Tray and oven

Abstract

The utility model relates to a tray and a drying oven, the tray can be fixed on the drying oven through a clamping groove in the drying oven, the tray can comprise a tray plane, the tray plane is an inclined plane, and the inclined plane can be used for enabling a crystal box to incline along with the gradient of the inclined plane when the crystal box is placed on the tray plane. And the problem of wafer adhesion caused by non-uniform gaps between wafers in the wafer box is effectively solved.

Description

Technical Field

[0001] This application relates to the field of wafer manufacturing technology, and in particular to trays and ovens. Background Technology

[0002] During the wafer fabrication process, there is a step of baking the wafer to ensure the cleanliness and quality of the wafer surface.

[0003] In related technologies, wafers can be placed in wafer boxes, wafer boxes can be placed on trays, and trays can be fixed in ovens by slots, with the ovens baking the wafers.

[0004] In related technologies, the tray is usually fixed horizontally in the oven, and there is uneven spacing between wafers in the wafer box, which leads to wafer sticking problems. Utility Model Content

[0005] Therefore, it is necessary to provide a tray and oven for eliminating wafer sticking.

[0006] A first aspect of this application provides a tray, which is fixed to the oven by a slot in the oven, the tray comprising:

[0007] The tray plane is an inclined surface;

[0008] The inclined surface is used so that when the crystal cell is placed on the tray plane, the crystal cell tilts with the slope of the inclined surface.

[0009] In one embodiment, the inclined surface includes at least two sub-inclined surfaces, and adjacent sub-inclined surfaces are connected by a connecting surface.

[0010] In one embodiment, the angle between each of the sub-inclined surfaces and the horizontal plane is an acute angle.

[0011] In one embodiment, the inclined surface is a flat plane.

[0012] In an alternative embodiment, the angle between the whole plane and the horizontal plane is an acute angle.

[0013] In one embodiment, the acute angle is less than or equal to 30°.

[0014] In one embodiment, the acute angle is 30°.

[0015] In one embodiment, the tray includes a stop surface for stopping the crystal cell.

[0016] A second aspect of this application provides an oven, the oven including a slot, through which a tray as described in any of the above embodiments is fixed to the oven.

[0017] In one embodiment, the cross-sectional shape of the card slot is adapted to the cross-sectional shape of the tray.

[0018] The aforementioned tray and oven are described above. The tray can be fixed to the oven via a slot in the oven. The tray may include a tray plane, which is an inclined surface. This inclined surface allows the wafer to tilt with the slope of the inclined surface when the wafer is placed on the tray plane. By tilting the wafer with the slope of the inclined surface when the wafer is placed on the tray plane, the wafer placed in the wafer tilts with the tilt of the wafer, causing the wafer as a whole to tilt forward, thereby eliminating the uneven gap between wafers and effectively solving the problem of wafer sticking. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a tray structure provided in one embodiment of this application.

[0020] Figure 2 A schematic diagram of a tray structure provided for another embodiment of this application. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0022] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0027] Semiconductor manufacturing requires the use of wafers, and in the process of using wafers to produce semiconductors, some steps require baking the wafers so that they are more suitable for semiconductor manufacturing.

[0028] For example, the wafer baking steps may include, but are not limited to, soft baking after photolithography coating, wafer epitaxial processing, wafer polishing and cleaning.

[0029] Alternatively, the wafer can be baked using an oven.

[0030] In one embodiment, a wafer cassette can be provided, in which the wafer can be placed. When baking is required, the wafer cassette containing the wafer is placed on a support component, which is then fixed in an oven, where the oven bakes the wafer.

[0031] Alternatively, the supporting component can be a pallet.

[0032] In one embodiment, a wafer cassette can hold multiple wafers, such as 25 wafers, so that multiple wafers can be baked at once.

[0033] In one optional embodiment, multiple crystal boxes can be placed in the oven in the same batch; for example, six crystal boxes can be placed at once. Optionally, the maximum number of crystal boxes that can be placed in the same batch can be determined by the size of the oven.

