IMU chip protection structure, positioning module and host

Abstract

The utility model relates to the technical field of positioning chips, in particular to an IMU chip protection structure, a positioning module and a host. The IMU chip protection structure comprises a shell, a PCBA (Printed Circuit Board Assembly) and an IMU chip, a flexible heat insulation layer is arranged on the inner wall of the shell; the PCBA is arranged in the shell; the IMU chip is arranged on the PCBA, and a gap is formed between the IMU chip and the flexible heat insulation layer. According to the IMU chip protection structure, a user does not need to worry that the flexible heat insulation layer hinders the maintenance work of the PCBA and the IMU chip, and compared with the defect that an IMU chip module cannot be maintained in the prior art, the IMU chip protection structure is convenient to maintain, the PCB attached with the IMU chip makes contact with the outer shell through the flexible heat insulation layer in the shell, the flexible heat insulation layer can absorb deformation of the outer shell, and the service life of the PCBA and the IMU chip is prolonged. According to the IMU chip, the situation that stress is conducted to the IMU chip due to shell deformation can be avoided as much as possible, the performance stability of the IMU chip is improved, deformation of the IMU chip is reduced, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of positioning chip, in particular to an IMU chip protection structure, a positioning module and a host. BACKGROUND

[0002] An IMU chip is a core component of an inertial measurement unit. The IMU chip integrates an accelerometer, a gyroscope (and sometimes a magnetometer and other sensors) for measuring and reporting specific physical quantities of an object, such as acceleration, rotation rate, and (in the case of a magnetometer) direction. These structures are essential for determining the position, orientation, and velocity of an object in three-dimensional space. IMU chips are widely used in many fields, including but not limited to: unmanned aerial vehicle and robot fields, automotive safety system fields, virtual reality (VR) and augmented reality (AR) fields, motion tracking and fitness device fields, and aerospace fields, etc.

[0003] The IMU chip exhibits high sensitivity to changes in environmental temperature and stress. Therefore, the PCBA (Printed Circuit Board Assembly) installed with the IMU chip needs a special protection method: both to isolate the external temperature through the shell and to avoid rigid connection with the shell. Traditionally, in order to achieve the fixation and heat insulation of the IMU and the shell, glue is poured into the shell. However, this method has a problem, that is, once the assembly is completed, the module cannot be repaired again. More importantly, after the glue solidifies, the stress generated by the shell when experiencing temperature impact will still be partially transmitted to the IMU chip, thereby adversely affecting the performance stability of the chip. CONTENT OF THE INVENTION

[0004] The purpose of the present application is to provide an IMU chip protection structure, a positioning module and a host, which is convenient to repair and can reduce the interference of vibration, stress and temperature of the IMU chip.

[0005] In order to achieve the above-mentioned purpose, the first aspect of the present application provides an IMU chip protection structure, comprising a shell, a PCBA and an IMU chip. The inner wall of the shell is provided with a flexible heat insulation layer; the PCBA is arranged in the shell, and the PCBA and the inner wall of the shell are connected through the flexible heat insulation layer, and the flexible heat insulation layer is used to block the vibration and heat conduction from the shell to the PCBA; the IMU chip is arranged on the PCBA, and the IMU chip is installed in the shell through the PCBA, and the IMU chip has a gap with the flexible heat insulation layer.

[0006] In an embodiment, the housing comprises a first sub-housing and a second sub-housing, the first sub-housing is provided with a first connecting part, the second sub-housing is provided with a second connecting part, the second connecting part is connected with the first connecting part to connect the first sub-housing and the second sub-housing to form the housing, the flexible thermal insulation layer is arranged on the inner wall of the first sub-housing and the inner wall of the second sub-housing, and the PCBA is located between the flexible thermal insulation layer on the first connecting part and the flexible thermal insulation layer on the second connecting part.

[0007] In an embodiment, a terminal extension opening is formed on the first sub-housing.

