Solder strip connecting piece
By designing solder strip connectors, a stable connection is formed by the melting and diffusion of the tin-plated film, which solves the problem of weak solder strip overlap, improves welding reliability and rework efficiency, and reduces microcracks in the battery cells.
Patent Information
- Application Number
- CN202520256004.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-02-17
AI Technical Summary
If the welding strip overlap is not firmly welded, it is easy to pull it off, resulting in an unstable welding strip connection.
Design a solder strip connector, including a conductive substrate cavity and a tin-plated film layer. By heating the tin, the tin-plated film layer on the cavity wall of the solder strip and the tin-plated film layer on the solder strip melt and diffuse to form a stable connection structure.
This improved welding reliability and repair efficiency, and reduced microcracks in the battery cells.
Smart Images
Figure CN223652634U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photovoltaic field especially is connected with a solder strip connecting piece. BACKGROUND
[0002] In the preparation process of photovoltaic module, a plurality of cell pieces are connected into a string by using a solder strip. In actual production, solder strip welding anomaly is difficult to avoid. When welding anomaly occurs, sometimes the solder strip needs to be cut off for repair, and the disconnected solder strip is used for lap welding when the solder strip is connected again. However, the solder strip lap welding is prone to welding problems, which leads to the easy pull-out of the solder strip. SUMMARY
[0003] Therefore, it is necessary to provide a solder strip connecting piece to solve the problem of the insecure lap welding of the solder strip.
[0004] The utility model discloses the scheme as follows:
[0005] A solder strip connecting piece, comprising a conductive substrate cavity and a first tin-plated film layer, the conductive substrate cavity has a solder strip accommodating cavity and a first solder strip placing entrance and a second solder strip placing entrance respectively communicated with the solder strip accommodating cavity, the first solder strip placing entrance and the second solder strip placing entrance are oppositely arranged, and the first tin-plated film layer is arranged on the cavity wall of the solder strip accommodating cavity.
[0006] In one of the embodiments, the conductive substrate cavity is a middle-hole tubular structure, and the hollow hole of the middle-hole tubular structure forms the solder strip accommodating cavity.
[0007] In one of the embodiments, the conductive substrate cavity comprises a bearing part, a first limiting part and a second limiting part, the first limiting part and the second limiting part are connected to the opposite two ends of the bearing part, and the bearing part, the first limiting part and the second limiting part form the solder strip accommodating cavity.
[0008] In one of the embodiments, the conductive substrate cavity is a V-shaped groove or a U-shaped groove.
[0009] In one of the embodiments, the thickness of the first tin-plated film layer is 0.05mm-0.3mm.
[0010] In one of the embodiments, the solder strip connecting piece further comprises a second tin-plated film layer, and the second tin-plated film layer is arranged on the outer wall of the conductive substrate cavity.
[0011] In one of the embodiments, the thickness of the second tin-plated film layer is 0.05mm-0.3mm.
[0012] In one embodiment, the first tin-plated film layer and the second tin-plated film layer cooperate to wrap the surface of the conductive substrate cavity.
[0013] In one embodiment, the length of the welding strip connector is 5mm to 30mm.
[0014] In one embodiment, the conductive substrate cavity is a copper cavity, an aluminum cavity, or an iron cavity.
[0015] Compared with traditional solutions, the above-mentioned welded strip connectors have the following advantages:
[0016] When using the above-mentioned solder strip connector for rework, the two broken solder strips are inserted into the solder strip receiving cavity through the first solder strip inlet and the second solder strip inlet, respectively. Then, by heating and melting the tin, the first tin-plated film layer on the cavity wall of the solder strip receiving cavity and the tin-plated film layer on the solder strip melt and diffuse into each other to form a stable connection structure, thereby improving the reliability of the welding. Attached Figure Description
[0017] Figure 1 This is a cross-sectional view of a welding strip connector according to one embodiment;
[0018] Figure 2 For welding strip to be threaded Figure 1 A schematic diagram of the weld strip connector shown;
[0019] Figure 3 To utilize Figure 1 The diagram shows a weld strip connector for connecting weld strips.
[0020] Figure 4 A cross-sectional view of a welding strip connector according to another embodiment;
[0021] Figure 5 For welding strip to be threaded Figure 4 A schematic diagram of the weld strip connector shown;
[0022] Figure 6 A cross-sectional view of a welding strip connector according to another embodiment;
[0023] Figure 7 For welding strip to be threaded Figure 6 A schematic diagram of the weld strip connector shown;
[0024] Figure 8 A cross-sectional view of a welding strip connector according to another embodiment;
[0025] Figure 9 For welding strip to be threaded Figure 8 The diagram shows a weld strip connector.
