Electrode material cooling mechanism for replacement chamber and replacement chamber

Abstract

The utility model relates to the technical field of replacement chambers, and particularly discloses an electrode material cooling mechanism for a replacement chamber and the replacement chamber, the cooling mechanism comprises a cooling device, the cooling device comprises a plurality of cooling groups, each cooling group comprises a plurality of cooling units arranged in sequence, and each cooling unit is provided with a cooling cavity; the lifting mechanism is used for driving the cooling device to ascend or descend, so that the cooling unit moves away from or towards the saggar placed in the placing cavity; the cooling liquid supply assembly communicates with the cooling cavity and is used for continuously supplying flowing cooling liquid into the cooling cavity; the cooling mechanism can effectively improve the cooling efficiency of the electrode material.

Description

Technical Field

[0001] This utility model belongs to the field of displacement chamber technology, and specifically relates to an electrode material cooling mechanism and a displacement chamber for use in a displacement chamber. Background Technology

[0002] After sintering the electrode material in a kiln, the temperature of the electrode material inside the sagger reaches 300℃. If the sintered electrode material is exposed to air, it will oxidize, leading to a decline in its quality. Therefore, after sintering, the relevant technology requires moving the sagger into a displacement chamber connected to the kiln's output end to allow the sintered electrode material to cool within the displacement chamber. This technology relies on natural cooling to cool the electrode material in the displacement chamber. However, the electrode material has a low thermal conductivity, and the displacement chamber needs to be sealed during cooling. This means the gas temperature inside the displacement chamber gradually rises, causing the heat exchange efficiency between the electrode material and the gas to decrease. Therefore, this technology suffers from low cooling efficiency for the electrode material.

[0003] Therefore, the existing technology needs improvement and development. It should be noted that the information disclosed in this section is only for understanding the background of the present invention, and therefore may contain information that does not constitute prior art. Utility Model Content

[0004] The purpose of this application is to provide an electrode material cooling mechanism and a displacement chamber for a displacement chamber, which can effectively improve the cooling efficiency of the electrode material.

[0005] In a first aspect, this application provides an electrode material cooling mechanism for a displacement chamber, the displacement chamber including a placement cavity for placing a sagger, and the electrode material cooling mechanism for the displacement chamber including:

[0006] A cooling device comprising several cooling groups, each cooling group comprising multiple cooling units arranged in sequence, each cooling unit having a cooling chamber;

[0007] A lifting mechanism is used to drive the cooling device to rise or fall, so that the cooling unit moves away from or toward the sagger placed in the placement cavity;

[0008] A cooling fluid supply assembly, connected to the cooling chamber, is used to continuously supply flowing cooling fluid into the cooling chamber.

[0009] This application provides an electrode material cooling mechanism for a displacement chamber, which can dissipate heat from the electrode material placed in a sagger within the placement chamber through the cooperation of a lifting mechanism and a cooling liquid supply component. In other words, this application is equivalent to using liquid cooling instead of existing natural cooling. Since this application can ensure the heat exchange efficiency between the electrode material and the cooling liquid by continuously supplying flowing cooling liquid into the cooling chamber through the cooling liquid supply component, i.e., the heat dissipation efficiency of liquid cooling is greater than that of natural cooling, this application can effectively improve the cooling efficiency of the electrode material.

[0010] Furthermore, each cooling chamber is equipped with multiple deflector plates, with adjacent deflector plates staggered.

[0011] This technical solution is equivalent to forming an S-shaped flow channel in the cooling chamber by staggering multiple diverter plates in the cooling chamber. Therefore, this technical solution can effectively extend the residence time of the coolant in the cooling chamber and avoid the situation where the coolant that has absorbed heat cannot be discharged from the cooling chamber in time, thereby further improving the cooling efficiency of the electrode material.

[0012] Furthermore, the guide plate has a positioning part, and the cooling unit is provided with a positioning groove that matches the positioning part. The positioning part and the positioning groove cooperate to restrict the installation position of the guide plate in the cooling unit.

