Wafer supporting device

Abstract

The utility model provides a wafer supporting device, which comprises a base assembly, a lifting seat, a wafer loading table, a grating ruler and a reading head, and is characterized in that the lifting seat is arranged on the base assembly in a lifting manner; the lifting base is arranged above the lifting base and ascends and descends along with the lifting base; the grating ruler extends in the vertical direction and is installed on one of the base assembly and the lifting base. The reading head and the grating ruler are correspondingly arranged, and the reading head is installed on the other one of the base assembly and the lifting seat; and the reading head is configured to measure the lifting height data of the lifting seat through the relative position of the reading head and the grating ruler. According to the wafer loading platform of the wafer supporting device, the reading head and the grating ruler are used for measuring the lifting height data of the wafer loading platform, and the lifting precision of the wafer loading platform is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, in particular to a wafer support device. BACKGROUND

[0002] With the continuous development of semiconductor science and technology, the requirement for the lifting precision of the support equipment for lifting wafers in the height direction is increasingly improved. The wafer support equipment in the related art comprises a wafer loading table, a lifting mechanism and a driving motor, so as to drive the lifting mechanism to drive the wafer loading table to lift by the driving motor. Among them, the current driving motor has an encoder, the driving motor detects the lifting height of the wafer loading table by the encoder, and controls the movement of the lifting mechanism according to the detected lifting height data, so as to drive the wafer loading table to lift. However, there is a large deviation between the lifting height of the wafer loading table detected by the encoder and the actual lifting height of the wafer loading table, so that the wafer loading table cannot be accurately lifted in place, thus causing the problem of reducing the lifting precision of the wafer loading table. SUMMARY

[0003] In view of the above problems, the utility model is proposed to provide a wafer support device which overcomes the above problems or at least partially solves the above problems.

[0004] An object of the utility model is to solve how to accurately determine the actual lifting height of the wafer loading table, so as to realize the effect of improving the lifting precision of the wafer support equipment.

[0005] Specifically, the utility model provides a wafer support device.

[0006] The wafer support device of the utility model comprises a base assembly, a lifting seat which is arranged on the upper side of the base, a side seat which is arranged on the base, a grating ruler which is arranged on the lifting seat, and a reading head which is arranged on the side seat.

[0007] In some embodiments, the base assembly comprises a base, a lifting seat arranged on the upper side of the base, a side seat arranged on the base, a grating ruler arranged on the lifting seat, and a reading head arranged on the side seat.

[0008] In some embodiments, the lifting seat is located at one side of the side seat in a horizontal direction, and the lifting seat is movably installed on the side seat; the side seat is provided with a mounting hole penetrating through the side seat in the horizontal direction; the reading head is installed in the mounting hole, and the grating ruler is arranged on a surface of the lifting seat facing the reading head.

[0009] In some embodiments, the wafer supporting device further comprises a sliding block movably arranged on the base in a horizontal direction, the sliding block having a first inclined surface arranged obliquely relative to the horizontal direction; the lifting seat has a second inclined surface arranged obliquely relative to the horizontal direction and matched with the first inclined surface, the second inclined surface being slidable on the first inclined surface to drive the lifting seat to move up and down by the sliding block; and a lower end of the second inclined surface is adjacent to the side seat.

[0010] In some embodiments, the wafer supporting device further comprises a driving assembly installed on the base and configured to drive the sliding block to move in the horizontal direction, thereby driving the lifting seat to move up and down; and the driving assembly is electrically connected with the reading head to obtain the lifting height data generated by the reading head.

[0011] In some embodiments, the wafer supporting device further comprises a top rod arranged on the base assembly; and the wafer loading platform is provided with a through hole corresponding to the top rod, and the top rod is configured to protrude upwardly out of the through hole during the lowering of the wafer loading platform.

[0012] In some embodiments, the wafer supporting device further comprises a plurality of flexible hinges respectively connected between the lifting seat and the wafer loading platform; and a plurality of lifting mechanisms arranged on the lifting seat and corresponding to the flexible hinges; wherein each flexible hinge comprises a fixed part arranged on the lifting seat, a lifting part arranged on the wafer loading platform, and a driving matching part between the fixed part and the lifting part and connected with the corresponding lifting mechanism to drive the driving matching part to move up and down by the lifting mechanism; a first elastic connecting part connected between the driving matching part and the fixed part; and a second elastic connecting part connected between the driving matching part and the lifting part; the flexible hinge is configured to make the lifting displacement of the driving matching part greater than the lifting displacement of the lifting mechanism by the deformation of the first and second elastic connecting parts when the driving matching part moves up and down.

[0013] In some embodiments, the plurality of flexible hinges are arranged at intervals in a circumferential direction of the wafer loading platform; wherein two of the plurality of flexible hinges are arranged oppositely, and another two of the plurality of flexible hinges are arranged oppositely.

[0014] In some embodiments, each of the driving matching portions has a downward supporting surface; each of the lifting mechanisms comprises a lifting head, and each of the lifting heads abuts against a corresponding supporting surface; the wafer supporting device further comprises a plurality of adjusting members, the plurality of adjusting members are arranged one-to-one with the plurality of driving matching portions, each of the adjusting members is liftably mounted on a corresponding lifting head, and each of the adjusting members is configured to drive a corresponding driving matching portion to move relative to a corresponding lifting head during part or all of a downward movement relative to the corresponding lifting head.

