Wafer processing equipment

Abstract

The utility model relates to wafer processing equipment, and the equipment comprises a gluing and developing device which comprises a gluing and developing structure for executing a wafer gluing and developing task, and a cleaning structure for cleaning residual glue in the gluing and developing structure; the processing device comprises a plurality of processing parts used for executing different wafer processing processes; the cleaning part is arranged between any two adjacent treatment parts and comprises a cleaning disc; the cleaning disc is used for replacing a wafer to be mounted in the gluing and developing device in the operation process of the cleaning structure; the conveying device comprises at least two mechanical arms with independent strokes and is used for conveying the wafer and / or the cleaning disc between the gluing and developing device and / or the processing device; and the controller is connected with the gluing and developing device, the processing device and the conveying device and is used for controlling the gluing and developing device, the processing device and the conveying device to execute corresponding actions. And the glued CUP is regularly cleaned, residual glue accumulated in the CUP is removed, the glued CUP is protected, the back face quality of a product is guaranteed, and pollution to a next station is avoided.

Description

Technical Field

[0001] This application relates to the field of wafer manufacturing, and in particular to a wafer processing apparatus. Background Technology

[0002] Photoresist coating is a crucial process in semiconductor device manufacturing. Specialized coating equipment is typically used to uniformly coat the wafer surface using a spin-coating method. During spin-coating, due to the viscosity of the photoresist, excess photoresist that is spun off the wafer adheres to the inner wall of the protective cover. If not cleaned regularly, the increasing amount of residual photoresist causes backsplattering and changes in ventilation, ultimately resulting in severe photoresist residue on the back of the wafer, affecting product quality and contaminating subsequent equipment.

[0003] Current methods suffer from low efficiency, cumbersome processes, and reliance on manual labor. Regular disassembly of the cup covers and exhaust ducts leads to complex maintenance, impacting equipment reliability and causing significant time consumption, failing to keep pace with the demands for automation and increased efficiency. In the rapidly evolving industrial environment, automated cleaning and maintenance systems have become a crucial trend for improving productivity and reducing labor costs. Therefore, finding a faster, more convenient solution that requires minimal manual intervention is key to enhancing operational efficiency. Utility Model Content

[0004] Therefore, it is necessary to provide a wafer processing device that can at least automatically clean residual adhesive inside the device, addressing the problems mentioned in the background art.

[0005] In order to solve the above-mentioned technical problems and other problems, according to some embodiments, one aspect of this application provides a wafer processing apparatus, including: a coating and developing device, including a coating and developing structure for performing wafer coating and developing tasks, and a cleaning structure for cleaning residual adhesive in the coating and developing structure.

[0006] The processing apparatus includes multiple processing units for performing different wafer processing processes;

[0007] A cleaning unit, disposed between any adjacent processing units, includes a cleaning tray; the cleaning tray is used to replace the wafer in the coating and developing apparatus during the operation of the cleaning structure.

[0008] The conveying device includes at least two independently traveling robotic arms for conveying wafers and / or cleaning trays between a coating and developing unit and / or a processing unit.

[0009] The controller is connected to the coating and developing unit, the processing unit, and the conveying unit, and is used to control the coating and developing unit, the processing unit, and the conveying unit to perform corresponding actions.

[0010] In the wafer processing equipment described in the above embodiments, a cleaning structure and a rinsing section are added to the coating and developing unit and the processing unit, respectively, to compensate for the original design defects. During operation, the controller controls the conveyor to automatically load and unload wafers between the coating and developing unit and / or the processing unit. When the wafer is installed in the coating and developing unit, the coating and developing structure automatically applies adhesive; when the rinsing tray is installed in the coating and developing unit, the rinsing structure automatically cleans. This wafer processing equipment has a simple structure, a high degree of automation, and reduces manpower consumption.

[0011] In some embodiments, the cleaning structure includes:

[0012] The cleaning nozzle, mounted on the rotating arm, is used to spray cleaning fluid;

[0013] The on / off valve, connected to the cleaning nozzle via a flushing pipe, is used to open or close the valve of the cleaning tank upon receiving a command from the controller; the cleaning tank is used to store the cleaning fluid.

