Automatic turnover device for chip packaging

Abstract

The utility model relates to the technical field of chip packaging, in particular to an automatic turnover device for chip packaging. The automatic turnover device for chip packaging comprises a substrate, a conveying track and a turnover mechanism. The conveying track is arranged on the substrate and used for conveying chips. The turnover mechanism is arranged on the substrate and comprises a lifting table and a turnover assembly, the lifting table is used for jacking the chip to reach a set height, the turnover assembly is used for turning over the chip and putting the turned chip back to the lifting table, and the turned chip falls back to the conveying track when the lifting table is reset. According to the automatic overturning device for chip packaging, automatic overturning of the chip can be achieved in the chip packaging process, the labor cost can be reduced, and the production efficiency can be improved.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and more specifically, to an automatic flipping device for chip packaging. Background Technology

[0002] Currently, in the chip packaging process, after the back side of the chip is produced, it is necessary to manually inspect the production quality using a microscope. After inspection, the chip is manually flipped with the aid of an auxiliary fixture so that the front side is facing up before proceeding with the production of the front side. In the above process, the inspection and flipping work mainly relies on manual labor, which not only increases labor costs but also results in low production efficiency, and quality inspection is inevitably prone to omissions and errors. Utility Model Content

[0003] This application provides at least one automatic flipping device for chip packaging, which can reduce labor costs and improve production efficiency.

[0004] This application provides an automatic flipping device for chip packaging, the device comprising:

[0005] substrate;

[0006] A transport track, disposed on the substrate, is used to transport chips;

[0007] A flipping mechanism is disposed on the substrate and includes a lifting platform and a flipping component. The lifting platform is used to lift the chip to a set height, and the flipping component is used to flip the chip and put the flipped chip back onto the lifting platform. When the lifting platform is reset, the flipped chip falls back onto the conveyor track.

[0008] In one alternative embodiment, the flipping assembly includes a frame, grippers, and a flipping motor. The frame is rotatably disposed above the lifting platform. The grippers are movably disposed at both ends of the frame and have a first position for gripping the chip and a second position for releasing the chip. The flipping motor is connected to the frame and is used to drive the frame to rotate to flip the chip.

[0009] In one alternative embodiment, the device further includes:

[0010] A feeding mechanism is disposed on the substrate and located at the feeding end of the conveying track, for receiving the chip output from the previous machine's discharge track and feeding it into the conveying track.

[0011] In one optional embodiment, the feeding mechanism includes a feeding track and a first driving component. The feeding track is movably disposed on the substrate, and the first driving component is connected to the feeding track for driving the feeding track to move to receive the chips output from different front-end output tracks.

[0012] In one alternative embodiment, the device further includes:

[0013] The testing mechanism is disposed on the substrate and includes a first testing unit and a second testing unit. The first testing unit is used to test whether the upper surface of the chip is qualified, and the second testing unit is used to test whether the lower surface of the chip is qualified.

[0014] In one optional implementation, both the first detection unit and the second detection unit include a detection head, which includes a camera and a processor. The camera is used to acquire image information of the surface corresponding to the chip, and the processor is electrically connected to the camera to determine whether the surface corresponding to the chip is qualified based on the grayscale of the image information.

[0015] In one optional embodiment, both the first detection unit and the second detection unit include a lateral movable platform, a second driving component, a longitudinal movable platform, and a third driving component. The lateral movable platform is movably disposed on the substrate. The second driving component is connected to the lateral movable platform and is used to drive the lateral movable platform to move along the conveying direction of the conveying track. The longitudinal movable platform is movably disposed on the lateral movable platform. The third driving component is connected to the longitudinal movable platform and is used to drive the longitudinal movable platform to move in a direction closer to or farther from the conveying track. The detection head is disposed on the longitudinal movable platform.

[0016] In one optional embodiment, both the first detection unit and the second detection unit include a lifting assembly, the lifting assembly being disposed on a substrate, and the detection head being disposed on the substrate via the lifting assembly. The lifting assembly is used to drive the detection head to move up and down to adjust its detection height.

