Wafer film deposition preparation system
By installing a protective shield assembly and a gas filtration system between the SMIF unit and the open-gear thin film deposition equipment, the contamination problem during wafer transport was solved, enabling efficient and clean wafer transport and processing, and improving production efficiency and yield.
Patent Information
- Application Number
- CN202423126519.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-18
AI Technical Summary
During the wafer thin film deposition process, when the SMIF device is connected to the open-gate thin film deposition equipment, the wafer is exposed to an open environment and is easily affected by dust particles or other contaminants, which increases the complexity of operation during production, the probability of human error, and yield loss.
A wafer thin film deposition system was designed, including an SMIF device, an open-type gate thin film deposition equipment, a protective cover assembly, a fixed connection mechanism, and a docking sealing mechanism. The protective cover assembly forms a contamination-proof lateral conveying channel between the SMIF device and the open-type gate thin film deposition equipment, and inner and outer ring protective layers and laminar flow fans are set to achieve gas filtration and ventilation functions, ensuring a clean environment during the wafer conveying process.
It effectively prevents wafers from being contaminated during transport, reduces operational complexity and the probability of human error, improves production efficiency and yield, and reduces labor costs.
Smart Images
Figure CN223660200U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor processing, specifically relates to a wafer film deposition preparation system. BACKGROUND
[0002] Film deposition is one of four processes of semiconductor manufacturing, in such high-precision environment of semiconductor manufacturing, small pollution can lead to the decline of product yield. Open type card lock film deposition equipment, in actual production, the operator needs to place the wafer in the piece lock, and the piece lock is placed on the equipment card lock platform, in this process, the wafer is in an unsealed state, which can cause new particles and pollution of the equipment. Moreover, frequent opening of the equipment door and frequent manual operation by personnel can increase the complexity of operation and the probability of operation errors, reduce the work efficiency in the production process, increase the labor cost and cause yield loss.
[0003] In order to ensure the quality of wafers during transportation between different processes and avoid dust particles or other pollution, more and more transportation work uses standard transportation devices, such as SMIF (standard mechanical interface, SMIF for short) devices. At present, SMIF devices are commonly used wafer loading and detection integrated devices in the industry.
[0004] However, although the SMIF device has an automatic conveying assembly and has dustproof protection for wafers, when the SMIF device is connected with the open type card lock film deposition equipment, there is still an exposed connecting section. That is, during the process of taking the wafer out of the SMIF device and conveying it to the platform of the open type card lock film deposition equipment, the wafer or its storage box still has an exposed space, and there is still a high risk of dust particles or other pollution. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a wafer film deposition preparation system, which aims at improving the anti-pollution performance of the wafer film deposition processing process. The utility model realizes the purpose by the following scheme.
[0006] A wafer film deposition preparation system comprises an SMIF device and an open type card lock film deposition equipment, characterized in that it further comprises a protective cover assembly, a fixed connection mechanism and a butt joint sealing mechanism. The protective cover assembly has a first side end opening, a second side end opening and a horizontal conveying channel connecting the first side end opening and the second side end opening. The first side end opening is sealingly connected to the material port of the open type card lock film deposition equipment through the fixed connection mechanism, the second side end opening is fixedly provided with the butt joint sealing mechanism, and the material port of the SMIF device is sealingly butted or separated with the butt joint sealing mechanism.
[0007] As a preferred technical scheme, the protective cover assembly comprises an inner ring protective layer, an outer ring protective layer, a laminar flow fan and a first filter assembly; the inner ring protective layer and the outer ring protective layer are sealingly connected to each other at the first side end opening and the second side end opening respectively, an annular air flow channel is formed between the inner ring protective layer and the outer ring protective layer, and an inner cavity of the inner ring protective layer forms the transverse conveying channel; an air supply opening and an air return opening are arranged on the inner ring protective layer, and an air exchange opening is arranged on the outer ring protective layer; the laminar flow fan is arranged at the air supply opening and is used to supply air between the inner ring protective layer and the outer ring protective layer to the transverse conveying channel, and the first filter assembly is arranged on the air supply opening.
[0008] As a preferred technical scheme, the protective cover assembly further comprises a circulating fan arranged at the air exchange opening; and a second filter assembly is arranged on an air flow channel from the air exchange opening to the air supply opening.
[0009] As a preferred technical scheme, a third filter assembly is arranged on the air exchange opening.
[0010] As a preferred technical scheme, the air supply opening is arranged at a top of the inner ring protective layer, the air return opening is arranged at a bottom of the inner ring protective layer, and the air exchange opening is arranged at a lower side of the outer ring protective layer.
