Water cooling device for drawing silicon core

Abstract

The utility model relates to the technical field of water cooling devices, in particular to a water cooling device for drawing a silicon core, which comprises a ring body, a connecting mechanism is fixedly arranged above the ring body, a cooling mechanism is movably arranged on the inner wall of the ring body, and a butt joint sealing mechanism is movably arranged above the ring body through the connecting mechanism. Before the water cooling device is used, a water pipe above the ring body passes through a clamping groove formed by a butt joint pipe above a connecting pipe and an internal clamping ring, so that the connecting pipe below is clamped in the clamping groove, and the connecting effect is achieved; under the action of an extrusion spring installed in an extrusion groove in the butt joint pipe, the butt joint pipe is arranged on the connecting pipe in a sleeving mode during installation, and under pushing of external force, an internal extrusion clamping block extrudes inwards, so that the butt joint pipe is arranged on the connecting pipe in a sleeving mode; and under the action of an extrusion telescopic rod and an extrusion spring, an extrusion clamping block on one side extends out and is clamped on one side of a clamping pipe, so that the effect of connection and fixation is achieved.

Description

Technical Field

[0001] This utility model relates to the field of water cooling device technology, specifically a water cooling device for pulling silicon cores. Background Technology

[0002] Currently, based on the company's development and cost requirements, 120 and 140 furnace types are used for silicon core pulling. The most basic requirement for silicon cores is that they must be pulled to a specified length without cracks; otherwise, the entire silicon core will be scrapped. According to the industry's understanding, the water-cooled screen currently used in single-crystal furnaces cannot be used for silicon core pulling; only a flow guide can be used. Based on this understanding, the water-cooled screen needs to be modified to not only make water cooling play a significant role but also to maintain a clear view and ensure proper alignment during operation.

[0003] The water-cooled screen and single-crystal furnace disclosed in Chinese Utility Model Patent Application Publication CN 221217973 U, achieve a lower temperature for the cooling liquid flowing into the interlayer space of the water-cooled screen body, thereby lowering the temperature of the thermal field provided by the water-cooled screen body to the single-crystal silicon. This increases the heat exchange rate of the water-cooled screen body, accelerates the cooling rate of the crystal rod, improves the growth rate of the single-crystal silicon, increases the crystallization rate of the crystal rod, and thus improves production efficiency. However, the water-cooled screen of this device has a small heat dissipation area, slow heat dissipation speed, and large size, making it inconvenient to install. Utility Model Content

[0004] The purpose of this invention is to provide a water-cooling device for pulling silicon cores, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A water-cooling device for pulling silicon cores, comprising

[0007] A ring body, wherein a connecting mechanism is fixedly provided on the top of the ring body, a cooling mechanism is movably provided on the inner wall of the ring body, and a docking sealing mechanism is movably provided on the top of the ring body through the connecting mechanism;

[0008] A reinforcing ring is provided, with its inner wall fixedly disposed below the ring body. A water pipe is fixedly disposed above the ring body, and a clamping pipe is fixedly disposed above the water pipe. A connecting pipe is fixedly disposed at the top of the clamping post.

[0009] Preferably, the connecting mechanism includes a connecting pipe and an inlet pipe. The connecting pipe is movably disposed above the connecting pipe, and the inner wall of the connecting pipe is movably disposed on one side of the connecting pipe. The inlet pipe is fixedly disposed at the top of the connecting pipe by welding, and the outlet pipe is fixedly disposed at the top of the connecting pipe by welding. The connecting pipe connects the connecting pipe to the external inlet and outlet pipes, thereby achieving the effect of internal circulating cooling and heat dissipation.

[0010] Preferably, a retaining ring is fixedly provided on the inner wall of the connecting pipe, and a retaining groove is formed on the inner wall of the connecting pipe through the retaining ring. The inner wall of the retaining groove is movably disposed above the connecting pipe. The connecting pipe above the connecting pipe passes through the retaining groove formed by the retaining ring inside, thereby causing the connecting pipe below to be locked inside the retaining groove, thus achieving the connection effect.

[0011] Preferably, the docking sealing mechanism includes a compression block, an compression groove is formed on the inner wall of the docking pipe, a compression block is movably disposed on the inner wall of the compression groove, one side of the compression block is movably disposed on one side of the clamping post, a stop is fixedly disposed on one side of the compression block, a compression telescopic rod is fixedly disposed on one side of the stop, a compression spring is movably disposed on one side of the compression telescopic rod, and one end of the compression telescopic rod is fixedly disposed on the inner wall of the compression groove. Under the action of the compression spring installed inside the compression groove of the docking pipe, the docking pipe is fitted onto the connecting pipe during installation. Under the force of external push, the internal compression block is squeezed inward, thus fitting the docking pipe onto the connecting pipe. Then, under the action of the compression telescopic rod and the compression spring, one side of the compression block extends out and clamps onto one side of the clamping pipe, thereby achieving the effect of connection and fixation.

