Circuit board structure capable of improving heat dissipation effect and current-carrying capability

Abstract

The utility model discloses a circuit board structure capable of improving heat dissipation effect and current-carrying capability in the field of circuit board design, which comprises a plurality of relay groups arranged on a circuit board side by side, a plurality of plated-through holes are arranged between every two vertically adjacent relay groups, a heat dissipation block is welded on each plated-through hole, and the heat dissipation blocks are welded on the circuit board. And the height of the heat dissipation block is smaller than that of the relay group. According to the utility model, the problem that the current-carrying and heat dissipation effects of the circuit board are poor when the existing circuit board is used in a high-voltage and large-current environment is solved, the heat dissipation block can quickly conduct heat of the circuit board to the surrounding environment, the circuit board is prevented from being corroded, the temperature of equipment is reduced, the heat dissipation effect is improved, and the service life of the circuit board is prolonged. And the heat dissipation block can increase the thickness and the area of the conducting layer of the circuit board, so that the circuit board can bear larger current, the current-carrying capacity of the circuit is improved, the reliability and the durability of welding spots are improved, and damage or failure of components caused by overlarge current is prevented.

Description

Technical Field

[0001] This utility model relates to the field of circuit board design technology, specifically to a circuit board structure that increases heat dissipation and current carrying capacity. Background Technology

[0002] In high-voltage, high-current projects, the heat dissipation and current-carrying capacity of the circuit board are crucial. Traditionally, this has been achieved by increasing the thickness of the copper layers inside the circuit board to improve current carrying capacity, hoping to achieve some heat dissipation. However, this method is ineffective in handling high-voltage, high-current environments. Insufficient current carrying capacity and overheating of the circuit board can lead to the following consequences.

[0003] 1. Corrosion of the circuit board: When the current is too high, it will generate heat, which can easily burn the dielectric material of the circuit board. At the same time, excessive current may cause chemical reactions, leading to corrosion of the circuit board, or even burning out the circuit board.

[0004] 2. Solder joint damage: Excessive current can also affect the solder joints on the circuit board, causing changes in the chemical composition of the solder joints, thereby reducing the reliability and durability of the solder joints.

[0005] 3. Component damage: When the current on the circuit board is too high, it will also have a certain impact on the components, which may cause the components to be damaged or fail, thus affecting the overall performance of the electronic device.

[0006] The above-mentioned defects urgently need to be addressed. Utility Model Content

[0007] To address the problem of poor current carrying capacity and heat dissipation of existing circuit boards in high-voltage, high-current environments, this invention provides a circuit board structure that enhances heat dissipation and current carrying capacity.

[0008] The technical solution of this utility model is as follows:

[0009] A circuit board structure for improving heat dissipation and current carrying capacity includes multiple relay groups arranged side by side on the circuit board. Several metallized holes are provided between two adjacent relay groups, and a heat sink is soldered onto each metallized hole. The height of the heat sink is less than the height of the relay group.

[0010] According to the above-described scheme of this utility model, the length of the metallized hole is less than the length of the heat sink.

[0011] According to the above-described scheme of this utility model, the length of the metallized hole is 8mm to 10mm.

[0012] According to the above-described scheme of this utility model, the width of the metallized hole is equal to the width of the heat sink.

[0013] According to the above-described scheme of this utility model, the width of the metallized hole is 3mm to 5mm.

[0014] According to the above-described scheme of this utility model, the distance between two adjacent metallized holes is 30mm to 50mm.

[0015] According to the above-described scheme of this utility model, the creepage distance between two adjacent heat sinks is greater than 4mm.

[0016] According to the above-described scheme of this utility model, the length of the heat sink is 19mm to 21mm.

[0017] According to the above-described scheme of this utility model, the width of the heat sink is 3mm to 5mm.

[0018] According to the above-described scheme of this utility model, the thickness of the heat sink is 3mm to 5mm.

[0019] According to the above-described scheme of this utility model, the length, width and thickness of the heat sink are all greater than 1mm.

[0020] According to the above-described scheme of this utility model, a plurality of heat sinks are arranged in a straight line between two adjacent relay groups.

[0021] According to the above-described scheme of this utility model, each relay group includes multiple relays arranged at intervals, and the relays in two adjacent relay groups correspond one-to-one.

