Thickness detection mechanism, detection device and chamfering machine

Abstract

The utility model relates to the technical field of electronic device manufacturing, particularly provides a thickness detection mechanism, a detection device and a chamfering machine, and aims to solve the problem that an existing wafer thickness detection mechanism easily causes damage to the surface of a wafer. In order to achieve the purpose, the thickness detection mechanism comprises a first support; the first cantilever and the second cantilever are both connected with the first support, and a gap allowing a workpiece to be machined to enter is formed between the first cantilever and the second cantilever; the first laser sensor is arranged at the end, away from the first support, of the first cantilever. The second laser sensor is arranged at the end, away from the first support, of the second cantilever, the detection end of the first laser sensor and the detection end of the second laser sensor both stretch into the gap, and the detection end of the first laser sensor and the detection end of the second laser sensor are oppositely arranged. According to the invention, non-contact detection of the thickness of the workpiece can be realized, so that damage to the surface of the workpiece is avoided, and the processing quality of the workpiece is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device manufacturing, and specifically provides a thickness detection mechanism, a detection device and a chamfering machine. BACKGROUND

[0002] A semiconductor wafer is the basis for manufacturing integrated circuits and is widely used in various fields such as advanced electronic technology, communication technology, aerospace, etc. A crystal ingot is cut into a wafer, and before the wafer surface is ground, the edge of the wafer is usually chamfered to remove small cracks and defects in the cutting process and prevent the wafer surface from being damaged during the grinding process.

[0003] Before the semiconductor wafer is chamfered, the thickness of the wafer needs to be detected, and only when the thickness of the wafer meets the requirements can the wafer enter the chamfering process. In some related technologies, although the means for detecting the thickness of the wafer are involved, the wafer is usually detected by a probe or the like. However, the wafer surface is easily scratched during the process of the probe contacting the wafer surface and moving relative to the wafer surface, which may affect the processing quality of the wafer.

[0004] Therefore, there is a need in the art for a new technical solution to solve the above problems. UTILITY MODEL CONTENT

[0005] The present application aims to solve the above technical problems, i.e., to solve the problem that the existing wafer thickness detection mechanism easily damages the wafer surface.

[0006] In a first aspect, the present application provides a thickness detection mechanism, comprising:

[0007] a first support;

[0008] a first cantilever and a second cantilever, both connected to the first support, and a gap is formed between the first cantilever and the second cantilever for a workpiece to be machined to enter;

[0009] a first laser sensor arranged at an end of the first cantilever away from the first support;

[0010] a second laser sensor arranged at an end of the second cantilever away from the first support, the detection end of the first laser sensor and the detection end of the second laser sensor both extend into the gap, and the detection end of the first laser sensor and the detection end of the second laser sensor are oppositely arranged.

[0011] In the technical solution, the first laser sensor and the second laser sensor are arranged oppositely to detect the thickness of the workpiece based on the laser ranging principle. In the detection process, the first laser sensor and the second laser sensor do not contact the surface of the workpiece, so that the surface of the workpiece is not damaged, and the processing quality of the workpiece is improved. Meanwhile, the thickness of the workpiece is detected based on the optical measurement method. Compared with the contact type measurement element such as a probe, the measurement error caused by human operation factors can be eliminated, so that the detection accuracy is improved.

[0012] In one of the technical solutions of the thickness detection mechanism, a plurality of mounting holes are formed in the first cantilever and the second cantilever along the extension direction thereof, and the first laser sensor and the second laser sensor can be arranged in each mounting hole, respectively.

[0013] In the technical solution, the positions of the first laser sensor and the second laser sensor can be adjusted according to the actual size of the workpiece, so that the universality of the thickness detection mechanism is enhanced.

[0014] In one of the technical solutions of the thickness detection mechanism, the thickness detection mechanism further comprises:

[0015] A sliding block is arranged on the first support in a sliding manner along the vertical direction, and the first cantilever and the second cantilever are connected to the sliding block.

[0016] An adjusting assembly is arranged to control the reciprocating movement of the sliding block.

[0017] In the technical solution, after the workpiece is moved into the gap, the positions of the first cantilever and the second cantilever in the vertical direction can be adjusted by the adjusting assembly, so that the distances from the upper and lower surfaces of the workpiece to the first laser sensor and the second laser sensor are substantially the same. This prevents the detection accuracy from being affected due to the excessive distance between the first laser sensor or the second laser sensor and the workpiece. Thus, the accuracy of the thickness detection of the workpiece is improved, and the reliability of the detection result is improved.

[0018] In one of the technical solutions of the thickness detection mechanism, the adjusting assembly comprises:

[0019] An elastic member is connected at one end to the top of the first support and at the other end to the first cantilever or the sliding block.

[0020] An adjusting screw is threadedly connected to the first support, extends in the vertical direction, and abuts against the sliding block or the first cantilever.

