Wafer carrier and wafer de-bonding system
By designing the support structure of the wafer carrier, the problem of adhesion and difficulty in separating the device wafer and the carrier wafer was solved, realizing automatic separation and a highly efficient process.
Patent Information
- Application Number
- CN202422820173.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-11-19
AI Technical Summary
In the prior art, the residual solution between the device wafer and the carrier wafer has a surface tension that causes them to stick together and are difficult to separate.
Design a wafer carrier including a wafer slot and an immersion chamber. The immersion chamber is provided with a support portion, which divides the wafer slot into first and second receiving spaces. The support portion is used to restrict the first wafer of the bonding wafer pair in the first receiving space, so that it can automatically separate by gravity after being dissolved/etched in the wet solution.
It enables automatic separation of device wafers and carrier wafers, reduces manual intervention, improves process reliability and efficiency, and reduces costs.
Smart Images
Figure CN223651358U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor equipment technology, and in particular relates to a wafer carrier and a wafer debonding system. Background Technology
[0002] Currently, the processing of thin or ultra-thin wafers based on compound semiconductors often employs temporary bonding processes to perform back-side processes, including thinning and back-side metallization, before the thin wafer is debonded and separated from the carrier.
[0003] Temporary bonding processes are mainly classified according to the debonding method, including laser debonding, thermal slip debonding, and chemical wet debonding. In chemical wet debonding, the relevant technology involves immersing the device wafer and the carrier wafer in a wet bath using a crystal boat basket. After a certain period of time, the bonding interface between the two wafers is dissolved / etched apart by the chemical solution. However, the surface tension of the residual chemical solution between the device wafer and the carrier wafer at this time still makes them stick together and difficult to separate. Utility Model Content
[0004] This application aims to at least solve the technical problem in the prior art where residual chemical solution between device wafers and carrier wafers causes them to stick together due to surface tension, making them difficult to separate.
[0005] This application provides a wafer carrier, the wafer carrier comprising: at least one wafer slot, each wafer slot being used to place a bonding wafer pair and including an immersion cavity, the immersion cavity being provided with a support portion, the immersion cavity being divided into a first receiving space and a second receiving space communicating with the first receiving space along the support portion, the first receiving space being located above the second receiving space;
[0006] The support portion is used to restrict the first wafer of the bonding wafer pair in the first accommodating space so that the second wafer of the bonding wafer pair can fall into the second accommodating space after being separated from the first wafer.
[0007] According to one embodiment of this application, the support portion vertically supports the first wafer in the first receiving space, and a release channel is defined between the side wall of the support portion and the inner wall surface of the first receiving space, so that the second wafer can fall from the first receiving space into the second receiving space through the release channel.
[0008] According to one embodiment of this application, the wafer carrier further includes: a first retaining wall, a second retaining wall, and a recycling slot;
[0009] The first card wall and the second card wall are arranged opposite to each other, and the first receiving space is formed between the first card wall and the second card wall; a second receiving space is formed in the recycling card slot; the support is provided on the second card wall and defines the detachment channel between the support and the wall of the first card wall.
[0010] According to one embodiment of this application, the width of the first card wall and the second card wall ranges from 100um to 5mm, and the height of the first card wall and the second card wall ranges from 25mm to 350mm.
[0011] According to one embodiment of this application, the support portion laterally supports the first wafer in the first receiving space, so that the second wafer is suspended in the second receiving space and falls in the second receiving space after being separated from the first wafer.
[0012] According to one embodiment of this application, the support portion is provided with a raised separation structure, which is sandwiched between the first wafer and the second wafer.
[0013] According to one embodiment of this application, the support portion is provided with a limiting groove, which matches the edge of the first wafer; the protrusion separation structure is provided at one end of the limiting groove near the disengagement channel, or the protrusion separation structure is provided at one end of the limiting groove near the second accommodating space.
[0014] According to one embodiment of this application, the width of the raised separation structure ranges from 20um to 200um, and the height of the raised separation structure is no greater than 10mm; and / or, the width of the limiting groove is no greater than 1mm; and / or, the width of the disengagement channel is no greater than 1mm.
[0015] According to one embodiment of this application, the number of immersion chambers is multiple, and the multiple immersion chambers are arranged along a first direction or along a second direction, wherein the first direction is perpendicular to the second direction.
