Negative pressure fixing device for FPC (flexible printed circuit) board
By designing a guide slope and a collection box, the problem of negative pressure environment damage caused by debris accumulation during the shearing process of FPC circuit boards is solved, achieving stable adsorption and high-quality processing results.
Patent Information
- Application Number
- CN202423191459.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-24
AI Technical Summary
In existing technologies, during the shearing process of FPC circuit boards, fragments tend to accumulate at the ventilation openings, which disrupts the negative pressure environment, reduces the adhesion force, and makes it impossible to fix the board securely, thus affecting the quality of subsequent processing.
A negative pressure fixing device for FPC circuit boards was designed, comprising a guide slope, a collection box, and auxiliary structures. The device uses a fan to generate negative pressure to adsorb and fix the FPC circuit boards, and guides the debris generated by shearing to the collection box for unified collection, ensuring the stability of the negative pressure environment.
This method achieves stable adsorption and fixation of FPC circuit boards, avoids debris affecting the negative pressure, and improves the stability and quality of the processing.
Smart Images
Figure CN223652449U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of FPC circuit board technology, and in particular to an FPC circuit board negative pressure fixing device. Background Technology
[0002] Flexible printed circuit boards (FPCs) are a special type of circuit board made from flexible substrates. Due to their excellent flexibility and bendability, they play a crucial role in many electronic products. They can not only adapt to complex three-dimensional spatial layouts, but also effectively reduce device weight and improve signal transmission efficiency.
[0003] In existing technologies, commonly used adsorption systems rely on negative pressure generated by one or more fans located below the FPC to achieve effective adsorption on its surface. This method is simple and easy to implement. However, because debris is generated during the shearing process, it tends to accumulate at the ventilation openings, disrupting the negative pressure environment. This not only reduces the adsorption force, making it impossible to firmly fix the FPC, but also affects the quality of subsequent processing steps. Utility Model Content
[0004] The purpose of this invention is to solve the problem in the prior art where debris easily accumulates at the ventilation opening, causing damage to the negative pressure environment. This not only reduces the adsorption force, making it impossible to firmly fix the FPC, but also affects the quality of subsequent processing steps. Therefore, this invention proposes a negative pressure fixing device for FPC circuit boards.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A negative pressure fixing device for FPC circuit boards includes a base plate, an adsorption chamber fixedly connected to the top of the base plate, a chamber door movably connected to the front of the adsorption chamber via a hinge, a guide slope and a collection box respectively provided inside the adsorption chamber, a sealing plate fixedly installed on the back of the guide slope, a fan fixedly installed inside the guide slope, and multiple through holes opened on the guide slope.
[0007] The top of the adsorption chamber is equipped with an auxiliary structure for helping to fix the circuit board.
[0008] Preferably, a pair of connecting lugs are fixedly connected to the front of the guide slope, and the connecting lugs and the adsorption chamber are threadedly connected by the same fastening bolt.
[0009] Preferably, both the sealing plate and the adsorption chamber are provided with exhaust holes to facilitate the exhaust of the fan.
[0010] Preferably, the auxiliary structure includes a groove formed on the top of the adsorption chamber, a plurality of T-shaped protrusions fixed in the groove, an annular groove formed in the groove, a plurality of limiting sliders slidably connected in the groove, an L-shaped rod fixedly connected to the top of the limiting slider, a slide rod vertically slidably connected to the L-shaped rod, a pressure plate fixedly connected to the bottom of the slide rod, a pull plate fixedly connected to the top of the slide rod, and a spring sleeved on the slide rod, with both ends of the spring fixedly connected to the L-shaped rod and the pull plate respectively.
[0011] Preferably, the limiting slider and the T-shaped protrusion are horizontally slidably connected, and the limiting slider and the annular groove are adapted to each other.
[0012] Preferably, the front sidewall of the guide slope is vertically arranged, and the front sidewall of the guide slope and the collection box form a drop opening.