[0021] The elastic member is always in a stretched state, so that the elastic member and the adjusting screw apply forces in opposite directions to the sliding block.

[0022] In one of the above technical solutions of the thickness detection mechanism, the elastic member is a spring.

[0023] In one of the above technical solutions of the thickness detection mechanism, the adjusting assembly comprises:

[0024] A lead screw is rotationally connected to the first support, and the lead screw is threadedly connected to the sliding block.

[0025] In a second aspect, the application provides a detection device, which comprises:

[0026] The thickness detection mechanism of any one of the first aspect;

[0027] A bearing table is located on one side of the thickness detection mechanism, and the bearing table comprises a driver and a rotating shaft connected to an output end of the driver. When a workpiece to be processed is placed on the top end of the rotating shaft, the edge of the workpiece to be processed can extend into the gap.

[0028] In the above technical solution, after the workpiece is placed on the bearing table, the thickness detection of the edge of the workpiece can be realized by controlling the rotation of the rotating shaft.

[0029] In one of the above technical solutions of the detection device, the detection device further comprises a workpiece type detection mechanism, and the workpiece type detection mechanism comprises:

[0030] A second support;

[0031] A third cantilever and a fourth cantilever, both of which are connected to the second support;

[0032] An optical fiber sensor, which comprises a transmitting end arranged on the third cantilever and a receiving end arranged on the fourth cantilever, and the transmitting end and the receiving end are oppositely arranged so that when the workpiece to be processed is located between the transmitting end and the receiving end, the light emitted by the transmitting end can be received by the receiving end after passing through the workpiece to be processed, thereby obtaining the light transmittance of the workpiece to be processed.

[0033] In the vertical direction, the top end of the rotating shaft is located between the transmitting end and the receiving end.

[0034] In the above technical solution, after the workpiece is placed on the bearing table, the thickness detection of the workpiece and the workpiece type detection can be realized at the same time.

[0035] In one of the above technical solutions of the detection device, the optical fiber sensor is provided in two groups, the transmitting ends of the two groups of optical fiber sensors are arranged at intervals along the third cantilever, and the receiving ends of the two groups of optical fiber sensors are arranged at intervals along the fourth cantilever.

[0036] The connecting line between the normal projection of the top end surface of the rotating shaft at the transmitting end and the normal projection of the top end surface of the rotating shaft at the receiving end is located on a radial line of the top end surface of the rotating shaft.

[0037] In the technical scheme, after the workpiece is placed on the bearing table, the thickness of the workpiece and the position offset of the workpiece can be detected simultaneously.

[0038] In one of the technical schemes of the detection device, the third cantilever and the fourth cantilever are parallel to each other, the transmitting end of each group of optical fiber sensors is slidingly arranged on the third cantilever, and the receiving end of each group of optical fiber sensors is slidingly arranged on the fourth cantilever.

[0039] In the technical scheme, the distance between the two groups of optical fiber sensors can be adjusted according to the size of the workpiece, so that the workpieces of different sizes can be detected.

[0040] In one of the technical schemes of the detection device, a sliding member is slidingly arranged on each of the third cantilever and the fourth cantilever, and the transmitting end and the receiving end are arranged on the corresponding sliding member.

[0041] The workpiece type detection mechanism further comprises a locking member for fixing the sliding member.

[0042] In the technical scheme, after the transmitting end and the receiving end are slidingly arranged at the specified positions, the sliding member can be fixed by the locking member, so that the optical fiber sensors are prevented from moving due to external force during the detection process, thereby improving the stability of the workpiece type detection mechanism and ensuring the orderly progress of the detection process.

[0043] In one of the technical schemes of the detection device, a first positioning member is arranged on each of the third cantilever and the fourth cantilever, the first positioning member on the third cantilever is located between the two transmitting ends, and the first positioning member on the fourth cantilever is located between the two receiving ends.

[0044] In the technical scheme, the optical fiber sensors can be quickly positioned according to the specific size of the workpiece, which is beneficial to improve the detection efficiency.

[0045] In one of the technical schemes of the detection device, two second positioning members are arranged on each of the third cantilever and the fourth cantilever, the transmitting end is located between the first positioning member and the second positioning member on the third cantilever, the receiving end is located between the first positioning member and the second positioning member on the fourth cantilever, the distance between the second positioning member and the first positioning member on the third cantilever is equal, and the distance between the second positioning member and the first positioning member on the fourth cantilever is equal.

[0046] According to the technical scheme, the fiber sensor can be quickly positioned according to the specific size type of the workpiece, and the detection efficiency is improved.

[0047] In one of the technical schemes of the detection device, the detection device further comprises an edge detection mechanism, which is located on one side of the bearing table and is used for edge detection of the workpiece to be processed.

[0048] According to the technical scheme, the type detection, thickness detection and edge detection of the wafer can be simultaneously realized on the detection device, more reference information is provided for the subsequent grinding process of the wafer, the grinding process is smoothly performed, and the production loss is reduced.