[0013] Because this technical solution can limit the installation position of the guide plate in the cooling unit by cooperating with the positioning part and the positioning groove, it can effectively avoid the situation where the flow of cooling liquid in the cooling chamber is affected due to the accidental displacement of the guide plate, and the cooling efficiency of the electrode material is also affected.

[0014] Furthermore, the cooling unit has a puncture section on the side near the crucible.

[0015] Because the cooling unit of this technical solution has a puncture part on the side near the sagger, the puncture part makes it easier for the cooling unit to be inserted into the electrode material and increases the insertion depth of the cooling unit. Therefore, this technical solution can effectively increase the contact area between the electrode material and the cooling unit, thereby further improving the cooling efficiency of the electrode material.

[0016] Furthermore, the electrode material cooling mechanism for the replacement chamber also includes an inlet pipe, an outlet pipe, a first diversion assembly, and a second diversion assembly. The inlet pipe is connected to the cooling liquid supply assembly. All cooling chambers of the same cooling device are connected to at least one inlet pipe through at least one first diversion assembly and to at least one outlet pipe through at least one second diversion assembly.

[0017] Furthermore, both the inlet and outlet pipes are rigid pipes. The electrode material cooling mechanism for the replacement chamber also includes a first support, a second support, and multiple guide sleeves. The lifting mechanism and the guide sleeves are both mounted on the second support. The first support is fixedly connected to the output end of the lifting mechanism, the inlet pipe, and the outlet pipe. The cooling device is fixedly connected to the first support. Each guide sleeve is slidably connected to one inlet pipe or one outlet pipe.

[0018] Since each guide sleeve is slidably connected to an inlet pipe or an outlet pipe, and both the inlet and outlet pipes are rigid pipes, and under the action of the guide sleeve, the inlet and outlet pipes will only move in the vertical direction, this technical solution is equivalent to forming a guide assembly with the guide sleeve, the inlet pipe and the outlet pipe. This guide assembly can guide the lifting and lowering of the cooling device, thereby effectively avoiding the situation where the cooling unit cannot be smoothly inserted into the electrode material due to lateral displacement of the cooling device during the lifting and lowering process.

[0019] Furthermore, the first support has multiple through holes.

[0020] Furthermore, the second bracket is detachably equipped with multiple maintenance port covers.

[0021] Secondly, the present invention provides a displacement chamber, which includes the electrode material cooling mechanism for the displacement chamber provided in the first aspect above.

[0022] This application provides a displacement chamber that can dissipate heat from electrode materials placed in a sagger within the placement chamber through the cooperation of a lifting mechanism and a cooling liquid supply component. In other words, this application is equivalent to using liquid cooling instead of existing natural cooling. Since this application can ensure the heat exchange efficiency between the electrode material and the cooling liquid by continuously supplying flowing cooling liquid into the cooling chamber through the cooling liquid supply component, i.e., the heat dissipation efficiency of liquid cooling is greater than that of natural cooling, this application can effectively improve the cooling efficiency of the electrode material.

[0023] Furthermore, the replacement chamber also includes a position adjustment component for adjusting the position of the sagger placed inside the replacement chamber.

[0024] As can be seen from the above, the electrode material cooling mechanism and displacement chamber provided by this utility model can dissipate heat from the electrode material placed in the sagger in the placement chamber through the cooperation of the lifting mechanism and the cooling liquid supply component. That is, this application is equivalent to using liquid cooling to replace the existing natural cooling. Since this application can ensure the heat exchange efficiency between the electrode material and the cooling liquid by continuously supplying flowing cooling liquid to the cooling chamber through the cooling liquid supply component, that is, the heat dissipation efficiency of liquid cooling is greater than that of natural cooling, this application can effectively improve the cooling efficiency of the electrode material. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of an electrode material cooling mechanism for a displacement chamber, provided as an embodiment of this application.

[0026] Figure 2 A cross-sectional view of the first and second shunt components provided in the embodiments of this application.

[0027] Figure 3 This is a schematic diagram of the cooling unit provided in an embodiment of this application.