[0014] In some embodiments, the cleaning unit includes:

[0015] Base plate;

[0016] The support block, which is fixedly connected to the base plate via a bracket, is used to support the washing tray;

[0017] A position sensor, connected to the controller, is positioned on the surface of the tray to generate a signal indicating whether the cleaning tray has been removed.

[0018] In some embodiments, the processing apparatus includes at least three towers for storing processing units; a cleaning unit is disposed between any adjacent processing units within one or more towers.

[0019] In some embodiments, the coating and developing structure includes:

[0020] The process nozzle, mounted on the rotating arm and arranged side by side with the cleaning nozzle, is used to spray process liquids.

[0021] The adhesive supply device, connected to the process nozzle via an adhesive hose, is used to store the process liquid;

[0022] Vacuum chucks are used to hold wafers or cleaning trays.

[0023] A rotating mechanism, fixedly installed with the vacuum suction cup, is used to drive the vacuum suction cup to rotate;

[0024] A cup cover is used to collect process liquids or cleaning fluids that splash from a vacuum suction cup during rotation.

[0025] In some embodiments, the coating and developing apparatus further includes:

[0026] The waste liquid collection device is connected to the cup cover via a waste liquid pipeline and is used to collect the liquid flowing out of the cup cover;

[0027] The first liquid level sensor is installed inside the cleaning tank and connected to the controller. It is used to generate a first liquid replenishment signal when the liquid level of the cleaning fluid reaches a first preset position.

[0028] The second liquid level sensor is installed in the adhesive supply device and connected to the controller. It is used to generate a second liquid replenishment signal when the liquid level of the process liquid reaches a second preset position.

[0029] The third liquid level sensor is installed inside the waste liquid collection device and connected to the controller. It is used to generate a replacement signal when the liquid level of the waste liquid reaches the third preset position.

[0030] In some embodiments, the coating and developing apparatus includes a first device and a second device, wherein the second device is used to work in parallel with the first device and synchronously perform the same or different tasks.

[0031] In some embodiments, the second device performs the wafer coating and developing task in place of the first device when the first device is in a cleaning configuration.

[0032] In some embodiments, the coating and developing structures of the second device and the first device are provided with the same or different coating and developing parameters.

[0033] In some embodiments, a wafer support device is disposed on the side of the transfer device away from the processing device and is used to store wafers.

[0034] In some embodiments, the detection apparatus includes a first detection device disposed within the processing apparatus for monitoring the wafer temperature within the processing section, and a second detection device disposed within the coating and developing apparatus for measuring whether there is an abnormality in the wafer thickness.

[0035] An alarm device is connected to both the detection device and the controller. It receives data from the detection device and generates an alarm signal when the data is abnormal.

[0036] In some embodiments, the wafer processing apparatus further includes a memory connected to the controller for storing program instructions for wafer processing.

[0037] The wafer processing equipment provided in this application has the following unexpected technical effects:

[0038] By adding cleaning structures and cleaning sections to the coating and developing units and the processing unit respectively, the original design flaws are remedied. During wafer processing equipment operation, the controller can automatically load and unload materials between the coating and developing units and / or the processing unit according to a preset process route, and automatically clean the inner cup of the coating and developing structure. Without affecting the single-wafer coating process flow, periodically cleaning the residual adhesive accumulated inside the coating cup protects the coating cup, ensures the quality of the back side of the product, and prevents contamination of the next processing station.

