interference, the movement of the platform can easily cause pipeline fatigue or even damage.

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0028] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] The following description, with reference to the accompanying drawings, describes an integrated circuit carrier adsorption stage 1 according to an embodiment of the present invention.

[0031] like Figure 1 and Figure 2 As shown, the integrated circuit carrier adsorption stage 1 according to an embodiment of the present invention includes a stage body 10 and an air distribution pipe 20.

[0032] The stage body 10 has a gas distribution chamber inside and an adsorption surface 11 on the stage body 10. The adsorption surface 11 is provided with multiple adsorption holes suitable for adsorbing the carrier plate. Multiple gas distribution ports 12 are provided on the opposite surfaces of the adsorption surface 11 of the stage body 10. The gas distribution ports 12 and the adsorption holes are all connected to the gas distribution chamber. The gas distribution pipe 20 includes a main gas distribution pipe 21 and multiple branch gas distribution pipes 22. The multiple branch gas distribution pipes 22 are respectively connected to the multiple gas distribution ports 12. One end of the main gas distribution pipe 21 is connected to the multiple branch gas distribution pipes 22 and the other end is connected to a vacuum pumping device.

[0033] Specifically, the vacuum device can be a fan. The air distribution pipe 20 can be a rigid pipe.

[0034] The gripping device grips the carrier plate onto the platform body 10.

[0035] The vacuum device draws air to generate negative pressure, which is generated at the adsorption hole through the main gas distribution pipe 21, the branch gas distribution pipe 22 and the gas distribution chamber in the main body of the platform 30, so that the main body of the platform 10 can adsorb the carrier plate.

[0036] According to the embodiment of the present invention, the integrated circuit carrier adsorption platform 1 is provided with a gas distribution chamber in the main body 10, an adsorption hole and a gas distribution port 12 on the main body 10, and a gas distribution pipe 20. Multiple gas distribution branches 22 are connected to multiple gas distribution ports 12 respectively. One end of the main gas distribution pipe 21 is connected to multiple gas distribution branches 22 and the other end is connected to a vacuum pumping device. The vacuum pumping device can generate negative pressure at the adsorption hole through the main gas distribution pipe 21, the gas distribution branches 22 and the gas distribution chamber in the main body 10, so that the main body 10 can adsorb the carrier through the adsorption hole. This can realize the adsorption of the carrier and make the carrier move with the main body 10. Moreover, the vacuum adsorption method is less likely to damage the carrier.

[0037] Furthermore, by setting up a gas distribution pipe 20, which includes a main gas distribution pipe 21 and multiple branch gas distribution pipes 22, the vacuum adsorption force generated by the vacuum pump can be evenly distributed to all parts of the stage body 10, so that the adsorption holes on the stage body 10 can evenly adsorb the carrier plate. Compared with the integrated circuit carrier adsorption stage in related technologies, the force on the carrier plate can be more uniform, improving the reliability of adsorption and avoiding damage and detachment of the carrier plate.

[0038] Furthermore, since multiple gas branch pipes 22 are connected through the main gas distribution pipe 21, compared with the integrated circuit carrier adsorption platform using flexible hoses in related technologies, the vacuum pump only needs to be connected to the main gas distribution pipe 21, eliminating the need for additional pipeline connections, simplifying pipeline connections, avoiding interference between pipelines and the platform when the platform body 10 needs to be moved, avoiding pipeline fatigue or even damage caused by platform movement, reducing the maintenance frequency of the integrated circuit carrier adsorption platform 1, and extending the service life of the integrated circuit carrier adsorption platform 1.

[0039] Therefore, the integrated circuit carrier adsorption stage 1 according to the present invention has the advantages of uniform adsorption and high reliability.

[0040] The following description, with reference to the accompanying drawings, describes an integrated circuit carrier adsorption stage 1 according to a specific embodiment of the present invention.

[0041] In some specific embodiments of this utility model, such as Figure 1 and Figure 2 As shown, the integrated circuit carrier adsorption stage 1 according to an embodiment of the present invention includes a stage body 10 and an air distribution pipe 20.