[0011] As a preferred technical scheme, the wafer thin film deposition preparation system further comprises a positioning assembly, the positioning assembly comprises a positioning seat and a limiting piece; the positioning seat is fixedly arranged at a side of a material port of the open shutter thin film deposition device at a preset distance; and a limited piece of the SMIF device is arranged at a bottom of the SMIF device and can be limited by the limiting piece.
[0012] As a preferred technical scheme, the positioning assembly further comprises a locking piece, and a locked piece of the SMIF device is arranged at a bottom of the SMIF device and can be locked by the locking piece.
[0013] As a preferred technical scheme, the positioning assembly further comprises a guide rail, a guide wheel of the SMIF device is arranged at a bottom of the SMIF device and can be matched with the guide rail, and the limiting piece and the locking piece are arranged along a line of the guide rail.
[0014] As a preferred technical scheme, a communication interconnection line is arranged between the open shutter thin film deposition device and the SMIF device.
[0015] As a preferred technical scheme, a docking interlocking mechanism is arranged between the open shutter thin film deposition device and the SMIF device.
[0016] The wafer thin film deposition preparation system provided by the utility model provides a protective cover assembly, and the first side end opening of the protective cover assembly is fixedly and sealingly connected to the material opening of the open type latch thin film deposition equipment, when the SMIF device moves to one side of the material opening of the open type latch thin film deposition equipment, the second side end opening of the protective cover assembly and the material opening of the SMIF device are sealingly butted; in this way, the protective cover assembly forms a horizontal conveying channel for preventing pollution between the connection section of the open type latch thin film deposition equipment and the SMIF device; so that when the SMIF device and the open type latch thin film deposition equipment convey wafers, the wafers will not be polluted by dust, and the dust will not be brought into the thin film deposition equipment. In addition, the protective cover assembly in the utility model is provided with a double-layer structure, can realize the functions of air supply filtering and air return and air exchange, so that the horizontal conveying channel and the gas generated by the SMIF device and the open type latch thin film deposition equipment can be renewed, and the standard atmospheric pressure is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 The wafer thin film deposition preparation system provided by the utility model provides a protective cover assembly, and the first side end opening of the protective cover assembly is fixedly and sealingly connected to the material opening of the open type latch thin film deposition equipment, when the SMIF device moves to one side of the material opening of the open type latch thin film deposition equipment, the second side end opening of the protective cover assembly and the material opening of the SMIF device are sealingly butted; in this way, the protective cover assembly forms a horizontal conveying channel for preventing pollution between the connection section of the open type latch thin film deposition equipment and the SMIF device; so that when the SMIF device and the open type latch thin film deposition equipment convey wafers, the wafers will not be polluted by dust, and the dust will not be brought into the thin film deposition equipment. In addition, the protective cover assembly in the utility model is provided with a double-layer structure, can realize the functions of air supply filtering and air return and air exchange, so that the horizontal conveying channel and the gas generated by the SMIF device and the open type latch thin film deposition equipment can be renewed, and the standard atmospheric pressure is ensured.
[0018] Figure 2 The wafer thin film deposition preparation system provided by the utility model provides a protective cover assembly, and the first side end opening of the protective cover assembly is fixedly and sealingly connected to the material opening of the open type latch thin film deposition equipment, when the SMIF device moves to one side of the material opening of the open type latch thin film deposition equipment, the second side end opening of the protective cover assembly and the material opening of the SMIF device are sealingly butted; in this way, the protective cover assembly forms a horizontal conveying channel for preventing pollution between the connection section of the open type latch thin film deposition equipment and the SMIF device; so that when the SMIF device and the open type latch thin film deposition equipment convey wafers, the wafers will not be polluted by dust, and the dust will not be brought into the thin film deposition equipment. In addition, the protective cover assembly in the utility model is provided with a double-layer structure, can realize the functions of air supply filtering and air return and air exchange, so that the horizontal conveying channel and the gas generated by the SMIF device and the open type latch thin film deposition equipment can be renewed, and the standard atmospheric pressure is ensured.
[0019] Figure 3 The wafer thin film deposition preparation system provided by the utility model provides a protective cover assembly, and the first side end opening of the protective cover assembly is fixedly and sealingly connected to the material opening of the open type latch thin film deposition equipment, when the SMIF device moves to one side of the material opening of the open type latch thin film deposition equipment, the second side end opening of the protective cover assembly and the material opening of the SMIF device are sealingly butted; in this way, the protective cover assembly forms a horizontal conveying channel for preventing pollution between the connection section of the open type latch thin film deposition equipment and the SMIF device; so that when the SMIF device and the open type latch thin film deposition equipment convey wafers, the wafers will not be polluted by dust, and the dust will not be brought into the thin film deposition equipment. In addition, the protective cover assembly in the utility model is provided with a double-layer structure, can realize the functions of air supply filtering and air return and air exchange, so that the horizontal conveying channel and the gas generated by the SMIF device and the open type latch thin film deposition equipment can be renewed, and the standard atmospheric pressure is ensured.
