Wafer bearing mechanism and die bonding device

Abstract

The utility model discloses a wafer bearing mechanism and a wafer fixing device, the wafer bearing mechanism comprises a bearing part, a moving seat and a pushing part, the bearing part comprises a first platform used for bearing a wafer, and the first platform is provided with a plurality of guide structures and a vacuum channel; the moving seat comprises a connecting piece and a second platform, the connecting piece is used for connecting the driving mechanism, and the second platform is parallel to the first platform; the pushing piece is used for pushing the chip, and the pushing piece is magnetically coupled with the second platform; wherein the bearing piece adsorbs the crystal film to the first platform through the vacuum channel, the driving mechanism drives the second platform to approach the first platform through the moving seat, and the pushing piece extends out relative to the first platform to drive the chip to be separated from at least part of the crystal film. According to the embodiment of the invention, the pushing piece is fixed on the second platform through magnetic attraction, and the driving mechanism drives the pushing piece to extend or retract relative to the first platform through the moving seat, so that the stripping of the chip and part of the crystal film is realized, and the chip is easier to attract.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, and in particular relates to a wafer carrier mechanism and a die bonding device. Background Technology

[0002] In semiconductor packaging technology, die bonding refers to the process of grasping the chip and separating it from the die film, and then fixing the chip onto a bracket or substrate.

[0003] However, during the die bonding process, because the chip contacts the crystal film through the entire surface, there is a strong adhesion that makes it difficult to peel off, which can easily lead to defects such as chip breakage and affect product yield. Summary of the Invention

[0004] This application provides a wafer carrier mechanism and a die bonding device. The wafer carrier mechanism can adsorb the crystalline film through the carrier and then push the chip relative to part of the crystalline film through the pusher, thereby reducing the contact area between the chip and the wafer and reducing the difficulty of separation.

[0005] In a first aspect, embodiments of this application provide a wafer carrier mechanism, which includes a carrier, a motion seat, and a pusher. The carrier includes a first platform for carrying a wafer, and the first platform has multiple guide structures and a vacuum channel. The motion seat includes a connector and a second platform. The connector is used to connect a driving mechanism, and the second platform is arranged parallel to the first platform. The pusher is used to push the chip, and the pusher is magnetically coupled to the second platform. The carrier adsorbs the wafer onto the first platform through the vacuum channel, and the driving mechanism drives the second platform to move closer to the first platform through the motion seat. The pusher extends relative to the first platform, causing the chip to separate from at least a portion of the wafer.

[0006] In some embodiments, the motion seat also includes a limiting platform fixed relative to the second platform, the limiting platform having multiple limiting holes, and the pusher being arranged through the limiting holes.

[0007] In some embodiments, a plurality of limiting holes are arranged in an array, and the plurality of limiting holes are arranged in a one-to-one correspondence with a plurality of guide structures, and the number of limiting holes is greater than the number of pushers.

[0008] In some embodiments, the limiting platform is provided with a reference mark, which includes a first side and a second side that are perpendicular to each other. Among the multiple limiting holes arranged in an array, some limiting holes are arranged parallel to the first side and some limiting holes are arranged parallel to the second side.

[0009] In some embodiments, the carrier also includes a closure portion, which is always covered outside the second platform as the moving seat moves closer to or away from the carrier, forming a vacuum cavity between the first platform, the closure portion, and the second platform.

[0010] In some embodiments, the motion seat further includes a spacer, a limiting platform is fixedly connected to the spacer, a second platform is fixedly connected to the spacer, and the spacer has a first window communicating with a vacuum channel.

[0011] In some embodiments, the pusher is made of metal, the second platform is made of magnetic material, and the spacer is made of non-metallic material.

[0012] In some embodiments, the vacuum channel includes a first vacuum path arranged circumferentially along the first platform, the first vacuum path being in communication with the motion seat.

[0013] In some embodiments, the vacuum channel further includes a second vacuum path extending along the thickness direction of the first platform, and the second vacuum path is located between the guide structure and the first vacuum path along the radial direction of the first platform.