[0034] In one embodiment, the oven includes a slot through which the tray is secured within the oven.

[0035] Optionally, the cross-sectional shape of the card slot is adapted to the cross-sectional shape of the tray.

[0036] In one embodiment, the slot and the tray are non-detachably connected. For example, the slot and the tray may be an interference fit, meaning the tray, once fixed in the oven, cannot be detached from the oven.

[0037] In one embodiment, the card slot and the tray are detachably connected. Exemplarily, one card slot or tray has a raised structure, while the other has a recess; the raised structure can disengage from the recess, thereby achieving a detachable connection between the card slot and the tray.

[0038] Alternatively, when wafers need to be baked, the wafers can be placed in a wafer box, which is placed on a tray, and the tray is fixed in an oven so that the oven can bake the wafers placed in the wafer box.

[0039] In related technologies, when a tray is placed and fixed in an oven, the surface of the tray is horizontal, and the wafer cassette placed on the tray is also horizontal, thus ensuring that the wafers placed in the wafer cassette are also horizontal. However, when there is uneven spacing between wafers in the wafer cassette, wafers are prone to sticking together.

[0040] To address the wafer sticking problem caused by uneven spacing between wafers within the wafer cassette during baking when the cassette is horizontal, this application provides a tray, see reference. Figure 1 As shown, Figure 1A schematic diagram of a tray according to an embodiment of the present application is shown. The tray 1 provided in an embodiment of the present application includes a tray plane.

[0041] The tray surface is used to place items. For example, the tray surface is used to place a crystal box.

[0042] The wafer box is used to hold the wafer.

[0043] In one embodiment, the tray plane can be an inclined surface.

[0044] Optionally, the inclined surface is used so that when the cassette is placed on the tray plane, the cassette tilts with the slope of the inclined surface, thereby causing the wafers in the cassette to tilt with the slope of the inclined surface, solving the problem of wafer sticking caused by uneven gaps between wafers in the cassette.

[0045] The tray 1 provided in the above embodiment can place the wafer in the wafer box when the manufacturing process is baking. The wafer box is placed on the tray. Since the tray 1 is an inclined surface, the wafer box is also inclined along the slope of the inclined surface, so that the wafer placed in the wafer box is tilted forward as a whole, eliminating the problem of wafer sticking caused by uneven gap between wafers, and effectively improving the safety of the wafer.

[0046] In one embodiment, such as Figure 1 As shown, an inclined surface can be represented by an angle α between the extension of one of its sides and the horizontal line. For example, this angle α can be considered as the inclination angle of the inclined surface.

[0047] In one embodiment, in order for the inclined surface to stably support the cell, the inclination angle of the inclined surface can be an acute angle.

[0048] Optionally, the included angle can be an acute angle greater than 0 and less than or equal to 30° to reduce the risk of the wafer breaking due to the wafer becoming unstable on the tray because of an excessive tilt angle, causing the wafer to slide down and collide with other objects (such as the inner wall of the oven).

[0049] In one embodiment, the included angle α can be an acute angle of 30°, which can provide a sufficient tilt angle to effectively solve the problem of unevenness between wafers in the wafer cassette. It can prevent the wafer from sticking to the tray due to insufficient tilt angle of the tray after the wafer cassette is placed on the tray because the included angle is too small. At the same time, it can provide effective support for the wafer cassette, reduce the situation where the wafer cassette slides down the tilt angle of the tray due to excessive tilt angle, and thus reduce the wafer breakage caused by the wafer cassette colliding with other components (such as the inner wall of the oven), thus effectively improving safety.

[0050] In one embodiment, the tray plane has multiple through holes. By providing multiple through holes on the tray plane, the friction between the wafer and the tray plane is increased, preventing the wafer from sliding down due to insufficient friction after being placed on the tray, which could lead to the wafer colliding with the oven and causing wafer damage. This effectively improves wafer safety.