[0012] Preferably, the cooling mechanism includes a heat-conducting plate and a heat-insulating layer. The heat-conducting plate is fixedly installed on the inner wall of the ring, and a water-cooling tank is opened on the inner wall of the ring. A downward extension pipe is fixedly installed above the water-cooling tank, and a baffle is fixedly installed at the bottom end of the downward extension pipe. Multiple heat-conducting plates are fixedly installed inside the tank, which can absorb and conduct heat around the pulled silicon core. Coolant is then introduced into the water-cooling tank through the water-cooling tank opened inside the device and introduced into the tank through the externally connected inlet pipe. The coolant absorbs heat and flows out through the outlet pipe, thereby achieving a circulating heat dissipation and cooling effect.

[0013] Preferably, the top end of the lower extension pipe is fixedly installed at the bottom end of the water pipe, the inner wall of the water cooling tank is fixedly installed with a heat insulation layer by welding, and a solid steel ring is fixedly installed at the bottom of the inner wall of the water cooling tank by welding. A heat insulation layer is installed on the other side inside the water cooling tank to block the influence of external heat on internal heat dissipation, and the solid steel ring installed inside can prevent water leakage due to prolonged use of the device.

[0014] Preferably, a fixing rod is fixedly installed at the bottom of the ring body by welding, and a mounting plate is fixedly installed above the fixing rod by welding. A mounting groove is opened on the top of the mounting plate. The device is thus fixedly installed as a whole by the fixing rod at the bottom and the mounting plate at the top.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This water-cooling device for drawing silicon cores allows for connection before use. Before use, a water pipe above the ring connects to the connecting pipe via an internal retaining ring forming a groove, thus securing the lower connecting pipe within the groove. A compression spring inside the connecting pipe then pushes the connecting pipe onto the connecting pipe during installation. External force compresses the internal compression blocks, securing the connecting pipe onto the connecting pipe. Finally, the compression extension rod and compression spring cause one side of the compression block to extend and engage with the other side of the connecting pipe, achieving a secure connection. This water-cooling device for pulling silicon cores involves connecting external inlet and outlet pipes, then placing the entire device inside the silicon core pulling apparatus. The device is secured by a bottom fixing rod and an upper mounting plate. Multiple heat-conducting fins are installed inside the water-cooling device to absorb and conduct heat from the surrounding area of ​​the pulled silicon core. Coolant is introduced into the water-cooling tank through an external inlet pipe, absorbing heat and flowing out through the outlet pipe, achieving a circulating cooling effect. An insulation layer is installed on the other side of the water-cooling tank to block external heat from affecting internal heat dissipation, and a solid steel ring inside prevents leakage due to prolonged use. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of the cooling tank of this utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the connecting pipe of this utility model;

[0020] Figure 4 For the present utility model Figure 3 Enlarged structural diagram of section A;

[0021] Figure 5 This is a schematic diagram of the internal structure of the ring body of this utility model;

[0022] In the diagram: 100, Ring body; 101, Reinforcing ring; 102, Water pipe; 104, Pipe clamp; 103, Connecting pipe; 200, Connecting pipe; 201, Inlet pipe; 202, Outlet pipe; 203, Clamping ring; 204, Clamping groove; 205, Extrusion groove; 206, Extrusion clamping block; 207, Stop block; 208, Extrusion telescopic rod; 209, Extrusion spring; 105, Heat-conducting plate; 114, Water cooling tank; 113, Lower extension pipe; 114, Stop pipe; 111, Insulation layer; 112, Solid steel ring; 107, Fixing rod; 108, Mounting plate; 109, Mounting groove. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1-5 As shown, this utility model provides a technical solution:

[0025] A water-cooling device for pulling silicon cores, comprising

[0026] The ring body 100 has a connecting mechanism fixedly installed on its upper part, a cooling mechanism movably installed on the inner wall of the ring body 100, and a docking sealing mechanism movably installed on its upper part via the connecting mechanism.

[0027] A reinforcing ring 101 is fixedly installed on the inner wall of the ring body 100 below the ring body 100. A water pipe 102 is fixedly installed above the ring body 100. A clamping pipe 104 is fixedly installed above the water pipe 102. A connecting pipe 103 is fixedly installed at the top of the clamping post.