[0022] The advantages of this utility model based on the above solution are as follows:

[0023] In the aforementioned circuit board structure that enhances heat dissipation and current carrying capacity, several metallized vias are provided between two adjacent relay groups. Each metallized via is soldered with a heat sink. The heat sink quickly conducts heat from the circuit board to the surrounding environment, preventing corrosion, reducing equipment temperature, and improving heat dissipation. Simultaneously, the heat sink effectively disperses heat over a larger area, reducing localized hotspots, improving overall heat dissipation efficiency, extending the lifespan of the circuit board and its components, and enhancing the stability and reliability of the entire electronic device.

[0024] In addition, heat sinks can increase the thickness and area of ​​the conductive layer on the circuit board, thereby enabling the circuit board to carry a larger current, improving the current carrying capacity of the circuit, improving the reliability and durability of the solder joints, preventing component damage or failure due to excessive current, and ensuring the stable operation of the circuit board.

[0025] In addition, the height of the heat sink is less than the height of the relay group, avoiding the impact of the heat sink on the overall height of the circuit board and ensuring the convenience and flexibility of the circuit board during installation and integration. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is one of the structural schematic diagrams of this utility model;

[0028] Figure 2 This is the second structural schematic diagram of the present invention.

[0029] In the diagram, 1 is the circuit board; 2 is the relay group; 3 is the metallized hole; and 4 is the heat sink. Detailed Implementation

[0030] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0031] like Figure 1 As shown, this utility model provides a circuit board structure that increases heat dissipation and current carrying capacity. It includes multiple relay groups 2 arranged side-by-side on a circuit board 1. Several metallized holes 3 are provided between adjacent relay groups 2. A heat sink 4 is soldered onto each metallized hole 3. The heat sink 4 can quickly conduct heat from the circuit board 1 to the surrounding environment, preventing corrosion of the circuit board 1, reducing equipment temperature, and improving heat dissipation. Furthermore, the heat sink 4 can effectively disperse heat over a larger area, reducing localized hotspots, improving overall heat dissipation efficiency, extending the service life of the circuit board 1 and its components, and also improving the stability and reliability of the entire electronic device.

[0032] In this embodiment, according to the formula Where I represents the current carrying capacity, U represents the voltage, R represents the resistance, and S represents the cross-sectional area of ​​the circuit. When the resistivity ρ of the heat sink 4 is constant, the current carrying capacity of the circuit is directly proportional to the thickness of the circuit; the thicker the circuit, the greater the current carrying capacity. Therefore, the heat sink 4 can increase the thickness and area of ​​the conductive layer of the circuit board 1, thereby enabling the circuit board 1 to carry a larger current, improving the current carrying capacity of the circuit, reducing the stress caused by overheating at the solder joints, improving the reliability and durability of the solder joints, preventing component damage or failure due to excessive current, and ensuring the stable operation of the circuit board 1.

[0033] In this embodiment, the height of the heat sink 4 is less than the height of the relay group 2, so as to avoid the influence of the heat sink 4 on the overall height of the circuit board 1 and ensure the convenience and flexibility of the circuit board 1 during installation and integration.

[0034] In this embodiment, the heat sink 4 can be made of copper. Copper has good thermal conductivity, allowing the heat sink 4 to more effectively transfer heat from the heat source to the surrounding environment, thereby reducing the temperature of the relay. Of course, in actual design, the material of the heat sink 4 can be designed according to actual needs.

[0035] like Figure 1 As shown, in this embodiment, several heat sinks 4 are arranged in a straight line between two adjacent relay groups 2, which can effectively absorb and disperse the heat generated by the relay groups 2. Since relays generate a certain amount of heat during operation, failure to dissipate heat in time may lead to a decrease in relay performance or even damage. The presence of heat sinks 4 can accelerate the conduction and dissipation of heat, thereby reducing the operating temperature of the relays and improving their stability and lifespan. In addition, the straight-line distribution of the heat sinks 4 can ensure that heat is evenly distributed between the relay groups 2, avoiding excessively high temperatures in any area, thereby maintaining a balanced temperature across the entire circuit board 1.

[0036] like Figure 1 As shown, in this embodiment, each relay group 2 includes multiple relays spaced apart. The relays in two adjacent relay groups 2 correspond one-to-one, that is, multiple relays are arranged in a matrix on the circuit board 1. There is a certain gap between each relay, which provides sufficient space for the installation of the heat sink 4 and helps the heat sink 4 absorb the heat generated by the relays.

[0037] like Figure 1As shown, in this embodiment, the length of the metallized hole 3 is less than the length of the heat sink 4, allowing the heat sink 4 to make more sufficient contact with the circuit board 1, thereby conducting heat more effectively. Simultaneously, the extension of the heat sink 4 above the metallized hole 3 can also serve as an additional heat dissipation surface, further increasing the heat dissipation area and improving heat dissipation efficiency. Furthermore, the width of the metallized hole 3 is equal to the width of the heat sink 4, which helps increase the strength of the welded connection. During the welding process, the close contact between the heat sink 4 and the metallized hole 3 can form a strong metallurgical bond, thereby improving the stability and reliability of the entire circuit board 1 structure.

