Anti-falling SIM card seat during SMT reflow soldering

Abstract

The utility model relates to an anti-drop SIM card seat during SMT reflow soldering, which comprises a support and a cover plate connected with the support in a matching manner, the support comprises a plastic main body, two rows of contact groups are symmetrically arranged in the middle of the plastic main body, each row of contact group comprises three contacts, two rows of pin groups are correspondingly arranged at two ends of the plastic main body, and the two rows of pin groups are connected with the cover plate in a matching manner. Each row of pin group comprises four pins, only two pins are added on the basis of six contacts and six pins of an original support, and meanwhile, the contacts are not added, so that the welding firmness of the SIM card seat on a PCB (printed circuit board) is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board technology, and in particular to a SIM card holder that prevents it from falling off during SMT reflow soldering. Background Technology

[0002] Currently, SIM card slots are mounted to the front side of the PCB board via SMT reflow soldering. When users mount components on the back of the PCB board, the SIM card slots that have already been soldered to the PCB board will be turned upside down. After SMT high-temperature reflow soldering, about 3% of the SIM card slots will fall off, and there will be phenomena such as pins coming loose or poor soldering, leading to PCB board failure.

[0003] To address the aforementioned issues, existing methods involve using plastic clips or adhesive to secure the pre-attached SIM card holder. However, these methods are time-consuming and labor-intensive, and cannot guarantee a complete solution to the problem. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a SIM card holder that prevents it from falling off during SMT reflow soldering. This invention can completely solve the problems of SIM card holders falling off during SMT reflow soldering, pin detachment, and poor soldering, thereby improving the soldering strength of the product.

[0005] To achieve this objective, the technical solution adopted by this utility model is:

[0006] A SIM card holder designed to prevent it from falling off during SMT reflow soldering includes a bracket and a cover plate that mates with the bracket. The bracket includes a plastic body with two rows of contact groups symmetrically arranged in the middle of the plastic body. Each row of contact groups includes three contacts. Two rows of pin groups are arranged at both ends of the plastic body, with each row of pin groups including four pins.

[0007] As a further optimization of the above technical solution: the bracket has two rows of through holes in the middle, each row of through holes includes four through holes, and the contact is set in three of the through holes in each row of through holes. Three of the pins in each row of pins are set to the corresponding three contacts, and the other pin is set to the through hole without a contact.

[0008] As a further optimization of the above technical solution: hinge holes and mounting grooves are provided on both sides of the bracket, a limiting baffle is provided at the lower end of the mounting groove, and hinge shafts corresponding to the hinge holes and mounting plates cooperating with the mounting grooves are provided at both ends of the cover plate, and a limiting groove corresponding to the limiting baffle is provided on the mounting plate.

[0009] Compared with the prior art, the present invention includes a bracket and a cover plate that cooperates with the bracket. The bracket includes a plastic body with two rows of contact groups symmetrically arranged in the middle of the plastic body. Each row of contact groups includes three contacts. Two rows of pin groups are arranged at both ends of the plastic body. Each row of pin groups includes four pins. By adding only two pins to the original bracket's six contacts and six pins, without adding any more contacts, the soldering firmness of the SIM card holder on the PCB board will be greatly increased. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of this utility model.

[0011] Figure 2 This is an exploded structural diagram of the present invention. Detailed Implementation

[0012] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0013] like Figure 1 , 2 As shown, a SIM card holder designed to prevent falling during SMT reflow soldering includes a bracket 1 and a cover plate 2 that mates with the bracket 1. The bracket 1 includes a plastic body 3, with two rows of contact groups symmetrically arranged in the middle of the plastic body 3. Each row of contact groups includes three contacts 4. The plastic body 3 has two rows of pin groups at both ends, with each row of pin groups including four pins 5. By adding only two pins 5 to the original six contacts 4 and six pins 5 of the bracket 1, the soldering firmness of the SIM card holder on the PCB board will be greatly increased. At the same time, without adding contacts 4, the firmness will increase to 1.33 times the original.

[0014] In this embodiment, the bracket 1 has two rows of through holes 6 in the middle. Each row of through holes 6 includes four through holes 6. The contact 4 is correspondingly set in three of the through holes 6 in each row of through holes 6. Three of the pins 5 in each row of pins are respectively set to the corresponding three contacts 4, and the other pin 5 is set to the through hole 6 without a contact 4. The SIM card holder before and after the improvement was compared experimentally. When the SIM card holder with six contacts 4 and six pins 5 went through reflow soldering, the defect rate of the product was 3.4% due to dropping, pin 5 detachment, and poor soldering. After the product improvement, the defect rate of the SIM card holder with six contacts 4 and eight pins 5 went through reflow soldering.

[0015] In this embodiment, the bracket 1 has hinge holes 7 and mounting grooves 8 on both sides. The mounting groove 8 has a limiting baffle 9 at its lower end. The cover plate 2 has hinge shafts 10 connected to the hinge holes 7 and mounting plates 11 connected to the mounting grooves 8 at both ends. The mounting plate 11 has limiting grooves 12 corresponding to the limiting baffle 9. The cover plate 2 and the bracket 1 can be rotated and opened and closed by the cooperation of the hinge holes 7, mounting grooves 8 and limiting baffles 9 with the hinge shafts 10, mounting plates 11 and limiting grooves 12.

[0016] The preferred embodiments of this utility model have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of this utility model without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of this utility model through logical analysis, reasoning, or limited experimentation on the basis of existing technology should fall within the protection scope of this utility model.

Claims

1. A SIM card holder designed to prevent SIM card from falling out during SMT reflow soldering, characterized in that: The device includes a bracket and a cover plate that mates with the bracket. The bracket includes a plastic body with two rows of contact groups symmetrically arranged in the middle of the plastic body. Each row of contact groups includes three contacts. The plastic body has two rows of pin groups at both ends, with each row of pin groups including four pins.

2. The SIM card holder for preventing drop during SMT reflow soldering as described in claim 1, characterized in that: The bracket has two rows of through holes in the middle, each row of through holes includes four through holes. The contact is set in three of the through holes in each row of through holes. Three of the pins in each row of pins are set to the corresponding three contacts, and the other pin is set to the through hole where no contact is set.

3. A SIM card holder for preventing drop during SMT reflow soldering as described in claim 1, characterized in that: The bracket has hinge holes and mounting slots on both sides. The mounting slot has a limiting baffle at the lower end. The cover plate has hinge shafts that are connected to the hinge holes and mounting plates that are connected to the mounting slots at both ends. The mounting plates have limiting slots that are set to correspond to the limiting baffles.

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