[0039] In addition, the equipment integrates multiple types of sensors, which work together through multiple signals to monitor the status of each component in real time, improve the automation and intelligence of equipment operation, reduce the cost of manual intervention, and ensure the stable operation and efficient production of wafer processing equipment. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0041] Figure 1 This is a top view of a wafer processing apparatus provided in one embodiment of this application;

[0042] Figure 2 This is a cross-sectional view of the coating and developing apparatus provided in one embodiment of this application;

[0043] Figure 3 This is a front view schematic diagram of the processing device provided in one embodiment of this application;

[0044] Figure 4 This is a cross-sectional view of the cleaning section provided in one embodiment of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] 10. Coating and developing apparatus; 11. First apparatus; 12. Second apparatus; 101. Rotating arm; 102. Process nozzle; 103. Cleaning nozzle; 104. On / off valve; 105. Vacuum suction cup; 106. Rotating mechanism; 107. Cup cover; 20. Processing apparatus; 201. First tower; 202. Second tower; 203. Third tower; 21. Processing section; 22. Cleaning section; 221. Base plate; 222. Support; 223. Support block; 224. Cleaning tray; 225. Position sensor; 30. Conveying device; 40. Wafer support device; 401. First support device; 402. Second support device; 50. Controller. Detailed Implementation

[0047] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0049] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0050] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0051] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium, or they can refer to the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0052] This application provides a wafer processing apparatus, including: a coating and developing device 10, including a coating and developing structure for performing wafer coating and developing tasks, and a cleaning structure for cleaning residual adhesive in the coating and developing structure.

[0053] The processing apparatus 20 includes multiple processing units 21 for performing different wafer processing processes;

[0054] Cleaning unit 22 is disposed between any adjacent processing unit 21 and includes cleaning tray 224; cleaning tray 224 is used to replace wafers and be mounted into coating and developing apparatus 10 during the operation of cleaning structure.

[0055] The conveying device 30 includes at least two independently traveling robotic arms for conveying wafers and / or cleaning trays 224 between the coating and developing unit 10 and / or the processing unit 20.

[0056] The controller 50 is connected to the coating and developing device 10, the processing device 20, and the conveying device 30, and is used to control the coating and developing device 10, the processing device 20, and the conveying device 30 to perform corresponding actions.

[0057] Specifically, please refer to Figure 1 , Figure 1 This is a top view schematic diagram of the wafer processing equipment provided in this application. In some embodiments, the coating and developing apparatus 10 includes a first device 11 and a second device 12.

[0058] The first device 11 and the second device 12 are respectively placed on both sides of the conveying device 30 and are arranged symmetrically.

[0059] As an example, the second device 12 is used to work in parallel with the first device 11, synchronously performing the same or different tasks.

[0060] Here, when performing the same task, the first device 11 and the second device 12 can process multiple wafers or workpieces simultaneously, thereby significantly increasing the coating and developing throughput per unit time. The parallel operation of the two machines allows for smoother wafer flow on the production line, reduces waiting time, and improves the overall production line throughput. When performing different tasks, multiple process routes can be flexibly implemented within the same wafer processing equipment to meet diverse production needs.

[0061] As an example, when the cleaning structure of the first device 11 is running, the second device 12 performs the wafer coating and developing task in place of the first device 11.

[0062] Here, rotating cleaning allows for more orderly equipment maintenance. While the first device 11 or the second device 12 is performing regular maintenance, calibration, and cleaning, the other device can still maintain production, effectively ensuring production continuity.

[0063] As an example, the coating and developing structures of the second device 12 and the first device 11 are provided with the same or different coating and developing parameters.

[0064] Here, by setting different coating and development parameters, the wafer processing equipment can process different photoresists or workpiece size types according to needs, thus meeting diversified production requirements.

[0065] Further, please refer to Figure 2 , Figure 2 The first device 11 and / or the second device 12 are shown as a whole.

[0066] Specifically, in the coating and developing apparatus 10, the coating and developing structure includes: a process nozzle 102, mounted on a rotating arm 101 and arranged side by side with a cleaning nozzle 103, for spraying process liquid; a glue supply device, connected to the process nozzle 102 via a glue tube, for storing process liquid; a vacuum chuck 105, for fixing the wafer or cleaning tray 224; a rotating mechanism 106, fixedly installed with the vacuum chuck 105, for driving the vacuum chuck 105 to rotate; and a cup 107, for collecting the process liquid or cleaning fluid splashed on the vacuum chuck 105 due to rotation.