[0017] In one alternative embodiment, the device further includes:

[0018] A recycling mechanism is provided on the substrate and located at the unloading end of the conveying track, for recycling the tested chips.

[0019] In one optional embodiment, the recycling mechanism includes a first output track, a second output track, and a transfer track. The first output track and the second output track are arranged parallel to each other vertically. The first output track is used to recycle qualified chips, and the second output track is used to recycle unqualified chips. The transfer track is movably arranged at the unloading end of the conveying track and is used to convey the chips to the first output track or the second output track.

[0020] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0021] The automatic flipping device for chip packaging according to the embodiments of this application is used to automatically flip the chip during the chip packaging process, which can reduce labor costs and improve production efficiency.

[0022] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 A schematic diagram of an automatic flipping device for chip packaging provided in an embodiment of this application is shown.

[0025] Figure 2 It shows Figure 1 A schematic diagram of the structure of the tilting mechanism;

[0026] Figure 3 It shows Figure 1 Schematic diagram of the feed mechanism;

[0027] Figure 4 It shows Figure 1 A schematic diagram of the structure of a testing institution;

[0028] Figure 5 It shows Figure 1 A schematic diagram of the recycling mechanism;

[0029] Figure 6 It shows Figure 1 A schematic diagram of the push mechanism;

[0030] Figure label:

[0031] 1000 Automatic flipping device for chip packaging; 1100 Substrate; 1110 First substrate; 1120 Second substrate; 1200 Conveyor track; 1300 Flipping mechanism; 1310 Lifting platform; 1311 Board body; 1312 Lifting cylinder; 1320 Flipping assembly; 1321 Support; 1322 Frame; 1323 Gripper; 1324 Clamping cylinder; 1325 Flipping motor; 1330 First sensor; 1400 Feeding mechanism; 1410 Feeding track; 1420 First drive assembly; 1421 First lead screw; 1422 First drive motor; 1430 Second sensor; 1440 Limiter; 1500 Detection mechanism; 1510 First detection sheet 1520, Second detection unit; 1530, Detection head; 1531, Camera; 1532, Processor; 1533, Light source; 1540, Lateral translation assembly; 1541, Lateral moving platform; 1542, Second lead screw; 1550, Longitudinal translation assembly; 1551, Longitudinal moving platform; 1552, Third lead screw; 1553, Third drive motor; 1560, Lifting assembly; 1600, Retrieval mechanism; 1610, First output track; 1620, Second output track; 1630, Transfer track; 1700, Pushing mechanism; 1710, First mounting bracket; 1720, First cylinder; 1730, Second mounting bracket; 1740, Second cylinder; 1750, Push block; 1760, Third sensor. Detailed Implementation

[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0033] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0034] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0035] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] refer to Figures 1 to 6 This application provides an automatic flipping device 1000 for chip packaging, which can automatically flip the chip during the chip packaging process, thereby reducing labor costs and improving production efficiency.

[0038] In some embodiments, an automatic flipping device 1000 for chip packaging includes: a substrate 1100, a transport track 1200, and a flipping mechanism 1300. The transport track 1200 is disposed on the substrate 1100 and is used to transport chips. The flipping mechanism 1300 is disposed on the substrate 1100 and includes a lifting platform 1310 and a flipping component 1320. The lifting platform 1310 is used to lift the chip to a set height, and the flipping component 1320 is used to flip the chip and place the flipped chip back onto the lifting platform 1310. The flipped chip falls back onto the transport track 1200 when the lifting platform 1310 resets.

[0039] In some embodiments, the substrate 1100 includes a first substrate 1110 and a second substrate 1120, the first substrate 1110 and the second substrate 1120 are arranged parallel to each other vertically, and the first substrate 1110 and the second substrate 1120 are connected and fixed together by connecting posts.