[0008] In an embodiment, a first through hole is formed on the housing and penetrates the first sub-housing and the second sub-housing, and the first through hole is isolated from the internal space of the first sub-housing and the second sub-housing.

[0009] In an embodiment, the flexible thermal insulation layer comprises a first sub-layer and a second sub-layer, the first sub-layer is arranged on the inner wall of the first sub-housing and located between the PCBA and the first sub-housing, and the second sub-layer is arranged on the second sub-housing and located between the PCBA and the second sub-housing.

[0010] In an embodiment, the first connecting part and the second connecting part are column structures with threaded holes, the PCBA is provided with first matching holes corresponding to the positions of the first connecting part and the second connecting part, the first sub-layer is provided with second matching holes corresponding to the positions of the first connecting part and the second connecting part, the second sub-layer is provided with third matching holes corresponding to the positions of the first connecting part and the second connecting part, the first matching holes, the second matching holes and the third matching holes are coaxially arranged with the threaded holes on the first connecting part, the threaded holes on the first connecting part and the threaded holes on the second connecting part are coaxially arranged, and bolts are used to threadedly connect the first matching holes, the second matching holes, the third matching holes, the threaded holes on the first connecting part and the threaded holes on the second connecting part.

[0011] In an embodiment, the IMU chip protection structure further comprises a conductor, the conductor has a pre-buried end and a leading end, the pre-buried end is arranged in the flexible thermal insulation layer, and the leading end extends out of the flexible thermal insulation layer.

[0012] In an embodiment, the leading end extends out of the housing.

[0013] In a second aspect, the embodiments of the present application further provide a positioning module comprising the IMU chip protection structure according to any of the above embodiments.

[0014] In a third aspect, the embodiments of the present application further provide a host comprising the positioning module according to any of the above embodiments.

[0015] By adopting the IMU chip protection structure provided in the present application, it is not necessary to worry about the flexible thermal insulation layer hindering the maintenance work of the PCBA and the IMU chip, so compared with the IMU chip module in the prior art which cannot be maintained, the IMU chip protection structure provided in the present application has a gap between the IMU chip and the flexible thermal insulation layer, which can facilitate the maintenance of the PCBA and the IMU chip, the PCB with the IMU chip is in contact with the shell through the flexible thermal insulation layer in the shell, the flexible thermal insulation layer can absorb the deformation of the shell, can as far as possible avoid the stress transmission to the IMU chip due to the deformation of the shell, improves the performance stability of the IMU chip, reduces the deformation of the IMU chip, and improves the service life.

[0016] Other features and advantages of the present application will be described in detail in the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 A perspective view of the structure of one embodiment of the IMU chip protection structure provided in the present application;

[0019] Figure 2 A perspective view of the structure of another embodiment of the IMU chip protection structure provided in the present application;

[0020] Figure 3 A perspective view of the structure of another embodiment of the IMU chip protection structure provided in the present application;

[0021] Figure 4 A perspective view of the structure of another embodiment of the IMU chip protection structure provided in the present application;

[0022] Icon:

[0023] 100 - shell; 110 - first sub-shell; 112 - first connecting part; 114 - terminal extension opening; 120 - second sub-shell; 122 - second connecting part; 130 - first through hole;

[0024] 200-PCBA; 210-first fitting hole;

[0025] 300-flexible thermal insulation layer; 310-first sub-layer body; 320-second sub-layer body;

[0026] 400-conductor; 410-pre-buried end; 420-leading end;

[0027] 500-IMU chip. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0029] In the description of the present application, it should be noted that the positions or location relationships indicated by the terms “inner”, “outer” and the like are based on the positions or location relationships shown in the drawings, or the positions or location relationships in which the products of the present application are usually placed, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms “first”, “second” and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms “set”, “connected” should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] The embodiments of the present application provide an IMU chip protection structure, a positioning module and a host computer to solve the problem that the IMU chip 500 is easily affected by environmental changes and stress interference and the like, resulting in unstable performance, and also solve the problem that the host computer cannot be repaired in the prior art, resulting in increased equipment cost.

