Anti-falling bionic friction-increasing pad for wafer transfer

Abstract

The utility model relates to the technical field of friction-increasing pads, and particularly discloses an anti-falling bionic friction-increasing pad for wafer transfer, which comprises a counterweight strip, a bottom pad fixedly mounted in the counterweight strip, a circular groove formed in the bottom pad, a mounting pad fixedly mounted at the upper end of the counterweight strip, an inner groove formed in the mounting pad, and a bearing pad slidably mounted in the inner groove. Friction strips and first suction cups are evenly and fixedly installed at the upper end of the bearing pad at equal intervals, the friction strips and the first suction cups are evenly and fixedly installed on the bearing pad at equal intervals in a staggered mode, inner blocks are fixedly installed at the four corners of the inner wall of the installation pad, elastic columns are fixedly installed at the upper ends of the four inner blocks, and the four elastic columns are fixedly connected with the bearing pad. The fixing frame is fixedly installed at the lower end of the bearing pad, the possibility that the wafer falls off from the bearing pad can be effectively prevented, the wafer placing safety is improved, the gravity of the whole device faces downwards in cooperation with the design of the balance weight strip, the sliding phenomenon is not prone to occurring, and the wafer placing stability is further enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of the pad that increases friction, especially relates to a wafer transfer's anti -drop bionic pad that increases friction. BACKGROUND

[0002] Wafer transfer refers to the operation process that in the related process such as semiconductor manufacturing, wafer is accurately, safely and efficiently moved from one position to another position, and wafer needs to be placed after transfer;

[0003] The wafer after existing wafer transfer is usually placed directly on the ordinary cushion, and due to the lack of effective adsorption and fixing mechanism, the wafer is prone to shaking, displacement or even falling during the placing process, which not only may cause the wafer to be damaged, affect product quality, but also reduce production efficiency and increase production cost. UTILITY MODEL CONTENT

[0004] In view of the deficiency of prior art, the utility model provides a wafer transfer's anti -drop bionic pad that increases friction, solves the technical problem that the wafer after existing wafer transfer is usually placed directly on the ordinary cushion, and due to the lack of effective adsorption and fixing mechanism, the wafer is prone to shaking, displacement or even falling during the placing process, which not only may cause the wafer to be damaged, affect product quality, but also reduce production efficiency and increase production cost.

[0005] To achieve the above object, the utility model is realized by the following technical scheme:

[0006] A wafer transfer's anti -drop bionic pad that increases friction, including counterweight strip, the bottom pad is fixedly installed in the counterweight strip, the round groove is set up on the bottom pad, the installation pad is fixedly installed on the counterweight strip upper end, the inner groove is set up in the installation pad, the bearing pad is slidably installed in the inner groove, the friction strip and the first sucking disc are fixedly installed on the bearing pad upper end even equidistant.

[0007] Preferably, the friction strip and the first sucking disc are evenly and equidistantly staggered and arranged on the bearing pad, and the inner block is fixedly installed at the four corners of the inner wall of the installation pad.

[0008] Preferably, the elastic column is fixedly installed on the upper end of the four inner blocks, the elastic column is fixedly connected with the bearing pad, and the fixed frame is fixedly installed on the lower end of the bearing pad.

[0009] Preferably, the connecting column is fixedly installed on the lower end of the fixed frame, the connecting column is slidably installed in the round groove, the second sucking disc is fixedly installed on the lower end of the connecting column, and the lower end of the second sucking disc is flush with the lower end of the counterweight strip.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] I. When the wafer will be in contact with the first chuck, at this time the first chuck will be slightly deformed under the action of slight gravity, and then generate suction force to adsorb the wafer, at the same time the wafer will be in contact with the friction strip, increase the friction force, make it place more stable, and when the first chuck is slightly deformed, the wafer will be slightly sunken, at this time the gravity will also drive the bearing pad to be slightly sunken, at this time the bearing pad will extrude the inner block to make it be compressed, at this time the upper end of the wafer will be lower than the mounting pad, the mounting pad can protect it, can effectively prevent the wafer from falling from the bearing pad, improve the safety of wafer placement;