[0040] In some embodiments, the conveying track 1200 is a double-track conveyor belt or a roller conveyor belt, etc. In this embodiment, the conveying track 1200 is a double-track conveyor belt, and the conveying track 1200 is disposed on the upper surface of the first substrate 1110.

[0041] In some embodiments, the lifting platform 1310 includes a plate 1311 and a lifting cylinder 1312. The plate 1311 is located between two tracks of the conveying track 1200 and can move up and down relative to the conveying track 1200. The lifting cylinder 1312 is mounted on the lower surface of the first substrate 1110. The telescopic rod of the lifting cylinder 1312 is connected to the plate 1311. When the lifting cylinder 1312 controls the telescopic rod to extend, it can drive the plate 1311 to rise, thereby lifting the chip to a set height. When the lifting cylinder 1312 controls the telescopic rod to retract, it can drive the plate 1311 to descend, thereby resetting the plate 1311 and the chip.

[0042] In some embodiments, the flipping assembly 1320 includes a support 1321, a frame 1322, grippers 1323, and a flipping motor 1325. The support 1321 is disposed on the upper surface of the first substrate 1110. The frame 1322 is rotatably disposed on the support 1321 and located above the lifting platform 1310. For example, the frame 1322 has pivots at both ends, which rotatably engage with the support 1321, allowing the frame 1322 to rotate relative to the support 1321. The grippers 1323 are movably disposed at both ends of the frame 1322 and have a first position for gripping a chip and a second position for releasing a chip. For example, the frame 1322 has gripping cylinders 1324 at both ends, and the grippers 1323 are connected to the telescopic rods of the gripping cylinders 1324. When the gripping cylinders 1324 control the telescopic rods to extend, the grippers 1323 can move to the first position; when the gripping cylinders 1324 control the telescopic rods to retract, the grippers 1323 can move to the second position. A flip motor 1325 is mounted on the bracket 1321 and connected to the frame 1322, used to drive the frame 1322 to rotate and flip the chip. For example, the drive shaft of the flip motor 1325 is connected to the rotating shaft of the frame 1322. When the flip motor 1325 controls the drive shaft to rotate, it can drive the rotating shaft to rotate circumferentially, thereby driving the frame 1322 to rotate. During use, after the gripper 1323 moves to the first position to grip the chip, the flip motor 1325 is controlled to rotate the frame 1322 180°, which can change the chip from its original back-facing position to its front-facing position. Subsequently, the gripper 1323 moves to the second position to place the flipped chip back onto the lifting platform 1310, and the flipped chip can fall back onto the transport track 1200 when the lifting platform 1310 resets. It should be understood that during the rotation of the frame 1322, the lifting platform 1310 can be lowered to a certain height to avoid interference between the lifting platform 1310 and the frame 1322.

[0043] In some embodiments, during the flipping process, the rotation center of the frame 1322 coincides with the centerline of the chip, which allows the chip to fall back to its original position after flipping 180°, avoiding positional deviation.

[0044] In some embodiments, the flipping mechanism 1300 further includes a first sensor 1330, which is disposed on the conveying track 1200 and is used to sense the conveying position of the chip. During use, when the first sensor 1330 senses that the chip is above the lifting platform 1310, it sends a first sensing signal to the controller. The controller controls the conveying track 1200 to stop conveying according to the first sensing signal and controls the flipping mechanism 1300 to perform a flipping operation.

[0045] In some embodiments, the automatic flipping device 1000 for chip packaging further includes a feeding mechanism 1400. The feeding mechanism 1400 is disposed on the substrate 1100 and located at the feeding end of the conveying track 1200, and is used to receive the chip output from the previous machine's discharge track and feed it into the conveying track 1200.