[0049] In a third aspect, the application provides a chamfering machine comprising the thickness detection mechanism of any one of the first aspect or the detection device of any one of the second aspect. BRIEF DESCRIPTION OF DRAWINGS

[0050] The preferred embodiments of the application will be described below with reference to the accompanying drawings, in which:

[0051] Figure 1 is a schematic view of a detection device according to an embodiment of the application;

[0052] Figure 2 is a schematic view of a thickness detection mechanism according to an embodiment of the application;

[0053] Figure 3 is a schematic view of a wafer in a thickness detection process according to an embodiment of the application;

[0054] Figure 4 is a schematic view of a workpiece type detection mechanism according to an embodiment of the application;

[0055] Figure 5 is a schematic view of a wafer in a thickness detection process according to an embodiment of the application;

[0056] Figure 6 is a schematic view of a wafer in a thickness detection process according to an embodiment of the application;

[0057] In the drawings, the reference signs refer to the following:

[0058] 1, thickness detection mechanism; 11, first support; 12, first cantilever; 13, second cantilever; 14, first laser sensor; 15, second laser sensor; 16, slider; 17, adjusting assembly; 171, elastic member; 172, adjusting bolt; 2, workpiece type detection mechanism; 21, second support; 22, third cantilever; 23, fourth cantilever; 24, optical fiber sensor; 241, transmitting end; 242, receiving end; 25, sliding member; 251, locking member; 26, first positioning member; 27, second positioning member; 3, edge detection mechanism; 4, bearing table; 41, driver, 42, rotating shaft;

[0059] 100, wafer; 200, gap; 210, mounting hole; 300, material taking arm. DETAILED DESCRIPTION

[0060] The preferred embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application, and are not used to limit the protection scope of the present application. Those skilled in the art can make adjustments as needed to adapt to specific application occasions.

[0061] It should be noted that in the description of the present application, the terms indicating direction or positional relationship such as "upper", "lower", "left", "right", "inner", "outer" and the like are based on the direction or positional relationship shown in the drawings, which is only for the convenience of description, and does not indicate or imply that the related devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, ordinal numbers such as "first", "second" and the like are only for descriptive purposes, and cannot be understood as indicating or implying relative importance.

[0062] In addition, it should also be noted that in the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the present application according to the specific circumstances.

[0063] Reference Figure 1 The detection device according to an embodiment of the present application is mounted on a chamfering machine, and is used for pre-position detection of a workpiece to be machined before the workpiece to be machined enters a chamfering grinding process. In the present application, a wafer is exemplarily illustrated as the workpiece to be machined.

[0064] The detection device comprises a thickness detection mechanism 1, a workpiece type detection mechanism 2, an edge detection mechanism 3, and a bearing table 4. The thickness detection mechanism 1 is used for detecting the thickness of the wafer 100, judging whether the thickness of the wafer 100 meets the processing requirements, and allowing the wafer 100 to be transferred to the grinding station for grinding processing only when the thickness of the wafer 100 meets the requirements.

[0065] The workpiece type detection mechanism 2 is used for detecting the type of the wafer 100. The wafer 100 can be divided into silicon wafers, silicon carbide wafers, gallium arsenide wafers, and the like according to different materials. The rotation speed of the grinding spindle, the grinding time, and other process parameters in the grinding process are different for different types of wafers 100. Therefore, the type of the wafer 100 needs to be detected to judge whether the wafer to be processed is the target wafer in the current grinding process. The wafer is allowed to be transferred to the grinding station for grinding processing only when it is the target wafer. Otherwise, the wafer may be damaged due to the mismatch of process parameters, thereby causing loss to the production and processing.

[0066] The edge detection mechanism 3 is used for edge detection of the wafer 100. The center of the wafer is determined through edge detection of the wafer 100, so as to ensure accurate positioning in the subsequent grinding process. In addition, edge detection can also detect whether there are cracks, notches, and other defects on the edge of the wafer, so as to prevent the edge defects of the wafer from affecting the subsequent grinding processing. The bearing table 4 is used for bearing and fixing the wafer 100. In an embodiment of the present application, the bearing table 4 comprises a driver 41 and a rotating shaft 42 connected to the output end of the driver 41. When the wafer 100 is placed on the top end of the rotating shaft 42, the rotating shaft 42 drives the wafer 100 to rotate. At the same time, the edge detection mechanism 3 obtains the edge data of the wafer through its signal transmitter and signal receiver, fits the circumference of the wafer 100 according to the edge data of the wafer, and calculates the center point of the wafer 100. The detection principle of the edge detection mechanism 3 is a known technology in the art, which will not be described in detail herein.

[0067] Reference Figure 2 The thickness detection mechanism 1 according to an embodiment of the present application comprises a first bracket 11, a first cantilever 12, a second cantilever 13, a first laser sensor 14, and a second laser sensor 15.