[0016] Secondly, this application provides a wafer debonding system, which includes: a wet tank and a wafer carrier as described in any of the above embodiments;
[0017] The wet process tank is used to hold the wet process solution; the wafer carrier is immersed in the wet process solution, and the wet process solution fills the immersion chamber.
[0018] The above-described one or more technical solutions in the embodiments of this application have at least one of the following technical effects:
[0019] The support section of this application holds either the first wafer or the second wafer in the first receiving space. After the wet liquid dissolves / corrodes the bonding adhesive, the first wafer or the second wafer that is not held in the first receiving space will fall to the bottom of the second receiving space under its own gravity. This makes the separation of the first wafer and the second wafer easier, and the above process does not require manual operation, thus improving the reliability and efficiency of the process.
[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0021] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0022] Figure 1 This is a cross-sectional view of the wafer carrier provided in the first embodiment of this application;
[0023] Figure 2 This is a cross-sectional view of the wafer carrier, first wafer, second wafer, and bonding adhesive provided in the first embodiment of this application;
[0024] Figure 3 This is one of the cross-sectional views of the bonding and unbonding process of the wafer carrier, the first wafer, the second wafer, and the bonding adhesive provided in the first embodiment of this application;
[0025] Figure 4 This is a second cross-sectional view of the bonding and unbonding process of the wafer carrier, the first wafer, the second wafer, and the bonding adhesive provided in the first embodiment of this application;
[0026] Figure 5 This is the third cross-sectional view of the bonding and unbonding process of the wafer carrier, the first wafer, the second wafer, and the bonding adhesive provided in the second embodiment of this application;
[0027] Figure 6 This is a cross-sectional view of the wafer carrier, first wafer, second wafer, and bonding adhesive provided in the second embodiment of this application;
[0028] Figure 7 This is one of the cross-sectional views of the bonding and unbonding process of the wafer carrier, the first wafer, the second wafer, and the bonding adhesive provided in the second embodiment of this application;
[0029] Figure 8 This is a second cross-sectional view of the bonding and unbonding process of the wafer carrier, the first wafer, the second wafer, and the bonding adhesive provided in the second embodiment of this application;
[0030] Figure 9This is the third cross-sectional view of the bonding and unbonding process of the wafer carrier, the first wafer, the second wafer, and the bonding adhesive provided in the second embodiment of this application.
[0031] Figure label:
[0032] 100. Immersion chamber;
[0033] 110. First containment space; 120. Second containment space; 130. Escape passage;
[0034] 210. Support part; 211. Protruding separation structure; 212. Limiting groove;
[0035] 310, First card wall; 320, Second card wall; 330, Recycling card slot; a1, First wafer; a2, Second wafer; a3, Bonding adhesive; b1, Wet process tank; b2, Wet process solution. Detailed Implementation
[0036] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0037] Micro-Electro-Mechanical Systems (MEMS) are widely used in intelligent systems, consumer electronics, wearable devices, smart home systems, and microfluidics. Common products include MEMS accelerometers, MEMS microphones, micromotors, micropumps, microoscillators, MEMS pressure sensors, MEMS gyroscopes, MEMS humidity sensors, and their integrated products.
[0038] Most current MEMS devices have movable structures, and in many cases, they are hollow structures that run through the wafer. Such structures often require temporary bonding processes to achieve during fabrication.
[0039] Temporary bonding processes are mainly classified according to the debonding method, including laser debonding, thermal slip debonding, and chemical wet debonding.
[0040] Laser debonding works by using a photothermal material in the bonding interlayer. When the laser irradiates this material, it heats up and cracks, thus separating the device wafer from the carrier wafer. This method is fast and efficient, but it is limited to using transparent sheets (such as glass, quartz, etc.) as carriers. These transparent materials have significant thermal mismatch with the device wafer (usually a silicon wafer), and stress problems are often unavoidable in the post-bonding process due to the process temperature.
[0041] Thermal slip debonding softens and flows the bonding adhesive by heating, and applies a parallel force to make the device wafer and the carrier slide parallel to each other to complete the debonding. Compared with laser debonding, this method can use silicon wafers as carriers and avoid thermal mismatch problems. However, the slip method causes the softened bonding adhesive to move the cut-out structure along the slip direction. Once this movement exceeds the structural design limit, the structure will break, the chip will fail, and the wafer will be scrapped or the wafer yield will decrease.
