Single-sided aluminum-based circuit board

Abstract

The utility model discloses a single-sided aluminum-based circuit board, which relates to the technical field of aluminum-based circuit boards and comprises a protective frame and a circuit board main body, the protective frame is sleeved outside the circuit board main body, the top of the circuit board main body is provided with a radiating fin layer, the bottom of the radiating fin layer is provided with a heat-conducting silicone grease layer, and the heat-conducting silicone grease layer is attached to the top of the circuit board main body. A copper foil layer is arranged at the bottom of the circuit board body, a notch is formed in the copper foil layer, the copper foil layer is located in the notch and fixedly provided with a heat dissipation copper pipe, the protection frame wraps the circuit board body, the heat dissipation sheet layer and the copper foil layer, and a fixing ring is fixedly arranged at the bottom of the inner side of the protection frame. The heat conduction silicone grease layer is used for heat conduction and heat dissipation of components of the circuit board main body, a gap between the circuit board main body and the cooling fin layer is reduced, the circuit board main body and the cooling fin layer are in close contact, and therefore the stability of the heat dissipation effect of the circuit board main body is guaranteed; the upper side and the lower side of the circuit board main body are cooled.

Description

Technical Field

[0001] This utility model relates to the field of aluminum-based circuit board technology, and more specifically to a single-sided aluminum-based circuit board. Background Technology

[0002] Circuit boards are also known as ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrate boards, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed circuit boards (copper etching technology), etc. Aluminum-based circuit boards are circuit boards made from PCB substrates. PCB aluminum substrate is a unique metal-based copper-clad board with good thermal conductivity, electrical insulation properties, and machinability.

[0003] Existing aluminum-based circuit boards generate a lot of heat during operation. Current technology dissipates heat by placing heat sinks on the surface of the aluminum-based circuit board, but it is impossible to ensure that the heat sinks are in close contact with the aluminum-based circuit board, resulting in poor heat dissipation. When the aluminum-based circuit board operates for a long time, the inability to dissipate heat in time can easily lead to damage to the aluminum-based circuit board. Utility Model Content

[0004] The purpose of this invention is to provide a single-sided aluminum-based circuit board to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides a single-sided aluminum-based circuit board, including a protective frame and a circuit board body. The protective frame is sleeved on the outside of the circuit board body. A heat sink layer is provided on the top of the circuit board body, and a thermally conductive silicone grease layer is provided at the bottom of the heat sink layer. The thermally conductive silicone grease layer is attached to the top of the circuit board body. A copper foil layer is provided at the bottom of the circuit board body. A slot is formed on the copper foil layer, and a heat dissipation copper pipe is fixedly installed in the slot of the copper foil layer. The protective frame covers the circuit board body, the heat sink layer, and the copper foil layer. A fixing ring is fixedly installed on the bottom inner side of the protective frame, and a fastening component for fixing the circuit board body, the heat sink layer, and the copper foil layer is provided on the fixing ring.

[0006] As a further improvement to this technical solution, the fastening assembly includes multiple sets of studs and nuts. The studs are fixedly mounted on the fixing ring. Through holes for the studs to pass through are provided at the four corners of the circuit board body, the heat sink layer, and the copper foil layer. The nuts are threadedly connected to the top of the studs.

[0007] As a further improvement to this technical solution, a first shock-absorbing pad is fixedly provided on the fixing ring. The first shock-absorbing pad is configured as a rectangular ring structure, and the stud passes through the first shock-absorbing pad.

[0008] As a further improvement to this technical solution, a second shock-absorbing pad is attached to the inner sidewall of the protective frame. The second shock-absorbing pad is configured as a rectangular ring structure and is in contact with the outer periphery of the circuit board body, the heat sink layer, and the copper foil layer.

[0009] As a further improvement to this technical solution, the circuit board body includes multiple pads, each of which is disposed on the surface of the circuit board body and has a solder head.