[0068] The first cantilever 12 and the second cantilever 13 are connected with the first support 11, the first cantilever 12 and the second cantilever 13 have the same extension direction, and a gap 200 is formed between the first cantilever 12 and the second cantilever 13, and the wafer can extend into the gap 200. It should be noted that, based on the actual processing, the first cantilever 12 and the second cantilever 13 can be an integral structure, and the gap 200 is formed by slotting the integral structure. Of course, the first cantilever 12 and the second cantilever 13 can also be a split structure, and the two are independent of each other and arranged at intervals to form the gap 200. The specific structure of the first cantilever 12 and the second cantilever 13 is not limited in the application.

[0069] The first laser sensor 14 is fixedly arranged at the end of the first cantilever 12 away from the first support 11, the second laser sensor 15 is fixedly arranged at the end of the second cantilever 13 away from the first support 11, and the detection end of the first laser sensor 14 extends into the gap 200 through the first cantilever 12, and the detection end of the second laser sensor 15 extends into the gap 200 through the second cantilever 13, so that the detection end of the first laser sensor 14 and the detection end of the second laser sensor 15 are arranged opposite to each other, and a reserved distance for the wafer to extend into is formed between the detection end of the first laser sensor 14 and the detection end of the second laser sensor 15. It should be noted that, in the above, "opposite arrangement" means that the detection end of the first laser sensor 14 and the detection end of the second laser sensor 15 are close to each other, and the axes of the two are located on the same straight line.

[0070] Referring to Figure 3 When the thickness of the wafer 100 is detected, the wafer 100 is moved to a position close to the thickness detection mechanism 1 by the material taking arm 300, the wafer 100 is controlled to extend into the gap 200 according to the set trajectory, the center of the wafer 100 corresponds to the detection end of the first laser sensor 14, then the first distance between the detection end of the first laser sensor 14 and the upper surface of the wafer 100 is obtained, the second distance between the detection end of the second laser sensor 15 and the lower surface of the wafer 100 is obtained, and finally the thickness of the center position of the wafer 100 is calculated according to the first distance and the second distance. Of course, by moving the position of the wafer 100, the thickness of any other part of the wafer 100 can be detected.

[0071] For example, in one calculation mode, a reference member with a thickness of 600 μm is placed between the detection end of the first laser sensor 14 and the detection end of the second laser sensor 15 before the thickness of the wafer 100 is detected, the thickness of 600 μm is recorded as a reference thickness, the distance between the detection end of the first laser sensor 14 and the upper surface of the reference member is X0, the distance between the detection end of the second laser sensor 15 and the lower surface of the reference member is Y0, the system records the above detection values as "reference values". In the actual detection process, the first distance X1 between the detection end of the first laser sensor 14 and the upper surface of the wafer and the second distance Y1 between the detection end of the second laser sensor 15 and the lower surface of the wafer are obtained, the sum of the value of X1-X0 and the value of Y1-Y0 is obtained as a distance difference value, and the actual thickness of the wafer is determined according to the distance difference value and the reference thickness. For example, X0=1000 μm, Y0=1000 μm, X1=1050 μm is actually measured, Y1=980 μm, and the actual thickness of the wafer is 50-20+600=630 μm.

[0072] As described above, the present application is based on the principle of laser ranging, and the first laser sensor 14 and the second laser sensor 15 are arranged oppositely to detect the thickness of the wafer. In the detection process, the first laser sensor 14 and the second laser sensor 15 do not contact the surface of the wafer, so that damage to the surface of the wafer can be avoided, and the processing quality of the wafer is improved. At the same time, the thickness of the wafer is detected based on the optical measurement method, which can eliminate the measurement error caused by human operation factors compared with the contact type measurement element such as a probe, so that the detection accuracy is improved.

[0073] In one embodiment of the present application, a plurality of mounting holes 210 are formed on the first cantilever 12 and the second cantilever 13 along the extension direction thereof, and the first laser sensor 14 and the second laser sensor 15 can be fixedly arranged in each mounting hole 210. In this way, the positions of the first laser sensor 14 and the second laser sensor 15 can be adjusted according to the actual size of the wafer 100, and the versatility of the thickness detection mechanism 1 is enhanced. For example, when the diameter of the wafer 100 is large, the first laser sensor 14 and the second laser sensor 15 can be moved away from the first bracket 11 to ensure that when the center of the wafer 100 is located between the first laser sensor 14 and the second laser sensor 15, the edge of the wafer 100 can be completely inserted into the gap 200.

[0074] Reference Figure 2 and Figure 3In an implementation form of the present application, the first support 11 is provided with a sliding block 16 sliding in the vertical direction, the first cantilever 12 and the second cantilever 13 are both fixedly arranged on the sliding block 16, and the first support 11 is further provided with an adjusting assembly 17 connected with the sliding block 16, and the sliding block 16 is controlled to reciprocate by the adjusting assembly 17, so as to realize the displacement adjustment of the first cantilever 12 and the second cantilever 13 in the vertical direction.