[0042] Chemical wet debonding involves immersing the bonded wafer pair in an organic solution. The solution continuously dissolves / corrodes the bonding adhesive, eventually separating the device wafer from the carrier wafer. This method does not require a transparent carrier or external force, and it does not damage the structure of the device wafer, making the debonding method gentler.
[0043] The relevant technology involves immersing the device wafer and the carrier wafer, forming a bonded wafer pair, into a wet process bath using a crystal boat basket. After a certain period of time, the bonding interface between the device wafer and the carrier wafer is dissolved / etched apart by the chemical solution. However, the residual chemical solution between the device wafer and the carrier wafer still has surface tension, causing them to stick together and become difficult to separate.
[0044] On the one hand, embodiments of this application provide a wafer carrier for carrying a bonded wafer pair including a first wafer (device wafer) and a second wafer (carrier wafer). On the other hand, embodiments of this application also provide a wafer debonding system, which uses the aforementioned wafer carrier to place the bonded wafer pair into a wet process bath and immerses them in the wet process solution of the wet process bath to perform wet debonding, thereby separating the first wafer and the second wafer in the bonded wafer pair. The wafer carrier and wafer debonding system of the embodiments of this application can realize the automatic separation of carrier wafers from device wafers, reduce manual intervention, improve process controllability, and thus improve efficiency and reduce costs.
[0045] The following is for reference. Figures 1-9 This application describes a wafer carrier and a wafer debonding system according to embodiments thereof.
[0046] It should be noted that in the bonding wafer pair, a temporary bonding adhesive (TBA) a3 is provided between the first wafer a1 and the second wafer a2. The temporary bonding adhesive a3 is used to temporarily bond the first wafer a1 and the second wafer a2 and to debond them after processing. The temporary bonding adhesive a3 can be a photoresist (PR) made of photosensitizer, resin and solvent, or a bonding adhesive made of matrix materials such as tackifying resin and polymer resin. Its thickness can be no more than 200um.
[0047] In actual implementation, the first wafer a1 can be a device wafer, and the second wafer a2 can be a carrier wafer. The carrier wafer provides protection and support for the device wafer, and the material can be semiconductor materials such as silicon, quartz, glass, and metal, with a thickness range of 200 to 800 μm; the device wafer is a MEMS device processing wafer.
[0048] The wafer carrier can be made of materials such as plastic, Teflon, metal, or quartz, and includes at least one wafer slot, for example, the number of wafer slots can be 25. That is, a complete wafer carrier (crystal boat box, crystal boat basket) has 25 identical wafer slots, each wafer slot can hold a pair of bonded wafers, and the wafer carrier can simultaneously carry 25 pairs of bonded wafers. The following is a simplified description, only describing the structure of a single wafer slot in detail; the structures of the other wafer slots are the same.
[0049] like Figure 1 and Figure 6 As shown, the wafer carriers in the figure have three wafer slots arranged side by side (see figure). Figure 1 (in dashed box) and three stacked wafer slots (see...) Figure 6 The following explanation uses a dashed box as an example. Each wafer slot contains an immersion chamber 100, and each immersion chamber 100 has a support portion 210. Along the support portion 210, the immersion chamber 100 can be divided into a first receiving space 110 and a second receiving space 120 communicating with the first receiving space 110. The first receiving space 110 is located above the second receiving space 120. For example... Figure 2 and Figure 6 As shown, the support portion 210 is used to support the first wafer a1, and the second wafer a2 bonded to the first wafer a1 can fall into the second accommodating space 120.
[0050] More specifically, the support portion 210 holds the first wafer a1 in the first receiving space 110. After the wet liquid b2 dissolves / corrodes the temporary bonding adhesive a3, the second wafer a2, which is not held in the first receiving space 110, will fall from the first receiving space 110 into the second receiving space 120 or from the top of the second receiving space 120 to the bottom of the second receiving space 120 under its own gravity, thereby achieving the separation of the first wafer a1 and the second wafer a2. The above process does not require manual operation, thus improving the reliability and efficiency of the process.