[0020] Figure 4 The wafer thin film deposition preparation system provided by the utility model provides a protective cover assembly, and the first side end opening of the protective cover assembly is fixedly and sealingly connected to the material opening of the open type latch thin film deposition equipment, when the SMIF device moves to one side of the material opening of the open type latch thin film deposition equipment, the second side end opening of the protective cover assembly and the material opening of the SMIF device are sealingly butted; in this way, the protective cover assembly forms a horizontal conveying channel for preventing pollution between the connection section of the open type latch thin film deposition equipment and the SMIF device; so that when the SMIF device and the open type latch thin film deposition equipment convey wafers, the wafers will not be polluted by dust, and the dust will not be brought into the thin film deposition equipment. In addition, the protective cover assembly in the utility model is provided with a double-layer structure, can realize the functions of air supply filtering and air return and air exchange, so that the horizontal conveying channel and the gas generated by the SMIF device and the open type latch thin film deposition equipment can be renewed, and the standard atmospheric pressure is ensured.
[0021] BRIEF DESCRIPTION OF DRAWINGS DETAILED DESCRIPTION
[0022] The technical solutions of the embodiments of the present application will be explained and described below in combination with the drawings of the embodiments of the present application. However, the following embodiments are only preferred embodiments of the present application, and are not all. Based on the embodiments in the embodiments, other embodiments obtained by those skilled in the art without creative labor are all within the protection scope of the present application.
[0023] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", "front", "back", and the like are all based on the orientations or relative positional relationships shown in the drawings, and are intended to facilitate clear description of the structure of the product or device, and are not intended to limit the actual orientation of the product or device in the process of production, use, sale, etc.
[0024] In addition, the terms "first" and "second" are only used for the purpose of distinguishing in the description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "multiple" is two or more, unless otherwise explicitly limited.
[0025] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "setting", "fixing", "assembly" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0026] In the present application, unless otherwise explicitly specified and limited, the first feature "above" or "below" the second feature can include the direct contact of the first and second features, or can include the contact of the first and second features through another feature between them. Moreover, the first feature "above", "above" and "above" of the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0027] The utility model discloses in detail the specific implementation below the figure, and the technical features in each specific embodiment can be used mutually on the premise of not conflicting with each other.
[0028] As Figure 1 The wafer thin film deposition preparation system provided by the embodiment includes a SMIF device 10, an open shutter thin film deposition equipment 20, a protective cover assembly 30, a fixed connection mechanism 40 and a docking sealing mechanism 50 (not shown in combination with Figure 2
[0029] As Figure 2 The protective cover assembly 30 has a first side end opening 301, a second side end opening 302 and a transverse conveying channel 303 communicating the first side end opening 301 and the second side end opening 302. The first side end opening 301 is sealingly connected to the material port of the open shutter thin film deposition equipment 20 through the fixed connection mechanism 40, and the docking sealing mechanism 50 is fixedly arranged on the second side end opening 302. The docking sealing mechanism 50 is made of flexible material. When the SMIF device 10 is loaded with wafers to be processed and moves to the side of the material port of the open shutter thin film deposition equipment 20, the material port of the SMIF device 10 is sealingly docked with the docking sealing mechanism 50. When the SMIF device needs to be moved away, the material port of the SMIF device is separated from the docking sealing mechanism 50.
[0030] In the above embodiment, the first side end opening 301 of the protective cover assembly 30 is sealingly and fixedly connected to the material port of the open shutter thin film deposition equipment 20, and the second side end opening 302 of the protective cover assembly 30 is sealingly docked with the material port of the SMIF device 10. In this way, the protective cover assembly 30 forms a dustproof transverse conveying channel 303 at the joint between the open shutter thin film deposition equipment 20 and the SMIF device 10. Therefore, when the wafers are conveyed between the SMIF device 10 and the open shutter thin film deposition equipment 20, the wafers will not be contaminated by dust.