[0012] II. When the bearing pad moves downward, it will drive the fixed frame to move downward, the fixed frame will drive the connecting column to move downward in the circular groove, at this time the connecting column will drive the second chuck to move downward, at this time the second chuck will be adsorbed with the placement surface, make the equipment place more stable, and cooperate with the design of the counterweight strip, make the gravity of the whole device downward, more not easy to occur the phenomenon of sliding, further enhance the stability of wafer placement. BRIEF DESCRIPTION OF DRAWINGS

[0013] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and can be implemented according to the content of the specification, the following will be explained in detail with the preferred embodiment of the present application and the cooperation of the drawings.

[0014] Figure 1 It is a perspective view of the present application;

[0015] Figure 2 It is an installation pad connection explosion structural drawing of the present application;

[0016] Figure 3 It is an inner block connection structural drawing of the present application;

[0017] Figure 4 It is a bearing pad connection explosion structural drawing of the present application.

[0018] Legend: 11, counterweight strip; 12, bottom pad; 13, circular groove; 14, mounting pad; 15, inner groove; 16, bearing pad; 17, friction strip; 18, first chuck; 21, inner block; 22, elastic column; 23, fixed frame; 24, connecting column; 25, second chuck. DETAILED DESCRIPTION

[0019] The embodiment of the application effectively solves the problem that the wafer is usually directly placed on a common cushion after wafer transfer, and the wafer is prone to shaking, displacement or even falling during placement due to the lack of effective adsorption and fixing mechanism, which not only may cause the wafer to be damaged and affect product quality, but also reduces production efficiency and increases production cost. When the wafer comes into contact with the first suction cup, the first suction cup will be slightly deformed under the action of slight gravity, thereby generating suction force to adsorb the wafer. At the same time, the wafer comes into contact with the friction strip, increasing the friction force and making the wafer more stable. When the first suction cup is slightly deformed, the wafer will be slightly sunken, and the gravity will also drive the bearing pad to be slightly sunken. At this time, the bearing pad will extrude the inner block to be compressed. At this time, the upper end of the wafer will be lower than the mounting pad, and the mounting pad can protect the wafer from falling from the bearing pad, thereby improving the safety of wafer placement.

[0020] Embodiment: as shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 indicate that the technical solution in the embodiment of the application effectively solves the technical problem that the wafer is usually directly placed on a common cushion after wafer transfer, and the wafer is prone to shaking, displacement or even falling during placement due to the lack of effective adsorption and fixing mechanism, which not only may cause the wafer to be damaged and affect product quality, but also reduces production efficiency and increases production cost. The overall idea is as follows: a wafer transfer anti-falling biomimetic friction-increasing pad, including a counterweight strip 11, a bottom pad 12 fixedly installed inside the counterweight strip 11, a circular groove 13 opened on the bottom pad 12, a mounting pad 14 fixedly installed on the upper end of the counterweight strip 11, an inner groove 15 opened inside the mounting pad 14, a bearing pad 16 slidingly installed inside the inner groove 15, a friction strip 17 and a first suction cup 18 fixedly installed on the upper end of the bearing pad 16 at equal intervals, and the friction strip 17 and the first suction cup 18 are installed on the bearing pad 16 at equal intervals and staggered. When the wafer needs to be transferred, the wafer can be transferred to the device by the wafer transfer arm. At this time, the wafer comes into contact with the first suction cup 18, and the first suction cup 18 will be slightly deformed under the action of slight gravity, thereby generating suction force to adsorb the wafer. At the same time, the wafer comes into contact with the friction strip 17, increasing the friction force and making the wafer more stable. When the first suction cup 18 is slightly deformed, the wafer will be slightly sunken, and the gravity will also drive the bearing pad 16 to be slightly sunken. At this time, the bearing pad 16 will extrude the inner block 21 to be compressed. At this time, the upper end of the wafer will be lower than the mounting pad 14, and the mounting pad 14 can protect the wafer from falling from the bearing pad 16, thereby improving the safety of wafer placement.

