Wafer heating and cooling device

Abstract

The utility model relates to a wafer heating and cooling device, which comprises a base, a cooling assembly, a heating assembly and a heat insulation assembly, and is characterized in that the cooling assembly comprises a liquid cooling disc, and the liquid cooling disc is mounted on the base and used for supporting and cooling a wafer; the heating assembly comprises a heating disc, and the heating disc is installed on the base and used for supporting and heating a wafer; one of the heating disc and the liquid cooling disc is positioned above the other one; the heat insulation assembly is movably connected to the base and can be arranged on or separated from the heating disc in a sleeving mode. Taking the wafer heating and cooling device applied to preheating treatment before wafer laser annealing and cooling treatment after wafer laser annealing as an example, according to the wafer heating and cooling device provided by the utility model, the cooling assembly and the heating assembly are integrated on the same base and are arranged up and down; the time for transferring the wafer from the heating assembly to the cooling assembly is shortened, so that the annealing efficiency of the wafer is improved, and the probability that the wafer is polluted is reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and more specifically, to a wafer heating and cooling device. Background Technology

[0002] Annealing is a crucial step in semiconductor integrated circuit manufacturing. Wafer annealing can repair lattice defects and improve the electrical conductivity and properties of materials. Currently, wafer annealing commonly employs advanced laser annealing equipment. Laser annealing uses a high-energy pulsed laser to irradiate the wafer surface, rapidly heating and then quickly cooling it to achieve rapid annealing. However, in some wafer front-side annealing processes, uneven surface layer thickness after etching affects the uniformity of the laser annealing process. To address this issue, a common method is to heat the wafer to a certain temperature before laser annealing to improve uniformity. However, for processes requiring heating, prolonged heating and cooling times before and after laser annealing can reduce the efficiency of the wafer annealing process.

[0003] In the existing technology, heating and cooling of wafers are accomplished using heating devices and cooling devices respectively. Both devices occupy a large area. When a robotic arm transfers the wafer from the heating device to the cooling device, the following technical problems still exist: due to the long wafer transfer distance and long wafer transfer time, the wafer heating and cooling time is long, which in turn leads to low wafer annealing efficiency. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a wafer heating and cooling device that can shorten the wafer transfer time and improve the wafer annealing efficiency.

[0005] This utility model provides a wafer heating and cooling device, comprising:

[0006] Base;

[0007] A cooling assembly, including a liquid cooling plate mounted on the base, is used to support and cool the wafer;

[0008] A heating assembly includes a heating plate mounted on the base for supporting and heating a wafer; one of the heating plate and the liquid cooling plate is positioned above the other; and...

[0009] The heat insulation component is movably connected to the base and can be fitted onto or detached from the heating plate.

[0010] Optionally, the heating plate is located above the liquid cooling plate; the heat insulation assembly includes a heat insulation top plate and a heat insulation cover, the upper end of the heat insulation cover is fixed to the heat insulation top plate and the lower end of the heat insulation cover is open; the heat insulation top plate is pivotally connected to the base around a horizontal axis, and the heat insulation cover can be fitted onto or detached from the heating plate by flipping; or, the heat insulation top plate is slidably connected to the base in a vertical direction, and the heat insulation cover can be fitted onto or detached from the heating plate by moving up and down;

[0011] And / or, the base is fixedly provided with a first temperature sensor, close to the liquid cooling plate, for detecting the temperature of the wafer;

[0012] And / or, the base is fixed with a second temperature sensor near the heating plate for detecting the temperature of the wafer.

[0013] Optionally, the heat-insulating top plate has a liquid cooling channel and an inlet connector and an outlet connector respectively connected to the liquid cooling channel;

[0014] And / or, the heat insulation cover is a multi-layer heat insulation cover.

[0015] Optionally, the heat-insulating top plate is provided with a first leakage groove, which is located below the liquid inlet and the liquid outlet; the first leakage groove is provided with a leakage detection sensor for detecting whether there is liquid leakage at the liquid inlet and the liquid outlet.

[0016] And / or, the base is fixedly provided with a flip-up limiting plate, the flip-up limiting plate has an arc-shaped limiting groove, the heat-insulating top plate is provided with a limiting post, and the limiting post can be slidably connected to the arc-shaped limiting groove.

[0017] Optionally, the cooling assembly further includes a first base, which is mounted on the base, and the liquid cooling plate is mounted on the first base. The liquid cooling plate has a first liquid inlet and a first liquid outlet.