[0014] Secondly, embodiments of this application provide a die bonding apparatus, including a machine base, a drive mechanism, and a wafer carrier mechanism provided in any of the foregoing embodiments, wherein the carrier is fixedly connected to the machine base; and the drive mechanism is fixedly connected to the motion seat.

[0015] The wafer carrier mechanism of this application uses a carrier to adsorb and fix the portion of the wafer connecting to the vacuum channel onto a first platform. Then, a moving seat drives a pusher to extend relative to the first platform, pushing the chip away from the first platform, thereby peeling the chip off from part of the wafer, reducing the contact area and adhesion between the chip and the wafer, and simplifying chip pick-up. The pusher is magnetically coupled to a second platform, facilitating adjustment of the relative fixation strength between the pusher and the second platform. The second platform is parallel to the first platform, giving the pusher a pushing surface parallel to the first platform, reducing the risk of chip breakage due to axial movement of the pusher. Attached Figure Description

[0016] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0017] Figure 1 This is a schematic diagram of the wafer carrier mechanism in some embodiments of this application;

[0018] Figure 2 for Figure 1 The diagram shows the structural schematic of the carrier component in the wafer carrier mechanism.

[0019] Figure 3 for Figure 1 The diagram shows the structure of the motion seat in the wafer carrier mechanism.

[0020] Figure 4 for Figure 3 A schematic diagram of the motion seat from another perspective.

[0021] The reference numerals in the detailed embodiments are as follows:

[0022] 100. Supporting component; 101. First vacuum path; 102. Second vacuum path; 110. First platform; 111. Guide structure; 120. Enclosure;

[0023] 200, Motion seat; 210, Connector; 220, Second platform; 230, Limiting platform; 231, Limiting hole; 232, Reference mark; 240, Spacer; 241, First window;

[0024] 300. Push-pull component. Detailed Implementation

[0025] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0027] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0030] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0031] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0032] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0033] In semiconductor manufacturing technology, die bonding is a crucial step in the packaging process. It refers to the operation of picking up the chip from the wafer and placing it in a predetermined position on a support or substrate. The pick-up point and placement position of the chip directly affect the performance and reliability of the semiconductor device.

[0034] Specifically, the process of picking up chips from a wafer involves using negative pressure to pick up the side of the wafer coated with a crystalline film, fixing the crystalline film onto the processing platform, and then using a vacuum robotic arm to pick up the chip and peel it off from the crystalline film.

[0035] However, because the entire bottom surface of the chip is covered with a crystalline film, the contact area accounts for a large proportion of the chip area, resulting in strong adhesion and increasing the difficulty of peeling the chip off the crystalline film.

[0036] To address the problems of the prior art, embodiments of this application provide a wafer carrier mechanism and a die bonding device. The wafer carrier mechanism provided in this application embodiment will be described first below.

[0037] Please see Figure 1 In a first aspect, embodiments of this application provide a wafer carrier mechanism, including a carrier 100, a motion seat 200, and a pusher 300. The carrier 100 includes a first platform 110 for carrying a wafer, the first platform 110 having multiple guide structures 111 and a vacuum channel. The motion seat 200 includes a connector 210 and a second platform 220, the connector 210 being used to connect a driving mechanism, and the second platform 220 being arranged parallel to the first platform 110. The pusher 300 is used to push the chip, and the pusher 300 is magnetically coupled to the second platform 220. The carrier 100 adsorbs the wafer onto the first platform 110 through the vacuum channel. The driving mechanism drives the second platform 220 closer to the first platform 110 via the motion seat 200. The pusher 300 extends relative to the first platform 110, causing the chip to separate from at least a portion of the wafer.

[0038] A crystal film is a film-like structure located on one side of a wafer. It is usually in the form of a blue film or a UV film. The crystal film can provide physical protection for the wafer to reduce mechanical damage that the wafer surface may suffer during processing or transfer.