[0028] Figure 4 This is a cross-sectional view of the cooling unit provided in an embodiment of this application.

[0029] Figure 5 This is a schematic diagram showing the connection of the cooling liquid supply assembly, inlet pipe, first diversion assembly, and cooling unit provided in the embodiments of this application.

[0030] Figure 6 This is a schematic diagram of a displacement chamber provided in an embodiment of this application.

[0031] Figure 7 This is a schematic diagram of a replacement chamber without a protective cover, provided as an embodiment of this application.

[0032] Figure 8 for Figure 7 A magnified structural diagram of point A in the diagram.

[0033] Labeling Explanation: 1. Cooling Unit; 2. Cooling Chamber; 3. Lifting Mechanism; 4. Coolant Supply Assembly; 5. Drain Plate; 6. Positioning Part; 7. Puncture Part; 8. Inlet Pipe; 9. Outlet Pipe; 10. First Diverting Assembly; 11. Second Diverting Assembly; 12. First Support; 13. Second Support; 14. Guide Sleeve; 15. Through Hole; 16. Maintenance Port Cover; 17. Placement Chamber; 18. Sagger; 19. Switch Gate; 20. Position Adjustment Assembly; 201. Push Wheel Set; 202. Drive Mechanism; 21. Guide Column; 22. Protective Cover. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] The following disclosure provides many different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0036] Firstly, such as Figures 1-5 As shown, this application provides an electrode material cooling mechanism for a displacement chamber, the displacement chamber including a placement cavity 17 for placing a sagger 18 (see reference). Figure 6 The electrode material cooling mechanism for the displacement chamber includes:

[0037] A cooling device comprising several cooling groups, each cooling group comprising multiple cooling units 1 arranged in sequence, each cooling unit 1 having a cooling chamber 2;

[0038] Lifting mechanism 3 is used to drive the cooling device to rise or fall so that the cooling unit 1 moves away from or toward the sagger 18 placed in the placement cavity 17;

[0039] Cooling liquid supply component 4 is connected to cooling chamber 2 and is used to continuously supply flowing cooling liquid into cooling chamber 2.

[0040] In this embodiment, the replacement chamber includes a placement cavity 17 for placing a sagger 18. The sagger 18 is used to load electrode material. The sagger 18 containing the sintered electrode material is moved directly from the kiln into the placement cavity 17. The electrode material cooling mechanism in this embodiment can cool the electrode material in the sagger 18 placed in the placement cavity 17. The cooling device in this embodiment includes several cooling groups, each cooling group including multiple sequentially arranged cooling units 1. The cooling unit 1 is plate-shaped, and each cooling unit 1 has a cooling cavity 2 that can contain cooling liquid. Specifically, the cooling cavity 2 has a liquid inlet and a liquid outlet. The lifting mechanism 3 in this embodiment can be a cylinder, hydraulic cylinder, or electric cylinder, etc., capable of driving an object to rise or fall. The lifting mechanism 3 in this embodiment can move the cooling unit 1 away from or towards the sagger 18 placed in the placement cavity 17 by driving the cooling device to rise or fall. Specifically, since the cooling unit 1 in this embodiment is plate-shaped, when the lifting mechanism 3 drives the cooling device to fall, the cooling unit 1 will insert into the electrode material in the sagger 18. The cooling liquid supply component 4 in this embodiment can be a combination of a cooling liquid storage component and a liquid delivery pump. The cooling liquid supply component 4 is connected to the inlet of the cooling chamber 2 and can continuously supply flowing cooling liquid into the cooling chamber 2. The cooling liquid is preferably tap water. It should be understood that when the electrode material is inserted into the cooling unit 1 and the cooling liquid supply component 4 continuously supplies flowing cooling liquid into the cooling chamber 2, the cooling liquid will exchange heat with the electrode material through the cooling unit 1 because the temperature of the cooling liquid is lower than the temperature of the electrode material. Under the action of the cooling liquid supply component 4, the cooling liquid that has absorbed heat in the cooling chamber 2 will flow out of the cooling chamber 2 through the outlet. Therefore, this embodiment can remove the heat of the electrode material by using the lifting mechanism 3 to insert the cooling unit 1 into the electrode material and using the cooling liquid supply component 4 to continuously supply flowing cooling liquid into the cooling chamber 2. That is, this embodiment is equivalent to dissipating heat from the electrode material placed in the sagger 18 in the placement chamber 17 by the cooperation of the lifting mechanism 3 and the cooling liquid supply component 4.

