High-efficiency and high-precision LED (light-emitting diode) dispensing and die bonding device

Abstract

The utility model relates to the technical field of LED lamp production, in particular to an efficient and high-precision LED dispensing and die bonding device which comprises a machine shell, a sensor is fixedly installed in the machine shell, a transverse frame is fixedly installed on one side of the machine shell, a dispensing arm is fixedly installed on the side face of the transverse frame, and a suction arm is fixedly installed on the side face of the transverse frame. According to the utility model, the wafer tray, the sliding groove, the motor, the bevel gear, the hollow gear, the threaded rod and the clamping plate are arranged, the motor drives the bevel gear to be meshed with the hollow gear, the threaded rod rotates, and the clamping plate can slide in the sliding groove, so that the wafer tray is clamped and adjusted, and the wafer tray clamping device is suitable for wafer trays with different diameters; the stability and accuracy of the wafer tray in the dispensing and die bonding process are ensured, the limitation of depending on manual or semi-automatic adjustment is avoided, the accuracy and efficiency in the production process are improved, and the production requirements of products of different specifications are met.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp manufacturing technology, and in particular to a high-efficiency and high-precision LED dispensing and die bonding device. Background Technology

[0002] To improve the luminous efficacy, lifespan, and performance of LED chips, the bonding process between the LED chip and the substrate becomes particularly important. Die bonding technology is a key step in LED production, which firmly bonds the LED chip to the substrate using adhesive, requiring precise dispensing operations. Publication No. CN218945485U discloses an LED die bonding dispensing device, relating to the field of LED lamp production technology. This utility model discloses an LED die bonding dispensing device, including a worktable with a dispensing arm on it, and a dispensing tray assembly, including a movable frame with a rotating rod rotatably connected to it. Several dispensing trays are sequentially fixed to the rotating rod from top to bottom, and a dispensing needle on the dispensing arm extends into one of the dispensing trays. A lifting component is located below the movable frame, with its movable end fixed to the frame, allowing the frame to move up and down. A cleaning component is located on one side of the rotating rod, having a suction end located within one of the dispensing trays, with the dispensing needle and the suction end of the cleaning component also located within the tray. This invention facilitates the replacement and cleaning of the dispensing tray and adhesive, while shortening the dispensing tray replacement time to improve packaging efficiency. However, when dealing with wafers of different diameters, this device typically requires frequent changes of different fixtures or trays, which is cumbersome and error-prone, increasing production line downtime. This manual or semi-automatic approach is insufficient to meet the requirements of high-efficiency production, limiting the flexibility and efficiency of the production line. Especially when rapid switching between specifications or products is required, the production cycle is often affected, necessitating improvement. Utility Model Content

[0003] The purpose of this utility model is to solve the technical problems mentioned in the background art.

[0004] This utility model adopts the following technical solution: a high-efficiency and high-precision LED dispensing and die-bonding device, comprising a housing, a sensor fixedly installed inside the housing, a crossbeam fixedly installed on one side of the housing, a dispensing arm fixedly installed on the side of the crossbeam, a suction arm fixedly installed on the side of the crossbeam, a worktable provided inside the housing, a rotary motor fixedly installed inside the housing, a rotating rod fixedly installed at the output end of the rotary motor, a circular plate fixedly installed on the surface of the rotating rod, a placement plate fixedly installed on the surface of the circular plate, a heating element fixedly installed inside the placement plate, a glue tray slidably connected inside the placement plate, an installation plate fixedly installed inside the housing, a wafer tray fixedly installed on the surface of the installation plate, a groove formed on the surface of the wafer tray, a motor fixedly installed inside the wafer tray, a bevel gear fixedly installed at the output end of the motor, a hollow gear meshing on the surface of the bevel gear, a threaded rod fixedly installed inside the hollow gear, a stabilizing block rotatably connected to one end of the threaded rod, a fixing plate rotatably connected to the other end of the threaded rod, and a clamping plate threadedly connected to the surface of the threaded rod.

[0005] Preferably, the interior of the slide groove is slidably connected to the surface of the clamping plate, and the slide groove is evenly distributed on the surface of the wafer tray. Here, the slide groove allows the clamping plate to move flexibly to accommodate wafers of different sizes, improving the versatility of the device. The even distribution of the slide groove allows multiple clamping plates to clamp the wafer.