[0067] The cleaning structure includes: a cleaning nozzle 103 mounted on a rotating arm 101 for spraying cleaning fluid; an on / off valve 104 connected to the cleaning nozzle 103 via a flushing pipe for opening or closing the valve of the cleaning tank upon receiving a command from the controller 50; and a cleaning tank for storing cleaning fluid.

[0068] For example, the cup cover 107 is fixed to a work platform, with its side walls tightly surrounding the internal structure to form a closed working chamber. The top is designed with an openable cover (not shown), and the adhesive supply device and cleaning tank are obscured by the work platform. The vacuum suction cup 105 is fixedly connected to the rotating mechanism 106. In this embodiment, the adhesive coating and developing device 10 is designed for 6-inch wafer coating; therefore, the size of the cleaning tray 224 must be consistent with the wafer size, and the dimensions of the vacuum suction cup 105 and the cup cover 107 should be pre-installed according to the wafer specifications. Of course, in actual use, this equipment can be adjusted or replaced according to different wafer sizes or specific process requirements, and this is not limited here. The process nozzle 102 and the cleaning nozzle 103 are arranged side by side, respectively spraying the process liquid and the cleaning liquid.

[0069] The process liquid is a thick polyamide adhesive.

[0070] The cleaning solution is N-methyl-2-pyrrolidone (NMP).

[0071] In the above embodiments, the original coating and developing device is upgraded by adding a cleaning structure. Since the cleaning task and the coating task have similar processes, the improved coating and developing device has a simple structure, is easy to install, and can quickly remove residual adhesive when the cleaning task is triggered, effectively avoiding cross-contamination between different batches and significantly improving product yield.

[0072] In some embodiments, the coating and developing apparatus 10 further includes a waste liquid collection device (not shown), which is connected to the cup 107 via a waste liquid pipeline, for collecting liquid flowing out through the cup 107;

[0073] The first liquid level sensor (not shown) is installed inside the cleaning tank and connected to the controller 50. It is used to generate a first replenishment signal when the liquid level of the cleaning fluid reaches the first preset position.

[0074] The second liquid level sensor (not shown) is installed in the adhesive supply device and connected to the controller 50. It is used to generate a second liquid replenishment signal when the liquid level of the process liquid reaches the second preset position.

[0075] The third liquid level sensor (not shown) is installed inside the waste liquid collection device and connected to the controller 50. It is used to generate a replacement signal when the liquid level of the waste liquid reaches the third preset position.

[0076] It should be noted that the first, second, and third preset positions need to be defined according to the actual volume of the container they are in. They can be the same or different, and there are no restrictions here.

[0077] In the above embodiments, the cleaning tank, adhesive supply device, and waste liquid collection device are respectively equipped with a first liquid level sensor, a second liquid level sensor, and a third liquid level sensor, and are connected to the controller. When the liquid levels of the cleaning fluid, process liquid, and waste liquid reach their respective preset positions, a replenishment signal or replacement signal is generated and transmitted to the controller. This achieves real-time monitoring and automatic control of the liquid levels, ensuring a continuous supply of cleaning fluid and process liquid, guaranteeing the stable operation of cleaning and adhesive coating processes, and promptly handling waste liquid to prevent overflow and avoid interference with production, thereby improving the system's automation level and operational reliability.

[0078] Please continue reading. Figure 1 In some embodiments, the processing device 20 includes at least three towers for storing the processing units 21; a cleaning unit is disposed between any adjacent processing units 21 within one or more towers.

[0079] In this embodiment, the processing apparatus 20 includes a first tower 201, a second tower 202 and a third tower 203, which are disposed on the same side of the conveying device 30 and the coating and developing device 10. The different towers include multiple processing units 21 for performing different wafer processing processes.

[0080] The processing unit includes a hot plate unit (HP), a cold plate unit (CP), a super hot plate unit (DHP), a centering unit (CA), and an edge exposure unit (WEE). The wafer processing technology performed by the aforementioned processing unit 21 is well-known to those skilled in the art. The selection of the processing unit 21 is related to the requirements of the wafer fabrication process, and will not be elaborated further here.