[0018] And / or, the heating assembly further includes a second base, which is mounted on the base, and the heating plate is mounted on the second base.

[0019] Optionally, the cooling assembly further includes a first lifting drive and a first set of lifting pins. The first lifting drive is mounted on the first base and is connected to the first set of lifting pins for driving the first set of lifting pins to move up and down relative to the liquid cooling plate to support the wafer.

[0020] Optionally, the first base includes a first lower support plate, a first upper support plate, and a first vertical support portion. The first lower support plate is mounted on the base, and the first vertical support portion is used to connect the first upper support plate and the first lower support plate. The liquid cooling plate is mounted above the first upper support plate. The first lifting drive component is mounted between the first upper support plate and the first lower support plate.

[0021] And / or, the edge of the liquid cooling plate is provided with a first groove, the first groove having at least 3 and spaced apart; the first set of lifting pins includes at least 3 first lifting pins, the position and number of the first lifting pins corresponding one-to-one with the first groove; the first lifting pins pass through the first groove.

[0022] And / or, the first vertical support includes a first vertical support rod and a first leveling nut, the lower end of the first vertical support rod is fixed to the first lower support plate, the first leveling nut is threaded to the upper end of the first vertical support rod and can abut against the lower end face of the first upper support plate; the upper end of the first vertical support rod can be slidably connected to the first upper support plate.

[0023] Optionally, a heat insulation ring is fitted around the outer side of the heating plate, with the lower end of the heat insulation ring mounted on the second base and the upper end open; the heat insulation component can be fitted onto or detached from the heat insulation ring.

[0024] And / or, the second base has a cooling channel and a second liquid inlet and a second liquid outlet communicating with the cooling channel.

[0025] Optionally, the heating assembly further includes a second lifting drive and a second set of lifting pins. The second lifting drive is mounted on the second base and is connected to the second set of lifting pins for driving the second set of lifting pins to move up and down relative to the heating plate to support the wafer.

[0026] And / or, the heat insulation ring is a multi-layer heat insulation ring.

[0027] Optionally, the second base includes a second lower support plate, a second upper support plate, and a second vertical support portion. The second lower support plate is mounted on the base, and the second vertical support portion is used to connect the second upper support plate and the second lower support plate. The heating plate is mounted above the second upper support plate, and the cooling channel is located on the second upper support plate.

[0028] And / or, the edge of the heating plate is provided with a second groove, the second groove having at least 3 and spaced apart; the second set of lifting pins includes at least 3 second lifting pins, the position and number of the second lifting pins corresponding one-to-one with the second groove; the second lifting pins pass through the second groove and the heat insulation ring;

[0029] And / or, the second upper support plate is provided with a second leakage groove, which is located below the second liquid inlet and the second liquid outlet; the second leakage groove is provided with a leakage detection sensor for detecting whether there is liquid leakage at the second liquid inlet and the second liquid outlet;

[0030] And / or, the second vertical support includes a second vertical support rod and a second leveling nut, the lower end of the second vertical support rod is fixed to the second lower support plate, the second leveling nut is threaded to the upper end of the second vertical support rod and can abut against the lower end face of the second upper support plate; the upper end of the second vertical support rod can be slidably connected to the second upper support plate.

[0031] The wafer heating and cooling device provided by this utility model has at least the following beneficial technical effects:

[0032] Taking the use of this wafer heating and cooling device for preheating before laser annealing and cooling after laser annealing as an example, the wafer heating and cooling device provided by this utility model integrates the cooling component and the heating component on the same base and arranges them vertically. On the one hand, it shortens the transfer time of the wafer from the heating component to the cooling component, thereby improving the annealing efficiency of the wafer and reducing the probability of wafer contamination. On the other hand, it reduces the floor space occupied by the heating and cooling device. In addition, by installing a heat insulation component on the heating plate, the heat preservation effect during heating is improved, the heat loss of the wafer during heating is reduced, the wafer heating efficiency is improved, and the energy consumption is reduced. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the installation position of a wafer heating and cooling device provided in an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of the first state structure of a wafer heating and cooling device provided in an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of the second state structure of a wafer heating and cooling device provided in an embodiment of the present invention;

[0036] Figure 4 A partial structural diagram of a heat insulation component in a wafer heating and cooling device provided in this embodiment of the present invention;