[0032] In a first aspect, the embodiments of the present application provide an IMU chip protection structure, as shown in Figure 1 which includes a shell 100, a PCBA 200 (Printed Circuit Board Assembly, assembly circuit board) 200 and an IMU chip 500.

[0033] The inner wall of the shell 100 is provided with a flexible thermal insulation layer 300.

[0034] Exemplarily, the shell 100 has a cavity inside. The flexible thermal insulation layer 300 is laid on the inner wall of the cavity of the shell 100.

[0035] Exemplarily, the flexible thermal insulation layer 300 is made of thermoplastic polyurethane (TPU), which has the functions of heat insulation and vibration absorption. Of course, in other embodiments, the flexible thermal insulation layer 300 can also be made of other materials, such as latex, silicone, etc. Exemplarily, the flexible thermal insulation layer 300 is fixedly arranged on the inner wall of the shell 100 by means of secondary injection molding.

[0036] As shown in Figure 1 , the PCBA 200 is arranged in the cavity inside the shell 100, and the PCBA 200 is connected with the inner wall of the shell 100 through the flexible thermal insulation layer 300. The flexible thermal insulation layer 300 is used to block the vibration and heat conduction from the shell 100 to the PCBA 200, to protect the IMU chip 500 from the interference of the external environment, and to ensure the stability and precision thereof. Through effective vibration isolation and heat blocking, the mechanical structure of the present application can reduce the damage risk of the IMU chip 500 and the PCBA 200 due to vibration and heat accumulation, thereby prolonging the service life of these key components and improving the reliability of the whole system.

[0037] As shown in Figure 1 , the IMU chip 500 is arranged on the PCBA 200, and the IMU chip 500 is mounted in the shell 100 through the PCBA 200. The IMU chip 500 keeps a gap with the flexible thermal insulation layer 300, which facilitates the maintenance of the PCBA 200 and the IMU chip 500.

[0038] In the prior art, even if the shell 100 is disassembled, the PCBA 200 and the IMU chip 500 are still wrapped by the adhesive, and the PCBA 200 and the IMU chip 500 cannot be repaired. In the present application, when repairing, the shell 100 is disassembled, and the flexible thermal insulation layer 300 is disassembled together with the shell 100, so that the PCBA 200 and the IMU chip 500 are exposed by disassembling the shell 100, without worrying about the flexible thermal insulation layer 300 hindering the repair work of the PCBA 200 and the IMU chip 500. Therefore, compared with the disadvantage that the IMU chip 500 module in the prior art cannot be repaired, the IMU chip protection structure provided by the present application maintains a gap between the IMU chip 500 and the flexible thermal insulation layer 300, facilitating the maintenance of the PCBA 200 and the IMU chip 500. The PCBA 200 with the IMU chip 500 is in contact with the shell 100 through the flexible thermal insulation layer 300 in the shell, the flexible thermal insulation layer 300 can absorb the deformation of the shell 100, and can as far as possible avoid the stress transmission of the shell 100 to the IMU chip 500, thereby improving the performance stability of the IMU chip 500, reducing the deformation of the IMU chip 500, and prolonging the service life.

[0039] As shown in Figure 2 In one embodiment, the shell 100 includes a first sub-shell 110 and a second sub-shell 120.