[0015] In some embodiments, each of the driving matching portions is provided with a through hole; each of the adjusting members is an adjusting bolt, a shank portion of the adjusting bolt is threadedly connected to the lifting head through the through hole, and a diameter of the shank portion is smaller than a diameter of the through hole; a head portion of the adjusting bolt is located at an upper side of the driving matching portion and presses downward the driving matching portion; each of the lifting mechanisms is a piezoelectric ceramic actuator, and each of the piezoelectric ceramic actuators has one lifting head.

[0016] The wafer supporting device of the embodiment of the present application measures the actual relative position of the lifting seat and the base assembly in the up-down direction by respectively installing the reading head and the grating ruler on the base assembly and the lifting seat, and directly measuring the actual relative position of the lifting seat and the base assembly in the up-down direction by the reading head and the grating ruler, so as to feed back the actual lifting height of the wafer loading platform accurately by the reading head and the grating ruler, so as to judge whether the wafer loading platform is lifted to the position or not, and then make timely adjustment on the height of the wafer loading platform by the operator or the driving assembly for driving the wafer loading platform to lift, thereby improving the lifting precision of the wafer supporting device of the embodiment of the present application.

[0017] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0018] Some specific embodiments of the present application will be described in detail hereinafter with reference to the accompanying drawings, in an exemplary and non-limiting manner. The same reference signs in the drawings denote the same or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0019] Figure 1 is a schematic structural view of the wafer supporting device of the embodiment of the present application;

[0020] Figure 2 is a schematic structural diagram of a wafer support device according to an embodiment of the present application;

[0021] Figure 3 is Figure 1 is a partial enlarged schematic view of A in FIG. 4;

[0022] Figure 4 is a schematic structural diagram of a flexible hinge according to an embodiment of the present application;

[0023] Figure 5 is a schematic structural diagram of a flexible hinge according to an embodiment of the present application;

[0024] Figure 6 is a partial schematic structural diagram of a wafer support device according to an embodiment of the present application;

[0025] Figure 7 is a partial schematic structural diagram of a wafer support device according to an embodiment of the present application;

[0026] Figure 8 is Figure 7 is a partial enlarged schematic view of B in FIG. 5;

[0027] Figure 9 is a schematic structural diagram of a wafer support device according to an embodiment of the present application;

[0028] Figure 10 is a schematic structural diagram of a wafer support device according to an embodiment of the present application.

[0029] Reference signs:

[0030] Base assembly 100; lifting seat 110; second inclined surface 120; sliding block 130; first inclined surface 131; driving motor 141; lead screw 142; top rod 150; base assembly 160; base 161; side seat 162; first guide rail 163; mounting hole 164; wafer loading platform 200; flexible hinge 310; fixed part 311; lifting part 312; driving matching part 313; support surface 315; first elastic connecting part 316; second elastic connecting part 317; first flexible hinge 301; second flexible hinge 302; third flexible hinge 303; fourth flexible hinge 304; fifth flexible hinge 305; sixth flexible hinge 306; lifting mechanism 330; lifting head 331; elastic member 340; activity space 350; adjusting member 360; grating ruler 410; reading head 420. DETAILED DESCRIPTION

[0031] Reference will now be made to Figures 1 to 10This description pertains to a wafer support device according to an embodiment of the present invention. In this description, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0032] Unless otherwise expressly specified and limited, the terms "set," "install," "connect," "link," "fix," and "couple" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] Furthermore, in the description of this embodiment, "above" or "below" the second feature can include direct contact between the first and second features, or it can include contact between the first and second features through another feature between them. That is, in the description of this embodiment, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "below" of the second feature can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] In the description of this embodiment, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] The wafer support device of the present invention is described below with reference to the accompanying drawings.

[0036] As Figures 1-10 The wafer supporting device in the embodiment of the present application comprises a base assembly 160, a lifting seat 110, a grating ruler 410 and a reading head 420.

[0037] The lifting seat 110 is arranged on the base assembly 160 in a lifting manner. A wafer loading platform 200 is arranged above the lifting seat 110 and is lifted along with the lifting seat 110. That is, the wafer loading platform 200 is used for mounting a wafer, and the wafer loading platform 200 is arranged above the base assembly 100. That is, the wafer can be mounted on the wafer loading platform 200 and is lifted or lowered along with the wafer loading platform 200.

[0038] The grating ruler 410 extends in the up-down direction, and the grating ruler 410 is mounted on one of the base assembly 160 and the lifting seat 110. The reading head 420 is arranged correspondingly to the grating ruler 410, and the reading head 420 is mounted on the other one of the base assembly 160 and the lifting seat 110. In other words, the grating ruler 410 is mounted on the base assembly 160, and the reading head 420 is mounted on the lifting seat 110; or the grating ruler 410 is mounted on the lifting seat 110, and the reading head 420 is mounted on the base assembly 160. Since the lifting seat 110 can be lifted relative to the base assembly 160, when the lifting seat 110 is lifted, the reading head 420 is lifted relative to the grating ruler 410.