[0037] Figure 5 A partial structural diagram of the cooling component in a wafer heating and cooling device provided in this embodiment of the present invention;

[0038] Figure 6 This is a partial structural diagram of the heating component in a wafer heating and cooling device provided in an embodiment of the present invention.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Wafer heating and cooling device;

[0041] 10. Base; 101. First temperature sensor; 102. Second temperature sensor;

[0042] 20. Cooling assembly; 210. First base; 211. First lower support plate; 212. First upper support plate; 213. First vertical support part; 220. Liquid cooling plate; 221. First groove; 222. First liquid inlet port; 223. First liquid outlet port; 230. First lifting pin;

[0043] 30. Heating assembly; 310. Second base; 311. Second upper support plate; 3111. Second liquid inlet; 3112. Second liquid outlet; 312. Second lower support plate; 313. Second vertical support; 314. Second leakage groove; 320. Heating plate; 321. Second groove; 330. Heat insulation ring; 340. Second lifting pin;

[0044] 40. Thermal insulation component; 410. Thermal insulation top plate; 411. Liquid inlet connector; 412. Liquid outlet connector; 413. First leakage groove; 414. Hinge; 415. Flip-over limiting plate; 4151. Arc-shaped limiting groove; 420. Thermal insulation cover. Detailed Implementation

[0045] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the following description is provided in conjunction with the appendix. Figure 1-6 Specific embodiments of this utility model will be described in detail.

[0046] In this utility model, the terms "connection" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure.

[0047] In this utility model, the terms "inner", "outer", "upper", "lower", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0048] This utility model embodiment provides a wafer heating and cooling device 1, see attached drawing. Figure 2 The wafer heating and cooling device 1 includes a base 10, a cooling assembly 20, and a heating assembly 30. The cooling assembly 20 includes a liquid cooling plate 220, which is mounted on the base 10 and used to support and cool the wafer. The heating assembly 30 includes a heating plate 320, which is mounted on the base 10 and used to support and heat the wafer. One of the heating plate 320 and the liquid cooling plate 220 is located above the other. A heat insulation assembly 40 is movably connected to the base 10 and can be fitted onto or detached from the heating plate 320. It should be noted that the heat insulation assembly 40 can be rotatably connected to the base 10 or slidably connected to the base 10.

[0049] This utility model provides a wafer heating and cooling device 1, which is applied to the preheating treatment before wafer laser annealing and the cooling treatment after wafer laser annealing, as shown in the attached figure. Figure 1 As shown, it can be installed in the Equipment Front End Module (EFEM) of a laser annealing equipment. This embodiment of the invention provides a wafer heating and cooling device 1, which integrates the cooling component 20 and the heating component 30 onto the same base 10 and arranges them vertically. On one hand, this shortens the distance the wafer travels from the heating component 30 to the cooling component 20, i.e., it shortens the transfer time, thereby improving the annealing efficiency of the wafer and reducing the probability of wafer contamination, thus increasing the wafer yield. On the other hand, it reduces the floor space occupied by the heating and cooling device. Furthermore, by installing a heat insulation component 40 on the heating plate 320, the heat preservation effect during heating is improved, reducing heat loss during wafer heating, improving wafer heating efficiency, and reducing energy consumption.

[0050] In this embodiment of the utility model, see appendix. Figures 2-4 The heating plate 320 is located above the liquid cooling plate 220. The heat insulation assembly 40 includes a heat insulation top plate 410 and a heat insulation cover 420. The upper end of the heat insulation cover 420 is fixed to the heat insulation top plate 410, and the lower end of the heat insulation cover 420 is open. The heat insulation cover 420 can be fitted onto or detached from the heating plate 320. This configuration allows the movable heat insulation cover 420 to maintain the heating space of the heating plate 320 and facilitates the maintenance of the heating assembly 30. The heat insulation cover 420 is movably connected to the base 10, and can be connected to the base 10 by rotation or sliding connection, as detailed below:

[0051] For example, as shown in the appendix Figure 3 and Figure 4As shown, the heat insulation top plate 410 is pivotally connected to the base 10 around the horizontal axis, and can be flipped to allow the heat insulation cover 420 to be fitted onto or detached from the heating plate 320. With this configuration, the heat insulation top plate 410 causes the heat insulation cover 420 to flip and fit onto the heating plate 320, thus maintaining the temperature of the heating space of the heating plate 320; the heat insulation top plate 410 causes the heat insulation cover 420 to detach from the heating plate 320, facilitating the placement and removal of wafers.