[0038] like Figure 1 , Figure 2 As shown, in this embodiment, the length of the metallized hole 3 is 8mm to 10mm. The length of the metallized hole 3 can be designed to be any value in the range of 8mm, 8.2mm, 8.4mm, 8.6mm, 8.8mm, 9mm, 9.2mm, 9.4mm, 9.6mm, 9.8mm, 10mm, etc. In actual design, the length of the metallized hole 3 can be designed according to actual needs.

[0039] like Figure 2 As shown, in this embodiment, the width of the metallized hole 3 is 3mm to 5mm. The width of the metallized hole 3 can be designed to be any value in the range of 3mm, 3.2mm, 3.4mm, 3.6mm, 3.8mm, 4mm, 4.2mm, 4.4mm, 4.6mm, 4.8mm, 5mm, etc. In actual design, the width of the metallized hole 3 can be designed according to actual needs.

[0040] like Figure 2 As shown, in this embodiment, the spacing between two adjacent metallized holes 3 is 30mm to 50mm. The spacing between two adjacent metallized holes 3 can be designed to be any value in the range of 30mm, 32mm, 34mm, 36mm, 38mm, 40mm, 42mm, 44mm, 46mm, 48mm, 50mm, etc. In actual design, the spacing between two adjacent metallized holes 3 can be designed according to actual needs.

[0041] In this embodiment, the creepage distance between two adjacent heat sinks 4 is greater than 4mm, which can effectively prevent arcing caused by excessive voltage difference, thereby ensuring the safe operation of the electrical system and reducing equipment damage caused by faults such as electrical breakdown, short circuit, or leakage. In addition, maintaining sufficient creepage distance allows for more spacious space between the heat sinks 4, making it easier for maintenance personnel to inspect and repair the equipment.

[0042] In this embodiment, the length of the heat sink 4 is greater than 1mm, and the length of the heat sink 4 is 19mm to 21mm. The length of the heat sink 4 can be designed to be any value in the range of 19mm, 19.2mm, 19.4mm, 19.6mm, 19.8mm, 20mm, 20.2mm, 20.4mm, 20.6mm, 20.8mm, 21mm, etc. In actual design, the length of the heat sink 4 can be designed according to actual needs.

[0043] In this embodiment, the width of the heat sink 4 is greater than 1mm, and the width of the heat sink 4 is 3mm to 5mm. The width of the heat sink 4 can be designed to be any value in the range of 3mm, 3.2mm, 3.4mm, 3.6mm, 3.8mm, 4mm, 4.2mm, 4.4mm, 4.6mm, 4.8mm, 5mm, etc. In actual design, the width of the heat sink 4 can be designed according to actual needs.

[0044] In this embodiment, the thickness of the heat sink 4 is greater than 1mm, and the thickness of the heat sink 4 is 3mm to 5mm. The thickness of the heat sink 4 can be designed to be any value in the range of 3mm, 3.2mm, 3.4mm, 3.6mm, 3.8mm, 4mm, 4.2mm, 4.4mm, 4.6mm, 4.8mm, 5mm, etc. In actual design, the thickness of the heat sink 4 can be designed according to actual needs.

[0045] It should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art, or the orientation or positional relationship that the product is usually placed in during use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0046] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0047] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A circuit board structure that enhances heat dissipation and current carrying capacity, characterized in that, It includes multiple relay groups arranged side by side on a circuit board, with several metallized holes between two adjacent relay groups, and a heat sink welded to each metallized hole, the height of which is less than the height of the relay group.

2. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, The length of the metallized hole is less than the length of the heat sink.

3. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, The width of the metallized hole is equal to the width of the heat sink.

4. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, The spacing between two adjacent metallized holes is 30mm to 50mm.

5. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, The creepage distance between two adjacent heat sinks is greater than 4 mm.

6. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, The length of the heat sink is 19mm~21mm.

7. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, The width of the heat sink is 3mm to 5mm.

8. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, The thickness of the heat sink is 3mm to 5mm.

9. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, Several heat sinks are arranged in a straight line between two adjacent relay groups.

10. The circuit board structure for increasing heat dissipation and current carrying capacity according to claim 1, characterized in that, Each relay group includes multiple relays spaced apart, with one relay in each adjacent relay group corresponding to the other.

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