[0039] The reading head 420 is configured to measure the lifting height data of the lifting seat 110 through the relative position of the reading head 420 and the grating ruler 410. When the lifting seat 110 is lifted, the reading head 420 obtains the change amount of the relative position of the reading head 420 and the grating ruler 410 in the up-down direction, so as to obtain the lifting height of the lifting seat 110 relative to the base assembly 160, and further obtain the lifting height of the wafer loading platform 200.

[0040] Compared with the related art, the wafer supporting device in the embodiment of the present application mounts the reading head 420 and the grating ruler 410 on the base assembly 160 and the lifting seat 110 respectively, and directly measures the actual position change amount of the lifting seat 110 and the base assembly 160 in the up-down direction by using the reading head 420 and the grating ruler 410, so as to feed back the actual lifting height of the wafer loading platform 200 through the reading head 420 and the grating ruler 410. In order to determine whether the wafer loading platform 200 is lifted to the position, and further make timely adjustment on the height of the wafer loading platform 200 by the operator or the driving assembly for driving the wafer loading platform 200 to lift when the wafer loading platform 200 does not reach the preset target height, so as to improve the lifting precision of the wafer supporting device in the embodiment of the present application.

[0041] In some embodiments of the present application, as Figures 1-2As shown in the figure, the base assembly 160 comprises a base 161 and a side base 162, the lifting base 110 is arranged on the upper side of the base 161, and the side base 162 is arranged on the base 161. The grating ruler 410 is installed on the lifting base 110, and the reading head 420 is installed on the side base. By installing the reading head 420 on the side base, when the grating ruler 410 follows the lifting of the lifting base 110, the grating ruler 410 can correspond to the reading head 420, and the reading head 420 and the side base 162 do not interfere with the lifting of the lifting base 110 and the grating ruler 410.

[0042] Further, as Figures 1-2 shown, the lifting base 110 is on one side of the side base 162 in the horizontal direction, and the lifting base 110 is movably installed on the side base 162. For example Figure 1 , the lifting base 110 is on the rear side of the side base 162.

[0043] The side base is provided with a mounting hole penetrating the side base 162 in the horizontal direction, that is, the extension direction of the mounting hole is consistent with the relative direction of the lifting base 110 and the side base 162. The reading head 420 is installed in the mounting hole, and the grating ruler 410 is arranged on the surface of the lifting base 110 facing the reading head 420. Since the extension direction of the mounting hole is consistent with the relative direction of the lifting base 110 and the side base 162, after the reading head 420 is installed in the mounting hole, the reading head 420 can not only extend out of the mounting hole, but also correspond to the grating ruler 410, so as to not only realize the installation of the reading head 420 on the side base 162 and correspond to the grating ruler 410, but also the structure of the mounting hole is simple and easy to process and manufacture the side base 162.

[0044] In some embodiments of the utility model, as Figures 1-2 shown, the wafer supporting device further comprises a sliding block 130, the sliding block 130 is movably arranged on the base 161 along the horizontal direction, and the sliding block 130 has a first inclined surface 131 arranged obliquely relative to the horizontal direction.

[0045] The lifting base 110 has a second inclined surface arranged obliquely relative to the horizontal direction and matched with the first inclined surface, and the second inclined surface is slidable on the first inclined surface, so that the sliding block drives the lifting base 110 to lift. That is, when the sliding block 130 moves along the horizontal direction, the first inclined surface 131 slides relative to the second inclined surface 120, so that the sliding block 130 lifts the lifting base 110 or makes the lifting base 110 descend, and then the lifting base 110 drives the wafer loading platform 200 to lift.

[0046] For example Figure 1As shown, the horizontal direction is the front-rear direction, the first inclined surface 131 is inclined relative to the front-rear direction, and the front end of the first inclined surface 131 is below the rear end. The second inclined surface 120 is inclined relative to the front-rear direction, and the front end of the first inclined surface 131 is below the rear end. That is, when the slider 130 moves along the front-rear direction, the first inclined surface 131 slides relative to the second inclined surface 120, thereby lifting the lifting seat 110 or lowering the lifting seat 110. Thus, by adjusting the position of the lifting seat 110 in the up-down direction, the height position of the wafer loading platform 200 is quickly adjusted, and the height of the wafer loading platform 200 is adjusted.

[0047] Further, the side seat 162 is provided with a first guide rail 163 extending in the up-down direction. The lifting seat 110 is provided with a guide piece matched with the first guide rail 163, and the guide piece is slidably matched with the first guide rail 163 in the up-down direction, thereby realizing the movement of the lifting seat 110 in the up-down direction.

[0048] In some embodiments of the present application, as shown in Figures 1-2 As shown, the lower end of the first inclined surface is adjacent to the side seat 162. That is, the end surface of one end of the lifting seat 110 adjacent to the side seat 162 has a size in the up-down direction greater than that of the other end in the up-down direction. Since the grating ruler 410 is arranged on the surface of the lifting seat 110 facing the reading head 420, the grating ruler 410 has a larger installation space on the lifting seat, thereby facilitating the installation of the grating ruler 410, and the grating ruler 410 can have a larger height size, thereby enabling the grating ruler 410 to have a larger height measurement range.

