Computer cooling device

Abstract

The utility model discloses a computer cooling device which comprises a chip cold head, a compressor, a condensation row and an air cooling assembly, the chip cold head, the compressor and the condensation row are respectively provided with a liquid inlet and a liquid outlet, the liquid outlet of the chip cold head is connected with the liquid inlet of the compressor through a pipeline, the liquid outlet of the compressor is connected with the liquid inlet of the condensation row through a pipeline, and the air cooling assembly is connected with the air cooling assembly. A liquid outlet of the condensation row is connected with a liquid inlet of the chip cold head through a pipeline, the air cooling assembly is connected to one side of the condensation row, and an air outlet of the air cooling assembly faces the condensation row. The liquid condensing agent in the chip cold head absorbs heat, so that the heat is changed into high-temperature and low-pressure gas, then the heat is dissipated through the compressor and the condensing bar in sequence, the high-temperature and low-pressure gas is changed into the low-temperature and low-pressure liquid condensing agent, and the low-temperature and low-pressure liquid condensing agent flows back to the chip cold head to dissipate heat of the CPU again. Meanwhile, by arranging the air cooling assembly, heat dissipation of the condensation bar is accelerated through the air cooling assembly, and the heat dissipation efficiency of the computer heat dissipation device is improved.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, specifically to a computer cooling device. Background Technology

[0002] Today, while electronic devices are experiencing rapid performance improvements, they are severely hampered by heat dissipation issues. When the temperature of a control chip or processor becomes too high, its efficiency can drop significantly or it can crash. Therefore, to maintain the performance of the processor or control chip, the heat generated by these chips must be quickly dissipated. This is where computer cooling systems come in.

[0003] Traditional cooling systems typically use cooling fans, but their cooling capacity is increasingly unable to meet the growing heat dissipation demands. They often fall short when faced with high heat loads and cannot provide sufficient and stable cooling for the equipment. Utility Model Content

[0004] To address the shortcomings of existing technologies, a computer cooling device is provided.

[0005] To achieve the above objectives, this utility model provides a computer cooling device, comprising: a chip cold head, a compressor, a condenser, and an air-cooling assembly. The chip cold head, compressor, and condenser each have a liquid inlet and a liquid outlet. The liquid outlet of the chip cold head is connected to the liquid inlet of the compressor via a pipe, the liquid outlet of the compressor is connected to the liquid inlet of the condenser via a pipe, the liquid outlet of the condenser is connected to the liquid inlet of the chip cold head via a pipe, and the air-cooling assembly is connected to one side of the condenser, with the air outlet of the air-cooling assembly facing the condenser.

[0006] According to one embodiment of the present invention, it further includes a capillary assembly, which includes a capillary, a first connecting part and a second connecting part. One end of the capillary is connected to the first connecting part, and the other end of the capillary is connected to the second connecting part. The other end of the second connecting part is connected to a pipe between the liquid outlet of the chip cold head and the liquid inlet of the compressor. The first connecting part is connected to the liquid outlet of the condenser through a pipe.

[0007] According to one embodiment of the present invention, the air-cooled assembly includes multiple cooling fans, which are arranged along the height direction of the condenser radiator, and each cooling fan is installed on the condenser radiator.

[0008] According to one embodiment of the present invention, the connecting pipes between the chip cold head, the compressor and the condenser are all copper pipes.

[0009] According to one embodiment of the present invention, the first connecting part includes a connecting connector, a body, and a guide fluid. One end of the connecting connector is connected to the side wall of the body and is connected to the interior of the body. The other end of the connecting connector is connected to the outlet of the condenser drain through a pipe. One end of the guide fluid is connected to the bottom of the body and the other end is connected to the inlet of the chip cold head through a pipe. One end of the capillary tube is connected to the top of the body and is connected to the body and the guide fluid.

[0010] According to one embodiment of the present invention, the inner diameter of the guide fluid gradually decreases along the direction away from the main body.

[0011] According to one embodiment of the present invention, the compressor is a scroll compressor.

[0012] According to one embodiment of the present invention, the capillary is coiled.

[0013] The beneficial effects of this invention are as follows: by incorporating a chip cooling head, compressor, and condenser, during heat dissipation, the liquid coolant inside the chip cooling head absorbs heat, transforming it into a high-temperature, low-pressure gas. This gas then passes through the compressor and condenser to dissipate heat, transforming the high-temperature, low-pressure gas into a low-temperature, low-pressure liquid coolant, which flows back to the chip cooling head to further cool the CPU. Simultaneously, by incorporating an air-cooling component, the condenser's heat dissipation is accelerated, improving the overall heat dissipation efficiency of the computer's cooling system. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 This is a perspective view of the computer cooling device in the embodiment;

[0016] Figure 2 This is another perspective view of the computer cooling device in the embodiment;

[0017] Figure 3 This is an enlarged view of part A in the embodiment;

[0018] Figure 4 This is a schematic diagram illustrating the air-cooled component in the embodiment.