[0021] The inner block 21 is fixedly installed at the four corners of the inner wall of the mounting pad 14, the elastic column 22 is fixedly installed at the upper end of the four inner blocks 21, the four elastic columns 22 are fixedly connected with the bearing pad 16, the fixed frame 23 is fixedly installed at the lower end of the bearing pad 16, the connecting column 24 is fixedly installed at the lower end of the fixed frame 23 and is slidably installed in the circular groove 13, the second suction disc 25 is fixedly installed at the lower end of the connecting column 24 and is flush with the lower end of the counterweight strip 11, when the bearing pad 16 moves downward, the fixed frame 23 is driven to move downward, the connecting column 24 is driven to move downward in the circular groove 13, and the second suction disc 25 is driven to move downward, so that the second suction disc 25 is adsorbed to the placing surface, the equipment is placed more stably, the gravity of the whole device is downward, the sliding phenomenon is less likely to occur, and the stability of wafer placement is further enhanced.

[0022] In view of the problems in the prior art, the utility model provides a kind of anti-falling bionic increased pad for wafer transfer, when wafer will contact with first suction disc 18, first suction disc 18 will slightly deform under the action of slight gravity, and then generate suction force to adsorb wafer, while wafer will contact with friction strip 17, increase friction, make it place more stable, and when first suction disc 18 slightly deforms, wafer will slightly sink, at this time, gravity will also drive bearing pad 16 to slightly sink, at this time, bearing pad 16 will extrude inner block 21 and make it compress, at this time, the upper end of wafer will be lower than mounting pad 14, mounting pad 14 can protect it, can effectively prevent wafer from falling from bearing pad 16, improve the safety of wafer placement.

[0023] Among them:

[0024] Counterweight strip 11: counterweight strip 11 increases the weight of the bottom of the whole device, so that the gravity center of the device is downward, which reduces the possibility of sliding or toppling during placement and enhances stability;

[0025] Bottom pad 12: bottom pad 12 fixed in counterweight strip 11 plays a buffering and supporting role, disperses the pressure transmitted by the structure above, protects counterweight strip 11 and increases durability;

[0026] Circular groove 13: circular groove 13 opened in bottom pad 12 provides space and guidance for the movement of connecting column 24, ensuring that connecting column 24 can move vertically and stably up and down;

[0027] Mounting pad 14: mounting pad 14 located at the upper end of counterweight strip 11 has inner groove 15 opened inside for accommodating bearing pad 16 and other components, and can prevent wafer from sliding from the side when it sinks, playing a peripheral protection role;

[0028] Inner groove 15: The inner groove 15 provides a moving space for the bearing pad 16, limits its moving range, and makes the bearing pad 16 only slide up and down in a specific area.

[0029] Bearing pad 16: The main component of the bearing wafer, the bearing pad 16 moves up and down in response to the placement of the wafer and changes in pressure. The friction strip 17 and the first suction cup 18 installed on it directly contact the wafer, realizing the functions of fixation and adsorption.

[0030] Friction strip 17: The friction strip 17 in contact with the wafer increases the friction force, preventing the wafer from moving horizontally on the bearing pad 16 and enhancing the stability of the wafer placement.

[0031] First suction cup 18: The first suction cup 18 deforms under the action of slight gravity, generating suction force to adsorb the wafer and providing vertical fixation force. Together with the friction strip 17, it ensures the stable placement of the wafer.

[0032] Inner block 21: The inner block 21 installed at the four corners of the inner wall of the pad 14 bears the extrusion when the bearing pad 16 sinks, limiting the sinking amplitude of the bearing pad 16 and possibly providing a springback force.

[0033] Spring column 22: The spring column 22 connecting the inner block 21 and the bearing pad 16 is stretched when the bearing pad 16 sinks, providing elastic recovery force for the bearing pad 16 and helping the bearing pad 16 to return to the initial position after the wafer is removed.

[0034] Fixed frame 23: The fixed frame 23 fixed at the lower end of the bearing pad 16 moves with the bearing pad 16, transmits force and drives the connecting column 24.