[0049] In some embodiments of the present application, as shown in Figures 1-2 As shown, the wafer supporting device of the present application further comprises a driving assembly mounted on the base 161 and used for driving the slider to move in the horizontal direction, thereby driving the lifting seat 110 to lift and lower. The driving assembly is electrically connected with the reading head 420 to obtain the lifting height data generated by the reading head 420. That is, the lifting height data generated by the reading head 420 can be fed back to the driving assembly, so that the driving assembly can adjust the height of the wafer loading platform 200 according to the lifting height data, thereby realizing the closed-loop control of the grating ruler 410, the reading head 420 and the driving assembly, and thus improving the lifting accuracy of the wafer loading platform 200.

[0050] In some optional embodiments of the present application, the driving assembly comprises a lead screw assembly and a driving motor 141, the lead screw 142 in the lead screw assembly is connected with the driving motor 141, so that the driving motor 141 drives the lead screw 142 to rotate. The nut of the lead screw assembly is connected with the slider 130, so that when the driving motor 141 drives the lead screw 142 to rotate, the nut drives the slider 130 to move in the horizontal direction.

[0051] In some optional embodiments of the utility model, the driving assembly is a linear motor, the linear motor is connected with the sliding block 130, so that the linear motor directly drives the sliding block 130 to move in the horizontal direction.

[0052] As shown in Figures 1-10 The wafer supporting device of the utility model embodiment comprises a plurality of flexible hinges 310 and a plurality of lifting mechanisms 330.

[0053] The plurality of lifting mechanisms 330 are arranged on the base assembly 100 and are arranged in one-to-one correspondence with the plurality of flexible hinges 310. Each flexible hinge 310 comprises a fixed part 311, a lifting part 312, a driving cooperation part 313, a first elastic connecting part 316 and a second elastic connecting part 317. The fixed part 311 is arranged on the base assembly 100, and the lifting part 312 is arranged on the wafer loading table 200. The driving cooperation part 313 is between the fixed part 311 and the lifting part 312 and is connected with the corresponding lifting mechanism 330, so that the lifting mechanism 330 drives the driving cooperation part 313 to ascend and descend.

[0054] The first elastic connecting part 316 is connected between the driving cooperation part 313 and the fixed part 311. The second elastic connecting part 317 is connected between the driving cooperation part 313 and the lifting part 312. The first elastic connecting part 316 and the second elastic connecting part 317 can elastically deform, that is, the first elastic connecting part 316 and the second elastic connecting part 317 can be bent and deformed under external force and can recover.

[0055] For example, when the lifting mechanism 330 drives the driving cooperation part 313 to ascend, the driving cooperation part 313 as a whole tilts upward, and one end of the driving cooperation part 313 close to the lifting part 312 ascends. In this process, the first elastic connecting part 316 and the second elastic connecting part 317 are bent under force, so that the driving cooperation part 313 can tilt, and one end of the driving cooperation part 313 close to the lifting part 312 can smoothly ascend. For another example, when the lifting mechanism 330 drives the driving cooperation part 313 to descend, the driving cooperation part 313 descends under the influence of gravity, and one end of the driving cooperation part 313 close to the lifting part 312 descends. In this process, the bent first elastic connecting part 316 and the bent second elastic connecting part 317 are respectively subjected to the pulling force of the fixed part 311 and the driving cooperation part 313 and the pulling force of the lifting part 312 and the driving cooperation part 313, and the first elastic connecting part 316 and the second elastic connecting part 317 are restored from the bent state to the flat state, so that one end of the driving cooperation part 313 close to the lifting part 312 can smoothly descend.

[0056] The flexible hinge 310 is configured to make the lifting displacement of the driving fitting part 313 greater than the lifting displacement of the lifting mechanism 330 through the deformation of the first elastic connecting part 316 and the second elastic connecting part 317 when the driving fitting part 313 is lifted or lowered.

[0057] When the driving fitting part 313 is lifted or lowered, the driving fitting part 313 can be inclined at a certain angle due to the elastic deformation of the first elastic connecting part 316 and the second elastic connecting part 317, so that the lifting or lowering displacement of the end of the driving fitting part 313 connected with the lifting part 312 is greater than the lifting or lowering displacement of the lifting mechanism 330, and the lifting or lowering height of the lifting part 312 driving the wafer loading platform 200 is greater than the lifting or lowering height of the lifting mechanism 330. Therefore, when the lifting mechanism 330 drives the driving fitting part 313 to reach the limit height that can be output by the lifting mechanism 330, that is, the lifting mechanism 330 reaches the limit position of the stroke, the lifting height of the lifting part 312 driving the wafer loading platform 200 is greater than the limit height, so that the stroke of the wafer loading platform 200 is greater than the stroke of the lifting mechanism 330.