[0006] Preferably, the top of the stabilizing block is fixedly connected to the interior of the wafer tray, and the side of the fixing plate is fixedly connected to the interior of the wafer tray. Here, the connection between the stabilizing block and the fixing plate ensures the stability of the wafer tray within the device, preventing positional displacement due to external interference or equipment vibration during use. Simultaneously, the fixing plate ensures a secure connection between the tray and other components within the device, thus improving operational stability and ensuring wafer positioning accuracy.

[0007] Preferably, the surface of the rotating rod is rotatably connected to the interior of the housing. This rotatable connection allows the circular plate and the placement plate to rotate smoothly.

[0008] Preferably, a fixing block is fixedly installed on the surface of the placement plate, a spring is fixedly installed inside the fixing block, a clamping plate is fixedly installed at one end of the spring, a pinching plate is fixedly installed on the surface of the clamping plate, and a locking block is slidably connected to the surface of the clamping plate. Here, the fixing block and spring configuration allows for quick installation and removal of the glue tray, improving operational convenience. The cooperation of the clamping plate and locking block ensures the stability of the glue tray during high-speed operation, preventing the glue tray from falling off or shifting, further improving the accuracy and efficiency of dispensing.

[0009] Preferably, the surface of the clamping plate is slidably connected to the interior of the fixing block, the side of the clamping block is fixedly connected to the interior of the glue tray, and the surface of the pinching plate is slidably connected to the interior of the fixing block. Here, the slidable connection between the clamping plate and the pinching plate makes the installation and removal of the glue tray more flexible, allowing operators to quickly change the glue tray and reducing downtime. The fixed connection between the clamping block and the glue tray ensures the stability of the glue tray during high-speed operation, preventing glue overflow or uneven distribution.

[0010] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0011] 1. This utility model incorporates a wafer tray, a slide groove, a motor, a bevel gear, a hollow gear, a threaded rod, and a clamping plate. The motor drives the bevel gear to mesh with the hollow gear, while the threaded rod rotates. The clamping plate can slide within the slide groove, enabling the wafer tray to be clamped and adjusted. This adapts to wafer trays of different diameters, ensuring the stability and accuracy of the wafer tray during dispensing and die bonding processes. It avoids the limitations of relying on manual or semi-automatic adjustments, improves the precision and efficiency of the production process, and meets the production needs of products with different specifications.

[0012] 2. This utility model incorporates a spring, a clamping plate, a pinching plate, and a clamping block. The clamping plate pinches the clamping plate, and the clamping plate is firmly inserted into the clamping block under the action of the spring. This ensures that the glue tray is stably fixed in the device, improving the efficiency of glue tray replacement and avoiding the tedious steps of manual adjustment and fixing. Through the action of the spring, the fixing between the clamping plate and the clamping block is more secure and faster, reducing errors in the glue tray fixing process, improving the stability of fixing, increasing the efficiency of the production line, reducing downtime, and avoiding dispensing accuracy problems caused by glue tray loosening or offset, thereby improving the overall production accuracy and product quality. Attached Figure Description

[0013] Figure 1 A schematic diagram of the overall structure of an efficient and high-precision LED dispensing and die bonding device is provided for this utility model.

[0014] Figure 2 An exploded view of the overall structure of a high-efficiency and high-precision LED dispensing and die bonding device is provided for this utility model.

[0015] Figure 3 A schematic diagram of the hollow gear section of the high-efficiency and high-precision LED dispensing and die bonding device proposed in this utility model;

[0016] Figure 4 A schematic diagram of the fixing block of a high-efficiency and high-precision LED dispensing and die bonding device is provided for this utility model.

[0017] Figure 5This invention proposes a high-efficiency and high-precision LED dispensing and die bonding device. Figure 4 Enlarged view of point A in the middle.

[0018] Legend:

[0019] 1. Housing; 2. Sensor; 3. Horizontal frame; 4. Dispensing arm; 5. Suction arm; 6. Worktable; 7. Rotary motor; 8. Rotating rod; 9. Circular plate; 10. Placement plate; 11. Heating element; 12. Glue tray; 13. Mounting plate; 14. Wafer tray; 15. Slide groove; 16. Motor; 17. Bevel gear; 18. Hollow gear; 19. Threaded rod; 20. Stabilizing block; 21. Fixing plate; 22. Clamping plate; 23. Fixing block; 24. Spring; 25. Clamping plate; 26. Pinch plate; 27. Clamping block. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Example 1