[0051] When separating the first wafer a1 and the second wafer a2 by wet debonding, the wafer carrier can be at least one of the following structural forms:
[0052] Firstly, such as Figures 1-5As shown, the bonding wafer pair is placed vertically within the first receiving space 110 of the immersion chamber 100, that is, the first wafer a1 and the second wafer a2 are placed side by side opposite each other, and the first wafer a1 is supported and constrained from below by the support portion 210. The support portion 210 supports the bottom edge of the vertically oriented first wafer a1 from below, and a release channel 130 is defined between the side wall of the support portion 210 and the inner wall surface of the first receiving space 110 near the second wafer a1. The support portion 210 holds the first wafer a1 within the first receiving space 110, and the second wafer a2 can fall from the first receiving space 110 through the release channel 130 to the bottom of the second receiving space 120.
[0053] In this embodiment, the wet solvent b2 dissolves / etches the temporary bonding adhesive a3 between the first wafer a1 and the second wafer a2. The second wafer a2, under its own gravity, gradually slides downwards through the detachment channel 130. Figure 5 As shown, when the bond is completely unbonded, the second wafer a2 falls into the bottom of the second accommodating space 120, realizing the separation of the first wafer a1 and the second wafer a2.
[0054] Secondly, such as Figures 6-9 As shown, the bonding wafers are placed laterally in the immersion chamber 100, that is, the first wafer a1 and the second wafer a2 are arranged vertically opposite each other. The first wafer a1 is laterally constrained by the support portion 210 in the first receiving space 110, and the second wafer a2 is suspended at the top of the second receiving space 120. The support portion 210 is supported on the bottom edge of the laterally placed first wafer a1, and is laterally sandwiched between the first wafer a1 and the second wafer a2, holding the first wafer a1 within the first receiving space 110 and the second wafer a2 within the second receiving space 120.
[0055] In this embodiment, since the second wafer a2 is initially located at the top of the second accommodating space 120, the bonding adhesive a3 between the first wafer a1 and the second wafer a2 is dissolved / etched by the wet solution b2, such as... Figure 9 As shown, when the bond is completely broken, the second wafer a2 will fall from the top of the second accommodating space 120 to the bottom of the second accommodating space 120 under its own gravity, thus separating the first wafer a1 from the second wafer a2.
[0056] In one embodiment, there are multiple wafer slots arranged along a first direction. In another embodiment, the multiple wafer slots are arranged along a second direction. The first direction is perpendicular to the second direction, and the first direction can be a horizontal direction, while the second direction can be a vertical direction.
[0057] The structure of the wafer carrier is further defined below in one embodiment.
[0058] like Figure 1 and Figure 2 As shown, in some embodiments, each wafer slot of the wafer carrier further includes: a first retaining wall 310, a second retaining wall 320, and a recycling slot 330.
[0059] The first card wall 310 and the second card wall 320 are arranged opposite to each other, and a first receiving space 110 is formed between the first card wall 310 and the second card wall 320; a second receiving space 120 is formed in the recycling card slot 330; the support part 210 is provided on the second card wall 320 and defines an escape channel 130 between the support part 210 and the wall surface of the first card wall 310.
[0060] It should be noted that if there are multiple immersion chambers 100, there should also be multiple first card walls 310, second card walls 320 and recycling card slots 330. Each first card wall 310 and second card wall 320 can separate the first receiving space 110 of adjacent wafer card slots.
[0061] In actual implementation, the width of the first card wall 310 and the second card wall 320 ranges from 100um to 5mm, and the height of the first card wall 310 and the second card wall 320 ranges from 25mm to 350mm.
[0062] like Figure 1 and Figure 2 As shown, in some embodiments, the support portion 210 is provided with a raised separation structure 211, which extends upward to the space between the first wafer a1 and the second wafer a2.
[0063] In this embodiment, the protrusion separation structure 211 can isolate the first wafer a1 and the second wafer a2, so that after the bond between the first wafer a1 and the second wafer a2 is broken, the first wafer a1 and the second wafer a2 will not come into contact, thereby avoiding the occurrence of the first wafer a1 and the second wafer a2 being attracted together.
[0064] It should be noted that the specific structure of the protrusion separation structure 211 is not limited in this embodiment. It should be understood that any structure that can prevent the second wafer a2 from contacting the first wafer a1 during the falling process can be used as the protrusion separation structure 211.
[0065] like Figure 1 and Figure 2 As shown, in some embodiments, the support portion 210 is provided with a limiting groove 212, which matches the edge of the first wafer a1; the protruding separation structure 211 is provided at one end of the limiting groove 212 near the disengagement channel 130.