[0035] Connecting column 24: The connecting column 24 connecting the fixed frame 23 and the second suction cup 25 slides in the circular groove 13, transmitting the vertical movement of the fixed frame 23 to the second suction cup 25.

[0036] Second suction cup 25: The second suction cup 25 adsorbed with the placement surface increases the adhesion between the entire device and the placement surface, cooperating with the design of the counterweight strip 11, and further improving the placement stability of the device.

[0037] Working principle:

[0038] The first step, when the wafer needs to be transferred, the wafer can be transferred to the device by the wafer conveying arm at this time, at this time the wafer will be in contact with the first suction cup 18, at this time the first suction cup 18 will be slightly deformed under the action of slight gravity, thereby generating suction to adsorb the wafer, at the same time the wafer will be in contact with the friction strip 17, increasing the friction force, making it more stable, and when the first suction cup 18 is slightly deformed, the wafer will be slightly sunken, at this time the gravity will also drive the bearing pad 16 to be slightly sunken, at this time the bearing pad 16 will extrude the inner block 21 to be compressed, at this time the upper end of the wafer will be lower than the mounting pad 14, the mounting pad 14 can protect it, which can effectively prevent the wafer from falling off from the bearing pad 16, and improve the safety of wafer placement;

[0039] The second step, when the bearing pad 16 moves downward, it will drive the fixed frame 23 to move downward, the fixed frame 23 will drive the connecting column 24 to move downward in the circular groove 13, at this time the connecting column 24 will drive the second suction cup 25 to move downward, at this time the second suction cup 25 will be adsorbed with the placement surface, making the device more stable, and cooperating with the design of the counterweight strip 11, the gravity of the whole device is downward, it is not easy to slide, further enhancing the stability of wafer placement.

[0040] Finally, it should be noted that: obviously, the above embodiments are only examples for clearly illustrating the utility model, and are not limited to the implementation mode. For ordinary skilled in the art, on the basis of the above description, other different forms of changes or changes can be made. Here, it is not necessary and impossible to enumerate all the implementation modes. The obvious changes or changes derived therefrom are still within the protection scope of the utility model.

Claims

1. A biomimetic friction-enhancing pad for preventing wafer transfer from falling off, comprising a counterweight (11), wherein a base pad (12) is fixedly installed inside the counterweight (11), and a circular groove (13) is formed on the base pad (12), characterized in that, The upper end of the counterweight bar (11) is fixedly installed with a mounting pad (14), and the mounting pad (14) has an inner groove (15) inside. The inner groove (15) has a bearing pad (16) slidably installed inside. The upper end of the bearing pad (16) is evenly and equidistantly fixedly installed with friction strips (17) and a first suction cup (18).

2. The anti-detachment biomimetic friction-enhancing pad for wafer transfer as described in claim 1, characterized in that, The friction strip (17) and the first suction cup (18) are evenly and equidistantly arranged and staggered on the bearing pad (16).

3. The anti-detachment biomimetic friction-enhancing pad for wafer transfer as described in claim 1, characterized in that, Inner blocks (21) are fixedly installed at the four corners of the inner wall of the mounting pad (14).

4. The anti-detachment biomimetic friction-enhancing pad for wafer transfer as described in claim 3, characterized in that, Each of the four inner blocks (21) has a spring column (22) fixedly installed at its upper end, and each of the four spring columns (22) is fixedly connected to the bearing pad (16).

5. The anti-detachment biomimetic friction-enhancing pad for wafer transfer as described in claim 4, characterized in that, A fixing frame (23) is fixedly installed at the lower end of the bearing pad (16).

6. The anti-detachment biomimetic friction-enhancing pad for wafer transfer as described in claim 5, characterized in that, A connecting column (24) is fixedly installed at the lower end of the fixed frame (23), and the connecting column (24) is slidably installed in the circular groove (13).

7. The anti-detachment biomimetic friction-enhancing pad for wafer transfer as described in claim 6, characterized in that, The lower end of the connecting column (24) is fixedly installed with a second suction cup (25), and the lower end of the second suction cup (25) is flush with the lower end of the counterweight bar (11).

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