[0041] The specific process of cooling the electrode material by the electrode material cooling mechanism for the replacement chamber in this embodiment can be as follows: After the sintered electrode material in the sagger 18 is placed into the placement chamber 17, the lifting mechanism 3 is controlled to drive the cooling device to descend so as to insert the cooling unit 1 into the electrode material; the cooling liquid supply component 4 is controlled to continuously supply flowing cooling liquid into the cooling chamber 2; after the cooling of the electrode material is completed, the lifting mechanism 3 is controlled to drive the cooling device to rise so as to pull the cooling unit 1 out of the electrode material, and then the cooling liquid supply component 4 is controlled to stop continuously supplying flowing cooling liquid into the cooling chamber 2.

[0042] This application provides an electrode material cooling mechanism for a displacement chamber, which can dissipate heat from the electrode material placed in the sagger 18 within the placement cavity 17 through the cooperation of the lifting mechanism 3 and the cooling liquid supply component 4. That is, this application is equivalent to using liquid cooling to replace the existing natural cooling. Since this application can ensure the heat exchange efficiency between the electrode material and the cooling liquid by continuously supplying flowing cooling liquid into the cooling cavity 2 through the cooling liquid supply component 4, that is, the heat dissipation efficiency of liquid cooling is greater than that of natural cooling, this application can effectively improve the cooling efficiency of the electrode material.

[0043] In some preferred embodiments, each cooling chamber 2 is provided with multiple guide plates 5, and adjacent guide plates 5 are staggered. This embodiment is equivalent to forming an S-shaped flow channel in the cooling chamber 2 by staggering multiple guide plates 5. Therefore, this embodiment can effectively extend the residence time of the coolant in the cooling chamber 2 and avoid the situation where the coolant that has absorbed heat cannot be discharged from the cooling chamber 2 in time, thereby further improving the cooling efficiency of the electrode material.

[0044] In some preferred embodiments, the guide plate 5 has a positioning part 6, and the cooling unit 1 is provided with a positioning groove that matches the positioning part 6. The positioning part 6 cooperates with the positioning groove to restrict the installation position of the guide plate 5 in the cooling unit 1. Since this embodiment can restrict the installation position of the guide plate 5 in the cooling unit 1 by the cooperation of the positioning part 6 and the positioning groove, this embodiment can effectively avoid the situation where the flow of cooling liquid in the cooling chamber 2 is affected due to accidental displacement of the guide plate 5, and the cooling efficiency of the electrode material is also affected. Preferably, the positioning part 6 in this embodiment protrudes from the surface of the cooling unit 1. In this embodiment, the positioning part 6 protruding from the surface of the cooling unit 1 can be melted by welding. The melted positioning part 6 can fill the gap between the positioning groove and the positioning part 6 that does not protrude from the surface of the cooling unit 1. Therefore, this embodiment can fix the positioning part 6 to the cooling unit 1 by welding. It should be understood that after welding is completed, the positioning part 6 is flush with the surface of the cooling unit 1.

[0045] In some preferred embodiments, the cooling unit 1 has a puncture portion 7 on the side near the crucible 18. The cross-sectional shape of the puncture portion 7 in this embodiment is preferably triangular. Because the cooling unit 1 in this embodiment has a puncture portion 7 on the side near the crucible 18, this puncture portion 7 allows the cooling unit 1 to be inserted into the electrode material more easily and increases the insertion depth of the cooling unit 1. Therefore, this embodiment can effectively increase the contact area between the electrode material and the cooling unit 1, thereby further improving the cooling efficiency of the electrode material.

