Radiating tube shell structure of optical module

Abstract

The utility model relates to the technical field of optical modules, and discloses an optical module radiating tube shell structure which comprises a shell, a plurality of heat conduction assemblies made of aluminum nitride ceramic materials are arranged in the shell, and each heat conduction assembly comprises a heat conduction plate attached to the surface of an optical module circuit board. A heat conducting plate is arranged in the shell, a plurality of cooling fins are arranged on the outer side of the heat conducting plate, the cooling fins penetrate through the shell in a sliding mode and reach the outer side of the shell, a plurality of cushion blocks are arranged between the heat conducting plate and the shell, and the shell is composed of an upper shell body and a lower shell body which are connected in a buckled mode. Through cooperative use of the upper shell, the lower shell and the heat conduction assembly, the heat conduction plate is in direct contact with the circuit board of the optical module, heat generated by heating elements such as a chip can be rapidly absorbed, then the heat is transmitted to the shell and the cooling fins, the heat dissipation area is enlarged, and the overall heat dissipation efficiency is improved; compared with the prior art, the LED lamp has the advantages of being high in heat dissipation efficiency and good in heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of optical modules, in particular to an optical module heat dissipation pipe shell structure. BACKGROUND

[0002] In the working process of the optical module, the chip in the optical module, especially the laser used to generate optical signals, is the main source of power consumption. Since the laser in the optical module has strict requirements on temperature, the optical module needs an effective heat dissipation system to ensure normal operation.

[0003] Currently, the optical module usually adopts metal shell heat dissipation, and the heat generated by the chip is transmitted to the metal shell through the heat-conducting glue, and then the heat is dissipated by the shell. However, in the case of high-speed transmission and high heat flux density, this heat dissipation mode may face challenges, especially when running for a long time under high load, the heat conduction efficiency will decrease, causing the internal temperature of the optical module to rise, which may cause failure, reduce the service life, and increase the failure rate. CONTENT OF THE INVENTION

[0004] In order to solve the problem that the existing optical module transmits heat through the metal shell and the heat-conducting glue, and the efficiency is low, the application provides an optical module heat dissipation pipe shell structure.

[0005] The optical module heat dissipation pipe shell structure provided by the application adopts the following technical scheme:

[0006] An optical module heat dissipation pipe shell structure, comprising a shell, a plurality of heat-conducting components are arranged in the shell, the heat-conducting component comprises a heat-conducting plate attached to the surface of the optical module circuit board, a plurality of heat dissipation fins are arranged on the outer side of the heat-conducting plate, the heat dissipation fins slide through the shell and reach the outer side of the shell.

[0007] Preferably, a plurality of spacers are arranged between the heat-conducting plate and the shell, and the heat-conducting component is made of aluminum nitride ceramic material.

[0008] Preferably, the shell is composed of an upper shell and a lower shell connected by mutual buckling, and the heat dissipation fins pass through the corresponding upper shell and lower shell, respectively, wherein the upper shell comprises an upper clamping shell, and a plurality of insertion rods are arranged in the inner side of the upper clamping shell.

[0009] Preferably, the lower shell comprises a lower clamping shell, and a plurality of insertion barrels are arranged on the inner side of the lower clamping shell, and the plurality of insertion barrels are respectively sleeved on the outer side of the corresponding insertion rods.

[0010] Preferably, the insertion barrels and the outer side of the insertion rods are sleeved with the same support barrel, and the support barrel is located on the inner side of the two heat-conducting plates.

[0011] In summary, the application has the following beneficial technical effects:

[0012] By the cooperation of the upper shell, the lower shell and the heat conduction assembly, the heat conduction plate is directly contacted with the circuit board of the optical module, the heat generated by the heat generating elements such as chips can be quickly absorbed, and then the heat is transmitted to the shell and the heat dissipation fins, the heat dissipation area is expanded, and the overall heat dissipation efficiency is accelerated; compared with the prior art, the heat dissipation efficiency is high, and the heat dissipation effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 is the first perspective three-dimensional structure schematic diagram of the application embodiment;

[0014] Fig. 2 is the second perspective three-dimensional structure schematic diagram of the application embodiment;

[0015] Fig. 3 is the third perspective three-dimensional structure schematic diagram of the application embodiment.

