Heat dissipation module

Abstract

The utility model discloses a heat dissipation module which is used for cooling an optical fiber transceiver module. The heat dissipation module comprises a heat conduction seat and a heat pipe. The heat conduction seat is provided with a heat dissipation surface and a heat absorption surface, and the heat absorption surface is used for thermally contacting the optical fiber transceiver module. The heat pipe is provided with an evaporation end and a condensation end, the evaporation end is arranged on the heat dissipation face, and the condensation end is used for being connected with a heat dissipation device. Wherein a working fluid is arranged in the heat pipe, the evaporation end is used for absorbing heat of the heat conduction seat to heat the working fluid into a vapor working fluid, and the condensation end is used for cooling the working fluid into a liquid working fluid.

Description

Technical Field

[0001] This utility model relates to a heat dissipation module, and more particularly to a heat dissipation module that uses the two-phase flow of the working fluid in a heat pipe to transfer heat. Background Technology

[0002] Today, many countries around the world have widely adopted optical fiber as the primary means of network transmission. Because optical fiber transmits signals through total internal reflection, it offers advantages such as high-speed transmission and low transmission loss. When used as a transmission medium in network systems, optical fiber exhibits broadband, high capacity, and high speed. However, with the continuous growth in information transmission volume and increasingly stringent user demands for network speed, the transmission capacity of optical fiber is gradually facing challenges. To address the problem of insufficient data transmission, in addition to improving the transmission speed of the optical fiber itself, the receiving and transmitting performance at both ends of the fiber is equally crucial. This includes core components such as optical receivers, optical transmitters, and optical transceivers.

[0003] As data transmission demands continue to rise, fiber optic transceiver modules are undertaking a greater workload, leading to increased heat dissipation requirements. In high-data-rate environments, these modules generate significant heat; ineffective heat dissipation can result in performance degradation or component damage. Therefore, to ensure stable operation, modern network equipment often requires advanced cooling technologies to address the heat dissipation needs of these fiber optic transceiver modules. Utility Model Content

[0004] The present invention provides a heat dissipation module to meet the heat dissipation requirements of fiber optic transceiver modules.

[0005] An embodiment of this invention discloses a heat dissipation module for cooling a fiber optic transceiver module. The heat dissipation module includes a heat-conducting base and a heat pipe. The heat-conducting base has a heat-dissipating surface and a heat-absorbing surface, with the heat-absorbing surface making thermal contact with the fiber optic transceiver module. The heat pipe has an evaporating end and a condensing end, the evaporating end being disposed on the heat-dissipating surface, and the condensing end being connected to a heat dissipation device. The heat pipe is filled with a working fluid; the evaporating end absorbs heat from the heat-conducting base to heat the working fluid into a vaporized working fluid, and the condensing end cools the working fluid into a liquid working fluid.

[0006] In the aforementioned heat dissipation module, the evaporation end of the heat pipe is in thermal contact with the heat dissipation surface of the heat-conducting base.

[0007] In the aforementioned heat dissipation module, the heat pipe is a flat heat pipe.

[0008] In the aforementioned heat dissipation module, the heat pipe has two opposing wide surfaces, and one of the wide surfaces is in thermal contact with the heat dissipation surface of the heat-conducting base at the evaporation end.

[0009] In the aforementioned heat dissipation module, the heat pipe is made of copper alloy.

[0010] In the aforementioned heat dissipation module, the heat-conducting base is made of copper alloy.

[0011] In the aforementioned heat dissipation module, the heat-conducting base has an assembly groove on the heat dissipation surface, and the evaporation end is disposed in the assembly groove.

[0012] In the aforementioned heat dissipation module, the evaporation end is tightly fitted into the assembly slot.

[0013] In the aforementioned heat dissipation module, a medium with a high thermal conductivity is disposed between the evaporation end and the assembly tank.

[0014] The aforementioned heat dissipation module further includes the heat dissipation device, which is a heat dissipation fin, a fan, a liquid cooler, or a heat conduction plate.