[0046] In some preferred embodiments, the electrode material cooling mechanism for the replacement chamber further includes an inlet pipe 8, an outlet pipe 9, a first diversion assembly 10, and a second diversion assembly 11. The inlet pipe 8 is connected to the cooling liquid supply assembly 4. All cooling chambers 2 of the same cooling device are connected to at least one inlet pipe 8 through at least one first diversion assembly 10 and to at least one outlet pipe 9 through at least one second diversion assembly 11. Specifically, when the cooling device includes multiple cooling groups, the inlets of all cooling chambers 2 of the same cooling device can share the same first diversion assembly 10 and inlet pipe 8, and the outlets of all cooling chambers 2 can share the same second diversion assembly 11 and outlet pipe 9. This embodiment can also make the inlet of each cooling chamber 2 of each cooling group correspond to a separate first diversion assembly 10 and inlet pipe 8, and the outlet of each cooling chamber 2 of each cooling group correspond to a separate second diversion assembly 11 and outlet pipe 9, that is, the number of the first diversion assembly 10, inlet pipe 8, second diversion assembly 11, and outlet pipe 9 is the same as the total number of cooling groups. It should be understood that if there are multiple cooling devices, then different cooling devices correspond to different inlet pipes 8, outlet pipes 9, first diversion components 10, and second diversion components 11. Preferably, the cooling device of this embodiment includes two cooling groups, each cooling group corresponding to a first diversion component 10, a set of inlet pipes 8, a second diversion component 11, and an outlet pipe 9. The two inlet pipes 8 are symmetrically arranged with the center of the lifting mechanism 3 as the center of symmetry, and the two outlet pipes 9 are symmetrically arranged with the center of the lifting mechanism 3 as the center of symmetry.

[0047] In some preferred embodiments, the inlet pipe 8 and the outlet pipe 9 are both rigid pipes. The electrode material cooling mechanism for the replacement chamber also includes a first support 12, a second support 13, and multiple guide sleeves 14. The lifting mechanism 3 and the guide sleeves 14 are both mounted on the second support 13. The first support 12 is fixedly connected to the output end of the lifting mechanism 3, the inlet pipe 8, and the outlet pipe 9. The cooling device is fixedly connected to the first support 12. Each guide sleeve 14 is slidably connected to one inlet pipe 8 or one outlet pipe 9. In this embodiment, the second support 13 is installed on the replacement chamber, and the cooling unit 1 and the first support 12 are both located in the placement cavity 17. Since each guide sleeve 14 is slidably connected to an inlet pipe 8 or an outlet pipe 9, and the inlet pipe 8 and the outlet pipe 9 are both rigid pipes, under the action of the guide sleeve 14, the inlet pipe 8 and the outlet pipe 9 will only move in the vertical direction. Therefore, this embodiment is equivalent to forming a guide assembly with the guide sleeve 14, the inlet pipe 8 and the outlet pipe 9. This guide assembly can guide the lifting and lowering of the cooling device, thereby effectively avoiding the situation where the cooling unit 1 cannot be smoothly inserted into the electrode material due to the lateral displacement of the cooling device during the lifting and lowering process.

[0048] In some preferred embodiments, the first support 12 is provided with a plurality of through holes 15. This embodiment is equivalent to reducing the weight of the first support 12 by providing a plurality of through holes 15 on the first support 12, thereby reducing the load on the lifting mechanism 3 and effectively avoiding damage to the lifting mechanism 3 due to excessive load.

[0049] In some preferred embodiments, a plurality of maintenance port covers 16 are detachably mounted on the second bracket 13. In this embodiment, the maintenance port covers 16 can be detachably mounted on the second bracket 13 by means of screw locking or snap-fit ​​connection. In this embodiment, the cooling unit 1 and the first bracket 12 can be maintained simply by removing the maintenance port covers 16. Therefore, this embodiment can effectively improve the convenience of maintaining the electrode material cooling mechanism used in the replacement chamber.

