Solder mask surface pretreatment device

Abstract

The utility model discloses a solder mask surface pretreatment device which comprises a first cleaning pool, a PCB is arranged in the first cleaning pool, a clamping moving assembly is arranged on the outer side of the first cleaning pool, a sweeping mechanism is arranged in the first cleaning pool, and the sweeping mechanism comprises a bottom sweeping assembly arranged at the bottom in the first cleaning pool and used for sweeping the PCB; the bottom cleaning assembly is used for cleaning the bottom of the PCB and stirring cleaning liquid in the first cleaning pool; the top cleaning assembly is arranged in the middle of the inner wall of the first cleaning pool, the bottom cleaning assembly is arranged at the top of the PCB, a first cleaning brush is driven by rotation of a driving motor to clean the bottom of the PCB, and a rotating second cleaning brush is driven by cooperation with stretching and retracting of a hydraulic rod to clean the top of the PCB; according to the PCB cleaning device, the top and the bottom of a PCB can be cleaned at the same time, cleaning is more convenient, the cleaning efficiency is improved, the rotating shaft drives the stirring rods to rotate, the flow speed of cleaning liquid can be increased, and the cleaning effect on the PCB is improved.

Description

Technical Field

[0001] This application relates to the field of solder resist on PCB boards, and more particularly to a device for pre-treating the surface of the solder resist layer. Background Technology

[0002] Solder resist is a process used to protect critical parts of a circuit board, which can improve the reliability and stability of the circuit and thus improve product quality. Surface pretreatment is required before solder resisting. This pretreatment is of great significance in ensuring good adhesion between the solder resist layer and the circuit board substrate, improving the solder resist effect, and enhancing the overall quality of the circuit board.

[0003] However, during the implementation of the relevant technical solutions, at least the following technical problems were found: During the pretreatment of the weldment, a wire brush is generally used to clean the surface of the weldment to remove impurities such as grease, dirt, rust, and oxide layer. The wire brush needs to clean all parts of the weldment. When the weldment is placed horizontally in the cleaning pool, the wire brush usually needs to be turned over to clean it. It is inconvenient to clean the top and bottom of the weldment, which affects the anti-weld effect. Utility Model Content

[0004] This application provides a surface pretreatment device for the solder resist layer, which solves the problem of inconvenience in cleaning horizontally set PCB boards in the prior art, and achieves the effect of cleaning the top and bottom of the PCB board at the same time.

[0005] This application provides a surface pretreatment device for solder resist, including a first cleaning tank, a PCB board disposed inside the first cleaning tank, a clamping and moving assembly disposed outside the first cleaning tank, and a cleaning mechanism disposed inside the first cleaning tank. The cleaning mechanism includes: a bottom cleaning assembly disposed at the bottom inside the first cleaning tank, which is used to clean the bottom of the PCB board and stir the cleaning liquid in the first cleaning tank; and a top cleaning assembly disposed in the middle of the inner wall of the first cleaning tank, with the bottom cleaning assembly disposed at the top of the PCB board.

[0006] Furthermore, the bottom cleaning assembly includes: a rotating shaft rotatably connected to the bottom of the first cleaning tank; a drive motor fixedly installed inside the inner wall of the bottom of the first cleaning tank, and the output shaft of the drive motor is fixedly connected to the rotating shaft; and a stirring rod disposed on the outside of the rotating shaft.

[0007] Furthermore, a fixing seat is provided at the top of the rotating shaft, and a first cleaning brush is provided at the top of the fixing seat. The top of the first cleaning brush is in contact with the bottom of the PCB board.

[0008] Furthermore, the top cleaning assembly includes: two hydraulic rods, respectively disposed in the middle of the inner walls on both sides of the first cleaning pool; a connecting seat, disposed at one end of the hydraulic rods; a second cleaning brush, rotatably connected to the connecting seat on the side near the middle of the first cleaning pool; and a driving component, disposed on the connecting seat, and the driving component is used to drive the second cleaning brush to rotate.