[0010] As a further improvement to this technical solution, the circuit board body includes multiple chip modules, all of which are disposed on the surface of the circuit board body, and thermal conductive pads are disposed at intervals between the multiple chip modules.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. By setting a thermally conductive silicone grease layer, the thermally conductive silicone grease layer is used for heat conduction and heat dissipation of the main components of the circuit board, reducing the gap between the main body of the circuit board and the heat sink layer, and making the main body of the circuit board and the heat sink layer in close contact, thereby ensuring the stable heat dissipation effect of the main body of the circuit board. The heat dissipation copper pipe dissipates the heat from the bottom of the main body of the circuit board. By dissipating heat on the top and bottom sides of the main body of the circuit board, it can be ensured that the main body of the circuit board can dissipate heat in time during long-term operation.

[0013] 2. By setting up a protective frame, the circuit board body, heat sink layer, and copper foil layer are protected, preventing the heat sink layer from being affected by impacts. The first shock-absorbing pad provides shock absorption protection for the bottom of the circuit board body, and the second shock-absorbing pad provides shock absorption protection for the periphery of the circuit board body. This reduces the impact of vibration on the circuit board body during transportation and use, and improves the service life of the circuit board body. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the overall cross-section of the utility model;

[0016] Figure 3 This is a schematic diagram of the main structure of the circuit board of the utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the copper foil layer of the utility model;

[0018] Figure 5 This is a structural schematic diagram of the protective frame for a utility model.

[0019] The meanings of the labels in the diagram are as follows:

[0020] 1. Protective frame; 2. Circuit board body; 21. Solder pad; 22. Chip module; 23. Thermal conductive pad; 3. Heat sink layer; 4. Thermal grease layer; 5. Copper foil layer; 6. Heat dissipation copper pipe; 7. Retaining ring; 8. Stud; 9. Nut; 10. First shock-absorbing pad; 11. Second shock-absorbing pad. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0023] Please see Figures 1-5 As shown, this utility model provides a single-sided aluminum-based circuit board, including a protective frame 1 and a circuit board body 2. The protective frame 1 is sleeved on the outside of the circuit board body 2. The circuit board body 2 includes multiple solder pads 21, which are all disposed on the surface of the circuit board body 2. Each solder pad 21 is provided with a solder head. The solder pads 21 facilitate the soldering of electronic components during the assembly of the circuit board body 2. The circuit board body 2 includes multiple chip modules 22, which are all disposed on the surface of the circuit board body 2. Thermal conductive pads 23 are provided at intervals between the multiple chip modules 22 to fill the gaps between the multiple chip modules 22 and enhance the heat dissipation effect between electronic components.

[0024] A heat sink layer 3 is provided on the top of the circuit board body 2, and a thermal grease layer 4 is provided at the bottom of the heat sink layer 3. The thermal grease layer 4 is attached to the top of the circuit board body 2 and is used for heat conduction and heat dissipation of the components of the circuit board body 2. It reduces the gap between the circuit board body 2 and the heat sink layer 3, and makes the circuit board body 2 in close contact with the heat sink layer 3, thereby ensuring the stable heat dissipation effect of the circuit board body 2. A copper foil layer 5 is provided at the bottom of the circuit board body 2. A slot is opened on the copper foil layer 5, and a heat dissipation copper pipe 6 is fixedly installed in the slot. The heat dissipation copper pipe 6 dissipates the heat from the bottom of the circuit board body 2. By dissipating heat from the top and bottom sides of the circuit board body 2, it can be ensured that the heat can be dissipated in time when the circuit board body 2 is working for a long time.

[0025] The protective frame 1 covers the outer perimeter of the circuit board body 2, the heat sink layer 3, and the copper foil layer 5. The protective frame 1 protects the circuit board body 2, the heat sink layer 3, and the copper foil layer 5 from impacts. A fixing ring 7 is fixedly installed on the bottom inner side of the protective frame 1. The fixing ring 7 is equipped with fastening components for fixing the circuit board body 2, the heat sink layer 3, and the copper foil layer 5. The fastening components include multiple sets of studs 8 and nuts 9. The studs 8 are fixedly installed on the fixing ring 7. Through holes for the studs 8 to pass through are opened at the four corners of the circuit board body 2, the heat sink layer 3, and the copper foil layer 5. The nuts 9 are threaded to the top of the studs 8. By placing the copper foil layer 5, the circuit board body 2, and the heat sink layer 3 in sequence inside the protective frame 1, allowing the studs 8 to pass through the through holes of the circuit board body 2, the heat sink layer 3, and the copper foil layer 5, and then installing the nuts 9, the nuts 9 are tightened against the heat sink layer 3, thereby fixing the copper foil layer 5, the circuit board body 2, and the heat sink layer 3 to the protective frame 1.