[0075] For example, in an embodiment, the adjusting assembly 17 comprises an elastic member 171 and an adjusting bolt 172, one end of the elastic member 171 is connected with the top of the first support 11, the other end is connected with the first cantilever 12, and the elastic member 171 is arranged in the vertical direction. In some embodiments, the elastic member 171 can be a spring, an elastic rubber rope or the like. The adjusting bolt 172 is threadedly connected with the top of the first support 11, extends in the vertical direction, and the lower end thereof abuts against the sliding block 16.

[0076] After the adjusting assembly 17 is installed on the thickness detection mechanism 1, the adjusting bolt 172 is rotated downward to keep the elastic member 171 in a stretched state, in which state the elastic member 171 exerts an upward vertical force on the sliding block 16, the adjusting bolt 172 exerts a downward vertical force on the sliding block 16, and the sliding block 16 is in a balanced state under the action of the above-mentioned forces, so as to be kept stationary. It should be noted that, since the first cantilever 12 and the sliding block 16 are in a relatively fixed state, the lower end of the elastic member 171 can be connected with the first cantilever 12 or the sliding block 16, and similarly, the lower end of the adjusting bolt 172 can be connected with the first cantilever 12 or the sliding block 16, which is not limited in the present application, and can be adaptively adjusted according to the space layout requirements in actual application.

[0077] The specific form of the adjusting assembly 17 is not limited to the above-mentioned manner, for example, in some other implementation forms, the adjusting assembly 17 and the sliding block 16 can also adopt a screw nut transmission mode, that is, the adjusting assembly 17 is a lead screw, the sliding block 16 is provided with a thread matched with the lead screw, the two ends of the lead screw are rotationally connected with the first support 11, and the threaded part of the lead screw is threadedly connected with the sliding block 16, so as to control the linear reciprocating motion of the sliding block 16 by rotating the lead screw.

[0078] The smaller the detection distance range of the first laser sensor 14 and the second laser sensor 15 is, the higher the detection accuracy is. In the case of the above-mentioned mode, after the wafer 100 moves into the gap 200, the positions of the first cantilever 12 and the second cantilever 13 in the vertical direction are adjusted by the adjusting assembly 17, so that the distances from the upper and lower surfaces of the wafer 100 to the first laser sensor 14 and the second laser sensor 15 are substantially consistent, preventing the detection accuracy from being affected due to the excessively large distance between the first laser sensor 14 or the second laser sensor 15 and the wafer. In this way, the accuracy of the wafer thickness detection can be improved, and the reliability of the detection result can be improved.

[0079] Referring to Figure 4 According to an embodiment of the workpiece type detection mechanism 2, the second bracket 21, the third cantilever 22, the fourth cantilever 23, and the optical fiber sensor 24 are provided.

[0080] The third cantilever 22 and the fourth cantilever 23 are connected to the second bracket 21. Optionally, the third cantilever 22 and the fourth cantilever 23 are parallel to each other, and a space for the wafer to pass through is formed between the third cantilever 22 and the fourth cantilever 23. The optical fiber sensor 24 includes a transmitting end 241 and a receiving end 242. The transmitting end 241 and the receiving end 242 are oppositely arranged in the vertical direction. Here, the “oppositely arranged” means that the axes of the transmitting end 241 and the receiving end 242 are located on the same vertical line. In this way, when the wafer is located between the transmitting end 241 and the receiving end 242, the light emitted by the transmitting end 241 can pass through the wafer and then be received by the receiving end 242.

[0081] As described above, before the chamfer grinding of the wafer, the wafer is transferred by the material taking arm to between the transmitting end 241 and the receiving end 242 of the optical fiber sensor 24, so that the light emitted by the transmitting end 241 can pass through the wafer and reach the receiving end 242. The optical fiber sensor 24 determines the material of the wafer according to the change in the optical properties (such as the light transmittance, the intensity of the light, the polarization state, etc.) of the light after passing through the wafer, and then identifies the wafer type. Finally, whether to perform grinding processing on the wafer is determined according to the wafer type, or the corresponding grinding process parameters are determined according to the wafer type. In this way, the phenomenon that the wafer type does not match the grinding process parameters due to the feeding error can be prevented, and the production loss can be reduced.

[0082] Referring to Figure 4 In an embodiment of the present application, the optical fiber sensor 24 is provided with two groups (each group of the optical fiber sensor 24 includes one transmitting end 241 and one receiving end 242). The two transmitting ends 241 in the two groups of the optical fiber sensor 24 are spaced apart along the third cantilever 22, the two receiving ends 242 in the two groups of the optical fiber sensor 24 are spaced apart along the fourth cantilever 23, and the transmitting end 241 and the receiving end 242 in each group of the optical fiber sensor 24 are oppositely arranged.

