Ceramic semiconductor high-efficiency heat dissipation device

Abstract

The utility model discloses a ceramic semiconductor high-efficiency heat dissipation device which comprises a semiconductor ceramic plate and two connecting ends, the top and the bottom of the semiconductor ceramic plate are both provided with heat conduction plates, one side of each heat conduction plate is symmetrically provided with two connecting grooves, and a plurality of heat dissipation fins are arranged between the outer edges of the heat conduction plates at equal intervals. Two connecting blocks are symmetrically arranged on one side of the cooling fin, a heat conduction inserting column and a heat conduction inserting groove are arranged at the two ends of each connecting block respectively, positioning grooves are formed in the two ends of the cooling fin, fastening through holes are formed in the positions, close to the two ends, of the cooling fin, and limiting baffles are arranged at the two ends of the heat conduction plate. Mounting plates are arranged at the two ends of the heat conduction plate. Components such as the radiating fins and the connecting ends are used in cooperation, heat can be conveniently and evenly guided to the outside of the semiconductor ceramic plate, uniformity of heat conduction and heat dissipation is guaranteed, meanwhile, the fixing plates on the connecting ends can be replaced, and installation requirements of different environments can be conveniently met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor ceramics, specifically to a ceramic semiconductor high -efficient heat dissipation device. BACKGROUND

[0002] The semiconductor heater is a new type of heating equipment, it adopts the semiconductor ceramic material as the heating element, through the action of electric current makes the semiconductor ceramic material heat, thereby realizes the heating purpose. Through the search, the patent no. CN220985864U discloses a kind of semiconductor ceramic heater, including semiconductor ceramic sheet, fin and temperature sensor, the fin is arranged in semiconductor ceramic sheet both sides, the temperature sensor is arranged on the shell outside fin, with the beneficial effect of preventing overheat and cause the damage of semiconductor ceramic sheet, prolong the service life of semiconductor ceramic sheet etc.

[0003] The existing ceramic semiconductor high -efficient heat dissipation device has the following defects:

[0004] 1, the existing heat dissipation structure is mainly located at the top and bottom of ceramic heating plate, and lacks heat dissipation structure on both sides, the heat conduction uniformity effect is insufficient, in the heat conduction process, it is easy to appear the phenomenon of uneven heating, thereby leading to the problem of affecting overall heat dissipation effect;

[0005] 2, the mounting end of the existing ceramic heating plate is generally integrated structure, cannot well adapt to the need of different installation position structure, needs to adopt the corresponding installation end of custom when installing, thereby leading to the problem of inconvenient installation and high cost.

[0006] Therefore, it is necessary to provide a solution. UTILITY MODEL CONTENT

[0007] (I) the technical problem solved

[0008] In view of the deficiencies of prior art, the utility model provides a kind of ceramic semiconductor high -efficient heat dissipation device to solve the problems in the background art.

[0009] (II) technical scheme

[0010] In order to achieve the above object, the utility model discloses a kind of ceramic semiconductor high-efficiency heat dissipation device, including semiconductor ceramic plate and two connecting ends, the top and bottom of the semiconductor ceramic plate are provided with heat conduction plate, one side of the heat conduction plate is symmetrically provided with two connecting grooves, a plurality of radiating fins are arranged at equal intervals between the outer edges of the heat conduction plate, two connecting blocks are symmetrically provided on one side of the radiating fin, heat conduction plug posts and heat conduction slots are respectively provided on the two ends of the connecting block, positioning grooves are provided on the two ends of the radiating fin, fastening through holes are provided on the position close to the two ends of the radiating fin, limiting baffle is provided on the two ends of the heat conduction plate, mounting plate is provided on the two ends of the heat conduction plate.

[0011] One end of the connecting end is provided with a connecting frame, a fixed plate is provided on the connecting frame, a mounting column is provided at the middle position of one side of the fixed plate, a connecting stud is provided between the fixed plate and the connecting frame, mounting through holes are provided on the connecting end and the mounting plate.

[0012] Preferably, the two ends of the semiconductor ceramic plate are integrally connected with a fixed plate, the connecting end is in the shape of a square tube, the two ends of the heat conduction plate are in the shape of an "L" and the bending part is in the shape of a circular arc, and a temperature control assembly is mounted on the connecting end.