[0040] The first sub-shell 110 is provided with a first connecting portion 112, and the second sub-shell 120 is provided with a second connecting portion 122. The second connecting portion 122 is connected with the first connecting portion 112, so that the first sub-shell 110 and the second sub-shell 120 are connected to form the shell 100. Exemplarily, the first sub-shell 110 has a first sub-cavity, and the second sub-shell 120 has a second sub-cavity. After the first sub-shell 110 and the second sub-shell 120 are connected to form the shell 100, the first sub-cavity and the second sub-cavity are connected to form an internal cavity of the shell 100. The shell 100 is divided into the first sub-shell 110 and the second sub-shell 120, and connected through the connecting portion, so that the assembly and disassembly process is more convenient. Such split design not only facilitates production and maintenance, but also improves the flexibility of assembly. Moreover, the shell 100 is provided as the first sub-shell 110 and the second sub-shell 120, facilitating the installation of the PCBA 200.

[0041] The flexible thermal insulation layer 300 is arranged on the inner wall of the first sub-shell 110 and the inner wall of the second sub-shell 120. The PCBA 200 is located between the flexible thermal insulation layer 300 on the first connecting portion 112 and the flexible thermal insulation layer 300 on the second connecting portion 122. This design can more effectively block heat transfer and vibration conduction, and provide better protection for the PCBA 200 and the IMU chip 500.

[0042] When the PCBA 200 or the IMU chip 500 needs to be repaired or replaced, it is only necessary to disconnect the first connecting part 112 and the second connecting part 122 to easily access the PCBA 200 or the IMU chip 500. This design avoids the cumbersome process of damaging the glue or other fixing materials for repair in traditional designs.

[0043] As shown in Figure 3 and Figure 4 In one embodiment, a terminal extension opening 114 is formed on the first sub-housing 110.

[0044] Exemplarily, the IMU chip 500 is provided with first connecting terminals that can extend out of the terminal extension opening 114 to connect other devices such as displays, controllers, other PCBAs, etc. In another embodiment, the PCBA 200 is provided with second connecting terminals that can extend out of the terminal extension opening 114 to connect other devices such as displays, controllers, other PCBAs, etc.

[0045] Through the terminal extension opening 114, the connecting terminals on the IMU chip 500 or the PCBA 200 can directly extend out and connect with external devices. This design avoids complex wiring layout and additional connection interfaces, making the connection between devices more direct and efficient.

[0046] When the external device needs to be replaced or repaired, it is only necessary to simply disconnect the connecting terminals without the need to disassemble the entire housing 100. This greatly reduces the maintenance cost and time cost.

[0047] As technology develops and production demands change, devices may need to be upgraded or expanded. Through the terminal extension opening 114 and standardized connecting terminals, external devices can be easily added or removed to adapt to new demands. This flexibility allows devices to easily cope with various changes, extending the service life of the devices.

[0048] As shown in Figure 3 and Figure 4 In one embodiment, the housing 100 is provided with a first through hole 130 that penetrates the first sub-housing 110 and the second sub-housing 120, and the first through hole 130 is isolated from the internal space of the first sub-housing 110 and the second sub-housing 120.

[0049] Exemplarily, by providing screws on the first through hole 130, the housing 100 can be fixedly arranged on external devices, and the connection strength between the first sub-housing 110 and the second sub-housing 120 can be increased. This design enhances the overall stability and structural strength of the housing 100, ensuring that the mechanical structure can maintain its integrity and functionality during use.

[0050] A first through-hole 130 is simultaneously formed on both the first sub-shell 110 and the second sub-shell 120, allowing heat exchange media such as air to flow even without screws. This design allows the heat exchange medium (such as air) to freely pass through the first through-hole 130 and exchange heat with the inner wall of the through-hole. This helps regulate and stabilize the temperature of the first sub-shell 110 and the second sub-shell 120, preventing performance degradation or damage due to overheating. Through effective heat dissipation and temperature control, the mechanical structure can operate stably under a wider range of environmental conditions. This reduces the risk of mechanical failure or performance fluctuations caused by temperature changes, thereby improving the reliability and durability of the mechanical structure.

[0051] like Figure 1 or Figure 2 As shown, in one embodiment, the flexible thermal insulation layer 300 includes a first sublayer 310 and a second sublayer 320.