[0039] In this process, the drive mechanism moves the second platform 220 closer to the first platform 110, and the second platform 220 pushes the pusher 300 to move synchronously. The carrier 100 is connected to the negative pressure mechanism through a vacuum channel to fix the crystal film. The pusher 300 extends from the guide structure 111 and lifts the chip a certain distance to peel the chip from part of the crystal film. The vacuum robotic arm adsorbs the chip surface and carries the chip away to the next process, completing the bonding and fixing of the chip to the bracket or substrate. After the chip is picked up, the drive mechanism moves the second platform 220 away from the first platform 110, and the pusher 300 is synchronously reset with the second platform 220 through magnetic attraction, ready for the next chip lifting action.

[0040] Therefore, the pusher 300, extending relative to the first platform 110, can lift the chip to be picked up. This facilitates the vacuum robot's identification of the chip and pick-up point, improving the accuracy of the die bonding operation. Furthermore, it reduces the contact area and adhesion between the chip and the die film, lowering the difficulty of wafer pickup. In addition, the second platform 220, positioned parallel to the first platform 110, keeps the tops of all pushers 300 on the same horizontal plane, reducing the probability of chip breakage due to axial misalignment between different pushers 300.

[0041] According to certain embodiments of this application, the motion seat 200 further includes a limiting platform 230, which is fixed relative to the second platform 220. The limiting platform 230 has a limiting hole 231, and the pusher 300 is arranged through the limiting hole 231.

[0042] Optionally, the pusher 300 and the limiting hole 231 are transition-fitted, or the pusher 300 and the limiting hole 231 are interference-fitted. For example, the diameter of the pusher 300 is 0.7 mm, and the diameter of the limiting hole 231 is 0.71 mm ± 0.1 mm.

[0043] Optionally, the limiting platform 230 is made of magnetic material to further enhance the relative fixation between the motion seat 200 and the pusher 300 through magnetic attraction.

[0044] Optionally, the limiting platform 230 is made of a non-magnetic material to avoid attraction or repulsion between the limiting platform 230 and the second platform 220.

[0045] Optionally, a limiting hole 231 is provided, and each pusher 300 passes through the limiting hole 231. The orthographic projection of each pusher 300 on the second platform 220 falls within the orthographic projection area of ​​the limiting hole 231 on the second platform 220, so that multiple pushers 300 are kept within the same range.

[0046] Optionally, multiple limiting holes 231 are provided, and the pusher 300 is provided in a one-to-one correspondence with the limiting hole 231.

[0047] Therefore, the limiting platform 230 restricts the horizontal movement of the pusher 300 through the limiting hole 231, thereby improving the stability of the connection between the pusher 300 and the second platform 220, reducing the possible displacement of the pusher 300 relative to the second platform 220, and thus reducing the possibility of chip breakage.

[0048] According to certain embodiments of this application, the number of limiting holes 231 is greater than the number of pushing members 300.

[0049] Optionally, the plurality of limiting holes 231 are arranged in an array. For example, the plurality of limiting holes 231 are arranged in a rectangular array, or the plurality of limiting holes 231 are arranged in a circular array.

[0050] Optionally, multiple limiting holes 231 are provided in a one-to-one correspondence with multiple guide structures 111.

[0051] Therefore, the pusher 300 can be installed in different limiting holes 231, thereby realizing the adjustment of the position of the pusher 300 relative to the second platform 220 and the first platform 110 in the horizontal plane to adapt to different chip pusher requirements.

[0052] According to certain embodiments of this application, the limiting platform 230 is provided with a reference mark 232, which includes an intersecting first side and a second side. Among the multiple limiting holes 231 arranged in an array, some limiting holes 231 are arranged parallel to the first side, and some limiting holes 231 are arranged parallel to the second side.

[0053] Optionally, the first side and the second side are perpendicular to each other.

[0054] Optionally, the first and second sides are obtained by inkjet printing or other processing methods.