[0015] According to the heat dissipation module disclosed in the above embodiments, heat is transferred by utilizing the two-phase flow change of the working fluid in the heat pipe to dissipate heat from the fiber optic transceiver module, thereby meeting the heat dissipation requirements of the fiber optic transceiver module.

[0016] The above description of the present invention and the following description of its embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. Attached Figure Description

[0017] Figure 1 This is a perspective view of the heat dissipation module and the heat-generating element according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1 Partial and exploded schematic diagrams of the heat dissipation module and heat-generating components.

[0019] Figure 3 for Figure 1 Partial and another exploded schematic diagram of the heat dissipation module and heat-generating element.

[0020] In the attached figures, the following labels are used:

[0021] 9: Heating element, fiber optic transceiver module

[0022] 1: Heat dissipation module

[0023] 10: Heat-conducting seat

[0024] 12: Heat pipe

[0025] E1: Evaporation end

[0026] E2: Condensation end

[0027] A1: Assembly slot

[0028] S1: Heat dissipation surface

[0029] S2: Heat-absorbing surface

[0030] W1: Wide face

[0031] N1: Narrow face Detailed Implementation

[0032] The following detailed description of the embodiments of this invention outlines its features and advantages, sufficient to enable anyone skilled in the art to understand and implement the technical content of these embodiments. Furthermore, based on the disclosure, claims, and drawings herein, anyone skilled in the art can easily understand the related objectives and advantages of this invention. The following embodiments further illustrate the principles of this invention, but are not intended to limit its scope in any way.

[0033] Please see Figures 1 to 3 , Figure 1 This is a perspective view of the heat dissipation module and the heat-generating element according to an embodiment of the present invention. Figure 2 for Figure 1 Partial and exploded schematic diagrams of the heat dissipation module and heat-generating components, and Figure 3 for Figure 1 Partial and another exploded schematic diagram of the heat dissipation module and heat-generating element.

[0034] In this embodiment, the heat dissipation module 1 is used to cool a heat-generating element 9, which may be, for example, a quad small form-factor pluggable (QSFP) fiber optic transceiver module 9. The structural shape of the heat-generating element is simplified in the figures, but the present invention is not limited to the shape of the heat-generating element.

[0035] The heat dissipation module 1 includes a heat-conducting base 10 and a heat pipe 12. The heat-conducting base 10 has a heat dissipation surface S1 and a heat absorption surface S2, and the heat absorption surface S2 is used to make thermal contact with the fiber optic transceiver module 9.

[0036] The heat pipe 12 has an evaporation end E1 and a condensation end E2. The evaporation end E1 is disposed on the heat dissipation surface S1 of the heat-conducting base 10, and the condensation end E2 is used to connect a heat dissipation device (not shown). The heat pipe 12 is filled with a working fluid. The evaporation end E1 of the heat pipe 12 absorbs heat from the heat-conducting base 10 to heat the working fluid into a vapor state, which diffuses to the condensation end E2 of the heat pipe 12. At the condensation end E2, the working fluid is cooled into a liquid state, and then flows back to the evaporation end E1 through a capillary structure (not shown) inside the heat pipe 12 for two-phase flow heat conduction again. Based on this, heat conduction is performed using the two-phase flow change of the working fluid in the heat pipe 12 to dissipate heat from the fiber optic transceiver module. The heat dissipation device can be, for example, a heat sink, a fan, or a liquid-cooled radiator, but this invention is not limited thereto. The working fluid can flow in the heat pipe 12, for example, by gravity or capillary force, but this invention is not limited thereto. Furthermore, the working fluid may be, for example, water or organic fluids such as propane and pentane, but the present invention is not limited to the type of working fluid.