[0058] Since the two ends of the driving fitting part 313 are connected with the fixed part 311 and the lifting part 312 through the first elastic connecting part 316 and the second elastic connecting part 317 respectively, and the first elastic connecting part 316 and the second elastic connecting part 317 can be elastically deformed, when the lifting mechanism 330 drives the driving fitting part 313 of the flexible hinge 310 to lift or lower, the driving fitting part 313 can be inclined at a certain angle, so that the lifting or lowering displacement of the end of the driving fitting part 313 connected with the lifting part 312 is greater than the lifting or lowering displacement output by the lifting mechanism, thereby increasing the stroke of the wafer loading platform 200. That is, the wafer supporting device of the embodiment only needs to be configured with a lifting mechanism 330 with a small stroke and a small size, so that the wafer loading platform 200 has a larger lifting range than the stroke of the lifting mechanism 330. Therefore, the wafer supporting device of the embodiment not only has a larger stroke, but also has a smaller overall size.

[0059] In some embodiments of the utility model, as shown in Figures 3-5 The fixed part 311 is a connecting block, and the lower surface thereof is connected with the base assembly 100. The lifting part 312 is a connecting block, and the upper surface thereof is connected with the wafer loading platform 200. The first elastic connecting part 316 and the second elastic connecting part 317 are both elastic sheets. Therefore, the flexible hinge 310 can be conveniently installed on the wafer loading platform 200 and the base assembly 100, and has the advantage of high assembly efficiency.

[0060] In some embodiments of the utility model, as shown in Figures 3-5As shown, the fixing part, the lifting part, the driving matching part, the first elastic connecting part and the second elastic connecting part are integrally formed by the same material. The installation of the whole flexible hinge 310 can be completed by only fixing the fixing part 311 and the lifting part 312 on the lifting seat 110 and the wafer loading table 200 respectively, and the installation efficiency is higher.

[0061] In some embodiments of the utility model, the top rod 150 is arranged on the base assembly 160; the wafer loading table 200 is provided with a through hole corresponding to the top rod 150, and the top rod 150 is configured to protrude upwardly through the through hole in the process of lowering the wafer loading table. When the wafer loading table 200 is lowered to the lowest position, the upper end of the top rod 150 is located above the wafer loading table 200, so that the top rod 150 can lift the wafer on the wafer loading table 200, so as to take the wafer off the wafer loading table 200.

[0062] In some embodiments of the utility model, as shown in Figure 4 and Figure 5 As shown, the first elastic connecting part 316 is connected between the lower part of the corresponding fixing part 311 and the lower part of the corresponding driving matching part 313, so as to form a first accommodation slot with the opening upward. The second elastic connecting part 317 is connected between the upper part of the corresponding lifting part 312 and the middle part of the corresponding driving matching part 313, so as to form an accommodation slot with the opening downward.

[0063] Because the first accommodation slot is formed between the lower part of the fixing part 311 and the lower part of the corresponding driving matching part 313, the restriction of the fixing part 311 on the driving matching part 313 is reduced when the driving matching part 313 rotates relative to the fixing part 311. Similarly, the second accommodation slot is formed between the upper part of the lifting part 312 and the middle part of the corresponding driving matching part 313, the restriction of the lifting part 312 on the driving matching part 313 is reduced when the driving matching part 313 rotates relative to the lifting part 312. Therefore, the driving matching part 313 connected between the fixing part 311 and the lifting part 312 has a large degree of freedom of rotation, and the height adjustment range of the wafer loading table 200 is increased.

[0064] In some embodiments of the utility model, as shown in Figure 3As shown, the wafer supporting device further comprises a plurality of elastic members 340, the plurality of elastic members 340 are arranged one by one corresponding to the plurality of lifting portions 312, each elastic member 340 is connected between the base assembly 100 and the corresponding lifting portion 312, and is configured to apply a force to make the base assembly 100 and the lifting portion 312 close to each other. In other words, one end of the elastic member 340 is connected with the lifting seat 110, the other end of the elastic member 340 is connected with the lifting portion 312, and the elastic member 340 is in a tensile tension state to make the elastic member 340 apply a downward pulling force to the lifting portion 312. Thus, when the lifting mechanism 330 is lowered, the lifting portion 312 can be lowered in time, thereby improving the sensitivity of the wafer supporting device in the embodiment of the utility model.

[0065] In addition, the elastic member 340 provides a pulling force to allow the lifting mechanism 330 to drive the lifting portion 312 to rise, that is, the elastic coefficient of the elastic member 340 is smaller than the elastic coefficient of the connecting portion, so that when the lifting mechanism 330 drives the lifting portion 312 to rise, the lifting portion 312 can maintain a horizontal state.

[0066] In some embodiments of the utility model, the elastic member 340 is arranged above the lifting portion 312, and the lower end of the elastic member 340 abuts against the lifting portion 312 to apply a downward pressure to the lifting portion 312.

[0067] In some embodiments of the utility model, the plurality of flexible hinges 310 are arranged at intervals in the circumferential direction of the wafer loading table 200; wherein two flexible hinges 310 in the plurality of flexible hinges 310 are arranged oppositely, and another two flexible hinges in the plurality of flexible hinges 310 are arranged oppositely.

[0068] As shown in Figure 9 and Figure 10 two flexible hinges 310 in the plurality of flexible hinges 310 are respectively a first flexible hinge 301 and a second flexible hinge 302.