[0026] Explanation of reference numerals in the attached figures:
[0027] 100. Solder strip connector; 110. Conductive substrate cavity; 111. Solder strip receiving cavity; 112. First solder strip inlet; 113. Second solder strip inlet; 120. First tin plating layer; 130. Second tin plating layer; 114. Supporting part; 115. First limiting part; 116. Second limiting part; 200. Solder strip; 210. Tin plating layer. Detailed Implementation
[0028] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0030] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] Please combine Figures 1 to 3 As shown, the solder strip connector 100 provided by this utility model includes a conductive substrate cavity 110 and a first tin-plated film layer 120. The conductive substrate cavity 110 has a solder strip receiving cavity 111 and a first solder strip inlet 112 and a second solder strip inlet 113 respectively communicating with the solder strip receiving cavity 111. The first solder strip inlet 112 and the second solder strip inlet 113 are arranged opposite to each other, and the first tin-plated film layer 120 is disposed on the cavity wall of the solder strip receiving cavity 111.
[0034] When using the above-mentioned solder strip connector 100 for rework, the two broken solder strips 200 are inserted into the solder strip receiving cavity 111 through the first solder strip inlet 112 and the second solder strip inlet 113, respectively. Then, by heating and melting the tin, the first tin-plated film layer 120 on the cavity wall of the solder strip receiving cavity 111 and the tin-plated film layer 210 on the solder strip 200 melt and diffuse into each other to form a stable connection structure, thereby improving the reliability of the welding.
[0035] In addition, the use of the aforementioned welding strip connector 100 can improve rework efficiency and reduce microcracks in the battery cells.
[0036] The conductive substrate cavity 110 is a conductive component, made of a conductive material such as metal, specifically copper, aluminum, iron, or an alloy of multiple metal elements, and performs the main function of current conduction. For example, in some examples, the conductive substrate cavity 110 is a copper cavity. In some examples, the conductive substrate cavity is an aluminum cavity. In some examples, the conductive substrate cavity is an iron cavity.
[0037] In addition to metallic tin (Sn), other elements can be added to the first tin-plated film layer 120. By adjusting the composition, it can meet the requirements of low-temperature welding or lamination welding processes. For example, adding lead (Pb), bismuth (Bi) and other components to the first tin-plated film layer 120 can reduce its welding temperature.
[0038] like Figure 1As shown, in some examples, the conductive substrate cavity 110 includes a support portion 114, a first limiting portion 115, and a second limiting portion 116. The support portion 114 supports the solder strip 200. The first limiting portion 115 and the second limiting portion 116 are connected to opposite ends of the support portion 114. The support portion 114, the first limiting portion 115, and the second limiting portion 116 cooperate to form a groove, i.e., a solder strip receiving cavity 111 is formed between the support portion 114, the first limiting portion 115, and the second limiting portion 116.
[0039] In some examples, the first limiting part 115, the second limiting part 116, and the supporting part 114 are all sheet-like structures. Furthermore, in some examples, the first limiting part 115 and the second limiting part 116 are perpendicular to the supporting part 114.
[0040] In some examples, the width of the support portion 114 is 0.3mm to 1mm. Further, in some examples, the width of the support portion 114 is 0.5mm to 0.8mm. In some specific examples, the width of the support portion 114 is 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc.
[0041] In some examples, the heights of the first limiting portion 115 and the second limiting portion 116 are independently 0.1 mm to 0.5 mm. Further, in some examples, the heights of the first limiting portion 115 and the second limiting portion 116 are independently 0.2 mm to 0.4 mm. In some specific examples, the heights of the first limiting portion 115 and the second limiting portion 116 are, for example, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc.
[0042] In some examples, the cross-sectional area of the conductive substrate cavity 110 is 0.05 mm². 2 ~0.5mm 2 Furthermore, in some examples, the cross-sectional area of the conductive substrate cavity 110 is 0.1 mm². 2 ~0.4mm 2 In some specific examples, the cross-sectional area of the conductive substrate cavity 110 is, for example, 0.05 mm². 2 0.1mm 2 0.15mm 2 0.2mm 2 0.25mm 2 0.3mm 2 0.35mm 2 0.4mm 2 0.45mm 2 0.5mm2 etc.
[0043] In Figure 1 In the specific example shown, the cross-section of the conductive substrate cavity 110 is in a "U" shape.