[0019] Explanation of reference numerals in the attached figures

[0020] 1. Chip cold head; 2. Compressor; 3. Condenser radiator; 4. Air-cooled assembly; 41. Cooling fan; 5. Capillary assembly; 51. Capillary; 52. First connecting part; 53. Second connecting part; 520. Connecting connector; 521. Body; 522. Fluid guide. Detailed Implementation

[0021] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0022] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] Please refer to Figure 1 , Figure 1 This is a perspective view of the computer cooling device in this embodiment. This embodiment provides a computer cooling device including a chip cooling head 1, a compressor 2, a condenser 3, and an air-cooling assembly 4. The chip cooling head 1, compressor 2, and condenser 3 are each provided with a liquid inlet and a liquid outlet. During connection, the liquid outlet of the chip cooling head 1 is connected to the liquid inlet of the compressor 2 via a pipe, and the liquid outlet of the compressor 2 is connected to the liquid inlet of the condenser 3 via a pipe. The liquid outlet of the condenser 3 is connected to the liquid inlet of the chip cooling head 1. The air-cooling assembly 4 is connected to one side of the condenser 3, and the air outlet of the air-cooling assembly 4 faces the condenser 3.

[0024] Specifically, in use, the chip cooling head 1 is attached to the computer's CPU. The chip cooling head 1 absorbs the CPU's heat, which is then converted into a high-temperature, low-pressure gaseous state by the liquid coolant inside the chip cooling head 1. This converted heat flows out from the outlet of the chip cooling head 1 and then through a pipe into the inlet of the compressor 2. The compressor 2 compresses the high-temperature, low-pressure gas into a high-temperature, high-pressure gas, which is then discharged from the outlet of the compressor 2 and flows through a pipe into the inlet of the condenser 3. The condenser 3 condenses the high-temperature, high-pressure gas into a low-temperature, low-pressure liquid, which then flows out from the outlet of the condenser 3 and through a pipe back into the inlet of the chip cooling head 1, thus circulating the low-temperature, low-pressure liquid to dissipate heat from the CPU. The air-cooling component 4 is located on one side of the condenser 3, providing a large amount of air to blow onto the condenser 3, allowing heat to be dissipated from the fins inside the condenser 3. Simultaneously, it helps the hot air inside the computer case circulate, preventing hot air from accumulating and further aiding in heat dissipation. Thus, through the cooperation of the chip cold head 1, compressor 2, condenser radiator 3, and air-cooling component 4, a complete heat dissipation cycle is formed, improving the heat dissipation capacity of the heat dissipation equipment while avoiding energy waste. It should be noted that the condenser radiator 3 is an existing structure, and its structure does not involve the improvements of this application; therefore, the specific structure of the condenser radiator 3 will not be described in detail here.

[0025] Preferably, the pipes connecting the chip cooling head 1, compressor 2, and condenser 3 are all made of copper. Copper pipes have corrosion resistance and excellent stability, as well as good thermal conductivity, effectively improving the service life of the computer cooling equipment. It should be noted that the pipes connecting the chip cooling head 1, compressor 2, and condenser 3 can be bent and deformed to adapt to the assembly of different chassis. The pipe shapes in the attached drawings are for reference only.

[0026] In this embodiment, the compressor 2 is a scroll compressor 2, which has frequency conversion function, simple structure and small size, making the compressor 2 easy to assemble and effectively reducing the size of the computer cooling device.

[0027] please Figure 2 and Figure 3 , Figure 2 This is another perspective view of the computer cooling system. Figure 3 This is an enlarged view of part A. Further references are available. Figure 3 The computer cooling device also includes a capillary assembly 5. The capillary assembly 5 includes a capillary 51, a first connecting part 52, and a second connecting part 53. One end of the capillary 51 is connected to the first connecting part 52, and the other end of the capillary 51 is connected to one end of the second connecting part 53. The other end of the second connecting part 53 is connected to the pipe between the liquid outlet of the chip cold head 1 and the liquid inlet of the compressor 2.

[0028] When the computer cooling system is operating normally, the chip cooling head 1 absorbs heat from the CPU and converts it into a high-temperature, low-pressure gas. This gas flows through a pipe into the inlet of compressor 2. Compressor 2 compresses the high-temperature, low-pressure gas into a high-temperature, high-pressure gas, which is then discharged from the outlet of compressor 2 to the inlet of condenser 3. Condenser 3 converts the high-temperature, high-pressure gas into a low-temperature, low-pressure liquid, which is discharged from the outlet of condenser 3 and then flows through a pipe into the first connection part 52. It then flows out from the first connection part 52, through a pipe to the inlet of chip cooling head 1, where it reforms as liquid coolant to dissipate heat from the CPU.

[0029] When compressor 2 stops running, since compressor 2 still maintains a high pressure state, the gas pressure inside compressor 2 flows into capillary tube 51 through the second connection 53. Because capillary tube 51 has a small diameter, the gas from compressor 2 flows faster as it passes through capillary tube 51, thereby reducing the gas pressure and allowing the gas pressure inside the computer cooling device to quickly reach a balanced state.