[0069] The fixed part 311 of the first flexible hinge 301 and the fixed part 311 of the second flexible hinge 302 are located between the lifting parts 312 of the first flexible hinge 301 and the lifting parts 312 of the second flexible hinge 302. That is, the interval distance between the fixed part 311 of the first flexible hinge 301 and the fixed part 311 of the first flexible hinge 301 is smaller than the interval distance between the lifting part 312 of the first flexible hinge 301 and the lifting part 312 of the first flexible hinge 301. Alternatively, the lifting part 312 of the first flexible hinge 301 and the lifting part 312 of the second flexible hinge 302 are located between the fixed part 311 of the first flexible hinge 301 and the fixed part 311 of the second flexible hinge 302. That is, the interval distance between the lifting part 312 of the first flexible hinge 301 and the lifting part 312 of the first flexible hinge 301 is smaller than the interval distance between the fixed part 311 of the first flexible hinge 301 and the fixed part 311 of the first flexible hinge 301.

[0070] The lifting mechanisms 330 are in one-to-one correspondence with the driving matching parts 313 of the first flexible hinge 301 and the driving matching parts 313 of the first flexible hinge 301, and drive the driving matching parts 313 of the first flexible hinge 301 and the driving matching parts 313 of the first flexible hinge 301 to rise and fall.

[0071] When the driving matching part 313 is lifted or lowered by the lifting mechanism 330, the bending position of the connecting part 316 connected between the driving matching part 313 and the fixed part 311 may change, so that the driving matching part 313 has a tendency to move in the horizontal direction. When the driving matching part 313 of the first flexible hinge 301 has a tendency to move in the horizontal direction, the driving matching part 313 of the second flexible hinge 302 is also lifted and lowered synchronously, and has a tendency to move in the horizontal direction opposite to that of the driving matching part 313 of the first flexible hinge 301, so as to limit the displacement of the first flexible hinge 301 and the second flexible hinge 302 in the horizontal direction, and avoid the horizontal displacement of the wafer loading table 200 when lifting.

[0072] For example, the first flexible hinge 301 is one or two, the first flexible hinge 301 and the two first flexible hinges 301 are evenly spaced in the circumferential direction of the lifting seat 110, and the fixed part 311 of the first flexible hinge 301 is close to the center of the lifting seat 110 relative to the lifting part 312 thereof. The fixed part 311 of each first flexible hinge 301 is close to the center of the lifting seat 110 relative to the lifting part 312 thereof.

[0073] In some embodiments of the present application, Figure 10As shown, two of the plurality of flexible hinges 310 are a third flexible hinge 303 and a fourth flexible hinge 304, respectively. The third flexible hinge 303 and the fourth flexible hinge 304 are symmetrically arranged as a whole with the first flexible hinge 301 and the second flexible hinge 302.

[0074] That is, the fixed part 311 of the third flexible hinge 303 and the fixed part 311 of the fourth flexible hinge 304 are both located between the lifting part 312 of the third flexible hinge 303 and the lifting part 312 of the fourth flexible hinge 304. Alternatively, the lifting part 312 of the third flexible hinge 303 and the lifting part 312 of the second flexible hinge 302 are both located between the fixed part 311 of the first flexible hinge 301 and the fixed part 311 of the second flexible hinge 302.

[0075] And the direction in which the fixed part 311, the lifting part 312 and the driving matching part 313 of the first flexible hinge 301 are sequentially arranged is not parallel to the direction in which the fixed part 311, the lifting part 312 and the driving matching part 313 of the second flexible hinge 302 are sequentially arranged. The direction in which the fixed part 311, the lifting part 312 and the driving matching part 313 of the third flexible hinge 303 are sequentially arranged is not parallel to the direction in which the fixed part 311, the lifting part 312 and the driving matching part 313 of the fourth flexible hinge 304 are sequentially arranged.

[0076] For example Figure 10 As shown, the first flexible hinge 301 and the first flexible hinge 301 are sequentially arranged in the front-back direction, the third flexible hinge 303 and the fourth flexible hinge 304 are sequentially arranged in the front-back direction, and the whole formed by the first flexible hinge 301 and the first flexible hinge 301 is symmetrically arranged in the left-right direction with the whole formed by the third flexible hinge 303 and the fourth flexible hinge 304.

[0077] The whole formed by the first flexible hinge 301 and the second flexible hinge 302 and the whole formed by the third flexible hinge 303 and the fourth flexible hinge 304 form a symmetrical arrangement, so that when the plurality of lifting mechanisms 330 drive the driving matching part 313 of the flexible hinge 310, each part of the wafer loading table 200 can be uniformly lifted, thereby improving the high levelness of the wafer loading table 200 during lifting.

[0078] In some other embodiments of the present application, for example Figure 9As shown, the first flexible hinge 301 and the second flexible hinge 302 are oppositely arranged, and the other two flexible hinges 310 in the plurality of flexible hinges 310 are respectively a fifth flexible hinge 305 and a sixth flexible hinge 306. The fifth flexible hinge 305 and the sixth flexible hinge 306 are oppositely arranged; the whole formed by the fifth flexible hinge 305 and the sixth flexible hinge 306 is arranged in a horizontal direction and is spaced apart from the whole formed by the first flexible hinge 301 and the second flexible hinge 302.