[0028] In the preferred embodiment, the connecting mechanism includes a connecting pipe 200 and an inlet pipe 201. The connecting pipe 200 is movably disposed above the connecting pipe 103. The inner wall of the connecting pipe 200 is movably disposed on one side of the connecting pipe 103. The inlet pipe 201 is fixedly disposed at the top of the connecting pipe 200 by welding. The outlet pipe 202 is fixedly disposed at the top of the connecting pipe 200 by welding.

[0029] Through the above scheme, by connecting the connecting pipe 200 to the external inlet pipe 201 and outlet pipe 202 through the connecting pipe 103, the internal circulation cooling and heat dissipation effect is achieved.

[0030] In the preferred embodiment, a retaining ring 203 is fixedly provided on the inner wall of the connecting pipe 200, and a retaining groove 204 is opened on the inner wall of the connecting pipe 200 through the retaining ring 203, and the inner wall of the retaining groove 204 is movably disposed above the connecting pipe 103.

[0031] Through the above scheme, the connecting pipe 103 is connected by the groove 204 formed by the internal retaining ring 203 of the connecting pipe 200 above the connecting pipe 103, thereby locking the connecting pipe 103 below into the groove 204 and achieving the connection effect.

[0032] In the preferred embodiment, the docking sealing mechanism includes a compression block 206, a compression groove 205 is provided on the inner wall of the docking pipe 200, the compression block 206 is movably disposed on the inner wall of the compression groove 205, one side of the compression block 206 is movably disposed on the side of the clamping post, a stop block 207 is fixedly disposed on one side of the compression block 206, a compression telescopic rod 208 is fixedly disposed on one side of the stop block 207, a compression spring 209 is movably disposed on one side of the compression telescopic rod 208, and one end of the compression telescopic rod 208 is fixedly disposed on the inner wall of the compression groove 205.

[0033] Through the above scheme, under the action of the compression spring 209 installed inside the compression groove 205 inside the connecting pipe 200, the connecting pipe 200 is fitted onto the connecting pipe 103 during installation. Under the force of external push, the internal compression block 206 is squeezed inward, thus fitting the connecting pipe 200 onto the connecting pipe 103. Then, under the action of the compression telescopic rod 208 and the compression spring 209, the compression block 206 on one side extends out and locks onto one side of the clamping pipe 104, thereby achieving the effect of connection and fixation.

[0034] In the preferred embodiment, the cooling mechanism includes a heat-conducting plate 105 and a heat insulation layer 111. The heat-conducting plate 105 is fixedly disposed on the inner wall of the ring body 100. A water-cooling groove 114 is opened on the inner wall of the ring body 100. A lower extension pipe 113 is fixedly disposed above the water-cooling groove 114. A baffle pipe 114 is fixedly disposed at the bottom end of the lower extension pipe 113.

[0035] Through the above scheme, multiple heat-conducting plates 105 are fixedly installed inside, which can absorb and conduct heat around the pulled silicon core. Then, through the water-cooling tank 114 opened inside the device, coolant is put into the water-cooling tank 114 through the externally connected inlet pipe 201, which absorbs heat and flows out from the outlet pipe 202, thereby achieving the effect of circulating heat dissipation and cooling.

[0036] In the embodiment, preferably, the top end of the lower extension pipe 113 is fixedly disposed at the bottom end of the water pipe 102, the inner wall of the water cooling tank 114 is fixedly disposed with a heat insulation layer 111 by welding, and a solid steel ring 112 is fixedly disposed at the bottom of the inner wall of the water cooling tank 114 by welding.

[0037] Through the above scheme, an insulation layer 111 is installed on the other side of the water-cooled tank 114 to block the influence of external heat on internal heat dissipation, and a solid steel ring 112 installed inside can prevent water leakage due to prolonged use of the device.

[0038] In the embodiment, preferably, a fixing rod 107 is fixedly installed at the bottom of the ring body 100 by welding, and an mounting plate 108 is fixedly installed above the fixing rod 107 by welding, and an mounting groove 109 is provided above the mounting plate 108.

[0039] The above solution achieves the effect of fixing the device as a whole by using the fixing rod 107 at the bottom and the mounting plate 108 at the top.