[0044] Such as Figure 4 As shown, in some examples, the conductive substrate cavity 110 is a hollow tubular structure, and the hollow hole of this hollow tubular structure forms the solder strip accommodating cavity 111. The two open ends of this hollow tubular structure respectively form the first solder strip insertion port 112 and the second solder strip insertion port 113.
[0045] The cross-sectional shape of the conductive substrate cavity 110 can be specifically set according to the cross-sectional shape of the solder strip 200 used.
[0046] In Figure 4 In the specific example shown, the cross-section of the conductive substrate cavity 110 is rectangular. Such as Figure 5 As shown, the solder strip connector 100 of this example can be applied to common flat solder strips.
[0047] In some examples, the length of the rectangular cross-section is 0.3 mm to 1 mm. Further, in some examples, the width of the rectangular cross-section is 0.5 mm to 0.8 mm. In some specific examples, the width of the rectangular cross-section is 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc.
[0048] In some examples, the width of the rectangular cross-section is 0.1 mm to 0.5 mm. Further, in some examples, the width of the rectangular cross-section is 0.2 mm to 0.4 mm. In some specific examples, the width of the rectangular cross-section is, for example, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc.
[0049] For currently common flat solder strips, a "square" - shaped solder strip connector 100 as shown in Figure 4 can be used, or a "U" - shaped solder strip connector 100 as shown in Figure 1 can also be used. When using the "square" - shaped solder strip connector 100, the solder strip needs to be respectively inserted into the solder strip accommodating cavity 111 from the first solder strip insertion port 112 and the second solder strip insertion port 113 in advance. Compared with the "U" - shaped solder strip connector 100, the "square" - shaped solder strip connector 100 has a larger contact area with the solder strip during welding, so the conductive effect is better.
[0050] In Figure 6 In the specific example shown, the cross-section of the conductive substrate cavity 110 is triangular. Such as Figure 7As shown, the solder strip connector 100 in this example is applicable to triangular solder strips.
[0051] In other examples, the cross-section of the conductive substrate cavity 110 is not limited to rectangle or triangle, but can also be other shapes, such as circle, ellipse, trapezoid, etc.
[0052] In other examples, the shape of the conductive substrate cavity 110 is not limited to the examples described above. For example, the conductive substrate cavity 110 can also be a V-groove, a U-groove, etc.
[0053] like Figure 8 As shown, the conductive substrate cavity 110 is a V-shaped groove. (As indicated...) Figure 9 As shown, the solder strip connector 100 in this example is applicable to triangular solder strips.
[0054] For triangular solder strips, the following can be used: Figure 6 The triangular weld strip connector 100 shown can also be made as follows: Figure 8 The V-shaped solder strip connector 100 is shown. When using a triangular solder strip connector 100, the solder strip needs to be pre-inserted into the solder strip receiving cavity 111 through the first solder strip inlet 112 and the second solder strip inlet 113, respectively. Compared to the V-shaped solder strip connector 100, the triangular solder strip connector 100 has a larger contact area with the solder strip during welding, thus providing better conductivity.
[0055] In some examples, the opening width of the aforementioned V-groove or U-groove is 0.3mm to 1mm. Further, in some examples, the opening width of the aforementioned V-groove or U-groove is 0.5mm to 0.8mm. In some specific examples, the opening width of the aforementioned V-groove or U-groove is, for example, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc.
[0056] In some examples, the length of the solder strip connector 100 is 5mm to 30mm. Further, in some examples, the length of the solder strip connector 100 is 10mm to 25mm. In some specific examples, the length of the solder strip connector 100 is, for example, 5mm, 7mm, 9mm, 11mm, 13mm, 15mm, 17mm, 19mm, 21mm, 23mm, 25mm, 27mm, 29mm, 30mm, etc.
[0057] In some examples, the thickness of the first tin-plated film layer 120 is 0.05 mm to 0.3 mm. Further, in some examples, the thickness of the first tin-plated film layer 120 is 0.1 mm to 0.25 mm. In some specific examples, the thickness of the first tin-plated film layer 120 is, for example, 0.05 mm, 0.07 mm, 0.09 mm, 0.11 mm, 0.13 mm, 0.15 mm, 0.17 mm, 0.19 mm, 0.21 mm, 0.23 mm, 0.25 mm, 0.27 mm, 0.29 mm, 0.3 mm, etc.
[0058] In some examples, a first color layer (not shown in the figure) is provided on the first tin-plated film layer 120. The first color layer can be, for example, but not limited to, black, white, etc., to meet the appearance requirements of photovoltaic modules.