[0055] Optionally, the first and second sides are formed by grooving or other processes; for example, please refer to [link to relevant documentation]. Figure 3 The reference mark 232 is an inner groove formed on the periphery of the limiting platform 230, having a first side and a second side that are perpendicular to each other.

[0056] Therefore, when the pusher 300 is installed, the reference mark 232 can be used as a reference to select a suitable limiting hole 231 from the multiple limiting holes 231 set in the array so that the multiple pushers 300 are arranged in a preset position, thereby making the pushing force of the pusher 300 on the chip evenly distributed and reducing the probability of chip cracking.

[0057] Please see Figure 2 According to certain embodiments of this application, the carrier 100 further includes a closing portion 120. During the process of the motion seat 200 moving closer to or further away from the carrier 100, the closing portion 120 is always covered outside the second platform 220, and a vacuum cavity is formed between the first platform 110, the closing portion 120 and the second platform 220.

[0058] Optionally, the length of the closure 120 is greater than the stroke of the pusher 300, so that the closure 120 always covers the second platform 220 during the reciprocating motion of the motion seat 200.

[0059] Optionally, the enclosure 120 includes a telescopic structure that can move synchronously with the motion seat 200 so that the telescopic structure is always positioned between the first platform 110 and the second platform 220. For example, the telescopic structure is a sleeve.

[0060] Therefore, the enclosure 120 is placed outside the second platform 220, forming a sealed chamber between the carrier 100 and the motion seat 200. The sealed chamber forms a negative pressure through the vacuum channel of the carrier 100, giving each guide structure 111 a slight negative pressure effect, which can enhance the relative fixation between the crystal film and the first platform 110, and further facilitate the peeling of the chip and the crystal film; at the same time, it reduces the negative impact of the airflow impact in the sealed chamber on the crystal film adsorption effect during the extension and retraction of the pusher 300.

[0061] Please see Figure 3 or Figure 4 According to certain embodiments of this application, the motion seat 200 further includes a spacer 240, a limiting platform 230 fixedly connected to the spacer 240, and a second platform 220 fixedly connected to the spacer 240.

[0062] Optionally, please refer to Figure 4 The spacer 240 has a first window 241 that communicates with the vacuum channel, which helps to maintain a consistent air pressure environment between the space between the second platform 220 and the limiting platform 230 and between the limiting platform 230 and the first platform 110.

[0063] Therefore, the spacer 240 can lengthen the distance between the limiting platform 230 and the second platform 220, so that the limiting platform 230 is installed at the middle or top position of the pusher 300, thereby improving the fixing effect of the limiting platform 230 on the pusher 300 in the horizontal plane, and thus enhancing the stability of the connection between the pusher 300 and the motion seat 200.

[0064] According to certain embodiments of this application, the second platform 220 is made of magnetic material and the pusher 300 is made of metal material.

[0065] Optionally, the spacer 240 is made of a non-metallic material. For example, the spacer 240 is made of polyetheretherketone (PEEK) or polyaryletherketone (PAEK).

[0066] This achieves magnetic coupling between the pusher 300 and the second platform 220 while extending the distance between the magnetic material and the chip, thereby reducing the potential attraction between the magnetic material and the chip.

[0067] According to certain embodiments of this application, the vacuum channel includes a first vacuum path 101 arranged circumferentially along a first plane, and the first vacuum path 101 is connected to a negative pressure mechanism.

[0068] Optionally, the first vacuum path 101 includes an annular groove and a negative pressure hole connecting the annular groove and the negative pressure mechanism. The wafer is arranged to cover the annular groove so that the carrier 100 forms a negative pressure adsorption effect on the wafer. Further, the annular groove and the wafer are arranged coaxially.

[0069] Alternatively, the two ends of the negative pressure hole are connected to the annular groove and the motion seat 200, respectively.

[0070] Thus, the carrier 100 can be connected to the negative pressure mechanism through the first vacuum path 101 to form an adsorption of the crystal film, and this adsorption effect is evenly distributed along the circumference of the wafer to reduce the probability of other chips on the wafer being accidentally damaged during the pick-up operation.

