Integrated circuit packaging equipment

Abstract

The utility model belongs to the technical field of integrated circuit processing, particularly relates to integrated circuit packaging equipment, and aims to solve the problems that although packaging and dispensing can be carried out on an integrated circuit chip, manual shell packaging and pasting are still needed after dispensing, and use is inconvenient. The full-automatic dispensing machine is provided with an operation table and a multi-directional moving frame which are used in a matched mode, and a dispensing gun is installed on the multi-directional moving frame. During use, due to the design of the telescopic fixing assembly, automation of the pressing process of the packaging shell is achieved, the tedious step of manual shell packaging and pasting is avoided, the automation level of the whole packaging process is further improved, the detachable fixing assembly ensures that the fixing base is stably installed on the operation table, and the fixing base is not prone to falling off. And the fixing seat can be conveniently detached and replaced to adapt to integrated circuit chip bottom plates and packaging shells with different sizes and specifications, so that the flexibility and the universality of the equipment are enhanced.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit processing technology, and in particular to an integrated circuit packaging device. Background Technology

[0002] Dispensing machines play a crucial role in integrated circuit packaging equipment. Through precise dispensing technology, high-strength bonding effect, efficient automated production, and flexible coating capabilities, they provide reliable technical support for integrated circuit packaging. With the continuous development of technology, the application of dispensing machines in the field of integrated circuit packaging is becoming more and more widespread, injecting new vitality into the development of the integrated circuit industry.

[0003] A search revealed that the patent with publication number CN221413736U discloses an integrated circuit chip packaging device, which relates to the field of integrated circuit technology. Although the integrated circuit chip packaging device can perform encapsulation and dispensing on integrated circuit chips, manual encapsulation and pasting of the outer shell is still required after dispensing, which is inconvenient to use.

[0004] To address the aforementioned problems, this utility model document proposes an integrated circuit packaging device. Utility Model Content

[0005] This invention provides an integrated circuit packaging device that solves the problem that, although the existing technology can encapsulate integrated circuit chips with adhesive, manual encapsulation and bonding of the outer shell is still required after adhesive dispensing, which is inconvenient to use.

[0006] This utility model provides the following technical solution:

[0007] An integrated circuit packaging device, comprising:

[0008] A fully automatic dispensing machine, which is equipped with a matching operating table and a multi-directional moving frame, on which a dispensing gun is installed;

[0009] A detachable fixing component is provided on the operating table for fixing the matching integrated circuit chip base plate and packaging shell;

[0010] A telescopic fixing assembly, mounted on a multi-directional movable frame, is used to press the package housing onto the substrate of the integrated circuit chip after dispensing.

[0011] In one possible design, the detachable fixing component includes a fixing base disposed on the top of the operating table, with positioning blocks fixedly disposed at the four corners of the bottom of the fixing base, and a positioning slot for engaging the corresponding positioning blocks on the top of the operating table.

[0012] In one possible design, the top of the fixing base is provided with a first limiting groove for snapping into the integrated circuit chip base plate and a second limiting groove for snapping into the package shell. The edges of the first limiting groove and the second limiting groove are provided with recesses to facilitate the removal of the corresponding workpiece.

[0013] In one possible design, the telescopic fixing assembly includes an L-shaped mounting bracket fixedly disposed on one side of the multi-directional movable frame, an electric push rod fixedly mounted on the top of the inner wall of the L-shaped mounting bracket, and a suction cup plate fixedly disposed at the output end of the bottom of the electric push rod.

[0014] In one possible design, four pneumatic suction cups are mounted in a rectangular array on the bottom of the suction cup plate, and the pneumatic connectors on the top of the pneumatic suction cups extend to the top of the suction cup plate.

[0015] In one possible design, a guide rod is fixedly provided on one side of the suction cup plate to improve its movement stability, and a groove is provided at the bottom of the L-shaped mounting bracket for sliding connection of the top end of the guide rod.

[0016] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention.

[0017] The working principle and usage process of this technical solution are as follows:

[0018] When in use, place the integrated circuit chip substrate in the first limiting groove of the fixed seat on the operating table to ensure that the substrate is stable and does not move. Place the package shell in the second limiting groove of the fixed seat, and similarly ensure that the shell is stable. After starting the fully automatic dispensing machine, the dispensing gun on the multi-directional moving frame is controlled to perform precise dispensing operation on the integrated circuit chip substrate. The dispensing process can be completed automatically according to the preset program to ensure the uniformity and accuracy of dispensing.