[0031] As Figure 3 The protective cover assembly 30 includes an inner ring protection layer 31, an outer ring protection layer 32, a laminar flow fan 33 and a first filter assembly 34. The inner ring protection layer 31 and the outer ring protection layer 32 are sealingly connected to each other at the first side end opening 301 of the protective cover assembly 30. Similarly, the inner ring protection layer 31 and the outer ring protection layer 32 are also sealingly connected to each other at the second side end opening 302 of the protective cover assembly 30. In this way, an annular airflow channel 304 is formed between the inner ring protection layer 31 and the outer ring protection layer 32, and the inner cavity of the inner ring protection layer 31 forms the transverse conveying channel 303.
[0032] Continuing to refer toFigure 3 The inner ring protection layer 31 is provided with an air inlet 311 and an air outlet 312, and the outer ring protection layer 32 is provided with an air exchange port 325. The laminar flow fan 34 is arranged at the air inlet 311 and used to supply air between the inner ring protection layer and the outer ring protection layer to the horizontal conveying channel 303. The air inlet 311 is provided with a first filter assembly 34. In addition, the air outlet 312 exchanges the air in the horizontal conveying channel 303 while the air inlet 311 continuously supplies air.
[0033] Continuing to refer to Figure 3 The protection cover assembly 30 further comprises a circulating fan 35 arranged at the air exchange port 325 and used to exchange the inner and outer air. In addition, the air exchange port 325 to the air inlet 311 is provided with a second filter assembly 36, and the air exchange port is provided with a third filter assembly 37.
[0034] As a specific embodiment, continuing to refer to Figure 3 The air inlet 311 is arranged at the top of the inner ring protection layer 31, the air outlet 312 is arranged at the bottom of the inner ring protection layer 31, and the air exchange port 325 is arranged at the lower side of the outer ring protection layer 32. Preferably, the lower sides of the outer ring protection layer 32 are both provided with the air exchange port 325, and each air exchange port 325 is correspondingly provided with the circulating fan 35 and the third filter assembly 37.
[0035] The protection cover assembly is arranged in a double-layer structure, which can realize the functions of air supply filtering and air return and exchange, so that the air in the horizontal conveying channel and even the air generated by the SMIF device and the open shutter film deposition equipment can be updated, while the standard atmospheric pressure is ensured. Specifically, the laminar flow fan 34 is used to blow high-purity air to the horizontal conveying channel 303 (i.e. the jointing section of the SMIF device 10 and the open shutter film deposition equipment 20), and the air flows downward and flows out of the air outlet 312 at the bottom of the inner ring protection layer 31 to form a positive pressure clean environment. In addition, the air flowing out of the air outlet 312 can flow to the laminar flow fan 34 through the air filter assembly to realize recycling, thereby reducing the air filtering amount, saving filtering cost, energy saving and environmental protection. Furthermore, the air can be updated from the air exchange ports arranged at the lower sides of the outer ring protection layer 32.
[0036] Combined with Figure 1 and Figure 4As shown, the wafer thin film deposition preparation system provided by the embodiment further comprises a positioning assembly, which comprises a positioning seat 61 and a limiting piece 62; the positioning seat 61 is fixedly arranged at a side of the material port of the open shutter thin film deposition device 20 at a preset distance; the preset distance is greater than 500 mm and less than 80% of the maximum moving distance of the conveying device 14 of the SMIF device 10. The bottom of the SMIF device is provided with a limited piece 16 capable of being limited by the limiting piece 62. In this way, when the SMIF device 10 is used in cooperation with the open shutter thin film deposition device 20, the SMIF device 10 can be limited to a predetermined position through cooperation of the limiting piece 62 and the limited piece 16, and when the SMIF device 10 is limited to the predetermined position, the material port of the SMIF device 10 is just in abutting and sealing abutment with the abutting and sealing mechanism 50.
[0037] As a preferred embodiment, the positioning assembly further comprises a locking piece 63, and the bottom of the SMIF device 10 is provided with a locked piece 17 capable of being locked by the locking piece 63. In this way, when the SMIF device 10 is limited to the predetermined position, the SMIF device 10 is further locked at the predetermined position through cooperation of the locking piece 63 and the locked piece 17.
[0038] As a further preferred embodiment, the positioning assembly further comprises a guide rail 65, and the bottom of the SMIF device 10 is provided with a guide wheel 19 capable of cooperating with the guide rail 65, and the limiting piece 62 and the locking piece 63 are arranged along the guide rail 65. In this way, through arrangement of the guide rail 65 and the guide wheel 19, the SMIF device 10 is more convenient to guide to the predetermined position.
[0039] In addition, an abutting interlocking mechanism can be arranged between the open shutter thin film deposition device 20 and the SMIF device 10 to further enhance the anti-misoperation when the two are used in cooperation. In addition, a communication interconnection line 18 is arranged between the open shutter thin film deposition device 20 and the SMIF device 10, so that the two can realize interactive and cooperative operation through communication.