[0051] In one embodiment, the tray may include at least two sub-sloping surfaces. For example, as shown... Figure 1 As shown, the tray includes a first sub-inclined surface 11 and a second sub-inclined surface 12.

[0052] In one embodiment, such as Figure 1 As shown, there is an angle α between the extension of one of the edges of the first sub-inclined surface 11 and the horizontal line. For example, this angle α can be considered as the inclination angle α of the first sub-inclined surface 11.

[0053] Optionally, such as Figure 1 As shown, there is an angle β between the extension of one of the edges of the second sub-inclined surface 12 and the horizontal line. For example, this angle β can be considered as the inclination angle β of the second sub-inclined surface 12.

[0054] In one embodiment, the tilt angle α of the first sub-tilted surface 11 and the tilt angle β of the second sub-tilted surface 12 may be the same or different.

[0055] In one embodiment, the equal size of each sub-tilted surface can also be unequal in size. For example, as... Figure 1 As shown, the first sub-inclined surface 11 and the second sub-inclined surface 12 are of the same size, or they may not be of the same size.

[0056] Optionally, to ensure that the cell can be stably placed on any sub-tilted surface, the tilt angle of each sub-tilted surface is an acute angle. For example, as shown... Figure 1 As shown, the tilt angle α of the first sub-tilted surface 11 and the tilt angle β of the second sub-tilted surface 12 are both acute angles.

[0057] In an optional embodiment, the tilt angle of each sub-tilted surface can be greater than 0 and less than or equal to 30°. For example, as shown... Figure 1 The tilt angle α of the first sub-tilted surface 11 shown is greater than 0 and less than or equal to 30°, and the tilt angle β of the second sub-tilted surface 12 is greater than 0 and less than or equal to 30°.

[0058] In one embodiment, the tilt angle of each sub-tilted surface may be the same, or it may be different. For example, as shown... Figure 1As shown, the tilt angle α of the first sub-tilted surface 11 is the same as, or different from, the tilt angle β of the second sub-tilted surface 12.

[0059] Optionally, each sub-tilted surface has a tilt angle of 30°, ensuring that each sub-tilted surface provides a sufficient tilt angle to effectively address wafer unevenness within the wafer cassette. This prevents wafer sticking caused by unevenness due to insufficient tilt angle when the cassette is placed on the tray. It also provides effective support to the cassette, reducing the risk of wafer breakage due to excessive tilt angle causing the cassette to slide down the tray and collide with other components (such as the inner wall of the oven). This effectively improves safety.

[0060] For example, such as Figure 1 As shown, the tilt angle of the first sub-tilted surface 11 is 30°, and the tilt angle of the second sub-tilted surface 12 is 30°.

[0061] In one embodiment, each sub-tilted surface is provided with a through hole, so that when a wafer is placed on any sub-tilted surface, the through hole increases the friction between the wafer and the sub-tilted surface, effectively reducing the problem of wafer breakage caused by insufficient friction, which causes the wafer to slide with the slope of the sub-tilted surface, resulting in the wafer colliding with the oven or the wafer tipping over.

[0062] For example, such as Figure 1 As shown, both the first sub-inclined surface 11 and the second sub-inclined surface 12 are provided with through holes.

[0063] In an optional embodiment, adjacent sub-inclined surfaces are connected by a connecting surface, making the tray a single integral structure, thus improving the ease of securing the tray into the oven. For example, as shown... Figure 1 As shown, the first sub-inclined surface 11 and the second sub-inclined surface 12 are connected by a connecting surface 13.

[0064] In one embodiment, the connecting surface 13 can be used as a stop surface. When a die is placed on the sub-tilted surface, the connecting surface 13 can be used as a stop surface to prevent the die from tipping over and causing damage to the wafer inside the die when it moves on the sub-tilted surface. For example, when the die is placed on the first sub-tilted surface 11, if the die slides down when it tilts with the tilt angle of the first sub-tilted surface 11, the connecting surface 13 can be used to stop the downward movement of the die, reducing the excessive impact force caused by further downward movement of the die and thus preventing damage to the wafer.