[0046] In some embodiments, the feeding mechanism 1400 includes a feeding track 1410 and a first driving assembly 1420. The feeding track 1410 is movably disposed on the upper surface of the first substrate 1110. For example, a first translation track is disposed on the upper surface of the first substrate 1110, and the feeding track 1410 is disposed on the first translation track and is capable of moving along the first translation track. The first driving assembly 1420 is connected to the feeding track 1410 and is used to drive the feeding track 1410 to move to receive chips output from different previous machine output tracks. For example, the first drive assembly 1420 includes a first lead screw 1421 and a first drive motor 1422. The first lead screw 1421 is rotatably disposed on the upper surface of the first substrate 1110 and parallel to the first translational track. The first lead screw 1421 is rotatably engaged with the feed track 1410. The first drive motor 1422 is connected to the first lead screw 1421 and is used to drive the first lead screw 1421 to rotate circumferentially. When the first lead screw 1421 rotates circumferentially, it drives the feed track 1410 to move along the first translational track. During use, the first drive assembly 1420 can drive the feed track 1410 to move so that the feed track 1410 can be aligned with multiple front-end output tracks arranged along its moving direction to receive chips output from different front-end output tracks.

[0047] In some embodiments, the feeding mechanism 1400 further includes a second sensor 1430, which is disposed on the feeding track 1410 and is used to sense the incoming material direction. During use, when the second sensor 1430 senses that a chip is being output from a certain front-end output track, it sends a second sensing signal to the controller. The controller controls the first drive component 1420 according to the second sensing signal, causing it to move the feeding track 1410 and align it with the front-end output track.

[0048] In some embodiments, the feeding mechanism 1400 further includes a limiter 1440 disposed on the upper surface of the first substrate 1110 for limiting the travel of the feeding track 1410. During use, when the feeding track 1410 moves to the target position, the limiter 1440 can send a stop signal to the controller, and the controller controls the first drive assembly 1420 according to the stop signal to stop driving the feeding track 1410.

[0049] In some embodiments, the automatic flipping device 1000 for chip packaging further includes a detection mechanism 1500. The detection mechanism 1500 is disposed on the substrate 1100 and includes a first detection unit 1510 and a second detection unit 1520. The first detection unit 1510 is disposed on the upper surface of the first substrate 1110 and is used to detect whether the upper surface (front side) of the chip is qualified. The second detection unit 1520 is disposed on the upper surface of the second substrate 1120 and is used to detect whether the lower surface (back side) of the chip is qualified.

[0050] In some embodiments, both the first detection unit 1510 and the second detection unit 1520 include a detection head 1530. The detection head 1530 of the first detection unit 1510 is used to detect whether the front side of the chip is qualified, and the detection head 1530 of the second detection unit 1520 is used to detect whether the back side of the chip is qualified. The detection head 1530 includes a camera 1531 and a processor 1532. The camera 1531 is used to acquire image information of the corresponding surface of the chip. The processor 1532 is electrically connected to the camera 1531 and is used to determine whether the corresponding surface of the chip is qualified based on the grayscale of the image information. It should be understood that, in specific implementations, the cameras 1531 of the first detection unit 1510 and the second detection unit 1520 are oriented in opposite directions. The processor 1532 can store detection data for subsequent querying, and the processor 1532 can also use the stored data to calculate the chip yield.

[0051] Specifically, the processor 1532 uses a software grayscale balance system algorithm to determine whether the chip surface is qualified. It should be noted that grayscale refers to a series of grayscale combinations of different sizes arranged in sequence. The camera can capture this grayscale under different lighting conditions to evaluate the camera's ability to distinguish grayscale changes in images. A scene with a clear brightness hierarchy from the darkest black to the brightest white is created, and the camera 1531's response to the contrast and transition from white to black in this scene is recorded. The more distinct the grayscale levels in the captured image information, and the more natural the transition between adjacent grayscale levels, the better the grayscale response capability of the camera 1531. The black-and-white contrast can measure the presence and positional changes of the measured object, thus outputting the verification result.

[0052] In some embodiments, the detection head 1530 further includes a light source 1533 for providing supplemental lighting to the camera 1531. During use, the light source 1533 helps improve the brightness, sharpness, and color reproduction of the image by providing additional light, thereby enhancing the shooting quality.