[0019] After dispensing is completed, the suction cup plate is aligned with the package housing by controlling the movement of the multi-directional moving frame. The electric push rod of the telescopic fixing component is then activated to lower the suction cup plate. At this time, the pneumatic suction cup is connected to the air source through the pneumatic connector to generate suction force, which firmly adsorbs the package housing onto the bottom of the suction cup plate. As the electric push rod rises, it drives the suction cup plate and the adsorbed package housing to rise together until the multi-directional moving frame adjusts the suction cup plate to be aligned with the integrated circuit chip substrate. Then, the electric push rod pushes the package housing down, and the package housing comes into close contact with the integrated circuit chip substrate after dispensing. During the pressing process, the guide rod slides in the groove of the L-shaped mounting bracket to ensure that the movement of the suction cup plate is stable and precise.

[0020] After the pressing is completed, the suction of the pneumatic chuck is turned off, causing the package shell to separate from the chuck plate. The electric push rod returns to its initial position. Then, the packaged integrated circuit and the empty mounting base are taken out from the first and second limiting slots of the mounting base, respectively, to prepare for the next round of operations.

[0021] This utility model has the following beneficial effects:

[0022] The telescopic fixing component design in this invention automates the pressing process of the packaging shell, avoiding the tedious manual steps of sealing and pasting the shell, and further improving the automation level of the overall packaging process. The detachable fixing component, through the cooperation of positioning blocks and positioning slots, not only ensures the stable installation of the fixing base on the operating table, but also makes the fixing base easy to disassemble and replace, adapting to integrated circuit chip baseboards and packaging shells of different sizes and specifications, thus enhancing the flexibility and versatility of the equipment.

[0023] The recessed design in this invention makes it easier to remove the integrated circuit chip base plate and the package shell; the design of the slide groove and guide rod makes the movement of the telescopic fixing component more stable and reliable. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of an integrated circuit packaging device provided in an embodiment of the present utility model;

[0025] Figure 2 A schematic diagram of the separation structure of the operating table and the fixing base of an integrated circuit packaging device provided in this embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of a telescopic fixing component structure for an integrated circuit packaging device provided in an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the guide rod and slide groove separation structure of an integrated circuit packaging device provided in an embodiment of the present invention.

[0028] Reference numerals in the attached drawings: 1. Fully automatic dispensing machine; 2. Operating table; 3. Fixed base; 4. Multi-directional moving frame; 5. Dispensing gun; 6. First limiting groove; 7. Second limiting groove; 8. Lower recess; 9. Positioning block; 10. Positioning slot; 11. L-shaped mounting bracket; 12. Electric push rod; 13. Suction cup plate; 14. Pneumatic suction cup; 15. Pneumatic connector; 16. Guide rod; 17. Slide groove. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "opening", "upper", "middle", "length", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0031] To keep the following description of the embodiments of this utility model clear and concise, detailed descriptions of known functions and known components are omitted.

[0032] Example 1

[0033] Please refer to Figure 1-4 A packaging device, which mainly consists of a fully automatic dispensing machine 1, a detachable fixing component, a telescopic fixing component, and other components.

[0034] The core component of the equipment is the fully automatic dispensing machine 1, which is equipped with an operating table 2 and a multi-directional moving frame 4. The operating table 2 provides a stable platform for fixing and operating the integrated circuit chip substrate and the package shell. The multi-directional moving frame 4 is mounted on the fully automatic dispensing machine 1 and has the ability to move in multiple directions in order to precisely control the position of the dispensing gun 5.

[0035] On the top of the control panel 2, a detachable fixing component is provided, which mainly consists of a fixing base 3 and a positioning block 9. There is a positioning block 9 at each of the four bottom corners of the fixing base 3. These positioning blocks 9 can be engaged with the positioning slots 10 on the top of the control panel 2 to ensure the stable installation of the fixing base 3.

[0036] The top of the fixing base 3 is designed with a first limiting groove 6 and a second limiting groove 7, which are used to snap the integrated circuit chip base plate and the package shell respectively. In order to facilitate the removal of these workpieces, a recess 8 is provided at the edge of the first limiting groove 6 and the second limiting groove 7.