[0042] Specifically, such as Figure 1 and Figure 2As shown, the stage body 10 includes a gas distribution chamber 13 and an adsorption perforated plate 14. Multiple gas distribution ports 12 are provided on the gas distribution chamber 13. An adsorption surface 11 is formed on the adsorption perforated plate 14, and adsorption holes are formed on the adsorption perforated plate 14. The adsorption perforated plate 14 is mounted on the gas distribution chamber 13 and, together with the gas distribution chamber 13, defines the gas distribution chamber. This facilitates the formation of the gas distribution chamber and the processing and manufacturing of the gas distribution chamber 13 and the adsorption perforated plate 14.

[0043] Advantageously, a sealing ring is provided between the gas distribution chamber 13 and the adsorption orifice plate 14. This improves the sealing performance of the gas distribution chamber and prevents vacuum leakage from affecting the reliability of adsorption onto the carrier plate.

[0044] More advantageously, the gas distribution chamber 13 and the adsorption orifice plate 14 are connected by threaded fasteners. This allows for a tighter connection between the gas distribution chamber 13 and the adsorption orifice plate 14, further improving the sealing performance of the gas distribution chamber.

[0045] Furthermore, the adsorption plate 14 is made of Teflon material. This reduces friction between the adsorption plate 14 and the carrier plate, preventing wear on the carrier plate.

[0046] Figure 1 and Figure 2 An integrated circuit substrate adsorption stage 1 according to some examples of the present invention is shown. For example... Figure 1 and Figure 2 As shown, multiple gas distribution ports 12 are spaced apart along the length of the stage body 10, and multiple adsorption holes are arranged in an equally spaced array on the adsorption surface 11. Specifically, the size of the adsorption surface 11 can be greater than or equal to the size of the largest carrier plate that needs to be adsorbed. This not only makes the vacuum state in the gas distribution chamber more uniform, thus making the vacuum adsorption force distributed at each adsorption hole more uniform and the force on the carrier plate more uniform, but also makes the distribution of adsorption holes more uniform, further improving the uniformity of the force on the carrier plate. It also facilitates the adsorption of carrier plates of different sizes, improving the applicability of the integrated circuit carrier adsorption stage 1.

[0047] Specifically, such as Figure 1 and Figure 2 As shown, there are two air distribution ports 12 and two air distribution branch pipes 22, which are coaxially arranged. The axial direction of the main air distribution pipe 21 is perpendicular to the axial direction of the air distribution branch pipes 22. Specifically, the main air distribution pipe 21 and the two air distribution branch pipes 22 can be connected by a T-shaped tee pipe. This not only allows the vacuum adsorption force to be distributed to two parts along the length of the platform body 10 through the air distribution branch pipes 22, but also facilitates the connection between the main air distribution pipe 21 and the air distribution branch pipes 22, simplifying the pipeline connection structure.

[0048] Figure 1 and Figure 2An integrated circuit substrate adsorption stage 1 according to some examples of the present invention is shown. For example... Figure 1 and Figure 2 As shown, the integrated circuit carrier adsorption stage 1 also includes a rotating shaft 30, which is mounted on the stage body 10. The rotating shaft 30 has an airflow channel and is equipped with a first air port 31 and a second air port 32 communicating with the airflow channel. The first air port 31 is connected to the other end of the main gas distribution pipe 21, and the second air port 32 is connected to the vacuum device. Thus, the integrated circuit carrier adsorption stage 1 can be used for flipping the carrier and for detecting two different surfaces of the carrier. This allows for continuous and automatic detection of both sides of the carrier, improving the continuity of the carrier detection process, increasing the automation level of carrier detection, and improving carrier detection efficiency.