[0083] Firstly, it needs to be pointed out that the process of transferring the wafer clamped by the taking arm to the side of the detection device is generally carried out according to the preset route, that is, the wafer is transferred from its loading side to the bearing table 4 of the detection device, and the position of the wafer on the bearing table 4 is fixed. After the wafer is fixed on the bearing table 4, the wafer is subjected to type detection and / or thickness detection and / or edge detection. The above scheme is adopted in the present application, and in the process of detecting the type of the wafer, two groups of optical fiber sensors 24 are used. When the position of the wafer is within the deviation range, the two groups of optical fiber sensors 24 are arranged along the radial direction of the wafer, so that both of the two groups of optical fiber sensors 24 can detect the wafer type information. When at least one of the optical fiber sensors 24 cannot detect the wafer type information, it indicates that at least part of the position of the wafer is not at the set detection position (the light emitted by the emitting end 241 does not pass through the wafer directly to the receiving end 242), at this time, the wafer loading position error or the wafer non-loading and other abnormal situations may occur, and the detection process needs to be checked to determine the specific problem.

[0084] It can be seen that by setting two groups of optical fiber sensors 24, it can not only identify the type of the wafer, but also judge whether there is a wafer loading position error or a wafer non-loading and other abnormal situations. Then the detection process can be confirmed according to the above abnormal situations to reduce production loss.

[0085] Alternatively, the emitting end 241 in each group of optical fiber sensors 24 is slidingly arranged on the third cantilever 22, and the receiving end 242 in each group of optical fiber sensors 24 is slidingly arranged on the fourth cantilever 23. In actual application, the distance between the two groups of optical fiber sensors 24 can be adjusted according to the different sizes of the wafer, so as to realize the detection of wafers of different sizes.

[0086] Further, in one way, the third cantilever 22 and the fourth cantilever 23 are slidingly provided with sliding members 25, and the emitting end 241 and the receiving end 242 are fixedly arranged on the corresponding sliding members 25. At the same time, the sliding members 25 are also provided with locking members 251, which can include but are not limited to screws, buckles and other components. In this way, after the emitting end 241 and the receiving end 242 are slid to the specified position, the sliding members 25 can be fixed by the locking members 251, so as to prevent the optical fiber sensor 24 from moving due to external force during the detection process, thereby improving the stability of the workpiece type detection mechanism 2 and ensuring the orderly progress of the detection process.

[0087] It should be noted that the wafer can include a 4-inch wafer, a 6-inch wafer, an 8-inch wafer, a 12-inch wafer, and the like according to the wafer size. Therefore, in order to adapt to the above size types, in some embodiments, positioning members are respectively arranged on the third cantilever 22 and the fourth cantilever 23, and the positioning members are used to position the emitting ends 241 and the receiving ends 242 to quickly position them to the set positions.

[0088] With reference to Figure 4 and Figure 5 , the positioning members include first positioning members 26 and second positioning members 27, wherein one first positioning member 26 is arranged on the third cantilever 22 and the fourth cantilever 23 respectively, the first positioning member 26 on the third cantilever 22 is located between the two emitting ends 241, the first positioning member 26 on the fourth cantilever 23 is located between the two receiving ends 242, the upper and lower first positioning members 26 are located on the same vertical line, and the first positioning member 26 has left and right first positioning surfaces respectively, so that when the emitting ends 241 and the receiving ends 242 are slid to abut against the first positioning surfaces of the first positioning members 26, the emitting ends 241 and the receiving ends 242 are oppositely arranged, and at this time, the 4-inch wafer and the 6-inch wafer can be detected.

[0089] With reference to Figure 4 and Figure 6 , the second positioning members 27 are arranged on the third cantilever 22 and the fourth cantilever 23 respectively, and two second positioning members 27 are arranged on the third cantilever 22 respectively on the two sides of the first positioning member 26, and the two second positioning members 27 are symmetrically arranged relative to the first positioning member 26, so that the emitting ends 241 are located between the first positioning member 26 and the second positioning members 27, and the distances from the two second positioning members 27 to the first positioning member 26 are equal. Similarly, the two second positioning members 27 on the fourth cantilever 23 and their positional relationship with the first positioning member 26 are the same as the above arrangement. The surface of the second positioning member 27 close to the first positioning member 26 is a second positioning surface, so that when the emitting ends 241 and the receiving ends 242 are moved to abut against the second positioning surfaces of the corresponding second positioning members 27 respectively, the emitting ends 241 and the receiving ends 242 are oppositely arranged, and at this time, the 6-inch wafer, the 8-inch wafer, and the 12-inch wafer can be detected.