[0053] In some embodiments, both the first detection unit 1510 and the second detection unit 1520 include a lateral translation component 1540 and a longitudinal translation component 1550. The lateral translation component 1540 includes a lateral movable platform 1541 and a second driving component. The lateral movable platform 1541 is movably disposed on the substrate 1100. For example, a second translation track is disposed on the substrate 1100, and the lateral movable platform 1541 is disposed on the second translation track and is capable of moving along the second translation track. The second driving component is connected to the lateral movable platform 1541 and is used to drive the lateral movable platform 1541 to move along the conveying direction of the conveying track 1200. For example, the second drive assembly includes a second lead screw 1542 and a second drive motor (not shown in the figure). The second lead screw 1542 is rotatably mounted on the base plate 1100 and parallel to the second translation track. The second lead screw 1542 is rotatably engaged with the transverse movable platform 1541. The second drive motor is connected to the second lead screw 1542 and is used to drive the second lead screw 1542 to rotate circumferentially. When the second lead screw 1542 rotates circumferentially, it drives the transverse movable platform 1541 to move along the second translation track. The longitudinal translation assembly 1550 includes a longitudinal movable platform 1551 and a third drive assembly. The longitudinal movable platform 1551 is movably mounted on the upper surface of the transverse movable platform 1541. For example, the upper surface of the transverse movable platform 1541 is provided with a third translation track, and the longitudinal movable platform 1551 is mounted on the third translation track and can move along the third translation track. The third drive assembly is connected to the longitudinal movable platform 1551 and is used to drive the longitudinal movable platform 1551 to move in a direction closer to or away from the conveying track 1200. For example, the third drive assembly includes a third lead screw 1552 and a third drive motor 1553. The third lead screw 1552 is rotatably mounted on the upper surface of the transverse movable platform 1541 and parallel to the third translational track. The third lead screw 1552 is rotatably engaged with the longitudinal movable platform 1551. The third drive motor 1553 is connected to the third lead screw 1552 and is used to drive the third lead screw 1552 to rotate circumferentially. When the third lead screw 1552 rotates circumferentially, it drives the longitudinal movable platform 1551 to move along the third translational track. In a specific configuration, the detection head 1530 is mounted on the longitudinal movable platform 1551. During use, by controlling the second and third drive assemblies, the detection head 1530 can be moved laterally and longitudinally along the conveyor track 1200, thereby enabling the detection of different parts of the chip surface.

[0054] In some embodiments, both the first detection unit 1510 and the second detection unit 1520 include a lifting assembly 1560. The lifting assembly 1560 is disposed on the substrate 1100, and the detection head 1530 is disposed on the substrate 1100 via the lifting assembly 1560. The lifting assembly 1560 is used to drive the detection head 1530 to move up and down to adjust its detection height. For example, the lifting assembly 1560 can be a linear module, which, when activated, enables the detection head 1530 to move up and down. During use, by controlling the lifting assembly 1560, the detection head 1530 can be moved up and down along the height direction to adjust the detection height of the detection head 1530 (the shooting height of the camera 1531). In this embodiment, the lifting design and the moving design of the detection head 1530 are combined; that is, the lifting assembly 1560 can be disposed on the longitudinal movable platform 1551, and the detection head 1530 is disposed on the longitudinal movable platform 1551 via the lifting assembly 1560.

[0055] In some embodiments, the automatic flipping device 1000 for chip packaging further includes a recycling mechanism 1600. The recycling mechanism 1600 is disposed on the substrate 1100 and located at the unloading end of the conveying track 1200, and is used to recycle the inspected chips.