[0079] That is, the fixing part 311, the lifting part 312 and the driving matching part 313 of the first flexible hinge 301 are sequentially arranged in a direction parallel and coinciding with the fixing part 311, the lifting part 312 and the driving matching part 313 of the second flexible hinge 302. The fixing part 311, the lifting part 312 and the driving matching part 313 of the fifth flexible hinge 305 are sequentially arranged in a direction parallel and coinciding with the fixing part 311, the lifting part 312 and the driving matching part 313 of the sixth flexible hinge 306.

[0080] The whole formed by the first flexible hinge 301 and the second flexible hinge 302 and the whole formed by the third flexible hinge 303 and the fourth flexible hinge 304 form a symmetrical arrangement, so that when the plurality of lifting mechanisms 330 drive the driving matching parts 313 of the flexible hinges 310, each part of the wafer loading table 200 can be uniformly lifted, thereby improving the high levelness of the wafer loading table 200 during lifting.

[0081] In some embodiments of the utility model, as shown in Figure 6 Each driving matching part 313 has a downward supporting surface 315. Each lifting mechanism 330 includes a lifting head 331, and each lifting head 331 abuts against the corresponding supporting surface 315. Thus, the lifting head 331 allows the driving matching part 313 to move relative to the lifting mechanism 330 during lifting, thereby avoiding the lifting head 331 from restricting the rotation of the driving matching part 313.

[0082] In some embodiments of the utility model, as shown in Figure 6 As shown, the wafer supporting device in the embodiments of the utility model further includes a plurality of adjusting members 360, which are arranged one-to-one with the plurality of driving matching parts 313. Each adjusting member 360 is movably installed on the corresponding lifting head 331, and each adjusting member 360 is configured to drive the corresponding driving matching part 313 to move relative to the corresponding lifting head 331 during part or all of the downward movement relative to the corresponding lifting head 331.

[0083] A space 350 is formed between the driving fitting part 313 and the lifting mechanism 330 to allow the driving fitting part 313 to move relative to the lifting mechanism 330 when the driving fitting part 313 and the lifting mechanism 330 contact, so as to adjust the height of the lifting part 312. That is, when the lifting mechanism 330 drives the driving fitting part 313 to move up and down, the driving fitting part 313 will be inclined and a certain space will be formed between the driving fitting part 313 and the lifting mechanism 330, so that the driving fitting part 313 can be slightly changed in height.

[0084] Since the two connecting parts 316 of the flexible hinge 310 can be elastically deformed, when the adjusting member 360 drives the driving fitting part 313 to move relative to the lifting mechanism 330, the two connecting parts 316 can be deformed, so that the inclination angle of the driving fitting part 313 is changed, the height of the part of the wafer loading platform 200 connected with the connecting part 316 of the flexible hinge 310 is adjusted, so that the user can use the adjusting member 360 to drive the part of the wafer loading platform 200 corresponding to the adjusting member 360 to move up and down according to the actual situation, and the levelness of the wafer loading platform 200 is adjusted.

[0085] For example Figure 1 As shown in the figure, after the wafer loading platform 200 is lifted, the part in the left front of the wafer loading platform 200 is higher than the rest, and the user can use the adjusting member 360 in the left front to press down the driving fitting part 313 of the flexible hinge 310, so that the part in the left front of the wafer loading platform 200 is lowered, and the levelness of the wafer loading platform 200 as a whole is adjusted.

[0086] Specifically, as Figure 6 shown in the figure, the lifting mechanism 330 includes a liftable lifting head 331, the driving fitting part 313 has a supporting surface 315, the lifting head abuts against the supporting surface 315, and a space 350 is formed between the supporting surface 315 and the lifting head 331. Each adjusting member 360 is an adjusting bolt, the shank of the adjusting bolt is threadedly connected to the lifting head 331 through a through hole, and the diameter of the shank is smaller than the diameter of the through hole; the head of the adjusting bolt is located on the upper side of the driving fitting part 313 and is used to press down the driving fitting part 313. By using the threaded connection between the adjusting bolt and the lifting head 331 of the lifting mechanism 330, when the adjusting bolt is screwed in or out, the distance between the head of the adjusting bolt and the lifting head 331 is changed, the driving fitting part 313 is pressed down, and the structure is simple and easy to manufacture.

[0087] Alternatively, the lifting mechanism 330 is a piezoelectric ceramic actuator, each piezoelectric ceramic actuator has a lifting head 331, so that the lifting mechanism 330 drives the driving fitting part 313 to move up and down with high accuracy.

[0088] In some embodiments, the flexible hinge 310 comprises two sliding parts and a support plate part connected between the two sliding parts, and the support plate part is rotatable relative to the two sliding parts. The two sliding parts are respectively connected with the lifting seat 110 and the wafer loading platform 200 in a sliding manner. The lifting mechanism 330 abuts against the support plate part to drive the support plate part to lift and lower the wafer loading platform 200.