[0009] Furthermore, a cavity is provided on the side of the connecting seat, and the driving component includes: a reduction motor, which is fixedly installed on the top of the side of the connecting seat; a first bevel gear, which is rotatably connected to the inside of the cavity, and the top of the first bevel gear is fixedly connected to the output shaft of the reduction motor; and a second bevel gear, which is meshed with one side of the first bevel gear, and one end of the second bevel gear is fixedly connected to the second cleaning brush through a connecting rod.

[0010] Furthermore, a second cleaning tank is provided on one side of the first cleaning tank, and the clamping and moving assembly is used to move the PCB board between the first cleaning tank and the second cleaning tank. Ultrasonic generators are provided on both sides of the inner wall of the second cleaning tank.

[0011] The technical solution provided in this application has at least the following technical effects or advantages:

[0012] The rotation of the drive motor drives the first cleaning brush to clean the bottom of the PCB board, while the extension and retraction of the hydraulic rod drives the second cleaning brush to clean the top of the PCB board. This allows for simultaneous cleaning of both the top and bottom of the PCB board without the need for flipping it over, making cleaning more convenient and improving cleaning efficiency. The rotation of the agitator driven by the rotating shaft increases the flow rate of the cleaning fluid, and the ultrasonic generator further cleans small impurities on the PCB board, enhancing the cleaning effect. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of the pillow in the pretreatment device in the embodiments of this application;

[0014] Figure 2 This is a schematic diagram of the cleaning mechanism in the embodiments of this application;

[0015] Figure 3 This is a cross-sectional structural diagram of the connector in an embodiment of this application;

[0016] In the diagram: 10, First cleaning tank; 20, Second cleaning tank; 30, Clamping and moving assembly; 40, Cleaning mechanism; 50, PCB board; 60, Ultrasonic generator; 41, Bottom cleaning assembly; 42, Top cleaning assembly; 411, Rotating shaft; 412, Drive motor; 413, Fixed base; 414, First cleaning brush; 415, Stirring rod; 421, Hydraulic rod; 422, Connecting base; 423, Second cleaning brush; 424, Gear motor; 425, First bevel gear; 426, Second bevel gear. Detailed Implementation

[0017] This application discloses a surface pretreatment device for solder resist layer. The bottom of the PCB board 50 is cleaned by the rotation of the first cleaning brush 414. The rotation of the stirring rod 415 outside the rotating shaft 411 stirs the cleaning liquid in the first cleaning tank 10, increasing the flow rate and thus improving the cleaning efficiency. The second cleaning brush 423 is driven to rotate by the movement of the hydraulic rod 421 to clean the top of the PCB board 50. This makes it easier to clean the PCB board 50 without flipping it over, and also improves the cleaning efficiency.

[0018] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0019] Please refer to Figure 1 and Figure 2This embodiment provides a surface pretreatment device for solder resist, including a first cleaning tank 10. A PCB board 50 is disposed inside the first cleaning tank 10. A clamping and moving assembly 30 is disposed on the outside of the first cleaning tank 10. A cleaning mechanism 40 is disposed inside the first cleaning tank 10, including a bottom cleaning assembly 41 and a top cleaning assembly 42. The bottom cleaning assembly 41 is disposed at the bottom of the first cleaning tank 10 and is used to clean the bottom of the PCB board 50 and agitate the cleaning liquid in the first cleaning tank 10. The top cleaning assembly 42 is disposed in the middle of the inner wall of the first cleaning tank 10, and the bottom cleaning assembly 41 is disposed at the top of the PCB board 50. A second cleaning tank 20 is disposed on one side of the first cleaning tank 10. The clamping and moving component 30 is used to move the PCB board 50 between the first cleaning tank 10 and the second cleaning tank 20. Ultrasonic generators 60 are provided on both sides of the inner wall of the second cleaning tank 20. The bottom cleaning component 41 and the top cleaning component 42 clean the top and bottom of the PCB board 50 inside the first cleaning tank 10, and clean the PCB board 50 more thoroughly, removing larger impurities attached to the PCB board 50. The clamping and moving component 30 moves the PCB board 50 into the second cleaning tank 20, and the ultrasonic generator 60 generates ultrasonic waves. The cavitation effect of the ultrasonic waves in the liquid disperses and cleans the fine dirt on the surface of the PCB board 50, and more thoroughly cleans the oil and impurities attached to the PCB board 50.