[0056] In some embodiments, the recycling mechanism 1600 includes a first output track 1610, a second output track 1620, and a transfer track 1630. The first output track 1610 is used to recycle qualified chips. The second output track 1620 is used to recycle unqualified chips. The transfer track 1630 is movably disposed at the unloading end of the conveying track 1200 and is used to convey chips to the first output track 1610 or the second output track 1620. In this embodiment, the conveying directions of the first output track 1610, the second output track 1620, and the transfer track 1630 are perpendicular to the conveying direction of the conveying track 1200. The first output track 1610 is disposed on the upper surface of the first substrate 1110, the second output track 1620 is disposed on the upper surface of the second substrate 1120, and the first output track 1610 and the second output track 1620 are arranged parallel vertically. The transfer track 1630 is disposed on the upper surface of the second substrate 1120 and is capable of vertical movement. During operation, when the transfer track 1630 moves to the first height, it aligns with the first output track 1610, allowing qualified chips to be output to the first output track 1610 for recycling. When the transfer track 1630 moves to the second height, it aligns with the second output track 1620, allowing unqualified chips to be output to the second output track 1620 for recycling. It should be understood that in specific implementations, the transfer track 1630 can also align with the conveyor track 1200 at the first height, reducing the frequency of its vertical movement and improving efficiency.

[0057] In some embodiments, the automatic flipping device 1000 for chip packaging further includes a pushing mechanism 1700. The pushing mechanism 1700 is disposed on the substrate 1100 and is used to push the tested chip from the transport track 1200 to the transfer track 1630.

[0058] In some embodiments, the pushing mechanism 1700 includes a first mounting bracket 1710, a first cylinder 1720, a second mounting bracket 1730, a second cylinder 1740, and a pusher block 1750. The first mounting bracket 1710 is disposed on the upper surface of a first basic component. The first cylinder 1720 is disposed on the first mounting bracket 1710, and its telescopic rod is connected to the second mounting bracket 1730. The first cylinder 1720 controls the extension and retraction of the telescopic rod to move the second mounting bracket 1730 up and down. The second cylinder 1740 is disposed on the second mounting bracket 1730, and its telescopic rod is connected to the pusher block 1750. The second cylinder 1740 controls the extension and retraction of the telescopic rod to move the pusher block 1750 along the conveying direction of the conveying track 1200. During use, when the tested chip reaches the unloading end of the conveying track 1200, the first cylinder 1720 can be controlled to make the pusher 1750 move down to be flush with the chip, and then the second cylinder 1740 can be controlled to make the pusher 1750 move horizontally to push the chip from the conveying track 1200 to the transfer track 1630.

[0059] In some embodiments, the pushing mechanism 1700 further includes a third sensor 1760, which is disposed on the conveying track 1200. The third sensor 1760 is used to sense whether the chip has reached the unloading end of the conveying track 1200. During use, when the chip reaches the unloading end of the conveying track 1200, the third sensor 1760 can send a third sensing signal to the controller. The controller can control the first cylinder 1720 and the second cylinder 1740 according to the third sensing signal to push the chip from the conveying track 1200 to the transfer track 1630.

[0060] The automatic flipping mechanism for chip packaging in this application embodiment includes the following working process:

[0061] 1. When the second sensor 1430 senses the direction of incoming material, it controls the feeding track 1410 to move so that it is aligned with the corresponding front machine discharge track, so that the chip output from the front machine discharge track is sent into the feeding track 1410.

[0062] 2. Control the feed track 1410 to reset (align with the conveyor track 1200) and send the chip into the conveyor track 1200;

[0063] 3. When the first sensor 1330 detects the chip, it controls the conveyor rail 1200 to stop conveying and controls the lifting platform 1310 to lift the chip to the set height.

[0064] 4. After the chip reaches the set height, control the gripper 1323 of the flipping component 1320 to hold the chip, then control the flipping component 1320 to flip 180° so that the chip faces upward, and finally release the chip so that the flipped chip falls onto the lifting platform 1310, and falls back onto the conveying track 1200 when the lifting platform 1310 resets.

[0065] 5. When the flipped chip reaches the detection position, the first detection unit 1510 is controlled to detect whether the front side of the chip is qualified, and the second detection unit 1520 is controlled to detect whether the back side of the chip is qualified.