[0013] Preferably, the connecting block is located at the connecting groove, the structure of the radiating fin is the same as that of the heat conduction plate and one side of the radiating fin is attached to the outer edge of the heat conduction plate, and the heat conduction plug post is inserted into the adjacent heat conduction slot.

[0014] Preferably, the positioning grooves on the radiating fins in contact with each other are matched, fastening bolts and nuts are mounted between the fastening through holes, and the limiting baffle and the heat conduction plate are connected and fixed by studs.

[0015] Preferably, the mounting plate is located in the connecting end, the connecting frame and the connecting end are in an integrated structure, and a sealing layer is attached to one side of the fixed plate facing the connecting frame.

[0016] Preferably, the mounting column and the connecting plate are in an integrated structure, the connecting stud is threadedly connected with the connecting frame, and the mounting through holes at different positions are on the same perpendicular line.

[0017] (Three) beneficial effects

[0018] The utility model provides a kind of ceramic semiconductor high-efficiency heat dissipation device.It has the following beneficial effects:

[0019] The ceramic semiconductor high-efficiency heat dissipation device can effectively and uniformly transmit the heat generated by the semiconductor ceramic plate to the outside, the heat transmission is more uniform, the uniformity of the heat dissipation fins is guaranteed, and the heat dissipation and the heating and heat conduction effect of the semiconductor ceramic plate are well realized, meanwhile, the fixing plate on the connecting end can be conveniently assembled and disassembled, and can be replaced according to the needs of the installation environment, and the overall structure of the connecting end does not need to be separately customized, and the use is convenient. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the mounting plate of the utility model;

[0022] Figure 3 It is a schematic diagram of the heat dissipation fin of the utility model;

[0023] Figure 4 It is a schematic diagram of the connecting end of the utility model.

[0024] In the drawing: fixing plate-1, limiting baffle-2, heat dissipation fin-3, heat conduction plate-4, temperature control assembly-5, connecting end-6, semiconductor ceramic plate-7, mounting plate-8, connecting block-9, heat conduction plug post-10, heat conduction plug slot-11, positioning groove-12, fastening through hole-13, connecting groove-14, mounting through hole-15, connecting frame-16, connecting stud-17. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0026] Please refer to Figures 1-4 The embodiment of the utility model provides a technical scheme:

[0027] Embodiment 1

[0028] For the above-mentioned problem 1 to be solved: the existing heat dissipation structure is mainly located at the top and bottom of the ceramic heating plate, and lacks heat dissipation structure on the two side positions, and the heating and heat conduction uniformity effect is insufficient, and in the heat conduction process, the phenomenon of uneven heating is prone to occur, thereby affecting the overall heat conduction and heat dissipation effect.

[0029] The solution is as follows: a kind of ceramic semiconductor high-efficiency heat dissipation device, including semiconductor ceramic plate 7 and two connecting ends 6, the top and bottom of semiconductor ceramic plate 7 are provided with heat-conducting plate 4, one side of heat-conducting plate 4 is symmetrically provided with two connecting grooves 14, several heat dissipation fins 3 are arranged at equal intervals between the outer edges of heat-conducting plate 4, two connecting blocks 9 are symmetrically arranged on one side of heat dissipation fin 3, heat-conducting plug column 10 and heat-conducting plug groove 11 are respectively arranged on the two ends of connecting block 9, positioning groove 12 is arranged on the two ends of heat dissipation fin 3, fastening through hole 13 is arranged on the position close to the two ends of heat dissipation fin 3, limiting baffle 2 is arranged on the two ends of heat-conducting plate 4, mounting plate 8 is arranged on the two ends of heat-conducting plate 4, specifically, after the heating of semiconductor ceramic plate 7, the heat is conducted out through heat-conducting plate 4 and further transmitted to the heat dissipation fins 3 on the top and bottom, a closed loop structure formed by two heat dissipation fins 3 can uniformly guide the heat to each position of heat dissipation fin 3, thereby realizing the uniform effect of heat dissipation and the uniformity of heat transmission, and avoiding the phenomenon of uneven heating, meanwhile, cooperating with connecting block 9, the number of heating fins 3 can be adjusted according to needs, thereby the heat conduction and heat dissipation effect can be well determined according to different use needs, and the use is facilitated.