[0037] The evaporation end E1 of the heat pipe 12 can thermally contact the heat dissipation surface S1 of the heat conductor 10, and the evaporation end E1 can, for example, directly and physically contact the heat dissipation surface S1. In this embodiment, the heat pipe 12 is a flat heat pipe with two opposing wide surfaces W1, and one of the wide surfaces W1 thermally contacts the heat dissipation surface S1 of the heat conductor 10 at the evaporation end E1. Thus, by having the wide surface W1 of the heat pipe 12 thermally contact the heat dissipation surface S1 of the heat conductor 10, the contact area between the heat pipe 12 and the heat conductor 10 can be increased, thereby improving the heat transfer efficiency. The wide surface W1 can refer to the outer surface of the heat pipe 12 with a larger width, and the wide surface W1 can, for example, be a plane.

[0038] The heat-conducting base 10 may further have an assembly groove A1 on the heat dissipation surface S1, and the evaporation end E1 of the heat pipe 12 may be disposed in the assembly groove A1, thereby facilitating the assembly of the heat pipe 12 and the heat-conducting base 10. In this embodiment, the evaporation end E1 is tightly disposed in the assembly groove A1, so that the wide surface W1 of the heat pipe 12 and the two narrow surfaces N1 adjacent to the wide surface W1 can both make solid contact with the assembly groove A1 of the heat-conducting base 10, thereby simultaneously increasing the contact area between the heat pipe 12 and the heat-conducting base 10 and ensuring the assembly stability of the two.

[0039] In one embodiment, to further improve heat transfer efficiency, a medium (not shown) with a high thermal conductivity, such as thermal paste or thermal pad, can be selectively placed between the evaporation end of the heat pipe and the assembly groove of the heat-conducting seat to reduce the thermal resistance between the interfaces and ensure that heat energy is transferred more smoothly from the heat-conducting seat to the heat pipe.

[0040] In this embodiment, the heat pipe 12 is made of copper alloy (Cu1100), and the heat-conducting base 10 is also made of copper alloy, but this invention is not limited thereto. In other embodiments, the heat pipe 12 and the heat-conducting base 10 may be made of other metal materials, such as aluminum alloy, stainless steel, nickel alloy, or titanium alloy.

[0041] According to the heat dissipation module of the above embodiment, heat is transferred by the phase change of the working fluid in the heat pipe to dissipate heat from the fiber optic transceiver module, thereby meeting the heat dissipation requirements of the fiber optic transceiver module.

[0042] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A heat dissipation module, characterized in that, A heat dissipation module is used to cool a fiber optic transceiver module, and the heat dissipation module includes: A heat-conducting base has a heat-dissipating surface and a heat-absorbing surface, wherein the heat-absorbing surface is used for thermal contact with the fiber optic transceiver module; and A heat pipe having an evaporating end and a condensing end, the evaporating end being disposed on the heat dissipation surface, and the condensing end being used to connect to a heat dissipation device. The heat pipe is used to contain a working fluid, the evaporation end is used to absorb heat from the heat-conducting base to heat the working fluid into a vapor working fluid, and the condensation end is used to cool the working fluid into a liquid working fluid.

2. The heat dissipation module as described in claim 1, characterized in that, The evaporation end of the heat pipe is in thermal contact with the heat dissipation surface of the heat-conducting base.

3. The heat dissipation module as described in claim 1, characterized in that, The heat pipe is a flat heat pipe.

4. The heat dissipation module as described in claim 3, characterized in that, The heat pipe has two opposing wide surfaces, one of which is in thermal contact with the heat dissipation surface of the heat-conducting base at the evaporation end.

5. The heat dissipation module as described in claim 1, characterized in that, The heat pipe is made of copper alloy.

6. The heat dissipation module as described in claim 1, characterized in that, The heat-conducting base is made of copper alloy.

7. The heat dissipation module as described in claim 1, characterized in that, The heat-conducting base has an assembly groove on the heat dissipation surface, and the evaporation end is disposed in the assembly groove.

8. The heat dissipation module as described in claim 7, characterized in that, The evaporation end is tightly fitted into the assembly tank.

9. The heat dissipation module as described in claim 7, characterized in that, A medium with a high thermal conductivity is disposed between the evaporation end and the assembly tank.

10. The heat dissipation module as described in claim 1, characterized in that, It also includes the heat dissipation device, which is a heat sink, a fan, a liquid cooler, or a heat conduction plate.

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