[0052] For example, the heat insulation top plate 410 is slidably connected to the base 10 in the vertical direction, and can move up and down to put the heat insulation cover 420 onto or detach it from the heating plate 320. With this configuration, the heat insulation top plate 410 drives the heat insulation cover to move up and down to put it onto the heating plate 320, thereby keeping the heating space of the heating plate warm; the heat insulation top plate 410 drives the heat insulation cover 420 to move up and down to detach it from the heating plate 320, making it easier to pick up and put down the wafer.

[0053] In this embodiment of the utility model, see appendix. Figure 3 A first temperature sensor 101 is fixedly mounted on the base 10, close to the liquid cooling plate 220, for detecting the temperature of the wafer. This configuration enables real-time detection of the wafer surface temperature.

[0054] In this embodiment of the utility model, see appendix. Figure 3 A second temperature sensor 102 is fixedly mounted on the base 10, near the heating plate 320, for detecting the temperature of the wafer. This configuration enables real-time detection of the wafer surface temperature.

[0055] In this embodiment of the utility model, see appendix. Figure 4 The heat-insulating top plate 410 has a liquid cooling channel and an inlet connector 411 and an outlet connector 412 respectively connected to the liquid cooling channel.

[0056] In this embodiment of the invention, the heat insulation cover 420 is a multi-layer heat insulation cover. For example, the heat insulation cover 420 is a two-layer heat insulation cover; or, for example, a three-layer heat insulation cover or other layers of heat insulation cover. This configuration improves the heat insulation effect.

[0057] In this embodiment of the utility model, see appendix. Figure 4 The heat-insulating top plate 410 is provided with a first leakage channel 413, which is located below the liquid inlet connector 411 and the liquid outlet connector 412. A leakage detection sensor is installed inside the first leakage channel 413 to detect whether there is liquid leakage at the liquid inlet connector 411 and the liquid outlet connector 412. This design allows the first leakage channel 413 to collect leaked liquid, preventing it from flowing directly onto the ground or into the surrounding environment, thus avoiding damage to the equipment and the surrounding environment. The leakage detection sensor is used to detect liquid leaks.

[0058] In this embodiment of the present invention, regarding the case where the heat-insulating top plate 410 is pivotally connected to the base 10 around a horizontal axis, please refer to the attached document. Figure 4 The base 10 is fixedly provided with a flip-up limiting plate 415, which has an arc-shaped limiting groove 4151. The heat-insulating top plate 410 is provided with a limiting post, which can be slidably connected to the arc-shaped limiting groove 4151. This arrangement limits the flip-up angle of the heat-insulating top plate 410.

[0059] In this embodiment of the utility model, see appendix. Figure 5 The cooling assembly 20 also includes a first base 210, which is mounted on the base 10. The liquid cooling plate 220 is mounted on the first base 210 and has a first liquid inlet 222 and a first liquid outlet 223.

[0060] In this embodiment of the utility model, see appendix. Figure 6 The heating assembly 30 also includes a second base 310, which is mounted on the base 10, and the heating plate 320 is mounted on the second base 310.

[0061] In this embodiment of the invention, the cooling assembly 20 further includes a first lifting drive (not shown in the figure) and a first set of lifting pins. The first lifting drive is mounted on the first base 210 and is connected to the first set of lifting pins, used to drive the first set of lifting pins to move up and down relative to the liquid cooling plate 220 to support the wafer. It should be noted that during the cooling process, the first set of lifting pins descends, and the wafer is placed on the liquid cooling plate 220; after cooling, the first set of lifting pins rises and supports the wafer. This configuration allows the vertically movable first set of lifting pins to support the wafer and cooperate with the front-end module of the laser annealing equipment for wafer transfer.