[0052] The first sub-layer 310 is disposed on the inner wall of the first sub-shell 110 and located between the PCBA200 and the first sub-shell 110.

[0053] The second sub-layer 320 is disposed on the second sub-shell 120 and located between the PCBA 200 and the second sub-shell 120.

[0054] The first sublayer 310 and the second sublayer 320 are respectively disposed between the PCBA200 and the first sub-shell 110 and the second sub-shell 120, effectively providing thermal insulation. This prevents heat from the shell from being directly transferred to the PCBA200, which could cause the PCBA200 to overheat, affecting its normal operation or shortening its service life. The sublayers (i.e., the first sublayer 310 and the second sublayer 320) are disposed on the sub-shells (the first sub-shell 110 and the second sub-shell 120), and the separate arrangement of the sublayers reduces the impact of the sublayers on the disassembly of the sub-shells, facilitating the disassembly of the sub-shells.

[0055] The flexible insulation layer 300 not only provides thermal insulation but also cushions external impacts and vibrations to the PCBA200 to a certain extent. This helps protect the PCBA200 from mechanical damage, especially when the mechanical structure is subjected to external impacts or vibrations.

[0056] like Figure 2 and Figure 4 As shown, in one embodiment, the first connecting portion 112 and the second connecting portion 122 are cylindrical structures with threaded holes.

[0057] A first mating hole 210 is provided on the PCBA200 at the position corresponding to the first connecting part 112 and the second connecting part 122.

[0058] A second mating hole is provided on the first sub-layer 310 at the position corresponding to the first connecting part 112 and the second connecting part 122.

[0059] A third mating hole is provided on the second sub-layer 320 at the position corresponding to the first connecting part 112 and the second connecting part 122.

[0060] The first mating hole 210, the second mating hole, and the third mating hole are coaxially arranged with the threaded hole on the first connecting part 112. The threaded hole on the first connecting part 112 and the threaded hole on the second connecting part 122 are coaxially arranged. The bolt thread connection of the first mating hole 210, the second mating hole, the third mating hole, and the threaded hole on the first connecting part 112 and the second connecting part 122 can ensure a tight connection and stable assembly between the components.

[0061] When it is necessary to repair or replace PCBA200 and IMU chip 500, the relevant components can be easily disassembled by loosening the bolts.

[0062] like Figure 2 As shown, in one embodiment, the IMU chip protection structure further includes a conductive element 400, which has a pre-embedded end 410 and a guiding end 420. The pre-embedded end 410 is disposed within the flexible heat insulation layer 300, and the guiding end 420 extends out of the flexible heat insulation layer 300.

[0063] The embedded end 410 is located within the flexible insulation layer 300. When the flexible insulation layer 300 heats up, the heat on the flexible insulation layer 300 can be conducted to the embedded end 410. The embedded end 410 can effectively transfer the heat generated by the IMU chip 500 to the external environment through the conductive element 400, thereby enhancing heat dissipation performance. This design helps to keep the IMU chip 500 within a suitable operating temperature range, improving its stability and reliability.

[0064] The guide end 420 extends beyond the flexible heat insulation layer 300 to facilitate heat dissipation of the guide end 420 or to facilitate connection between the guide end 420 and an external heat dissipation device.

[0065] For example, such as Figure 2 As shown, a conductive element 400 is provided on the first sublayer 310 and a conductive element 400 is provided on the second sublayer 320.

[0066] like Figure 2 As shown, in one embodiment, the guide end 420 extends beyond the housing 100 to facilitate heat dissipation of the guide end 420 or to facilitate connection of the guide end 420 to an external heat dissipation device.

[0067] In one embodiment, the guide end 420 has a porous structure, which increases the surface area of ​​the guide end 420 and improves heat dissipation efficiency.

[0068] Secondly, embodiments of this application also provide a positioning module, including the IMU chip protection structure of any of the above embodiments. The positioning module employing the IMU chip protection structure of any of the above embodiments can improve its resistance to environmental interference and extend its service life. Furthermore, the IMU chip protection structure can be easily disassembled for convenient maintenance, thereby reducing equipment costs.