[0089] In some embodiments, the maximum distance between the wafer loading platform 200 and the lifting seat 110 is 100-300 μm. Alternatively, the maximum distance between the wafer loading platform 200 and the lifting seat 110 is 100-300 μm. Alternatively, the maximum distance between the wafer loading platform 200 and the lifting seat 110 is 140-260 μm. Alternatively, the maximum distance between the wafer loading platform 200 and the lifting seat 110 is 190-220 μm. Thus, the wafer loading platform 200 has a larger adjustment range.

[0090] In some embodiments, the maximum distance between the wafer loading platform 200 and the lifting seat 110 includes but is not limited to 100 μm, 121 μm, 150 μm, 200 μm, 234 μm, 257 μm, 280 μm, 297 μm or 300 μm.

[0091] It should be appreciated by those skilled in the art that, although the present application has been fully described by way of example and illustrated with reference to a number of example embodiments, various modifications and changes can be made to the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and determined to cover all such modifications and changes.

Claims

1. A wafer support device, characterized in that, include: Base assembly; A lifting seat, which is movably mounted on the base assembly; A wafer loading stage is positioned above the lifting platform and moves up and down with the lifting platform; A grating ruler, which extends in the vertical direction, is mounted on one of the base assembly and the lifting seat; and A reading head is provided, corresponding to the grating ruler, and is mounted on the other of the base assembly and the lifting seat; the reading head is configured to measure the lifting height data of the lifting seat by means of the relative position of the reading head and the grating ruler.

2. The wafer support device according to claim 1, characterized in that, The base assembly includes: The base, wherein the lifting seat is disposed on the upper side of the base; A side seat is mounted on the base; the grating ruler is mounted on the lifting seat, and the reading head is mounted on the side seat.

3. The wafer support device according to claim 2, characterized in that, The lifting seat is located on one side of the side seat in the horizontal direction, and the lifting seat is mounted on the side seat in a height-adjustable manner; The side seat is provided with a mounting hole that penetrates the side seat in the horizontal direction; The reading head is installed in the mounting hole, and the grating ruler is disposed on the surface of the lifting base facing the reading head.

4. The wafer support device according to claim 2, characterized in that, Also includes: A slider is movably disposed on the base in a horizontal direction, and the slider has a first inclined surface that is inclined relative to the horizontal direction; The lifting seat has a second inclined surface that is inclined relative to the horizontal direction and adapted to the first inclined surface. The second inclined surface is slidable on the first inclined surface so that the slider drives the lifting seat to rise and fall. The lower end of the second inclined surface is adjacent to the side seat.

5. The wafer support device according to claim 4, characterized in that, Also includes: A drive assembly, mounted on the base, is used to drive the slider to move horizontally, thereby driving the lifting seat to rise and fall. The drive component is electrically connected to the reading head to obtain the elevation and descent data generated by the reading head.

6. The wafer support device according to claim 1, characterized in that, Also includes: A push rod is provided on the base assembly; the wafer loading stage is provided with a through hole corresponding to the push rod, and the push rod is configured to extend upward through the through hole during the descent of the wafer loading stage.

7. The wafer support device according to claim 1, characterized in that, Also includes Multiple flexible hinges are respectively connected between the lifting base and the wafer loading stage; Multiple lifting mechanisms are mounted on the lifting seat and are correspondingly arranged with the multiple flexible hinges one by one; Each of the flexible hinges includes: A fixing part is provided on the lifting seat; The lifting section is disposed on the wafer loading stage; A drive engagement part is located between the fixed part and the lifting part, and is connected to a corresponding lifting mechanism, so that the lifting mechanism drives the drive engagement part to move up and down. A first elastic connection portion is connected between the driving engagement portion and the fixing portion; The second elastic connection is connected between the drive engagement part and the lifting part; the flexible hinge is configured such that when the drive engagement part is raised or lowered, the deformation of the first elastic connection part and the second elastic connection part causes the lifting displacement of the drive engagement part to be greater than the lifting displacement of the lifting mechanism.

8. The wafer support device according to claim 7, characterized in that, The plurality of flexible hinges are spaced apart in the circumferential direction of the wafer loading stage; wherein, two of the plurality of flexible hinges are arranged opposite each other, and another two of the plurality of flexible hinges are arranged opposite each other.

9. The wafer support device according to claim 7, characterized in that, Each of the drive mating parts has a downward-facing support surface; each of the lifting mechanisms includes a lifting head, and each lifting head abuts against the corresponding support surface; The wafer support device further includes: Multiple adjusting members are provided, and each adjusting member is correspondingly provided with a driving engagement part. Each adjusting member is vertically mounted on the corresponding lifting head. Each adjusting member is configured to drive the corresponding driving engagement part to move relative to the corresponding lifting head during part or all of the downward movement relative to the corresponding lifting head.

10. The wafer support device according to claim 9, characterized in that, Each of the aforementioned drive mating parts is provided with a through hole; Each of the adjusting components is an adjusting bolt, the threaded portion of which passes through a through hole and is threaded to the lifting head, and the diameter of the threaded portion is smaller than the diameter of the through hole; the head of the adjusting bolt is located on the upper side of the driving engagement part and presses down on the driving engagement part; Each of the lifting mechanisms is a piezoelectric ceramic actuator, and each of the piezoelectric ceramic actuators has one of the lifting heads.

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