[0062] In this embodiment of the utility model, see appendix. Figure 5 The first base 210 includes a first lower support plate 211, a first upper support plate 212, and a first vertical support portion 213. The first lower support plate 211 is mounted on the base 10. The first vertical support portion 213 connects the first upper support plate 212 and the first lower support plate 211; that is, the lower end of the first vertical support portion 213 is connected to the first lower support plate 211, and the upper end of the first vertical support portion 213 is connected to the first upper support plate 212. The liquid cooling plate 220 is mounted above the first upper support plate 212. The first lifting drive component is mounted between the first upper support plate 212 and the first lower support plate 211. It should be noted that the upper end of the first set of lifting pins passes through the first upper support plate 212, and can rise above the upper surface of the liquid cooling plate 220 to support the wafer, and can also descend below the upper surface of the liquid cooling plate 220 to remove the wafer. This configuration, with the first upper support plate 212 and the first lower support plate 211 spaced apart, provides installation space for the first lifting drive component.

[0063] In this embodiment of the utility model, see appendix. Figure 5The liquid cooling disk 220 has at least three first grooves 221 spaced apart on its edge. A first set of lifting pins includes at least three first lifting pins 230, each corresponding to a specific position and number of the first grooves 221. The first lifting pins 230 pass through the first grooves 221. For example, as shown in the attached figure, the liquid cooling disk 220 has three first grooves 221 on its edge, and the first set of lifting pins includes three first lifting pins 230, each corresponding to a specific position of the first groove 221. Alternatively, the liquid cooling disk 220 may have more than three other first grooves on its edge, and the first set of lifting pins may include more than three other first lifting pins 230. This arrangement provides support for the wafer.

[0064] In this embodiment of the invention, the first vertical support 213 includes a first vertical support rod and a first leveling nut. The lower end of the first vertical support rod is fixed to the first lower support plate 211, and the first leveling nut is threaded to the upper end of the first vertical support rod and can abut against the lower end face of the first upper support plate 212. The upper end of the first vertical support rod can be slidably connected to the first upper support plate 212. This configuration allows for adjustment of the levelness of the first upper support plate 211, making the first upper support plate 211 parallel to the plane containing the upper ends of the first set of lifting pins.

[0065] In this embodiment of the utility model, see appendix. Figure 6 A heat insulation ring 330 is fitted around the outer side of the heating plate 320. The lower end of the heat insulation ring 330 is installed on the second base 310 and the upper end is open. The heat insulation component 40 can be fitted onto or detached from the heat insulation ring 330. With this configuration, the heat insulation ring 330 can reduce the heat radiation from the heating plate 320 to the surrounding space.

[0066] In this embodiment of the utility model, see appendix. Figure 6 The second base 310 has a cooling channel and a second liquid inlet 3111 and a second liquid outlet 3112 connected to the cooling channel. This configuration reduces the heat transfer from the heating plate 320 to the cooling component 20 below, ensuring that the heating function of the heating component 30 and the cooling function of the cooling component 20 do not interfere with each other. This allows the heating component 30 and the cooling component 20 to process different wafers simultaneously, thereby improving the annealing efficiency of the wafers.

[0067] In this embodiment of the invention, the heating assembly 30 further includes a second lifting drive component and a second set of lifting pins. The second lifting drive component is mounted on the second base 310 and is connected to the second set of lifting pins for driving the second set of lifting pins to move up and down relative to the heating plate 320 to support the wafer. It should be noted that during the heating process, the second set of lifting pins descends, and the wafer is placed on the heating plate 320; after heating, the second set of lifting pins rises and supports the wafer. This configuration allows the vertically movable second set of lifting pins to support the wafer and cooperate with the front-end module of the laser annealing equipment for wafer transfer.

[0068] In this embodiment of the invention, the heat insulation ring 330 is a multi-layered heat insulation ring. For example, the heat insulation ring 330 is a two-layered heat insulation ring; or, for another example, a three-layered heat insulation ring or a other type of heat insulation ring. This configuration improves the heat insulation effect.

[0069] In this embodiment of the utility model, see appendix. Figure 6 The second base 310 includes a second lower support plate 312, a second upper support plate 311, and a second vertical support portion 313. The second lower support plate 312 is mounted on the base 10. The second vertical support portion 313 connects the second upper support plate 311 and the second lower support plate 312; that is, the lower end of the second vertical support portion 313 connects to the second lower support plate 312, and the upper end of the second vertical support portion 313 connects to the second upper support plate 311. The heating plate 320 is mounted above the second upper support plate 311. A cooling channel is located on the second upper support plate 311. A second lifting drive component is mounted between the second upper support plate 311 and the second lower support plate 312. It should be noted that the upper end of the second set of lifting pins passes through the second upper support plate 311, allowing it to rise above the upper surface of the heating plate 320 to support the wafer, and also to descend below the upper surface of the heating plate 320 to remove the wafer. This configuration, with the second upper support plate 311 and the second lower support plate 312 spaced apart, provides installation space for the second lifting drive component.