[0069] Thirdly, embodiments of this application also provide a host computer including a positioning module as described in any of the above embodiments. The positioning module in the above embodiments is more adaptable to environmental changes, and the host computer using the positioning module provided in the above embodiments can improve stability.

[0070] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0071] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An IMU chip protection structure, characterized in that, The application relates to a shell (100) with an inner wall provided with a flexible heat insulation layer (300); a PCBA (200) arranged in the shell (100) and connected with the inner wall of the shell (100) through the flexible heat insulation layer (300), the flexible heat insulation layer (300) being used for blocking vibration and heat conduction from the shell (100) to the PCBA (200); and an IMU chip (500) arranged on the PCBA (200) and mounted in the shell (100) through the PCBA (200), the IMU chip (500) having a gap with the flexible heat insulation layer (300). The shell (100) comprises a first sub-shell (110) provided with a first connecting part (112) in the first sub-shell (110); a second sub-shell (120) provided with a second connecting part (122) in the second sub-shell (120), the second connecting part (122) being connected with the first connecting part (112) to connect the first sub-shell (110) and the second sub-shell (120) to form the shell (100); and the flexible heat insulation layer (300) being arranged on the inner wall of the first sub-shell (110) and the inner wall of the second sub-shell (120), the PCBA (200) being located between the flexible heat insulation layer (300) on the first connecting part (112) and the flexible heat insulation layer (300) on the second connecting part (122). The first sub-shell (110) is provided with a terminal extension opening (114). The shell (100) is provided with a first through hole (130) penetrating through the first sub-shell (110) and the second sub-shell (120), and the first through hole (130) is isolated from the internal space of the first sub-shell (110) and the second sub-shell (120).

2. The IMU chip protection structure of claim 1, wherein, The flexible heat insulation layer (300) comprises a first sub-layer body (310) arranged on the inner wall of the first sub-shell (110) and located between the PCBA (200) and the first sub-shell (110); and a second sub-layer body (320) arranged on the second sub-shell (120) and located between the PCBA (200) and the second sub-shell (120). ​ ​ ​ 3. The IMU chip protection structure of claim 2, wherein, ​ 4. The IMU chip protection structure of claim 2, wherein, ​ 5. The IMU chip protection structure of claim 2, wherein, ​ ​ ​ 6. The IMU chip protection structure of claim 5, wherein, The first connecting part (112) and the second connecting part (122) are column structures with threaded holes, the PCBA (200) is provided with first matching holes (210) at positions corresponding to the first connecting part (112) and the second connecting part (122), the first sub-layer body (310) is provided with second matching holes at positions corresponding to the first connecting part (112) and the second connecting part (122), the second sub-layer body (320) is provided with third matching holes at positions corresponding to the first connecting part (112) and the second connecting part (122), the first matching holes (210), the second matching holes and the third matching holes are coaxially arranged with the threaded holes on the first connecting part (112), the threaded holes on the first connecting part (112) and the threaded holes on the second connecting part (122) are coaxially arranged, and bolts are used to threadedly connect the first matching holes (210), the second matching holes, the third matching holes, the threaded holes on the first connecting part (112) and the threaded holes on the second connecting part (122).

7. The IMU chip protection structure of claim 1, wherein, Also comprising: A conducting piece (400) having a pre-buried end (410) and a leading end (420), the pre-buried end (410) is arranged in the flexible thermal insulation layer (300), and the leading end (420) extends out of the flexible thermal insulation layer (300).

8. The IMU chip protection structure of claim 7, wherein, The leading end (420) extends out of the shell (100).

9. A positioning module, characterized by Comprising: The IMU chip protection structure of any one of claims 1 to 8.

10. A host, characterized by Comprising: The positioning module of claim 9.

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