[0040] In this embodiment, a water-cooling device for drawing silicon cores is used in the following way: Before use, the water pipe 102 above the ring 100 passes through the connecting pipe 200 above the connecting pipe 103. The connecting pipe 103 is then secured in the groove 204 formed by the internal retaining ring 203, thus achieving a connection. Then, under the action of the compression spring 209 installed inside the compression groove 205 inside the connecting pipe 200, the connecting pipe 200 is fitted onto the connecting pipe 103 during installation. Under the force of external push, the internal compression block 206 is pressed inward, thus fitting the connecting pipe 200 onto the connecting pipe 103. Finally, under the action of the compression telescopic rod 208 and the compression spring 209, one side of the compression block 206 extends and locks onto one side of the retaining pipe 104, thus achieving a connection and fixation effect.

[0041] After connecting the external inlet pipe 201 and outlet pipe 202, the entire device is placed inside the silicon core pulling device. The device is fixed in place by the bottom fixing rod 107 and the top mounting plate 108. The water cooling device has multiple heat-conducting fins 105 fixedly installed inside to absorb and conduct heat around the silicon core. Coolant is then introduced into the water cooling tank 114 through the external inlet pipe 201, absorbing heat and flowing out through the outlet pipe 202 to achieve a circulating heat dissipation and cooling effect. A heat insulation layer 111 is installed on the other side of the water cooling tank 114 to block the influence of external heat on internal heat dissipation, and a solid steel ring 112 installed inside prevents water leakage due to prolonged use.

[0042] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A water-cooling device for pulling silicon cores, characterized in that: include A ring body (100) is provided with a connecting mechanism fixedly arranged above the ring body (100), a cooling mechanism is movably arranged on the inner wall of the ring body (100), and a docking sealing mechanism is movably arranged above the ring body (100) through the connecting mechanism. A reinforcing ring (101) is fixedly installed on the inner wall of the reinforcing ring (101) below the ring body (100). A water pipe (102) is fixedly installed above the ring body (100). A clamping pipe (104) is fixedly installed above the water pipe (102). A connecting pipe (103) is fixedly installed at the top of the clamping post.

2. The water-cooling device for pulling silicon cores according to claim 1, characterized in that: The connecting mechanism includes a connecting pipe (200) and an inlet pipe (201). The connecting pipe (200) is movably disposed above the connecting pipe (103). The inner wall of the connecting pipe (200) is movably disposed on one side of the connecting pipe (103). The inlet pipe (201) is fixedly disposed at the top of the connecting pipe (200) by welding. The outlet pipe (202) is fixedly disposed at the top of the connecting pipe (200) by welding.

3. The water-cooling device for pulling silicon cores according to claim 2, characterized in that: A retaining ring (203) is fixedly provided on the inner wall of the connecting pipe (200), and a retaining groove (204) is opened on the inner wall of the connecting pipe (200) through the retaining ring (203). The inner wall of the retaining groove (204) is movably disposed above the connecting pipe (103).

4. The water-cooling device for pulling silicon cores according to claim 2, characterized in that: The docking sealing mechanism includes a compression block (206), and the inner wall of the docking pipe (200) is provided with a compression groove (205). The compression block (206) is movably arranged on the inner wall of the compression groove (205). One side of the compression block (206) is movably arranged on the side of the clamping post. A stop block (207) is fixedly arranged on one side of the compression block (206). A compression telescopic rod (208) is fixedly arranged on one side of the stop block (207). A compression spring (209) is movably arranged on one side of the compression telescopic rod (208). One end of the compression telescopic rod (208) is fixedly arranged on the inner wall of the compression groove (205).

5. The water-cooling device for pulling silicon cores according to claim 1, characterized in that: The cooling mechanism includes a heat-conducting plate (105) and a heat insulation layer (111). The heat-conducting plate (105) is fixedly installed on the inner wall of the ring (100). A water-cooling groove (114) is opened on the inner wall of the ring (100). A lower extension pipe (113) is fixedly installed above the water-cooling groove (114). A baffle pipe (114) is fixedly installed at the bottom end of the lower extension pipe (113).

6. A water-cooling device for pulling silicon cores according to claim 5, characterized in that: The top end of the lower extension pipe (113) is fixedly installed at the bottom end of the water pipe (102). The inner wall of the water cooling tank (114) is fixedly provided with a heat insulation layer (111) by welding. The bottom of the inner wall of the water cooling tank (114) is fixedly provided with a solid steel ring (112) by welding.

7. The water-cooling device for pulling silicon cores according to claim 1, characterized in that: A fixing rod (107) is fixedly installed at the bottom of the ring (100) by welding, and an installation plate (108) is fixedly installed above the fixing rod (107) by welding. An installation groove (109) is provided above the installation plate (108).

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