[0030] One end of connecting end 6 is provided with connecting frame 16, fixed plate 1 is arranged on connecting frame 16, mounting column is arranged on one side of fixed plate 1, connecting stud 17 is arranged between fixed plate 1 and connecting frame 16, mounting through hole 15 is arranged on connecting end 6 and mounting plate 8.

[0031] Further, the two ends of semiconductor ceramic plate 7 are integrally connected with fixed plate, the connecting end 6 is in the form of square tube, the two ends of heat-conducting plate 4 are in the form of "L" bending structure and the bending part is in the form of circular arc structure, and temperature control assembly 5 is mounted on connecting end 6.

[0032] Further, connecting block 9 is located at connecting groove 14, heat dissipation fin 3 has the same structure as heat-conducting plate 4 and is attached to the outer edge of heat-conducting plate 4 on one side, and heat-conducting plug column 10 is inserted into adjacent heat-conducting plug groove 11.

[0033] Further, the positioning grooves 12 on the heat dissipation fins 3 in contact with each other are matched, fastening bolts and fastening nuts are mounted between fastening through holes 13, and the limiting baffle 2 and the heat-conducting plate 4 are connected and fixed by stud.

[0034] Further, mounting plate 8 is located in connecting end 6, connecting frame 16 and connecting end 6 are in the form of integrated structure, and sealing layer is bonded on one side of fixed plate 1 facing connecting frame 16.

[0035] Further, mounting column and connecting plate 1 are in the form of integrated structure, connecting stud 17 is threadedly connected with connecting frame 16, and mounting through holes 15 at different positions are on the same vertical line.

[0036] Embodiment 2

[0037] For the above-mentioned problem 2 to be solved: the mounting end of the existing ceramic heating plate is generally an integrated structure, which cannot well adapt to the needs of different installation position structures, and a customized corresponding mounting end needs to be used during installation, thereby causing the problems of inconvenient installation and high cost.

[0038] The solution is as follows: before the connecting end 6 is mounted on the mounting plate 8, the fixing plate 1 of a suitable structure is placed in the connecting end 6 and gradually moved to the connecting frame 16, and the fixing plate 1 is connected and fixed with the connecting end 6 through the connecting bolt 17, so that the overall fixing of the connecting end 6 is completed, and the connecting end 6 is connected and fixed with the mounting plate 8 for overall installation and fixing.

[0039] Working principle: during operation, first, the number of the heat dissipation fins 3 is determined according to the needs, then the heat dissipation fins 3 are placed in the connecting grooves 14 through the connecting blocks 9, when the corresponding number of the heat dissipation fins 3 are filled, the limiting baffle 2 is fixed and mounted on both ends of the heat conduction plate 4 (to ensure that the connecting blocks 9 can fill the connecting grooves 14), so that the installation of the heat dissipation fins 3 is completed, then the heat conduction plate 4 can be attached to the semiconductor ceramic plate 7, at the same time, the positioning grooves 12 at the corresponding positions are matched, and the heat conduction plate 4 is connected and fixed by using the bolts, so that the heat conduction plate 4 is fixed on the semiconductor ceramic plate 7, at this time, the fixing plate 1 of a suitable installation structure is placed in the connecting end 6 and gradually moved to the connecting frame 16, and the fixing plate 1 is connected and fixed with the connecting end 6 through the connecting bolt 17, so that the overall fixing of the connecting end 6 is completed, and the connecting end 6 is connected and fixed with the mounting plate 8 for overall installation and fixing.