[0070] In this embodiment of the utility model, see appendix. Figure 6The heating plate 320 has at least three second grooves 321 at its edge, spaced apart. A second set of lifting pins includes at least three second lifting pins 340, each corresponding to a different second groove 321 in position and number. The second lifting pins 340 pass through the second grooves 321 and the heat insulation ring 330. For example, as shown in the attached diagram, the heating plate 320 has three second grooves 321 at its edge, and the second set of lifting pins includes three second lifting pins 230, each corresponding to a different second groove 321. Alternatively, the heating plate 320 may have more than three other second grooves 321 at its edge, and the second set of lifting pins may include more than three other second lifting pins 340. This arrangement provides support for the wafer.

[0071] In this embodiment of the utility model, see appendix. Figure 6 The second upper support plate 311 is provided with a second leakage tank 314, which is located below the second liquid inlet 3111 and the second liquid outlet 3112. A leakage detection sensor is installed inside the second leakage tank 314 to detect whether there is liquid leakage at the second liquid inlet 3111 and the second liquid outlet 3112. This configuration allows the second leakage tank 314 to collect leaked liquid, preventing it from flowing directly onto the ground or into the surrounding environment, thus avoiding damage to the equipment and the surrounding environment. The leakage detection sensor is also included to detect any liquid leakage.

[0072] In this embodiment of the invention, the second vertical support 313 includes a second vertical support rod and a second leveling nut. The lower end of the second vertical support rod is fixed to the second lower support plate 312, and the second leveling nut is threaded to the upper end of the second vertical support rod and can abut against the lower end face of the second upper support plate 311. The upper end of the second vertical support rod can be slidably connected to the second upper support plate 311. This configuration allows for adjustment of the levelness of the second upper support plate 311, making the second upper support plate 311 parallel to the plane containing the upper ends of the second set of lifting pins.

[0073] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer heating and cooling device, characterized in that, include: Base (10); A cooling assembly (20) includes a liquid cooling plate (220) mounted on the base (10) for supporting and cooling the wafer; A heating assembly (30) includes a heating plate (320) mounted on the base (10) for supporting and heating the wafer; one of the heating plate (320) and the liquid cooling plate (220) is located above the other; as well as, The heat insulation component (40) is movably connected to the base (10) and can be fitted onto or detached from the heating plate (320).

2. The wafer heating and cooling apparatus according to claim 1, characterized in that, The heating plate (320) is located above the liquid cooling plate (220); the heat insulation assembly (40) includes a heat insulation top plate (410) and a heat insulation cover (420), the upper end of the heat insulation cover (420) is fixed to the heat insulation top plate (410) and the lower end of the heat insulation cover (420) is open; the heat insulation top plate (410) is pivotally connected to the base (10) around a horizontal axis, and the heat insulation cover (420) can be put on or taken off from the heating plate (320) by flipping; or, the heat insulation top plate (410) is slidably connected to the base (10) in the vertical direction, and the heat insulation cover (420) can be put on or taken off from the heating plate (320) by moving up and down; And / or, the base (10) is fixedly provided with a first temperature sensor (101) near the liquid cooling plate (220) for detecting the temperature of the wafer; And / or, the base (10) is fixed with a second temperature sensor (102) near the heating plate (320) for detecting the temperature of the wafer.

3. The wafer heating and cooling apparatus according to claim 2, characterized in that, The heat-insulating top plate (410) has a liquid cooling channel and a liquid inlet connector (411) and a liquid outlet connector (412) respectively connected to the liquid cooling channel; And / or, the heat shield (420) is a multi-layer heat shield.

4. The wafer heating and cooling apparatus according to claim 3, characterized in that, The heat-insulating top plate (410) is provided with a first leakage groove (413), which is located below the liquid inlet connector (411) and the liquid outlet connector (412); the first leakage groove (413) is provided with a leakage detection sensor for detecting whether there is liquid leakage in the liquid inlet connector (411) and the liquid outlet connector (412); And / or, the base (10) is fixedly provided with a flip-up limiting plate (415), the flip-up limiting plate (415) has an arc-shaped limiting groove (4151), the heat-insulating top plate (410) is provided with a limiting post, the limiting post can be slidably connected to the arc-shaped limiting groove (4151).