[0066] 6. When the tested chip reaches the unloading end of the conveying track 1200, the control pushing mechanism 1700 pushes the chip onto the transfer track 1630. When the production quality of both the front and back of the chip is qualified, the transfer track 1630 outputs the chip to the first output track 1610 for the recycling of qualified chips. When the production quality of either the front or back of the chip is unqualified, the transfer track 1630 moves downward to align with the second output track 1620 and outputs the chip to the second output track 1620 for the recycling of unqualified chips.

[0067] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0068] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An automatic flipping device for chip packaging, characterized in that, The device includes: substrate; A transport track, disposed on the substrate, is used to transport chips; A flipping mechanism is disposed on the substrate and includes a lifting platform and a flipping component. The lifting platform is used to lift the chip to a set height, and the flipping component is used to flip the chip and put the flipped chip back onto the lifting platform. When the lifting platform is reset, the flipped chip falls back onto the conveyor track.

2. The automatic flipping device for chip packaging according to claim 1, characterized in that, The flipping assembly includes a frame, grippers, and a flipping motor. The frame is rotatably disposed above the lifting platform. The grippers are movably disposed at both ends of the frame and have a first position for gripping the chip and a second position for releasing the chip. The flipping motor is connected to the frame and is used to drive the frame to rotate to flip the chip.

3. The automatic flipping device for chip packaging according to any one of claims 1-2, characterized in that, The device further includes: A feeding mechanism is disposed on the substrate and located at the feeding end of the conveying track, for receiving the chip output from the previous machine's discharge track and feeding it into the conveying track.

4. The automatic flipping device for chip packaging according to claim 3, characterized in that, The feeding mechanism includes a feeding track and a first driving component. The feeding track is movably disposed on the substrate, and the first driving component is connected to the feeding track for driving the feeding track to move to receive the chips output from different front-end output tracks.

5. The automatic flipping device for chip packaging according to any one of claims 1-2, characterized in that, The device further includes: The testing mechanism is disposed on the substrate and includes a first testing unit and a second testing unit. The first testing unit is used to test whether the upper surface of the chip is qualified, and the second testing unit is used to test whether the lower surface of the chip is qualified.

6. The automatic flipping device for chip packaging according to claim 5, characterized in that, Both the first detection unit and the second detection unit include a detection head, which includes a camera and a processor. The camera is used to acquire image information of the surface corresponding to the chip, and the processor is electrically connected to the camera to determine whether the surface corresponding to the chip is qualified based on the grayscale of the image information.

7. The automatic flipping device for chip packaging according to claim 6, characterized in that, Both the first detection unit and the second detection unit include a transverse movable platform, a second driving component, a longitudinal movable platform, and a third driving component. The transverse movable platform is movably disposed on the substrate. The second driving component is connected to the transverse movable platform and is used to drive the transverse movable platform to move along the conveying direction of the conveying track. The longitudinal movable platform is movably disposed on the transverse movable platform. The third driving component is connected to the longitudinal movable platform and is used to drive the longitudinal movable platform to move in a direction closer to or farther from the conveying track. The detection head is disposed on the longitudinal movable platform.

8. The automatic flipping device for chip packaging according to claim 6, characterized in that, Both the first detection unit and the second detection unit include a lifting assembly. The lifting assembly is disposed on the substrate, and the detection head is disposed on the substrate via the lifting assembly. The lifting assembly is used to drive the detection head to move up and down to adjust its detection height.

9. The automatic flipping device for chip packaging according to claim 5, characterized in that, The device further includes: A recycling mechanism is provided on the substrate and located at the unloading end of the conveying track, for recycling the tested chips.

10. The automatic flipping device for chip packaging according to claim 9, characterized in that, The recycling mechanism includes a first output track, a second output track, and a transfer track. The first output track and the second output track are arranged parallel to each other. The first output track is used to recycle qualified chips, and the second output track is used to recycle unqualified chips. The transfer track is movably arranged at the unloading end of the conveying track and is used to transport the chips to the first output track or the second output track.

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