[0013] Compared with the prior art, the advantages of this utility model are as follows:
[0014] This invention, through the design of a guide slope, a collection box, and auxiliary structures, allows the FPC circuit board to be placed on top of the adsorption chamber. A fan is then activated to adsorb and fix the board. The shearing debris is guided by the through-hole and the guide slope, falling sequentially into the collection box for unified collection. This ensures a negative pressure environment inside the adsorption chamber, thereby achieving stable adsorption and fixation of the FPC circuit board. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of a negative pressure fixing device for FPC circuit boards proposed in this utility model;
[0016] Figure 2 This is a schematic diagram of the internal structure of the adsorption chamber in the negative pressure fixing device for FPC circuit boards proposed in this utility model;
[0017] Figure 3 for Figure 2 Enlarged view of point A in the middle;
[0018] Figure 4 This is a schematic diagram of the fan in a negative pressure fixing device for an FPC circuit board proposed in this utility model.
[0019] In the diagram: 1. Base plate; 2. Adsorption chamber; 3. Chamber door; 4. Guide slope; 5. Sealing plate; 6. Fan; 7. Through hole; 8. Connecting ear; 9. Collection box; 10. T-shaped protrusion; 11. Annular groove; 12. Limiting slider; 13. L-shaped rod; 14. Slide rod; 15. Pressure plate; 16. Pull plate; 17. Spring. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0021] Reference Figures 1-4 A negative pressure fixing device for FPC circuit boards includes a base plate 1, with an adsorption chamber 2 fixedly connected to the top of the base plate 1. The front of the adsorption chamber 2 is movably connected to a door 3 via a hinge. The base plate 1 is made of high-strength material to ensure the stability and durability of the entire device. An anti-slip pad can be installed on its bottom to increase friction with the ground and prevent sliding or displacement during use. A transparent glass window is installed on the door 3 to allow staff to observe the real-time situation inside the adsorption chamber 2.
[0022] The adsorption chamber 2 is equipped with a guide slope 4 and a collection box 9. The collection box 9 is used to collect sheared debris and other impurities. It should be noted that the top of the adsorption chamber 2 has multiple through-holes, located on opposite sides of adjacent T-shaped protrusions 10. This design not only facilitates the vertical fall of debris but also allows the fan 6 to adsorb and fix the FPC circuit board. A sealing plate 5 is fixedly installed on the back of the guide slope 4. The sealing plate 5 is preferably installed, but not limited to, using a detachable method such as bolts, to facilitate subsequent maintenance and upkeep of the fan 6. The fan 6 is fixedly installed inside the guide slope 4, which has multiple through-holes 7. These through-holes 7 allow airflow while preventing debris and impurities from falling into the guide slope 4.
[0023] The top of the adsorption chamber 2 is equipped with an auxiliary structure for helping to fix the circuit board.
[0024] The guide slope 4 is fixedly connected to a pair of connecting lugs 8 on its front side. The connecting lugs 8 and the adsorption chamber 2 are threaded together by the same fastening bolt. The fastening bolt and connecting lugs 8 facilitate the disassembly and assembly of the guide slope 4 as a whole, and subsequent maintenance and upkeep.
[0025] Both the sealing plate 5 and the adsorption chamber 2 are provided with exhaust holes to facilitate the exhaust of air by the fan 6. The arrangement of these exhaust holes allows a negative pressure to be formed inside the adsorption chamber 2, thereby achieving the adsorption and fixation of the FPC circuit board.
[0026] The auxiliary structure includes a groove on the top of the adsorption chamber 2, with multiple T-shaped protrusions 10 fixed inside the groove. The T-shaped protrusions 10 are designed to prevent the limiting sliders 12 from falling off the top of the adsorption chamber 2. An annular groove 11 is formed within the groove, and multiple limiting sliders 12 are slidably connected within it. An L-shaped rod 13 is fixedly connected to the top of each limiting slider 12. A slide rod 14 is vertically slidably connected to the L-shaped rod 13. A pressure plate 15 is fixedly connected to the bottom of the slide rod 14, and a pull plate 16 is fixedly connected to the top of the slide rod 14. A spring 17 is fitted onto the slide rod 14, with both ends of the spring 17 fixedly connected to the L-shaped rod 13 and the pull plate 16, respectively. Through the combined action of vertically pulling the pull plate 16 and the elastic force of the spring 17, the FPC circuit board is simultaneously adsorbed and fixed by the pressure plate 15, further ensuring the fixing effect of the FPC circuit board and thus guaranteeing the accuracy of the cutting.