[0066] In this embodiment, the limiting groove 212 and the protrusion separation structure 211 can better hold the first wafer a1 in the first direction (vertical direction), and after the bonding between the first wafer a1 and the second wafer a2 is broken, the first wafer a1 is still stuck in the limiting groove 212.
[0067] like Figure 6 and Figure 7 As shown, in some embodiments, the support portion 210 is provided with a limiting groove 212, which matches the edge of the first wafer a1; the protruding separation structure 211 is provided at one end of the limiting groove 212 near the second accommodating space 120.
[0068] In this embodiment, the limiting groove 212 and the protrusion separation structure 211 can better hold the first wafer a1 in the second direction (horizontal direction), and after the bonding between the first wafer a1 and the second wafer a2 is broken, the first wafer a1 is still stuck in the limiting groove 212 and supported from below by the protrusion separation structure 211.
[0069] In actual implementation, the shape and dimensions of the support portion 210 can be set as follows: the width of the raised separation structure 211 is in the range of 20um to 200um, which is less than the thickness of the temporary bonding adhesive a3; the height of the raised separation structure 211 is not greater than 10mm, to avoid excessive insertion into the temporary bonding adhesive a3; and / or, the width of the limiting groove 212 is not greater than 1mm, and should not be much greater than the thickness of the first wafer a1; and / or, the width of the disengagement channel 130 is not greater than 1mm, and should not be much greater than the thickness of the second wafer a2. The following describes two possible structural formations of the wafer carrier when separating the first wafer a1 and the second wafer a2, specifically illustrating the wafer carrier of this application embodiment.
[0070] 1. The wafer carrier includes: at least one immersion chamber 100, the immersion chamber 100 is provided with a support portion 210, the support portion 210 divides the immersion chamber 100 into a first receiving space 110 and a second receiving space 120 communicating with the first receiving space 110, the first receiving space 110 being located above the second receiving space 120;
[0071] The support portion 210 is provided with a raised separation structure 211, which is sandwiched between the first wafer a1 and the second wafer a2. The support portion 210 is provided with a limiting groove 212, which matches the end of the first wafer a1 or the second wafer a2; the raised separation structure 211 is located at the end of the limiting groove 212 near the disengagement channel 130.
[0072] The support portion 210 is used to support the first wafer a1, and the second wafer a2 can fall to the bottom of the second accommodating space 120.
[0073] In this embodiment, the wafer carrier is immersed in wet process liquid b2, and the wet process liquid b2 fills the immersion cavity 100. Then, the first wafer a1, the second wafer a2, and the bonding adhesive a3 between the first wafer a1 and the second wafer a2 are placed in the first receiving space 110. The first wafer a1 is located in the limiting groove 212, and the protruding separation structure 211 is sandwiched between the first wafer a1 and the second wafer a2 and presses against the bonding adhesive a3.
[0074] The wet solvent b2 dissolves / corrodes the bonding adhesive a3 between the first wafer a1 and the second wafer a2. Under its own gravity, the second wafer a2 begins to slide downwards through the separation channel 130. When the bond is completely broken, the raised separation structure 211 prevents the second wafer a2 from contacting the first wafer a1 during its fall until the second wafer a2 falls into the bottom of the second receiving space 120, thus achieving the separation of the first wafer a1 and the second wafer a2.
[0075] 2. The wafer carrier includes: at least one immersion chamber 100, the immersion chamber 100 is provided with a support portion 210, the support portion 210 divides the immersion chamber 100 into a first receiving space 110 and a second receiving space 120 communicating with the first receiving space 110, the first receiving space 110 being located above the second receiving space 120.
[0076] The support portion 210 is sandwiched between the first wafer a1 and the second wafer a2, and holds the first wafer a1 within the first receiving space 110 and the second wafer a2 within the second receiving space 120.
[0077] The support portion 210 is used to support the first wafer a1, and the second wafer a2 can fall to the bottom of the second accommodating space 120.
[0078] In this embodiment, the wafer carrier is immersed in wet process liquid b2 and the wet process liquid b2 fills the immersion cavity 100. Then, the first wafer a1, the second wafer a2, and the bonding adhesive a3 between the first wafer a1 and the second wafer a2 are placed in the first receiving space 110, wherein the second wafer a2 is initially located at the top of the second receiving space 120.