[0020] Please refer to Figure 1 and Figure 2 The bottom cleaning assembly 41 includes a rotating shaft 411, a drive motor 412, a fixed base 413, a first cleaning brush 414, and a stirring rod 415. The rotating shaft 411 is rotatably connected to the bottom of the first cleaning tank 10. The drive motor 412 is fixedly installed inside the inner wall of the bottom of the first cleaning tank 10, and the output shaft of the drive motor 412 is fixedly connected to the rotating shaft 411. The stirring rod 415 is located on the outside of the rotating shaft 411. The fixed base 413 is located on the top of the rotating shaft 411. The first cleaning brush 414 is located on the top of the fixed base 413. The top of the brush 414 is in contact with the bottom of the PCB board 50. The output shaft of the drive motor 412 drives the rotating shaft 411 to rotate, which in turn drives the top fixed seat 413 and the first cleaning brush 414 to rotate. This causes the first cleaning brush 414 to clean the bottom of the PCB board 50. The rotation of the drive motor 412 drives the outer stirring rod 415 to rotate, which in turn stirs the cleaning liquid inside the first cleaning tank 10, increasing the flow rate of the cleaning liquid in the first cleaning tank 10 and thus improving the cleaning efficiency.

[0021] Please refer to Figures 1-3The top cleaning assembly 42 includes hydraulic rods 421, a connecting seat 422, a second cleaning brush 423, and a driving component. Two hydraulic rods 421 are respectively disposed in the middle of the inner walls on both sides of the first cleaning tank 10. The connecting seat 422 is disposed at one end of the hydraulic rods 421. The second cleaning brush 423 is rotatably connected to the side of the connecting seat 422 near the middle of the first cleaning tank 10. The bottom of the second cleaning brush 423 is in contact with the PCB board 50. The driving component is disposed on the connecting seat 422 and is used to drive the second cleaning brush 423. The brush 423 rotates, and a cavity is provided on the side of the connecting seat 422. The driving components include a reduction motor 424, a first bevel gear 425, and a second bevel gear 426. The reduction motor 424 is fixedly installed on the top of the side of the connecting seat 422. The reduction motor 424 on the side can prevent collision with the clamping moving component 30 on the outside. The first bevel gear 425 is rotatably connected to the inside of the cavity, and the top of the first bevel gear 425 is fixedly connected to the output shaft of the reduction motor 424. The second bevel gear 426 meshes with the cavity. One end of the second bevel gear 426 is fixedly connected to the second cleaning brush 423 via a connecting rod, and the connecting seat 422 and the second cleaning brush 423 are moved towards the top of the PCB board 50 by the extension and retraction of the hydraulic rod 421 on the inner wall of the first cleaning tank 10. The two second cleaning brushes 423 move to the middle of the PCB board 50 at staggered times, so that the two second cleaning brushes 423 do not overlap at the middle of the top of the PCB board 50, thus affecting the cleaning of the PCB board 50. The rotation of the output shaft of the geared motor 424 on the side of the connecting seat 422 drives the first bevel gear 425 in the bottom cavity to rotate, causing the second bevel gear 426 meshing with the first bevel gear 425 to rotate as well. This drives the second cleaning brush 423 to rotate on the connecting seat 422, cleaning the bottom of the PCB board 50. Combined with the rotation of the first cleaning brush 414, the bottom of the PCB board 50 is cleaned. This allows for convenient cleaning of the horizontally placed PCB board 50 without the need for flipping it over, thus improving cleaning efficiency.

[0022] The functional principle of this application can be explained through the following methods:

[0023] In use, the clamping and moving assembly 30 clamps the PCB board 50 and moves it to a suitable position within the first cleaning tank 10. The drive motor 412 is then activated, causing its output shaft to rotate the rotating shaft 411. This, in turn, rotates the fixed seat 413 at the top of the rotating shaft 411 and the first cleaning brush 414. The first cleaning brush 414 cleans the bottom of the PCB board 50. The rotation of the rotating shaft 411 also rotates multiple agitator rods 415 on the outer side, agitating the cleaning fluid inside the first cleaning tank 10 and improving cleaning efficiency. Two hydraulic rods 421 on the inner wall of the first cleaning tank 10 are then activated, causing the hydraulic rods 421 to move the connecting seat 422 towards the center of the PCB board 50. The timing of the two connecting seats 422 moving to the center of the PCB board 50 is staggered to prevent the second... When the cleaning brush 423 collides with the PCB board, the reduction motor 424 on the connecting seat 422 is activated. This causes the output shaft of the reduction motor 424 to drive the first bevel gear 425 to rotate, which in turn causes the second bevel gear 426 to rotate. The rotation of the second bevel gear 426 drives the second cleaning brush 423 to rotate, cleaning the bottom PCB board 50. This facilitates cleaning of the top and bottom of the horizontally placed PCB board 50. After the hydraulic rod 421 removes the second cleaning brush 423 from the top of the PCB board 50, the clamping moving component 30 moves the PCB board 50 into the second cleaning tank 20. The ultrasonic generator 60 on the inner wall of the second cleaning tank 20 generates ultrasonic waves. The cavitation effect of the ultrasonic waves in the liquid disperses and cleans the fine dirt on the surface of the PCB board 50, thus more thoroughly cleaning the oil and impurities attached to the PCB board 50.

[0024] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

[0025] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present application, based on the technical solution and concept of the present application, should be covered within the scope of protection of the present application.

Claims

1. A surface pretreatment device for solder resist layer, comprising a first cleaning tank (10), wherein a PCB board (50) is disposed inside the first cleaning tank (10), and a clamping and moving assembly (30) is disposed outside the first cleaning tank (10), characterized in that, The first cleaning pool (10) is equipped with a cleaning mechanism (40), which includes: Bottom cleaning assembly (41) is disposed at the bottom inside the first cleaning tank (10), and the bottom cleaning assembly (41) is used to clean the bottom of the PCB board (50) and stir the cleaning liquid in the first cleaning tank (10); The top cleaning assembly (42) is disposed in the middle of the inner wall of the first cleaning tank (10), and the bottom cleaning assembly (41) is disposed on the top of the PCB board (50).

2. The surface pretreatment device for the solder resist layer as described in claim 1, characterized in that, The bottom cleaning assembly (41) includes: A rotating shaft (411) is rotatably connected to the bottom of the first cleaning tank (10); The drive motor (412) is fixedly installed inside the bottom inner wall of the first cleaning tank (10), and the output shaft of the drive motor (412) is fixedly connected to the rotating shaft (411); A stirring rod (415) is disposed on the outside of the rotating shaft (411).

3. The surface pretreatment device for the solder resist layer as described in claim 2, characterized in that, The top of the rotating shaft (411) is provided with a fixing seat (413), and the top of the fixing seat (413) is provided with a first cleaning brush (414). The top of the first cleaning brush (414) is in contact with the bottom of the PCB board (50).

4. The surface pretreatment device for the solder resist layer as described in claim 1, characterized in that, The top cleaning assembly (42) includes: Two hydraulic rods (421) are respectively installed in the middle of the inner walls on both sides of the first cleaning pool (10); A connecting seat (422) is disposed at one end of the hydraulic rod (421); The second cleaning brush (423) is rotatably connected to the side of the connecting seat (422) near the middle of the first cleaning pool (10); A driving component is disposed on the connecting seat (422), and the driving component is used to drive the second cleaning brush (423) to rotate.

5. The surface pretreatment device for the solder resist layer as described in claim 4, characterized in that, The connecting seat (422) has a cavity on its side, and the driving component includes: A geared motor (424) is fixedly installed on the top of the side of the connecting seat (422); The first bevel gear (425) is rotatably connected to the inside of the cavity, and the top of the first bevel gear (425) is fixedly connected to the output shaft of the geared motor (424); The second bevel gear (426) is meshed with one side of the first bevel gear (425), and one end of the second bevel gear (426) is fixedly connected to the second cleaning brush (423) through a connecting rod.

6. The surface pretreatment device for the solder resist layer as described in claim 1, characterized in that, A second cleaning tank (20) is provided on one side of the first cleaning tank (10). The clamping and moving assembly (30) is used to drive the PCB board (50) to move between the first cleaning tank (10) and the second cleaning tank (20). Ultrasonic generators (60) are provided on both sides of the inner wall of the second cleaning tank (20).

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