[0037] A telescopic fixing assembly is installed on the multi-directional moving frame 4 to press the package shell onto the integrated circuit chip substrate that has been glued. The main components of the telescopic fixing assembly include an L-shaped mounting bracket 11, an electric push rod 12, a suction cup plate 13, and a pneumatic suction cup 14. The L-shaped mounting bracket 11 is fixedly installed on one side of the multi-directional moving frame 4. An electric push rod 12 is installed on the top of its inner wall. The bottom output end of the electric push rod 12 is connected to the suction cup plate 13. Four pneumatic suction cups 14 are installed in a rectangular array at the bottom of the suction cup plate 13. The pneumatic connector 15 at the top of the pneumatic suction cup 14 passes through the top of the suction cup plate 13 and is connected to an air source to generate suction to fix the package shell.

[0038] In actual operation, the integrated circuit chip substrate and the package shell are first fixed on the operating table 2 by the detachable fixing component. Then, the integrated circuit chip substrate is glued by the glue gun 5 on the fully automatic dispensing machine 1 and the multi-directional moving frame 4. Next, the electric push rod 12 in the telescopic fixing component drives the suction cup plate 13 to descend, and the pneumatic suction cup 14 picks up the package shell. Then the electric push rod 12 rises and accurately presses the package shell onto the integrated circuit chip substrate. Finally, the packaged integrated circuit chip is taken out.

[0039] This application can be used for integrated circuit fabrication, or for other fields applicable to this application.

[0040] Example 2

[0041] Improvements based on Example 1:

[0042] An integrated circuit packaging device, which is used in the field of integrated circuit processing;

[0043] Please refer to Figure 3-4 In order to improve the stability of the suction cup plate 13 when it moves, a guide rod 16 is provided on one side of the suction cup plate 13, and a corresponding slide groove 17 is provided at the bottom of the L-shaped mounting bracket 11. The top of the guide rod 16 can slide in the slide groove 17.

[0044] However, as is well known to those skilled in the art, the working principles and wiring methods of the fully automatic dispensing machine 1, the electric push rod 12, and the pneumatic suction cup 14 are commonplace and are all conventional methods or common knowledge. They will not be described in detail here. Those skilled in the art can make any selections according to their needs or convenience.

[0045] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. In the absence of conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An integrated circuit packaging device, characterized in that, include: The fully automatic dispensing machine (1) is equipped with a matching operating table (2) and a multi-directional moving frame (4), and a dispensing gun (5) is installed on the multi-directional moving frame (4). A detachable fixing component is provided on the operating table (2) for fixing the matching integrated circuit chip base plate and packaging shell; A telescopic fixing component is mounted on a multi-directional moving frame (4) for pressing the package shell onto the substrate of the integrated circuit chip after dispensing.

2. The integrated circuit packaging equipment according to claim 1, characterized in that, The detachable fixing component includes a fixing base (3) set on the top of the operating table (2), and positioning blocks (9) are fixedly set at the four corners of the bottom of the fixing base (3). The top of the operating table (2) is provided with a positioning slot (10) for engaging the corresponding positioning block (9).

3. The integrated circuit packaging equipment according to claim 2, characterized in that, The top of the fixed base (3) is provided with a first limiting groove (6) for snapping on the integrated circuit chip base plate and a second limiting groove (7) for snapping on the package shell. The edges of the first limiting groove (6) and the second limiting groove (7) are provided with recesses (8) to facilitate the removal of the corresponding workpiece.

4. The integrated circuit packaging equipment according to claim 1, characterized in that, The telescopic fixing assembly includes an L-shaped mounting bracket (11) fixedly installed on one side of the multi-directional movable frame (4). An electric push rod (12) is fixedly installed on the top of the inner wall of the L-shaped mounting bracket (11), and a suction cup plate (13) is fixedly installed at the output end of the bottom of the electric push rod (12).

5. An integrated circuit packaging device according to claim 4, characterized in that, The bottom of the suction cup plate (13) is equipped with four pneumatic suction cups (14) in a rectangular array, and the pneumatic connector (15) at the top of the pneumatic suction cup (14) extends through to the top of the suction cup plate (13).

6. An integrated circuit packaging device according to claim 4, characterized in that, A guide rod (16) for improving its movement stability is fixedly provided on one side of the suction cup plate (13), and a groove (17) for sliding connection of the top end of the guide rod (16) is provided at the bottom of the L-shaped mounting bracket (11).

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