[0081] Specifically, please refer to Figure 3 , Figure 3The front view of the processing apparatus provided in this application shows that the first tower, the second tower, and the third tower are all semi-enclosed frames, including a wafer access surface facing the conveying device 30 and a maintenance surface opposite to the access surface; wherein, the access surface is used for the robotic arm in the conveying device 30 to move or remove wafers from the frame, and the maintenance surface is used for installing and / or disassembling the processing unit 21.

[0082] For example, according to the existing process flow, the hot plate unit HP8 (idle hot plate) is removed, and a cleaning section 22 (cup cover cleaning tank) is reserved for installation.

[0083] In some embodiments, please refer to Figure 4 The cleaning unit 22 includes: a base plate 221; a support block 223, which is fixedly connected to the base plate 221 via a bracket 222 to support the cleaning tray 224; and a position sensor 225, which is connected to the controller 50 and is disposed on the surface of the support block 223 to generate a prompt signal indicating whether the cleaning tray 224 has been removed.

[0084] In the above embodiment, the status of the cleaning tray is monitored in real time by a position sensor. When the cleaning tray is removed by the robotic arm, an alert signal is automatically generated and transmitted to the controller. Upon receiving the alert signal, the controller activates the cleaning mechanism. The entire process requires no manual intervention, effectively reducing the complexity of wafer processing equipment and the time cost of cleaning equipment.

[0085] Please continue reading. Figure 1 In some embodiments, the wafer processing apparatus further includes a wafer support device 40, disposed on the side of the transfer device 30 away from the processing device 20, for storing wafers.

[0086] In this embodiment, the wafer support device 40 includes a first support device 401 and a second support device 402. Of course, this embodiment is just an example, and there may be other support devices in other suitable examples, which are not limited here.

[0087] Specifically, during the process, the robotic arm of the conveying device 30 takes the wafer out from the first support device 401 and / or the second support device 402 and sends it to the processing unit 21 in the tower. After being processed by the processing unit 21, another wafer is taken out by the independent second robotic arm and installed in the coating and developing device 10. The process nozzle 102 sprays the corresponding process liquid to the center of the wafer. The rotating mechanism 106 drives the vacuum chuck 105 to rotate, so that the process liquid is uniformly coated on the wafer surface by spin coating.

[0088] After the robotic arm removes the cleaning tray 224, it takes the cleaning tray 224 out of the cleaning section 22 and replaces the wafer by installing it into the cup cover 107. The controller 50 controls the cleaning nozzle 103 to spray the cleaning fluid. At this time, the cleaning tray 224 rotates to simulate the wafer coating process, splashing the cleaning fluid onto the side wall of the cup cover 107 and carrying away the residual adhesive.

[0089] Please continue reading. Figure 1 In some embodiments, the wafer processing apparatus further includes: a detection device (not shown), including a first detection device disposed within the processing apparatus for monitoring the wafer temperature within the processing section, and a second detection device disposed within the coating and developing apparatus for measuring whether there is an abnormality in the wafer thickness;

[0090] An alarm device (not shown) is connected to both the detection device and the controller. It receives data from the detection device and generates an alarm signal when the data is abnormal.

[0091] In the above embodiments, by integrating the first detection device and the second detection device, abnormal situations within the wafer processing equipment are monitored in real time, and alarm signals are promptly issued through the alarm device. This improves the accuracy and fault prevention in the wafer processing process while supporting rapid abnormal response and continuous optimization of process control.

[0092] In some embodiments, a memory (not shown) is connected to a controller and is used to store program instructions for wafer processing.

[0093] Specifically, depending on the process route, the processing unit to which the wafer is delivered is different. Since the cleaning unit is installed in any tower, as long as a reasonable process route is set, the coating cup can be cleaned regularly without affecting the single-wafer coating process.

[0094] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation on the present invention.