[0026] A first shock-absorbing pad 10 is fixedly installed on the fixing ring 7. The first shock-absorbing pad 10 is a rectangular ring structure. The stud 8 passes through the first shock-absorbing pad 10. A second shock-absorbing pad 11 is pasted on the inner side wall of the protective frame 1. The second shock-absorbing pad 11 is a rectangular ring structure. The second shock-absorbing pad 11 is in contact with the outer periphery of the circuit board body 2, the heat sink layer 3, and the copper foil layer 5. The first shock-absorbing pad 10 provides shock-absorbing protection for the bottom of the circuit board body 2, and the second shock-absorbing pad 11 provides shock-absorbing protection for the periphery of the circuit board body 2, thereby reducing the impact of vibration on the circuit board body 2 during transportation and use, and improving the service life of the circuit board body 2.

[0027] The specific working principle of this utility model is as follows: the thermally conductive silicone grease layer 4 is used for the heat conduction and heat dissipation of the components of the circuit board body 2, reducing the gap between the circuit board body 2 and the heat sink layer 3, so that the circuit board body 2 and the heat sink layer 3 are in close contact, thereby ensuring the stability of the heat dissipation effect of the circuit board body 2. The heat dissipation copper pipe 6 dissipates the heat from the bottom of the circuit board body 2. By dissipating heat on the upper and lower sides of the circuit board body 2, it can be ensured that the heat can be dissipated in time when the circuit board body 2 works for a long time. The protective frame 1 protects the circuit board body 2, the heat sink layer 3 and the copper foil layer 5, so that the heat sink layer 3 is not affected by bumps.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A single-sided aluminum-based circuit board, comprising a protective frame (1) and a circuit board body (2), the protective frame (1) being sleeved outside the circuit board body (2), and the circuit board body (2) being provided with a heat dissipation fin layer (3) at the top, characterized in that: The fin layer (3) is provided with a heat-conducting silicone grease layer (4) at the bottom, which is attached to the top of the circuit board body (2), and the circuit board body (2) is provided with a copper foil layer (5) at the bottom, which is provided with notches, and the copper foil layer (5) is fixedly provided with a heat-dissipating copper pipe (6) in the notches, and the protective frame (1) is wrapped around the outer periphery of the circuit board body (2), the fin layer (3) and the copper foil layer (5), and the fixed ring (7) is fixedly arranged at the bottom of the inner side of the protective frame (1), and the fastening assembly for fixing the circuit board body (2), the fin layer (3) and the copper foil layer (5) is arranged on the fixed ring (7).

2. The single-sided aluminum-based circuit board of claim 1, wherein: The fastening assembly includes multiple groups of studs (8) and nuts (9), the studs (8) are fixedly arranged on the fixed ring (7), the circuit board body (2), the fin layer (3) and the copper foil layer (5) are all provided with through holes at the corners for the studs (8) to penetrate, and the nuts (9) are threadedly connected to the top ends of the studs (8).

3. The single-sided aluminum-based circuit board of claim 2, wherein: The first shock-absorbing pad (10) is fixedly arranged on the fixed ring (7), which is arranged in a rectangular ring structure, and the studs (8) penetrate the first shock-absorbing pad (10).

4. The single-sided aluminum-based circuit board of claim 1, wherein: The second shock-absorbing pad (11) is arranged on the inner side wall of the protective frame (1), which is arranged in a rectangular ring structure, and the second shock-absorbing pad (11) is in contact with the outer periphery of the circuit board body (2), the fin layer (3) and the copper foil layer (5).

5. The single-sided aluminum-based circuit board of claim 1, wherein: The circuit board body (2) includes multiple pads (21), and the pads (21) are arranged on the surface of the circuit board body (2), and the pads (21) are all provided with soldering heads.

6. The single-sided aluminum-based circuit board of claim 1, wherein: The circuit board body (2) includes multiple chip modules (22), and the chip modules (22) are arranged on the surface of the circuit board body (2), and the chip modules (22) are provided with heat-conducting rubber pads (23) at the spaced positions.

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