[0027] The limiting slider 12 and the T-shaped protrusion 10 are horizontally slidably connected, and the limiting slider 12 is adapted to the annular groove 11. This arrangement allows the limiting slider 12 to slide flexibly on the top of the adsorption chamber 2.
[0028] The guide slope 4 has a vertically set front sidewall, and the front sidewall of the guide slope 4 and the collection box 9 form a drop opening. The drop opening facilitates the passage of debris and impurities.
[0029] The functional principle of this utility model can be explained through the following operation methods:
[0030] First, place the FPC circuit board to be processed on top of the adsorption chamber 2.
[0031] Adjust the position of the limit slider 12 according to the actual size of the FPC circuit board. While adjusting the limit slider 12, pull the pull plate 16 vertically upward. The spring 17 is compressed. When the pressure plate 15 moves to the appropriate position (directly above the FPC circuit board), release the pull plate 16. Under the action of the spring force of the spring 17, the pull plate 16 moves vertically downward to clamp and fix the FPC circuit board.
[0032] When the FPC circuit board is being cut, the fan 6 is started. The fan 6 creates a negative pressure inside the adsorption chamber 2, which causes the FPC circuit board to be firmly adsorbed onto the top of the adsorption chamber 2.
[0033] Meanwhile, the waste generated by shearing falls sequentially through the through-hole at the top of the adsorption chamber 2 and the guide slope 4 into the collection box 9 for unified collection.
[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A negative pressure fixing device for FPC circuit boards, comprising a base plate (1), characterized in that, The bottom plate (1) is fixedly connected to the top of the adsorption chamber (2). The front of the adsorption chamber (2) is movably connected to the chamber door (3) via a hinge. The adsorption chamber (2) is provided with a guide slope (4) and a collection box (9). A sealing plate (5) is fixedly installed on the back of the guide slope (4). A fan (6) is fixedly installed inside the guide slope (4). Multiple through holes (7) are opened on the guide slope (4). The top of the adsorption chamber (2) is provided with an auxiliary structure for assisting in fixing the circuit board.
2. The FPC circuit board negative pressure fixing device according to claim 1, characterized in that, The guide slope (4) is fixedly connected to a pair of connecting ears (8) on the front, and the connecting ears (8) and the adsorption chamber (2) are threadedly connected by the same fastening bolt.
3. The FPC circuit board negative pressure fixing device according to claim 1, characterized in that, Both the sealing plate (5) and the adsorption chamber (2) are provided with exhaust holes to facilitate the exhaust of the fan (6).
4. The FPC circuit board negative pressure fixing device according to claim 1, characterized in that, The auxiliary structure includes a groove formed on the top of the adsorption chamber (2), a plurality of T-shaped protrusions (10) fixed in the groove, an annular groove (11) formed in the groove, a plurality of limiting sliders (12) slidably connected in the groove, an L-shaped rod (13) fixedly connected to the top of the limiting slider (12), a slide rod (14) vertically slidably connected to the L-shaped rod (13), a pressure plate (15) fixedly connected to the bottom of the slide rod (14), a pull plate (16) fixedly connected to the top of the slide rod (14), and a spring (17) sleeved on the slide rod (14), with the two ends of the spring (17) fixedly connected to the L-shaped rod (13) and the pull plate (16) respectively.
5. The FPC circuit board negative pressure fixing device according to claim 4, characterized in that, The limiting slider (12) and the T-shaped protrusion (10) are horizontally slidably connected, and the limiting slider (12) and the annular groove (11) are adapted to each other.
6. The FPC circuit board negative pressure fixing device according to claim 1, characterized in that, The guide slope (4) is vertically arranged on the front sidewall, and the guide slope (4) and the collection box (9) form a drop opening.