[0023] Please see Figure 1-5This utility model provides a technical solution: a high-efficiency and high-precision LED dispensing and die bonding device, including a housing 1. A sensor 2 is fixedly installed inside the housing 1 to help control chip alignment. A crossbeam 3 is fixedly installed on one side of the housing 1. A dispensing arm 4 is fixedly installed on the side of the crossbeam 3. A suction arm 5 is fixedly installed on the side of the crossbeam 3. A worktable 6 is provided inside the housing 1. A rotary motor 7 is fixedly installed inside the housing 1. A rotating rod 8 is fixedly installed at the output end of the rotary motor 7. A circular plate 9 is fixedly installed on the surface of the rotating rod 8. A placement plate 10 is fixedly installed on the surface of the circular plate 9. A heating element 11 is fixedly installed inside the placement plate 10. A sliding connection is provided inside the placement plate 10. A rubber tray 12 is attached. An mounting plate 13 is fixedly installed inside the housing 1. A wafer tray 14 is fixedly installed on the surface of the mounting plate 13. A groove 15 is formed on the surface of the wafer tray 14. A motor 16 is fixedly installed inside the wafer tray 14. A bevel gear 17 is fixedly installed at the output end of the motor 16. A hollow gear 18 meshes with the surface of the bevel gear 17. A threaded rod 19 is fixedly installed inside the hollow gear 18. A stabilizing block 20 is rotatably connected to one end of the threaded rod 19, and a fixing plate 21 is rotatably connected to the other end of the threaded rod 19. A clamping plate 22 is threadedly connected to the surface of the threaded rod 19. A sensor 2, model Optris, is first fixedly installed inside the housing 1. A CT laser displacement sensor is used to monitor the operating status of the equipment in real time or to inspect the surface condition of the LED chips and substrates to be processed. A dispensing arm 4 and a pick-up arm 5 are fixedly installed on one side of the crossbeam 3 for precise dispensing and chip handling, respectively. A rotating motor 7 drives the rotating rod 8 to rotate, which in turn drives the circular plate 9 to rotate. A placement plate 10 is installed on the circular plate 9, and a heating element 11 is installed inside it to provide a constant heat source for the adhesive to cure. The adhesive tray 12 can slide inside the placement plate 10 and its position is precisely adjusted through automated control. A wafer tray 14 is used to hold LED wafers. A motor 16 and its output bevel gear 17 are installed inside the wafer tray 14. The bevel gear 17 meshes with a hollow gear 18, thereby driving the threaded rod 19 to rotate. The two ends of the threaded rod 19 are respectively connected to a stabilizing block 20 and a... A fixing plate 21 is connected to a clamping plate 22 via a threaded connection, which effectively fixes and adjusts the position of the wafer tray 14. The interior of a sliding groove 15 is slidably connected to the surface of the clamping plate 22. The grooves 15 are evenly distributed on the surface of the wafer tray 14, allowing the wafer tray 14 to quickly adjust its position during different processing steps to accommodate wafers of different sizes or shapes, increasing the adaptability and flexibility of the equipment. The top of a stabilizing block 20 is fixedly connected to the interior of the wafer tray 14, and the side of the fixing plate 21 is fixedly connected to the inner side of the wafer tray 14. The stabilizing block 20 provides stable support for the wafer tray 14, ensuring that it does not tilt or shift during movement. The connection between the fixing plate 21 and the wafer tray 14 enhances the positional stability of the wafer tray 14 throughout the entire working process.The surface of the rotating rod 8 is rotatably connected to the interior of the housing 1, and this rotatable connection allows the circular plate 9 and the placement plate 10 to rotate smoothly.

[0024] Example 2

[0025] Please see Figure 1-5 A fixing block 23 is fixedly installed on the surface of the placement plate 10. A spring 24 is fixedly installed inside the fixing block 23. A clamping plate 25 is fixedly installed at one end of the spring 24. A pinching plate 26 is fixedly installed on the surface of the clamping plate 25. A clamping block 27 is slidably connected to the surface of the clamping plate 25. The pinching plate 26 is connected to the fixing block 23 through the action of the clamping plate 25. The surface of the clamping plate 25 is connected to the clamping block 27. When the rubber tray 12 needs to be fixed, the clamping plate 25 of the pinching plate 26 will firmly clamp the rubber tray 12 through the force of the spring 24, ensuring the stability and positioning accuracy of the rubber tray 12 during operation. The surface of the clamping plate 25 is slidably connected to the interior of the fixing block 23. The side of the clamping block 27 is fixedly connected to the interior of the rubber tray 12. The surface of the pinching plate 26 is slidably connected to the interior of the fixing block 23. When it is necessary to disassemble or replace the rubber tray 12, the clamping plate 25 can be easily moved through the sliding connection between the clamping plate 25 and the clamping block 27, allowing the rubber tray 12 to be quickly removed or installed.