[0090] It can be seen that through the arrangement of the first positioning members 26 and the second positioning members 27, the optical fiber sensor 24 can be quickly positioned according to the specific size type of the wafer, which is beneficial to improve the detection efficiency. Of course, the relative distance between the first positioning members 26 and the second positioning members 27 can be determined by the actual size of the wafer by those skilled in the art, and is not limited to the above exemplary manner.

[0091] With reference to Figures 1-4The relative position relationship between the thickness detection mechanism 1, the workpiece type detection mechanism 2, the edge detection mechanism 3 and the bearing table 4 is introduced.

[0092] The thickness detection mechanism 1, the workpiece type detection mechanism 2 and the edge detection mechanism 3 are distributed around the bearing table 4 with the bearing table 4 as the center. Specifically, the thickness detection mechanism 1 is located on one side of the bearing table 4, and optionally, the thickness detection mechanism 1 is spaced apart from the rotating shaft 42 of the bearing table 4, so that when the wafer 100 is placed on the top end of the rotating shaft 41, the edge of the wafer 100 is located between the first laser sensor 14 and the second laser sensor 15.

[0093] The workpiece type detection mechanism 2 is also located on one side of the bearing table 4, and the top end of the rotating shaft 42 is located between the emitting end 241 and the receiving end 242 of the optical fiber sensor 24, so that when the wafer 100 is placed on the top end of the rotating shaft 42, the light emitted by the emitting end 241 can pass through the wafer 100, thereby detecting the type of the wafer. Optionally, the extension directions of the third cantilever 22 and the fourth cantilever 23 are perpendicular to the extension direction of the first cantilever 12, the line between the orthographic projection of the emitting end 241 on the top surface of the rotating shaft 42 and the orthographic projection of the receiving end 242 on the top surface of the rotating shaft 42 is located on the radial line of the top surface of the rotating shaft 42, so that when the wafer 100 is placed on the rotating shaft 42 (the path of the wafer 100 moved by the material taking arm is usually such that the wafer 100 is placed on the top end of the rotating shaft 42, and the center of the wafer 100 coincides with the axis of the rotating shaft 42), the line between the orthographic projection of the emitting end 241 on the top surface of the rotating shaft 42 and the orthographic projection of the receiving end 242 on the top surface of the rotating shaft 42 just passes through the radial line of the wafer 100, and the deviation of the wafer 100 in the feeding position can be detected.

[0094] The edge detection mechanism 3 is located on one side of the bearing table 4, and optionally, the edge detection mechanism 3 is located on the opposite side of the workpiece type detection mechanism 2, so that when the wafer 100 is placed on the rotating shaft 42, the thickness detection mechanism 1, the workpiece type detection mechanism 2 and the edge detection mechanism 3 can simultaneously detect the wafer 100, and a larger space can be reserved for the movement of the material taking arm.

[0095] The whole detection process of the wafer is briefly introduced as follows. Before the wafer is ground, the wafer 100 is first moved by the taking arm to the side of the thickness detection mechanism 1, so that the wafer 100 extends into the gap 200, and the center of the wafer 100 is located between the first laser sensor 14 and the second laser sensor 15, and the thickness of the center of the wafer 100 is detected. Then the taking arm is retracted, and the wafer 100 is placed on the top end of the rotating shaft 42. At this time, the driver 41 drives the rotating shaft 42 to rotate, and in the rotating process, the workpiece type detection mechanism 2 detects the type of the wafer 100 and whether there is a position offset, and at the same time, the thickness detection mechanism 1 detects the thickness of the four edges of the wafer 100, and the edge detection mechanism 3 detects the edge of the wafer 100.

[0096] As described above, the thickness detection mechanism 1, the workpiece type detection mechanism 2 and the edge detection mechanism 3 are distributed around the bearing table 4, and the type detection, thickness detection and edge detection of the wafer 100 can be realized at the same time, which provides more reference information for the subsequent grinding process of the wafer 100, and is beneficial to the smooth progress of the grinding process and reduces the production loss.

[0097] The application also discloses a chamfering machine which comprises the detection device in any of the above embodiments.

[0098] So far, the technical scheme of the application has been described in combination with the preferred embodiments shown in the drawings, but it is easy for those skilled in the art to understand that the protection scope of the application is obviously not limited to these specific embodiments. Those skilled in the art can make equivalent changes or replacements to the related technical features without departing from the principles of the application, and the technical scheme after the changes or replacements will fall within the protection scope of the application.

Claims

1. A thickness detecting mechanism characterized by comprising: The thickness detection mechanism comprises: a first support (11); a first cantilever (12) and a second cantilever (13) connected to the first support (11), and a gap (200) formed between the first cantilever (12) and the second cantilever (13) for the workpiece to enter; a first laser sensor (14) arranged at the end of the first cantilever (12) away from the first support (11); a second laser sensor (15) arranged at the end of the second cantilever (13) away from the first support (11), the detection end of the first laser sensor (14) and the detection end of the second laser sensor (15) are arranged opposite to each other and extend into the gap (200).