[0050] In some preferred embodiments, the number of cooling devices is multiple. Because this embodiment has multiple cooling devices, it can effectively increase the number of saggers 18 that simultaneously cool the electrode material.

[0051] In some preferred embodiments, each cooling device includes multiple cooling groups. Because the cooling device in this embodiment includes multiple cooling groups, it can utilize the same cooling device to cool electrode materials in saggers 18 of different sizes. For example, each cooling device includes two cooling groups, which can cool electrode materials in a sagger 18 with a width of 72 cm, or it can cool electrode materials in two saggers 18 with a width of 36 cm, thereby effectively improving the versatility of the electrode material cooling mechanism for the replacement chamber.

[0052] As can be seen from the above, the electrode material cooling mechanism for the displacement chamber provided by this application can dissipate heat from the electrode material placed in the sagger 18 in the placement cavity 17 through the cooperation of the lifting mechanism 3 and the cooling liquid supply component 4. That is, this application is equivalent to using liquid cooling to replace the existing natural cooling. Since this application can ensure the heat exchange efficiency between the electrode material and the cooling liquid by continuously supplying flowing cooling liquid to the cooling cavity 2 through the cooling liquid supply component 4, that is, the heat dissipation efficiency of liquid cooling is greater than that of natural cooling, this application can effectively improve the cooling efficiency of the electrode material.

[0053] Secondly, such as Figures 6-8 As shown, the present invention provides a displacement chamber, which includes the electrode material cooling mechanism for the displacement chamber provided in the first aspect above.

[0054] This application provides a displacement chamber, which includes the electrode material cooling mechanism for the displacement chamber provided in the first aspect. The principle of the displacement chamber provided in this embodiment is the same as that of the electrode material cooling mechanism for the displacement chamber provided in the first aspect, and will not be discussed in detail here.

[0055] In some preferred embodiments, the displacement chamber includes multiple placement cavities 17 and a switching gate 19. Each placement cavity 17 has a switching gate 19 on both sides. After a sagger 18 containing sintered electrode material is placed into a placement cavity 17, the switching gate 19 closes to seal the placement cavity 17. Since this embodiment includes multiple placement cavities 17, each with a switching gate 19 on both sides, and the switching gate 19 closes after the sagger 18 containing sintered electrode material is placed into the placement cavity 17, this embodiment effectively isolates adjacent placement cavities 17 by closing the switching gate 19, thereby reducing the amount of heat exchange between adjacent placement cavities 17 during the cooling of the electrode material.

[0056] In some preferred embodiments, the replacement chamber further includes a position adjustment assembly 20, which is used to adjust the position of the sagger 18 placed inside the replacement chamber. Specifically, the position adjustment assembly 20 in this embodiment includes two push wheel sets 201 and two drive mechanisms 202. The two push wheel sets 201 and the two drive mechanisms 202 are symmetrically mounted on the replacement chamber. The push wheel sets 201 are located inside the placement cavity 17 and can abut against the side of the sagger 18. The drive mechanisms 202 are used to drive the push wheel sets 201 to move toward or away from the center of the placement cavity 17. The direction of movement of the push wheel sets 201 is perpendicular to the direction in which the sagger 18 is placed into or removed from the placement cavity 17. This embodiment can achieve center alignment of the sagger 18 by using the two drive mechanisms 202 to synchronously drive the two push wheel sets 201 to move toward the center of the placement cavity 17, so as to adjust the position of the sagger 18 to be directly below the cooling unit 1 and enable the cooling unit 1 to be smoothly inserted into the electrode material. Preferably, the replacement chamber of this embodiment further includes a guide post 21 and a protective cover 22. The guide post 21 is connected to the drive wheel assembly 201. The guide post 21 and the drive mechanism 202 are both located inside the protective cover 22. The guide post 21 can guide the movement of the drive wheel assembly 201, and the protective cover 22 can protect the guide post 21 and the drive mechanism 202 to avoid damage or even destruction of the guide post 21 and the drive mechanism 202 due to accidental collision.