[0026] Working principle: First, motor 16 drives bevel gear 17 to mesh with hollow gear 18. Hollow gear 18 rotates threaded rod 19, causing clamping plate 22 to slide precisely within the groove 15 on the surface of wafer tray 14, thereby adjusting the position of wafer tray 14 and ensuring its stability and accuracy. This allows it to adapt to wafer trays 14 of different diameters, avoiding the limitations of relying on manual or semi-automatic adjustment. Motor 7 drives rotating rod 8 to rotate, which in turn drives circular plate 9 and placement plate 10 to rotate, ensuring that adhesive tray 12 rotates stably and comes into contact with heating element 11. Heating ensures uniform curing of the adhesive. Through the force of spring 24, clamping plate 25 is firmly clamped into clamping block 27, ensuring the stable fixation of adhesive tray 12 and avoiding the tedious steps of manual adjustment and fixation. The pinching plate 26 makes the installation and removal of adhesive tray 12 more flexible, reducing downtime.

[0027] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A high-efficiency and high-precision LED dispensing and die bonding device, comprising a housing (1), characterized in that: A sensor (2) is fixedly installed inside the housing (1). A crossbeam (3) is fixedly installed on one side of the housing (1). A glue-dispensing arm (4) is fixedly installed on the side of the crossbeam (3). A suction arm (5) is fixedly installed on the side of the crossbeam (3). A worktable (6) is provided inside the housing (1). A rotary motor (7) is fixedly installed inside the housing (1). A rotating rod (8) is fixedly installed at the output end of the rotary motor (7). A circular plate (9) is fixedly installed on the surface of the rotating rod (8). A placement plate (10) is fixedly installed on the surface of the circular plate (9). A heating element (11) is fixedly installed inside the placement plate (10). A glue tray (12) is slidably connected inside the placement plate (10). An installation plate (13) is fixedly installed inside the housing (1). A wafer tray (14) is fixedly installed on the surface of the installation plate (13). A groove (15) is opened on the surface of the wafer tray (14). A motor (16) is fixedly installed inside the wafer tray (14). A bevel gear (17) is fixedly installed at the output end of the motor (16). A hollow gear (18) meshes with the surface of the bevel gear (17). A threaded rod (19) is fixedly installed inside the hollow gear (18). A stabilizing block (20) is rotatably connected to one end of the threaded rod (19). A fixing plate (21) is rotatably connected to the other end of the threaded rod (19). A clamping plate (22) is threadedly connected to the surface of the threaded rod (19).

2. The high-efficiency and high-precision LED dispensing and die bonding device according to claim 1, characterized in that: The interior of the slide groove (15) is slidably connected to the surface of the clamping plate (22), and the slide groove (15) is evenly distributed on the surface of the wafer tray (14).

3. The high-efficiency and high-precision LED dispensing and die bonding device according to claim 1, characterized in that: The top of the stabilizing block (20) is fixedly connected to the interior of the wafer tray (14), and the side of the fixing plate (21) is fixedly connected to the interior of the wafer tray (14).

4. The high-efficiency and high-precision LED dispensing and die bonding device according to claim 1, characterized in that: The surface of the rotating rod (8) is rotatably connected to the interior of the housing (1).

5. The high-efficiency and high-precision LED dispensing and die bonding device according to claim 1, characterized in that: A fixing block (23) is fixedly installed on the surface of the placement plate (10). A spring (24) is fixedly installed inside the fixing block (23). A clamping plate (25) is fixedly installed at one end of the spring (24). A pinching plate (26) is fixedly installed on the surface of the clamping plate (25). A clamping block (27) is slidably connected to the surface of the clamping plate (25).

6. The high-efficiency and high-precision LED dispensing and die bonding device according to claim 5, characterized in that: The surface of the card plate (25) is slidably connected to the interior of the fixing block (23), the side of the card block (27) is fixedly connected to the interior of the rubber disc (12), and the surface of the pinch plate (26) is slidably connected to the interior of the fixing block (23).

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