[0065] In one exemplary embodiment, the tray can be placed inside the oven along the direction of the horizontal arrow, or the horizontal arrow can be considered to be pointing towards the inside of the oven, opposite to the direction of the oven opening.

[0066] In one embodiment, a stop surface can be provided on the sub-inclined surface closest to the inner wall of the oven, so that when the wafer cassette moves on the sub-inclined surface, the connecting surface can abut against the wafer cassette to prevent the wafer cassette from tipping over and causing damage to the wafer inside the wafer cassette.

[0067] For example, such as Figure 1 As shown, a stop surface 14 is provided on the second sub-inclined surface 12.

[0068] In one embodiment, tray 1 can be a completely flat surface. Alternatively, tray 1 can be entirely in the shape of a triangular prism. For example, as shown... Figure 2 As shown, when viewed from a direction perpendicular to the horizontal line, the tray has a triangular cross-section. Optionally, the triangular cross-section of the tray can be an acute triangle with an included acute angle α. Exemplarily, the included angle α is the tilt angle of the tray.

[0069] Optionally, the acute angle can be an acute angle greater than 0 and less than or equal to 30° to reduce the risk of the wafer breaking due to the wafer being unstable on the tray because of an excessive tilt angle, causing the wafer to slide down and collide with other objects (such as the inner wall of the oven).

[0070] In one embodiment, the acute angle α can be a 30° acute angle, which can provide a sufficient tilt angle to effectively solve the problem of unevenness between wafers in the wafer cassette. It can prevent the wafer from sticking to the tray due to insufficient tilt angle of the tray after the wafer cassette is placed on the tray because the tilt angle of the tray is not enough to effectively eliminate the wafer sticking caused by unevenness between wafers in the wafer cassette. At the same time, it can provide effective support for the wafer cassette, reduce the situation where the wafer cassette slides down the tilt angle of the tray due to excessive tilt angle, and thus reduce the wafer breakage caused by the wafer cassette colliding with other components (such as the inner wall of the oven), thus effectively improving safety.

[0071] In an optional embodiment, the use of a slot to fix the oven and the tray can ensure the stability of the tray after it is fixed in the oven, prevent the movement of the crystal box placed on the tray due to the movement of the tray, and reduce the relative movement between the tray and the oven.

[0072] Optionally, the shape of the slot in the oven can be adapted to the shape of the tray so that the tray can be secured in the oven via the slot. For example, if the tray is like... Figure 2As shown, when the tray is viewed vertically along the horizontal line, its cross-section is triangular. Therefore, the cross-section of the card slot can also be triangular to match the cross-sectional shape of the tray, allowing the tray to be accurately inserted into the slot. For example, if the tray is as follows... Figure 1 As shown, when including at least two sub-inclined surfaces, the cross-sectional shape of the slot can also be adapted to the shape of the fold formed by the two sub-inclined surfaces.

[0073] In one alternative embodiment of this application, an oven is provided for baking wafers when needed.

[0074] In one embodiment, the oven may include, but is not limited to, a housing, heating elements, a fan or circulation system, a temperature control system, an air duct, a door, and a sealing device.

[0075] The enclosure serves as a frame to support the heating elements, fan or circulation system, temperature control system, air ducts, doors, and sealing devices. Optionally, the enclosure is typically supported by stainless steel or other high-temperature resistant materials, providing good thermal insulation to reduce heat loss.

[0076] The heating element is used to generate heat. Optionally, the heating element can be a resistance wire, an infrared heating tube, etc.

[0077] The fan or circulation system is used to distribute hot air evenly within the oven, ensuring uniform temperature and improving the uniformity of wafer drying.

[0078] The air duct is used to guide the flow of hot air, optimize heat distribution, and improve the drying effect of wafers.