5. The wafer heating and cooling apparatus according to any one of claims 1-4, characterized in that, The cooling assembly (20) further includes a first base (210), which is mounted on the base (10), and the liquid cooling plate (220) is mounted on the first base (210). The liquid cooling plate (220) has a first liquid inlet (222) and a first liquid outlet (223). And / or, the heating assembly (30) further includes a second base (310) mounted on the base (10), and the heating plate (320) mounted on the second base (310).

6. The wafer heating and cooling apparatus according to claim 5, characterized in that, The cooling assembly (20) further includes a first lifting drive and a first set of lifting pins. The first lifting drive is mounted on the first base (210) and is connected to the first set of lifting pins for driving the first set of lifting pins to move up and down relative to the liquid cooling plate (220) to support the wafer.

7. The wafer heating and cooling apparatus according to claim 6, characterized in that, The first base (210) includes a first lower support plate (211), a first upper support plate (212), and a first vertical support part (213). The first lower support plate (211) is installed on the base (10), and the first vertical support part (213) is used to connect the first upper support plate (212) and the first lower support plate (211). The liquid cooling plate (220) is installed above the first upper support plate (212). The first lifting drive is installed between the first upper support plate (212) and the first lower support plate (211). And / or, the edge of the liquid cooling plate (220) is provided with a first groove (221), the first groove (221) has at least 3 and is spaced apart; the first set of lifting pins includes at least 3 first lifting pins (230), the position and number of the first lifting pins (230) correspond one-to-one with the first grooves (221); the first lifting pins (230) pass through the first grooves (221); And / or, the first vertical support part (213) includes a first vertical support rod and a first leveling nut, the lower end of the first vertical support rod is fixed to the first lower support plate (211), the first leveling nut is threaded to the upper end of the first vertical support rod and can abut against the lower end face of the first upper support plate (212); the upper end of the first vertical support rod can be slidably connected to the first upper support plate (212).

8. The wafer heating and cooling apparatus according to claim 5, characterized in that, A heat insulation ring (330) is fitted on the outside of the heating plate (320). The lower end of the heat insulation ring (330) is installed on the second base (310) and the upper end is open. The heat insulation component (40) can be fitted onto or detached from the heat insulation ring (330). And / or, the second base (310) has a cooling channel and a second liquid inlet (3111) and a second liquid outlet (3112) communicating with the cooling channel.

9. The wafer heating and cooling apparatus according to claim 8, characterized in that, The heating assembly (30) further includes a second lifting drive and a second set of lifting pins. The second lifting drive is mounted on the second base (310) and is connected to the second set of lifting pins for driving the second set of lifting pins to move up and down relative to the heating plate (320) to support the wafer. And / or, the heat insulation ring (330) is a multi-layer heat insulation ring.

10. The wafer heating and cooling apparatus according to claim 9, characterized in that, The second base (310) includes a second lower support plate (312), a second upper support plate (311), and a second vertical support part (313). The second lower support plate (312) is installed on the base (10), and the second vertical support part (313) is used to connect the second upper support plate (311) and the second lower support plate (312). The heating plate (320) is installed above the second upper support plate (311). The cooling channel is located on the second upper support plate (311). The second lifting drive is installed between the second upper support plate (311) and the second lower support plate (312). And / or, the edge of the heating plate (320) is provided with a second groove (321), the second groove (321) having at least 3 and spaced apart; the second set of lifting pins includes at least 3 second lifting pins (340), the position and number of the second lifting pins (340) corresponding one-to-one with the second groove (321); the second lifting pins (340) pass through the second groove (321) and the heat insulation ring (330); And / or, the second upper support plate (311) is provided with a second leakage groove (314), the second leakage groove (314) is located below the second liquid inlet (3111) and the second liquid outlet (3112); the second leakage groove (314) is provided with a leakage detection sensor for detecting whether there is liquid leakage at the second liquid inlet (3111) and the second liquid outlet (3112); And / or, the second vertical support part (313) includes a second vertical support rod and a second leveling nut, the lower end of the second vertical support rod is fixed to the second lower support plate (312), the second leveling nut is threaded to the upper end of the second vertical support rod and can abut against the lower end face of the second upper support plate (311); the upper end of the second vertical support rod can be slidably connected to the second upper support plate (311).

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