[0071] According to certain embodiments of this application, the vacuum channel further includes a second vacuum path 102, which is disposed through the thickness direction of the first platform 110.

[0072] Optionally, along the radial direction of the first platform 110, the second vacuum path 102 is located between the guide structure 111 and the first vacuum path 101 to reduce the influence of the second vacuum path 102 on the reciprocating motion of the pusher 300.

[0073] Optionally, multiple second vacuum paths 102 are provided, and the multiple second vacuum paths 102 are symmetrically distributed about the center of the first platform 110.

[0074] Therefore, by setting the second vacuum path 102, more adsorption sites are formed on the surface of the crystal film, thereby enhancing the fixing effect of the carrier 100 on the crystal film.

[0075] Secondly, embodiments of this application provide a die bonding apparatus, which includes a machine base, a drive mechanism, and a wafer carrier mechanism provided in any of the foregoing embodiments. The carrier 100 is fixedly connected to the machine base, and the drive mechanism is fixedly connected to the motion seat 200. It is understood that the die bonding apparatus possesses all the beneficial effects of the aforementioned wafer carrier mechanism.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A wafer carrier mechanism, characterized in that, include: The carrier includes a first platform for carrying the wafer, the first platform having multiple guide structures and vacuum channels; The motion seat includes a connector and a second platform, the connector being used to connect a drive mechanism, and the second platform being arranged parallel to the first platform; A pusher component for pushing the chip, the pusher component being magnetically coupled to the second platform; The carrier adsorbs the crystal film onto the first platform through a vacuum channel, the driving mechanism drives the second platform to move closer to the first platform through the motion seat, and the pusher extends relative to the first platform to drive the chip to separate from at least part of the crystal film.

2. The wafer carrier mechanism according to claim 1, characterized in that, The motion seat also includes a limiting platform that is fixed relative to the second platform. The limiting platform has multiple limiting holes, and the pushing member is arranged through the limiting holes.

3. The wafer carrier mechanism according to claim 2, characterized in that, The array of multiple limiting holes is arranged, and the multiple limiting holes are arranged in a one-to-one correspondence with the multiple guide structures. The number of limiting holes is greater than the number of pushing members.

4. The wafer carrier mechanism according to claim 3, characterized in that, The limiting platform is provided with a reference mark, which includes a first side and a second side that are perpendicular to each other. Among the multiple limiting holes arranged in an array, some of the limiting holes are arranged parallel to the first side, and some of the limiting holes are arranged parallel to the second side.

5. The wafer carrier mechanism according to claim 2, characterized in that, The carrier also includes a closure portion. During the process of the moving seat moving closer to or away from the carrier, the closure portion is always covered outside the second platform, and a vacuum cavity is formed between the first platform, the closure portion and the second platform.

6. The wafer carrier mechanism according to claim 5, characterized in that, The motion seat also includes a spacer, the limiting platform is fixedly connected to the spacer, the second platform is fixedly connected to the spacer, and the spacer has a first window communicating with the vacuum channel.

7. The wafer carrier mechanism according to claim 6, characterized in that, The jacking component is made of metal, the second platform is made of magnetic material, and the spacer is made of non-metallic material.

8. The wafer carrier mechanism according to claim 1, characterized in that, The vacuum channel includes a first vacuum path arranged circumferentially along the first platform, and the first vacuum path is connected to the motion seat.

9. The wafer carrier mechanism according to claim 8, characterized in that, The vacuum channel further includes a second vacuum path extending along the thickness direction of the first platform, and the second vacuum path is located between the guide structure and the first vacuum path along the radial direction of the first platform.

10. A die bonding apparatus, characterized in that, include: Machine tool; The wafer carrier mechanism as described in any one of claims 1 to 9, wherein the carrier is fixedly connected to the machine base; A drive mechanism is fixedly connected to the motion seat.

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