[0040] The utility model discloses a fixed plate -1, limit baffle -2, fin -3, heat conduction plate -4, temperature control assembly -5, connecting end -6, semiconductor ceramic plate -7, mounting plate -8, connecting block -9, heat conduction plug -10, heat conduction slot -11, positioning recess -12, fastening through -hole -13, connecting recess -14, mounting through -hole -15, connecting frame -16, connecting stud -17, the component is all general standard spare or the component that the person skilled in the art knows, and its structure and principle are all the person skilled in the art can know or through conventional experimental method obtains through technical manual, the problem that the utility model solves is that the heat dissipation structure of existing mainly is located at the top and bottom of ceramic heating plate, and the both sides position is short of heat dissipation structure, and the heating heat conduction uniformity effect is insufficient, in the heat conduction process, the phenomenon of uneven heating is easy to appear, thereby leading to the problem of the influence of overall heat dissipation effect, the utility model discloses through the mutual combination of above -mentioned components can effectively even the heat that semiconductor ceramic plate generates is transmitted to the outside, makes heat transfer more even, guarantees the uniformity of fin heat dissipation, and then can realize heat dissipation and guarantee the heating heat conduction effect of semiconductor ceramic plate well, simultaneously, the fixed plate on connecting end can be conveniently assembled and disassembled, can be replaced according to the need of installation environment, need not single -order custom -made connecting end overall structure, convenient to use.

[0041] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above, for those skilled in the art, obviously the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be realized in other specific forms without departing from the spirit or basic characteristics of the utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the utility model is defined by the appended claims rather than the above description, therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any figure reference in the claims should not be regarded as limiting the claims involved.

[0042] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

1. A high-efficiency heat dissipation device for ceramic semiconductors, characterized in that: The device includes a semiconductor ceramic plate (7) and two connecting ends (6). A heat-conducting plate (4) is provided on the top and bottom of the semiconductor ceramic plate (7). Two connecting grooves (14) are symmetrically provided on one side of the heat-conducting plate (4). A number of heat sinks (3) are provided at equal intervals between the outer edges of the heat-conducting plate (4). Two connecting blocks (9) are symmetrically provided on one side of the heat sink (3). A heat-conducting plug (10) and a heat-conducting slot (11) are respectively provided on both ends of the connecting block (9). A positioning groove (12) is provided on both ends of the heat sink (3). A fastening through hole (13) is provided on the heat sink (3) near both ends. A limit baffle (2) is provided on both ends of the heat-conducting plate (4). An mounting plate (8) is provided on both ends of the heat-conducting plate (4). A connecting frame (16) is provided on one end of the connecting end (6), a fixing plate (1) is provided on the connecting frame (16), a mounting post is provided at the middle position on one side of the fixing plate (1), a connecting stud (17) is provided between the fixing plate (1) and the connecting frame (16), and a mounting through hole (15) is provided on both the connecting end (6) and the mounting plate (8).

2. The high-efficiency heat dissipation device for ceramic semiconductors according to claim 1, characterized in that: The semiconductor ceramic plate (7) has a fixed plate integrally connected to both ends. The connecting end (6) has a square tubular structure. The heat-conducting plate (4) has an "L" bent structure at both ends and the bent part has an arc-shaped structure. A temperature control component (5) is installed on the connecting end (6).

3. The high-efficiency heat dissipation device for ceramic semiconductors according to claim 1, characterized in that: The connecting block (9) is located at the connecting groove (14), the structure of the heat sink (3) is the same as that of the heat-conducting plate (4) and one side is attached to the outer edge of the heat-conducting plate (4), and the heat-conducting plug (10) is inserted into the adjacent heat-conducting slot (11).

4. The high-efficiency heat dissipation device for ceramic semiconductors according to claim 1, characterized in that: The positioning grooves (12) on the heat sink (3) that are in contact with each other fit together, and fastening bolts and fastening nuts are installed between the fastening through holes (13). The limiting baffle (2) and the heat conducting plate (4) are connected and fixed by studs.

5. The high-efficiency heat dissipation device for ceramic semiconductors according to claim 1, characterized in that: The mounting plate (8) is located inside the connecting end (6), the connecting frame (16) and the connecting end (6) are an integrated structure, and the fixing plate (1) has a sealing layer bonded on the side facing the connecting frame (16).

6. The high-efficiency heat dissipation device for ceramic semiconductors according to claim 1, characterized in that: The mounting post and the fixing plate (1) are an integrated structure. The connecting stud (17) is threadedly connected to the connecting frame (16). The mounting through holes (15) at different positions are on the same vertical line.

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