[0016] Explanation of reference signs: 1, upper shell; 101, upper clamping shell; 102, insertion rod; 2, lower shell; 201, lower clamping shell; 202, insertion cylinder; 3, heat conduction assembly; 301, heat conduction plate; 302, heat dissipation fin; 4, supporting cylinder; 5, cushion block. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings Figs. 1-3 The application is further described in detail.

[0018] The application embodiment discloses a light module heat dissipation pipe shell structure. Referring to Figs. 1-3 A light module heat dissipation pipe shell structure, comprising an upper shell 1 and a lower shell 2, the upper shell 1 comprises an upper clamping shell 101 internally provided with a plurality of insertion rods 102, and the lower shell 2 comprises a lower clamping shell 201 internally provided with a plurality of insertion cylinders 202, the upper clamping shell 101 is clamped and connected with the lower clamping shell 201 by buckling, and at the same time, the upper clamping shell 101 is inserted into the corresponding lower clamping shell 201 to form a complete shell for fixing the circuit board of the optical module.

[0019] Referring to Fig. 2 A plurality of heat conduction assemblies 3 are installed in the shell, the heat conduction assembly 3 comprises a heat conduction plate 301, which is used for being attached to the surface of the circuit board of the optical module and directly contacted with the electronic elements, a plurality of heat dissipation fins 302 are installed on the side of the heat conduction plate 301 away from the circuit board, the heat dissipation fins 302 slide through the shell and reach the outside of the shell. The heat conduction plate 301 and the heat dissipation fin 302 are both made of high-efficiency heat conduction material, such as aluminum nitride ceramic material, which can be directly contacted with the circuit board of the optical module, can quickly absorb the heat generated by the heat generating elements such as chips, and then transmit the heat to the shell and the heat dissipation fin 302, expand the heat dissipation area, and accelerate the overall heat dissipation efficiency.

[0020] Referring to Fig. 3Several support cylinders 4 are installed between the two heat-conducting plates 301. The support cylinders 4 are located on the outside of the circuit board and are fitted onto the insert 202 and the insert rod 102. Several pads 5 are installed on the side of the heat-conducting plate 301 away from the circuit board, and the pads 5 are respectively fitted onto the corresponding insert 202 and insert rod 102. The support cylinders 4 and the pads 5 are both made of flexible material and are used to increase the distance between the heat-conducting plate 301 and the housing, while avoiding excessive pressure on the circuit board from the heat-conducting component 3.

[0021] The implementation principle of the optical module heat dissipation shell structure in this application is as follows:

[0022] When the optical module is operating, the electronic components generate heat. This heat is first absorbed by the heat-conducting plate 301, which, due to its use of highly efficient thermally conductive materials such as aluminum nitride ceramic, can quickly transfer heat from the circuit board to itself. The heat-conducting plate 301, having absorbed the heat, then transfers it to the heat sink 302. The heat sink 302 extends outward through the outer casing, increasing the surface area in contact with the outside air, thereby accelerating the heat dissipation process.

[0023] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0024] Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0025] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

[0026] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation shell structure for an optical module, comprising an outer shell, characterized in that: The interior of the housing is provided with a number of heat-conducting components (3). The heat-conducting components (3) include a heat-conducting plate (301) attached to the surface of the optical module circuit board. A number of heat sinks (302) are provided on the outside of the heat-conducting plate (301). The heat sinks (302) slide through the housing and reach the outside of the housing.

2. The optical module heat dissipation shell structure according to claim 1, characterized in that: Several pads (5) are provided between the heat-conducting plate (301) and the outer shell, and the heat-conducting component (3) is made of aluminum nitride ceramic material.

3. The optical module heat dissipation shell structure according to claim 1, characterized in that: The outer shell is composed of an upper shell (1) and a lower shell (2) that are interlocked with each other. The heat sink (302) passes through the corresponding upper shell (1) and lower shell (2) respectively. The upper shell (1) includes an upper retainer (101), and the upper retainer (101) is provided with a plurality of insert rods (102).

4. The optical module heat dissipation shell structure according to claim 3, characterized in that: The lower shell (2) includes a lower retainer (201), and a plurality of inserts (202) are provided on the inner side of the lower retainer (201), and the plurality of inserts (202) are respectively sleeved on the outer side of the corresponding insert rod (102).

5. The optical module heat dissipation shell structure according to claim 4, characterized in that: The insert (202) and the insert rod (102) are fitted with the same support cylinder (4), which is located inside the two heat-conducting plates (301).

Images