[0057] As can be seen from the above, the displacement chamber provided by this application can dissipate heat from the electrode material placed in the sagger 18 in the placement cavity 17 through the cooperation of the lifting mechanism 3 and the cooling liquid supply component 4. That is, this application is equivalent to using liquid cooling to replace the existing natural cooling. Since this application can ensure the heat exchange efficiency between the electrode material and the cooling liquid by continuously supplying flowing cooling liquid to the cooling cavity 2 through the cooling liquid supply component 4, that is, the heat dissipation efficiency of liquid cooling is greater than that of natural cooling, this application can effectively improve the cooling efficiency of the electrode material.

[0058] As can be seen from the above, the electrode material cooling mechanism and the replacement chamber provided by this utility model can dissipate heat from the electrode material placed in the sagger 18 in the placement cavity 17 through the cooperation of the lifting mechanism 3 and the cooling liquid supply component 4. That is, this application is equivalent to using liquid cooling to replace the existing natural cooling. Since this application can ensure the heat exchange efficiency between the electrode material and the cooling liquid by continuously supplying flowing cooling liquid to the cooling cavity 2 through the cooling liquid supply component 4, that is, the heat dissipation efficiency of liquid cooling is greater than that of natural cooling, this application can effectively improve the cooling efficiency of the electrode material.

[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. An electrode material cooling mechanism for a displacement chamber, the displacement chamber comprising a placement cavity for placing a sagger, characterized in that, The electrode material cooling mechanism for the displacement chamber includes: A cooling device comprising several cooling groups, each cooling group comprising multiple cooling units arranged in sequence, each cooling unit having a cooling chamber; A lifting mechanism is used to drive the cooling device to rise or fall, so that the cooling unit moves away from or toward the sagger placed in the placement cavity; A cooling liquid supply assembly, connected to the cooling chamber, is used to continuously supply flowing cooling liquid into the cooling chamber.

2. The electrode material cooling mechanism for the displacement chamber according to claim 1, characterized in that, Each cooling chamber is equipped with multiple guide plates, and adjacent guide plates are staggered.

3. The electrode material cooling mechanism for the displacement chamber according to claim 2, characterized in that, The diversion plate has a positioning part, and the cooling unit is provided with a positioning groove that matches the positioning part. The positioning part and the positioning groove cooperate to restrict the installation position of the diversion plate in the cooling unit.

4. The electrode material cooling mechanism for the displacement chamber according to claim 1, characterized in that, The cooling unit has a puncture section on the side near the sagger.

5. The electrode material cooling mechanism for the displacement chamber according to claim 1, characterized in that, The electrode material cooling mechanism for the replacement chamber further includes an inlet pipe, an outlet pipe, a first diversion component, and a second diversion component. The inlet pipe is connected to the cooling liquid supply component. All cooling chambers of the same cooling device are connected to at least one inlet pipe through at least one first diversion component and to at least one outlet pipe through at least one second diversion component.

6. The electrode material cooling mechanism for the displacement chamber according to claim 5, characterized in that, Both the inlet pipe and the outlet pipe are rigid pipes. The electrode material cooling mechanism for the replacement chamber also includes a first support, a second support, and multiple guide sleeves. The lifting mechanism and the guide sleeves are both mounted on the second support. The first support is fixedly connected to the output end of the lifting mechanism, the inlet pipe, and the outlet pipe. The cooling device is fixedly connected to the first support. Each guide sleeve is slidably connected to one inlet pipe or one outlet pipe.

7. The electrode material cooling mechanism for the displacement chamber according to claim 6, characterized in that, The first bracket has multiple through holes.

8. The electrode material cooling mechanism for the displacement chamber according to claim 6, characterized in that, The second bracket is detachably equipped with multiple maintenance port covers.

9. A replacement chamber, characterized in that, The displacement chamber includes an electrode material cooling mechanism for the displacement chamber as described in any one of claims 1-8.

10. The replacement chamber according to claim 9, characterized in that, The displacement chamber also includes a position adjustment component for adjusting the position of the sagger placed inside the displacement chamber.

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