2. The thickness detecting mechanism according to claim 1, wherein A plurality of mounting holes (210) are formed on the first cantilever (12) and the second cantilever (13) along the extension direction thereof, and the first laser sensor (14) and the second laser sensor (15) can be arranged in each mounting hole (210) respectively.

3. The thickness detecting mechanism according to claim 1, wherein The thickness detection mechanism further comprises: a sliding block (16) vertically arranged on the first support (11), the first cantilever (12) and the second cantilever (13) are connected to the sliding block (16); an adjusting assembly (17) for controlling the reciprocating movement of the sliding block (16).

4. The thickness detecting mechanism according to claim 3, wherein The adjusting assembly (17) comprises: a resilient member (171) having one end connected to the top of the first support (11) and the other end connected to the first cantilever (12) or the sliding block (16); an adjusting bolt (172) threadedly connected to the first support (11), the adjusting bolt (172) extends in the vertical direction and abuts against the sliding block (16) or the first cantilever (12); wherein the resilient member (171) is always in a stretched state, so that the resilient member (171) and the adjusting bolt (172) apply forces in opposite directions to the sliding block (16).

5. The thickness detecting mechanism according to claim 3, wherein The adjusting assembly (17) comprises: a lead screw rotatably connected to the first support (11), and the lead screw is threadedly connected to the sliding block (16).

6. A detection device, characterized in that The thickness detection mechanism comprises: any one of claims 1 to 5; a carrying table (4) located on one side of the thickness detection mechanism, the carrying table (4) comprises a driver and a rotating shaft connected to the output end of the driver, and when the workpiece is placed on the top end of the rotating shaft, the edge of the workpiece can extend into the gap (200).

7. The detection device of claim 6, wherein, The detection device further comprises a workpiece type detection mechanism (2), the workpiece type detection mechanism (2) comprises: a second support (21); a third cantilever (22) and a fourth cantilever (23) connected to the second support (21); An optical fiber sensor (24) is arranged at the emitting end (241) of the third cantilever (22) and the receiving end (242) of the fourth cantilever (23), and the emitting end (241) and the receiving end (242) are oppositely arranged so that when the workpiece to be processed is located between the emitting end (241) and the receiving end (242), the light emitted by the emitting end (241) can be received by the receiving end (242) after passing through the workpiece to be processed, thereby obtaining the light transmittance of the workpiece to be processed. The top end of the rotating shaft is located between the emitting end (241) and the receiving end (242) in the vertical direction.

8. The detection device of claim 7, wherein, The optical fiber sensor (24) is arranged in two groups, and the emitting ends (241) of the two groups of optical fiber sensors (24) are arranged at intervals along the third cantilever (22), and the receiving ends (242) of the two groups of optical fiber sensors (24) are arranged at intervals along the fourth cantilever (23). The line between the normal projection of the emitting end (241) on the top end surface of the rotating shaft and the normal projection of the receiving end (242) on the top end surface of the rotating shaft is located on the radial line of the top end surface of the rotating shaft.

9. The detection device of claim 8, wherein, The third cantilever (22) and the fourth cantilever (23) are parallel to each other, and the emitting end (241) of each group of optical fiber sensors (24) is slidingly arranged on the third cantilever (22), and the receiving end (242) of each group of optical fiber sensors (24) is slidingly arranged on the fourth cantilever (23).

10. The detection device of claim 9, wherein, The third cantilever (22) and the fourth cantilever (23) are slidingly arranged with a sliding member (25), and the emitting end (241) and the receiving end (242) are arranged on the corresponding sliding member (25). The workpiece type detection mechanism further comprises a locking member (251) for fixing the sliding member (25).

11. The detection device of claim 9, wherein, The third cantilever (22) and the fourth cantilever (23) are respectively provided with a first positioning member (26), and the first positioning member (26) on the third cantilever (22) is located between the two emitting ends (241), and the first positioning member (26) on the fourth cantilever (23) is located between the two receiving ends (242).

12. The detection device of claim 9, wherein, The third cantilever (22) and the fourth cantilever (23) are respectively arranged with two second positioning members (27) at intervals, and the emitting end (241) is located between the first positioning member (26) and the second positioning member (27) on the third cantilever (22), and the receiving end (242) is located between the first positioning member (26) and the second positioning member (27) on the fourth cantilever (23), and the distance between the second positioning member (27) and the first positioning member (26) on the third cantilever (22) is equal, and the distance between the second positioning member (27) and the first positioning member (26) on the fourth cantilever (23) is equal.

13. The detection device of claim 6, wherein, The detection device further comprises an edge detection mechanism (3) located on one side of the bearing table (4) for edge detection of the workpiece to be processed.

14. A chamfering machine characterized by, The thickness detection mechanism according to any one of claims 1 to 5, or the detection device according to any one of claims 6 to 13.

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