[0030] It should be noted that the capillary tube 51 is made of copper, which can be bent and deformed according to the application scenario. Preferably, the capillary tube 51 is arranged in a spiral shape, which allows the length of the capillary tube 51 to be increased within a limited space, thus effectively saving installation space.

[0031] Furthermore, the first connecting part 52 includes a connecting connector 520, a body 521, and a guide fluid 52. One end of the connecting connector 520 is connected to the side wall of the body 521, and the connecting connector 520 is in communication with the interior of the body 521. The other end of the connecting connector 520 is connected to the liquid outlet of the condenser 3 through a pipe. One end of the guide fluid 522 is connected to the bottom of the body 521, and the other end of the guide fluid 522 is connected to the liquid inlet of the chip cold head 1 through a pipe. The inner diameter of the guide fluid 522 gradually decreases in the direction gradually away from the body 521. One end of the capillary tube 51 is connected to the top of the body 521, and the capillary tube 51 is in communication with the body 521 and the guide fluid 522.

[0032] In actual use, the low-temperature and low-pressure liquid discharged from the condenser 3 passes through the body 521 and is then collected by the guide fluid 522 and discharged through the pipe to the liquid inlet of the chip cold head 1.

[0033] Please refer to Figure 4 , Figure 4 This is a schematic diagram illustrating the air-cooling assembly. Further, the air-cooling assembly 4 includes multiple cooling fans 41 arranged along the height of 3, with the air outlet of each fan 41 facing the condenser 3. In this example, each cooling fan 41 is detachably connected to one side of the condenser 3 by screws, making the cooling fans 41 easy to install and remove.

[0034] In summary, by configuring a chip cooling head 1, a compressor 2, and a condenser 3, during heat dissipation, the liquid refrigerant inside the chip cooling head 1 absorbs heat, turning it into a high-temperature, low-pressure gas. This gas then passes through the compressor 2 and condenser 3 to dissipate heat, transforming the high-temperature, low-pressure gas into a low-temperature, low-pressure liquid refrigerant, which flows back to the chip cooling head 1 to cool the CPU again. Simultaneously, by incorporating an air-cooling component 4, heat dissipation from the condenser 3 is accelerated, improving the overall heat dissipation efficiency of the computer's cooling system.

[0035] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A computer cooling device, characterized in that, include: The chip cold head (1), compressor (2), condenser (3) and air-cooled assembly (4) are provided. Each of the chip cold head (1), compressor (2) and condenser (3) has a liquid inlet and a liquid outlet. The liquid outlet of the chip cold head (1) is connected to the liquid inlet of the compressor (2) through a pipe. The liquid outlet of the compressor (2) is connected to the liquid inlet of the condenser (3) through a pipe. The liquid outlet of the condenser (3) is connected to the liquid inlet of the chip cold head (1) through a pipe. The air-cooled assembly (4) is connected to one side of the condenser (3) and the air outlet of the air-cooled assembly (4) faces the condenser (3).

2. The computer cooling device according to claim 1, characterized in that, It also includes a capillary assembly (5), which includes a capillary (51), a first connecting part (52) and a second connecting part (53). One end of the capillary (51) is connected to the first connecting part (52), and the other end of the capillary (51) is connected to the second connecting part (53). The other end of the second connecting part (53) is connected to the pipe between the liquid outlet of the chip cold head (1) and the liquid inlet of the compressor (2). The first connecting part (52) is connected to the liquid outlet of the condenser (3) through a pipe.

3. The computer cooling device according to claim 1, characterized in that, The air-cooling assembly (4) includes a plurality of cooling fans (41), which are arranged along the height direction of the condenser (3), and each cooling fan (41) is installed on the condenser (3).

4. The computer cooling device according to claim 1, characterized in that, The connecting pipes between the chip cold head (1), the compressor (2) and the condenser (3) are all copper pipes.

5. The computer cooling device according to claim 2, characterized in that, The first connecting part (52) includes a connecting connector (520), a body (521), and a guide fluid (522). One end of the connecting connector (520) is connected to the side wall of the body (521), and the connecting connector (520) is connected to the interior of the body (521). The other end of the connecting connector (520) is connected to the liquid outlet of the condenser (3) through a pipe. One end of the guide fluid (522) is connected to the bottom of the body (521), and the other end is connected to the water inlet of the chip cold head (1) through a pipe. One end of the capillary tube (51) is connected to the top of the body (521), and the capillary tube (51) is connected to the body (521) and the guide fluid (522).

6. The computer cooling device according to claim 5, characterized in that, The inner diameter of the guide fluid (522) gradually decreases in the direction away from the main body (521).

7. The computer cooling device according to claim 1, characterized in that, The compressor (2) is a scroll compressor.

8. The computer cooling device according to claim 2, characterized in that, The capillary tube (51) is coiled.

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