[0079] The bonding adhesive a3 between the first wafer a1 and the second wafer a2 is dissolved / etched by the wet solution b2. Under its own gravity, the second wafer a2 will fall from the top to the bottom of the second accommodating space 120, thereby separating the first wafer a1 and the second wafer a2.
[0080] This application also provides a wafer debonding system using the above-described wafer carrier.
[0081] like Figures 3 to 5 , Figures 7 to 9As shown, the wafer debonding system includes: a wet tank b1 and a wafer carrier according to any of the above embodiments;
[0082] The wet process tank b1 is used to set the wet process liquid b2; the wafer carrier is immersed in the wet process liquid b2, and the wet process liquid b2 fills the immersion chamber 100.
[0083] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0084] In the description of this application, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0085] In the description of this application, "first feature" and "second feature" may include one or more of the features.
[0086] In the description of this application, "multiple" means two or more.
[0087] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.
[0088] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.
[0089] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0090] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A wafer carrier, characterized in that, The wafer carrier includes at least one wafer slot, each wafer slot being used to place a bonding wafer pair and including an immersion cavity (100), the immersion cavity (100) having a support portion (210) therein, the immersion cavity (100) being divided into a first receiving space (110) and a second receiving space (120) communicating with the first receiving space (110) along the support portion (210), the first receiving space (110) being located above the second receiving space (120); The support portion (210) is used to restrict the first wafer (a1) of the bonding wafer pair in the first receiving space (110) so that the second wafer (a2) of the bonding wafer pair can fall into the second receiving space (120) after being separated from the first wafer (a1).
2. The wafer carrier according to claim 1, characterized in that, The support (210) vertically supports the first wafer (a1) in the first receiving space (110). The side wall of the support (210) and the inner wall of the first receiving space (110) define a release channel (130) so that the second wafer (a2) can fall from the first receiving space (110) through the release channel (130) into the second receiving space (120).
3. The wafer carrier according to claim 2, characterized in that, Also includes: First card wall (310), second card wall (320) and recycling card slot (330); The first card wall (310) and the second card wall (320) are arranged vertically opposite each other, and the first receiving space (110) is formed between the first card wall (310) and the second card wall (320); the second receiving space (120) is formed in the recycling card slot (330); the support part (210) is provided on the second card wall (320) and defines the detachment channel (130) between the support part (210) and the wall surface of the first card wall (310).
4. The wafer carrier according to claim 3, characterized in that, The width of the first card wall (310) and the second card wall (320) ranges from 100um to 5mm, and the height of the first card wall (310) and the second card wall (320) ranges from 25mm to 350mm.
5. The wafer carrier according to claim 1, characterized in that, The support (210) laterally supports the first wafer (a1) in the first receiving space (110) so that the second wafer (a2) is suspended in the second receiving space (120) and falls in the second receiving space (120) after being separated from the first wafer (a1).
6. The wafer carrier according to claim 2 or 5, characterized in that, The support portion (210) is provided with a raised separation structure (211), which can be sandwiched between the first wafer (a1) and the second wafer (a2).
7. The wafer carrier according to claim 2, characterized in that, The support portion (210) is provided with a protruding separation structure (211), which can be sandwiched between the first wafer (a1) and the second wafer (a2); The support portion (210) is provided with a limiting groove (212), which matches the edge of the first wafer (a1); the protrusion separation structure (211) is provided at one end of the limiting groove (212) near the detachment channel (130), or the protrusion separation structure (211) is provided at one end of the limiting groove (212) near the second accommodating space (120).
8. The wafer carrier according to claim 7, characterized in that, The width of the raised separation structure (211) is 20um to 200um, and the height of the raised separation structure (211) is no greater than 10mm; and / or, the width of the limiting groove (212) is no greater than 1mm; and / or, the width of the disengagement channel (130) is no greater than 1mm.
9. The wafer carrier according to claim 1, characterized in that, The number of wafer slots is multiple, and the multiple wafer slots are arranged along a first direction or along a second direction, wherein the first direction is perpendicular to the second direction.
10. A wafer debonding system, characterized in that, include: The wet cell (b1) and the wafer carrier as described in any one of claims 1-9; The wet process tank (b1) is used to hold the wet process liquid (b2); the wafer carrier is immersed in the wet process liquid (b2) and the wet process liquid (b2) fills the immersion chamber (100).