[0049] Specifically, after one side of the carrier plate has been inspected, the inspected carrier plate is gripped onto the stage body 10 by a gripping device. A vacuum device creates negative pressure, allowing the stage body 10 to adsorb the carrier plate. After the stage body 10 adsorbs the carrier plate, the rotating shaft 30 rotates, causing the stage body 10 to flip as well, thus flipping the adsorbed carrier plate. The vacuum device stops pumping air, the vacuum at the adsorption hole ceases, and the carrier plate detaches from the stage body 10 for inspection of the other side. While the stage body 10 and rotating shaft 30 rotate, the gas distribution pipe 20 also rotates with the rotating shaft 30 and stage body 10; there is no relative displacement between the gas distribution pipe 20, the stage body 10, and the rotating shaft 30. On the one hand, the air distribution pipe 20 will not interfere with the rotation of the platform body 10, thus avoiding the problem of hose interference during rotation in the hose connection method. On the other hand, the air distribution pipe 20 will not have relative displacement with the platform body 10 and the rotating shaft 30, and will not be displaced or deformed due to the rotation of the platform body 10. This avoids the problem of hose fatigue or even damage caused by frequent displacement and deformation of the hose due to platform rotation in the hose connection method, thereby improving the reliability of air circuit connection, reducing maintenance frequency, and increasing the service life of the integrated circuit carrier adsorption platform 1.

[0050] Specifically, the first air port 31 is formed in the middle of the axial direction of the rotating shaft 30, and the second air port 32 is located at the end of the rotating shaft 30. This facilitates the connection of the rotating shaft 30 to the vacuum pumping device and the main gas distribution pipe 21, respectively.

[0051] The following describes an integrated circuit substrate testing device according to an embodiment of the present invention. The integrated circuit substrate testing device according to an embodiment of the present invention includes an integrated circuit substrate adsorption stage 1 according to the above embodiment of the present invention.

[0052] The integrated circuit carrier board testing equipment according to the embodiments of the present invention has the advantages of uniform adsorption and high reliability by utilizing the integrated circuit carrier board adsorption stage 1 according to the above embodiments of the present invention.

[0053] Other components and operations of the integrated circuit carrier board testing equipment according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An integrated circuit substrate adsorption stage, characterized in that, include: The platform body has a gas distribution chamber inside and an adsorption surface on the platform body. The adsorption surface is provided with a plurality of adsorption holes suitable for adsorbing the carrier plate. A plurality of gas distribution ports are provided on the surfaces opposite to the adsorption surface of the platform body. The gas distribution ports and the adsorption holes are all connected to the gas distribution chamber. The gas distribution pipe includes a main gas distribution pipe and multiple branch gas distribution pipes. The multiple branch gas distribution pipes are respectively connected to multiple gas distribution ports. One end of the main gas distribution pipe is connected to the multiple branch gas distribution pipes and the other end is connected to a vacuum pumping device.

2. The integrated circuit substrate adsorption stage according to claim 1, characterized in that, The platform body includes: The gas distribution chamber has multiple gas distribution ports disposed on it. An adsorption plate with an adsorption surface formed on it and adsorption holes formed on it are mounted on the gas distribution chamber and together with the gas distribution chamber define the gas distribution chamber.

3. The integrated circuit substrate adsorption stage according to claim 2, characterized in that, A sealing ring is provided between the gas distribution chamber and the adsorption plate.

4. The integrated circuit substrate adsorption stage according to claim 2, characterized in that, The gas distribution chamber and the adsorption orifice plate are connected by threaded fasteners.

5. The integrated circuit substrate adsorption stage according to claim 2, characterized in that, The adsorption plate is made of Teflon material.

6. The integrated circuit carrier adsorption stage according to claim 1, characterized in that, Multiple air distribution ports are spaced apart along the length of the platform body, and multiple adsorption holes are arranged in an array at equal intervals on the adsorption surface.

7. The integrated circuit substrate adsorption stage according to claim 1, characterized in that, There are two air distribution ports and two air distribution branch pipes. The two air distribution branch pipes are coaxially arranged, and the axial direction of the main air distribution pipe is perpendicular to the axial direction of the air distribution branch pipe.

8. The integrated circuit substrate adsorption stage according to claim 1, characterized in that, It also includes a rotating shaft, which is mounted on the platform body. The rotating shaft has an airflow channel inside and is provided with a first air port and a second air port that communicate with the airflow channel. The first air port is connected to the other end of the main gas distribution pipe, and the second air port is connected to the vacuum pumping device.

9. The integrated circuit substrate adsorption stage according to claim 8, characterized in that, The first air port is formed in the middle of the shaft along its axial direction, and the second air port is located at the end of the shaft.

10. An integrated circuit substrate testing device, characterized in that, Includes an integrated circuit substrate adsorption stage according to any one of claims 1-9.

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