[0059] In some examples, the solder strip connector 100 further includes a second tin-plated film layer 130, which is disposed on the outer wall of the conductive substrate cavity 110. The second tin-plated film layer 130 can isolate the conductive substrate cavity 110 from contact with the external environment and prevent the conductive substrate cavity 110 from reacting with external substances.
[0060] In some examples, the thickness of the second tin-plated film layer 130 is 0.05 mm to 0.3 mm. Further, in some examples, the thickness of the second tin-plated film layer 130 is 0.1 mm to 0.25 mm. In some specific examples, the thickness of the second tin-plated film layer 130 is, for example, 0.05 mm, 0.07 mm, 0.09 mm, 0.11 mm, 0.13 mm, 0.15 mm, 0.17 mm, 0.19 mm, 0.21 mm, 0.23 mm, 0.25 mm, 0.27 mm, 0.29 mm, 0.3 mm, etc.
[0061] In some examples, the first tin-plated film layer 120 and the second tin-plated film layer 130 cooperate to cover the surface of the conductive substrate cavity 110. In this way, the conductive substrate cavity 110 can be better isolated from the external environment, preventing the conductive substrate cavity 110 from reacting with external substances.
[0062] In addition to tin, other elements can be added to the second tin-plated film layer 130. By adjusting the composition, it can meet the requirements of low-temperature welding or lamination welding processes. For example, adding lead (Pb), bismuth (Bi) and other components to the second tin-plated film layer 130 can reduce its welding temperature.
[0063] In some examples, a second color layer (not shown in the figure) is provided on the second tin-plated film layer 130. The second color layer can be, for example, but not limited to, black, white, etc., to meet the appearance requirements of the photovoltaic module.
[0064] When using the above-mentioned solder strip connector 100 for rework, the two broken solder strips are inserted into the solder strip receiving cavity 111 through the first solder strip inlet 112 and the second solder strip inlet 113, respectively. Then, by heating and melting the tin, the first tin-plated film layer 120 on the cavity wall of the solder strip receiving cavity 111 and the tin-plated film layer 210 on the solder strip 200 melt and diffuse with each other to form a stable connection structure, thereby improving the reliability of the welding.
[0065] In addition, the use of the aforementioned welding strip connector 100 can improve rework efficiency and reduce microcracks in the battery cells.
[0066] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0067] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A welding strip connector (100), characterized in that, The solder strip connector (100) includes a conductive substrate cavity (110) and a first tin-plated film layer (120). The conductive substrate cavity (110) has a solder strip receiving cavity (111) and a first solder strip inlet (112) and a second solder strip inlet (113) respectively communicating with the solder strip receiving cavity (111). The first solder strip inlet (112) and the second solder strip inlet (113) are arranged opposite to each other. The first tin-plated film layer (120) is disposed on the cavity wall of the solder strip receiving cavity (111).
2. The welding strip connector (100) as described in claim 1, characterized in that, The conductive substrate cavity (110) is a hollow tubular structure, and the hollow holes of the hollow tubular structure form the solder strip accommodating cavity (111).
3. The welding strip connector (100) as described in claim 1, characterized in that, The conductive substrate cavity (110) includes a support portion (114), a first limiting portion (115), and a second limiting portion. The first limiting portion (115) and the second limiting portion are connected to opposite ends of the support portion (114), and the solder strip receiving cavity (111) is formed between the support portion (114), the first limiting portion (115), and the second limiting portion.
4. The welding strip connector (100) as described in claim 1, characterized in that, The conductive substrate cavity (110) is a V-shaped groove or a U-shaped groove.
5. The welding strip connector (100) as described in any one of claims 1 to 4, characterized in that, The thickness of the first tin-plated film layer (120) is 0.05mm~0.3mm.
6. The weld strip connector (100) as described in any one of claims 1 to 4, characterized in that, The solder strip connector (100) further includes a second tin-plated film layer (130), which is disposed on the outer wall of the conductive substrate cavity (110).
7. The welding strip connector (100) as described in claim 6, characterized in that, The thickness of the second tin-plated film layer (130) is 0.05mm~0.3mm.
8. The welding strip connector (100) as described in claim 6, characterized in that, The first tin-plated film layer (120) and the second tin-plated film layer (130) cooperate to wrap the surface of the conductive substrate cavity (110).
9. The weld strip connector (100) as described in any one of claims 1 to 4, 7, and 8, characterized in that, The length of the welding strip connector (100) is 5mm to 30mm.
10. The welding strip connector (100) as described in any one of claims 1 to 4, 7, and 8, characterized in that, The conductive substrate cavity (110) is a copper cavity, an aluminum cavity, or an iron cavity.