[0040] In the embodiment, the structures of the SMIF device 10 and the open shutter thin film deposition device 20 are both prior art, and the operation process of the embodiment will be exemplarily described below based on the basic structures:
[0041] Among them, the SMIF device mainly comprises a SMIF loading port 11, a cassette 12, a FOUP 13 and a SMIF conveying device 14; the open shutter thin film deposition device 20 comprises a material port, the material port is provided with a device door 21, and the material port is provided with a loading platform 22.
[0042] After the last process, the wafer material is transported to the side of the material port of the open shutter thin film deposition equipment 20 in the form of FOUP loading, waiting for processing. The operator places the FOUP in the SMIF loading port 11, presses the feeding button, the SMIF loading port 11 locks the FOUP to prevent the FOUP from being taken by mistake during the operation of the equipment, and the air purification function of the shield assembly 30 is started, and then the FOUP loaded with wafers is automatically opened, and then the SMIF conveying device 14 clamps the cassette loaded in the FOUP and sends it to the stage 22 of the open shutter thin film deposition equipment 20;
[0043] Then the open shutter thin film deposition equipment 20 takes the wafer from the cassette and sends it to the process chamber for corresponding processing; after the processing is completed, the equipment sends all the wafers back to the cassette, at this time the operator presses the unloading button, the SMIF conveying device 14 clamps the cassette and sends it back to the FOUP, then the SMIF loading port closes the FOUP, the FOUP is unlocked, and the operator takes the POUP to the next station. The center position of the cassette is unchanged each time.
[0044] The above only discloses the preferred embodiment of the present application, of course, cannot limit the scope of the rights of the present application, therefore, the equivalent changes made according to the claims of the present application still belong to the scope covered by the present application.
Claims
1. A wafer thin film deposition system comprising a SMIF pod and an open gate thin film deposition apparatus; characterized by: The protective cover assembly has a first side opening, a second side opening and a transverse conveying channel connecting the first side opening and the second side opening. The first side opening is sealed and connected to the material port of the open shutter thin film deposition equipment through the fixed connection mechanism, and the second side opening is fixedly provided with the docking sealing mechanism.
2. The wafer thin film deposition preparation system of claim 1, wherein: The protective cover assembly includes an inner ring protection layer, an outer ring protection layer, a laminar flow fan and a first filter assembly.
3. The wafer thin film deposition preparation system of claim 2, wherein: The inner ring protection layer and the outer ring protection layer are sealed and connected to each other at the first side opening and the second side opening, respectively, and an annular airflow channel is formed between the inner ring protection layer and the outer ring protection layer.
4. The wafer thin film deposition preparation system of claim 3, wherein: The inner cavity of the inner ring protection layer forms the transverse conveying channel.
5. The thin film deposition system of any one of claims 2-4, wherein: Air supply ports and air return ports are provided on the inner ring protection layer, and air exchange ports are provided on the outer ring protection layer.
6. The wafer thin film deposition fabrication system of claim 1, wherein: The laminar flow fan is arranged at the air supply port and is used to supply air between the inner ring protection layer and the outer ring protection layer to the transverse conveying channel.
7. The wafer thin film deposition preparation system of claim 6, wherein: A second filter assembly is arranged on the air flow channel from the air exchange port to the air supply port.
8. The wafer thin film deposition preparation system of claim 7, wherein: A third filter assembly is arranged on the air exchange port.
9. The wafer thin film deposition fabrication system of claim 1, wherein: The air supply port is arranged at the top of the inner ring protection layer, the air return port is arranged at the bottom of the inner ring protection layer, and the air exchange port is arranged at the lower side of the outer ring protection layer.
10. The wafer thin film deposition fabrication system of claim 1, wherein: The wafer thin film deposition preparation system further includes a positioning assembly, which includes a positioning seat and a limiting piece. The positioning seat is fixedly arranged on one side of the material port of the open shutter thin film deposition equipment at a predetermined distance. The bottom of the SMIF device is provided with a limited piece that can be limited by the limiting piece. The positioning assembly further includes a locking piece, and the bottom of the SMIF device is provided with a locked piece that can be locked by the locking piece. The positioning assembly further includes a guide rail, and the bottom of the SMIF device is provided with a guide wheel that can be matched with the guide rail. The limiting piece and the locking piece are arranged along the guide rail. Communication interconnection lines are arranged between the open shutter thin film deposition equipment and the SMIF device. A docking interlocking mechanism is arranged between the open shutter thin film deposition equipment and the SMIF device.