[0079] The door and sealing device are used to ensure the oven is airtight during operation, preventing heat leakage and the entry of external air.

[0080] In an alternative embodiment, a slot is provided on the housing, through which the tray can be fixed in the oven.

[0081] Optionally, the card slot can be tilted as a whole. For example, the card slot is tilted towards the inner wall of the box opposite to the door, with the front lower and the back higher. When the tray is fixed in the oven through the card slot, the tray tilts with the tilt slope of the card slot, also with the front lower and the back higher, providing a tilted surface. Thus, when the crystal box is placed on the tray, the crystal box also tilts with the tilt slope of the tray.

[0082] In one embodiment, the tilt of the card slot can be an angle between the card slot and the horizontal plane.

[0083] Optionally, the included angle can be an acute angle.

[0084] In one exemplary embodiment, the acute angle can be greater than 0 and less than or equal to 30°.

[0085] Optionally, if the acute angle is 30°, then when the tray is fixed in the oven by the slot, the tray also presents a 30° tilt angle. When the crystal box is placed on the tray, the crystal box presents a 30° tilt angle. The wafers in the crystal box are tilted forward in the slot, eliminating the problem of wafer sticking caused by uneven gaps between wafers.

[0086] In an alternative embodiment, the slot shape is adapted to the tray shape so that the tray can be accurately and stably fixed in the oven via the slot.

[0087] In an alternative embodiment, the card slot may also vary depending on the shape of the tray. For example, with... Figure 1 The card slots that fit the middle tray are as follows: Figure 2 The shapes of the slots that fit the middle tray are not the same. For example, when the tray includes at least two sub-inclined surfaces and the tray as a whole is "Z" shaped (viewed from a direction perpendicular to the horizontal line), the longitudinal section of the slot can also be a "Z" shaped slot that fits the tray, so that the tray can be effectively accommodated in the slot to fix the tray in the oven.

[0088] In an optional embodiment, when the cross-section of the pallet is triangular and the overall shape of the pallet is a triangular prism, the cross-section of the slot can also be triangular and the overall shape of the slot can also be a triangular prism, so that the slot can adapt to the shape of the pallet and ensure the fixed installation of the pallet.

[0089] In the above embodiments, an oven is provided, which may include a slot adapted to a tray. When the tray is placed in the slot, the tray is fixed in place by the slot. When the tray itself has an inclined angle, when the tray is fixed in the oven by the slot, the tray presents a state where the front is lower than the back (with the direction of the horizontal arrow as the front). This can solve the problem of wafer sticking caused by uneven spacing between wafers in the wafer cassette. In the above embodiments, an embodiment with an inclined slot is also provided, which allows the tray to be tilted without modifying the tray. This can also solve the problem of wafer sticking caused by uneven spacing between wafers in the wafer cassette.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A tray, characterized in that, The tray is fixed to the oven via a slot in the oven, and the tray includes: The tray plane is an inclined surface; The inclined surface is used so that when the crystal cell is placed on the tray plane, the crystal cell tilts with the slope of the inclined surface; The inclined surface includes at least two sub-inclined surfaces, and adjacent sub-inclined surfaces are connected by a connecting surface, or The inclined surface is a flat plane, and the angle between the flat plane and the horizontal plane is an acute angle.

2. The pallet according to claim 1, characterized in that, The angle between each of the sub-inclined surfaces and the horizontal plane is an acute angle.

3. The tray according to claim 1 or 2, characterized in that, The acute angle is less than or equal to 30°.

4. The tray according to claim 3, characterized in that, The acute angle is 30°.

5. The pallet according to claim 1, characterized in that, The tray includes a stop surface for stopping the crystal cell.

6. An oven, characterized in that, The oven includes a slot, and the tray as described in any one of claims 1-5 is fixed to the oven via the slot.

7. The drying oven according to claim 6, characterized in that, The cross-sectional shape of the card slot is adapted to the cross-sectional shape of the tray.

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