[0095] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are quite specific and detailed. However, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A wafer processing device, characterized in that, include: The coating and developing apparatus includes a coating and developing structure for performing wafer coating and developing tasks, and a cleaning structure for cleaning residual adhesive within the coating and developing structure. The processing apparatus includes multiple processing units for performing different wafer processing processes; A cleaning unit, disposed between any adjacent processing units, includes a cleaning tray; the cleaning tray is used to replace the wafer and be mounted into the coating and developing apparatus during the operation of the cleaning structure. A conveying device, comprising at least two independently traveling robotic arms, for conveying the wafer and / or the cleaning tray between the coating and developing apparatus and / or the processing apparatus; The controller is connected to the coating and developing device, the processing device, and the conveying device, and is used to control the coating and developing device, the processing device, and the conveying device to perform corresponding actions.

2. The wafer processing equipment according to claim 1, characterized in that, The cleaning structure includes: The cleaning nozzle, mounted on the rotating arm, is used to spray cleaning fluid; An on / off valve, connected to the cleaning nozzle via a flushing pipe, is used to open or close the valve of the cleaning tank upon receiving a command from the controller; the cleaning tank is used to store the cleaning fluid.

3. The wafer processing equipment according to claim 1, characterized in that, The cleaning unit includes: Base plate; The support block is fixedly connected to the base plate via a bracket and is used to support the cleaning tray; A position sensor, connected to the controller, is disposed on the surface of the support block and is used to generate a prompt signal indicating whether the cleaning tray has been removed.

4. The wafer processing equipment according to claim 1, characterized in that, The processing apparatus includes at least three towers for storing the processing units; the cleaning unit is disposed between any adjacent processing units within one or more of the towers.

5. The wafer processing equipment according to claim 2, characterized in that, The coating and developing structure includes: A process nozzle, mounted on the rotating arm and arranged side by side with the cleaning nozzle, is used to spray process liquid; A glue supply device, connected to the process nozzle via a glue tube, is used to store the process liquid; A vacuum chuck is used to fix the wafer or the cleaning tray; A rotating mechanism is fixedly installed with the vacuum suction cup and is used to drive the vacuum suction cup to rotate; A cup cover is used to collect the process liquid or cleaning fluid that splashes onto the vacuum suction cup due to rotation.

6. The wafer processing equipment according to claim 5, characterized in that, The coating and developing apparatus further includes: A waste liquid collection device is connected to the cup cover via a waste liquid pipeline and is used to collect the liquid flowing out through the cup cover; A first liquid level sensor is installed inside the cleaning tank and connected to the controller. It is used to generate a first liquid replenishment signal when the liquid level of the cleaning fluid reaches a first preset position. The second liquid level sensor is installed in the adhesive supply device and connected to the controller. It is used to generate a second liquid replenishment signal when the liquid level of the process liquid reaches a second preset position. The third liquid level sensor is installed inside the waste liquid collection device and connected to the controller. It is used to generate a replacement signal when the liquid level of the waste liquid reaches a third preset position.

7. The wafer processing apparatus according to any one of claims 1-6, characterized in that, The coating and developing apparatus includes a first device and a second device; The second device includes at least one of the following features: The second device is used to work in parallel with the first device, synchronously performing the same or different tasks; When the cleaning structure of the first device is running, the second device performs the wafer coating and developing task in place of the first device. The second device and the first device have the same or different coating and developing parameters in their coating and developing structures.

8. The wafer processing apparatus according to any one of claims 1-6, characterized in that, Also includes: A wafer support device is disposed on the side of the conveying device away from the processing device and is used to store wafers.

9. The wafer processing apparatus according to any one of claims 1-6, characterized in that, Also includes: The detection device includes a first detection device disposed within the processing device for monitoring the temperature of the wafer within the processing section, and a second detection device disposed within the coating and developing device for measuring whether there is an abnormality in the thickness of the wafer. An alarm device is connected to both the detection device and the controller, and is used to receive data from the detection device and generate an alarm signal when the data is abnormal.

10. The wafer processing apparatus according to any one of claims 1-6, characterized in that, It also includes a memory, connected to the controller, for storing program instructions for wafer processing.

Images