Differential signal wiring of SMD high-speed connector
By designing specific differential signal trace structures for SMD high-speed connectors and optimizing the design using automated programs and simulation results, the problems of low design efficiency and accuracy caused by manual trace drawing are solved, achieving efficient and standardized differential signal trace generation.
Patent Information
- Application Number
- CN202422858297.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-11-22
AI Technical Summary
In existing technologies, differential signal traces of SMD high-speed connectors are mainly drawn manually, which results in a large workload for PCB designers, low accuracy, and a high risk of errors, affecting design efficiency and quality.
Design a differential signal trace for an SMD high-speed connector. The trace is divided into six segments using a specific structure. The differential signal trace is automatically generated by an automated program. The design is optimized based on simulation results to ensure that the segment parameters meet the requirements of equal length and impedance balance.
It simplifies the design process of differential signal routing, improves PCB design efficiency, reduces human error, and achieves a standardized and regulated routing structure, facilitating subsequent inspection and confirmation.
Smart Images
Figure CN223666541U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to technical fields, more specifically, relate to a kind of SMD high-speed connector differential signal wiring. BACKGROUND
[0002] SMD (Surface Mount Device) high-speed connector is a kind of component for fast, efficient data transmission between electronic devices, usually used in computers, communication equipment and other high-performance electronic systems to realize high-speed data exchange. The characteristics of SMD connector are that they can be directly mounted on the surface of printed circuit board (PCB), instead of traditional through-hole mounting method, which makes SMD connector more compact, saves space, and facilitates automation production. SMD high-speed connector is widely used in various high-speed data transmission interfaces, such as LVDS, IEEE1394 and USB2.0, etc. These interfaces usually require high data transmission rate and low bit error rate, and SMD high-speed connector is the ideal choice to meet these requirements.
[0003] High-speed differential signal is a kind of signal transmitted on two parallel wires, which are called differential pair. This signal transmission method has the advantages of strong anti-interference ability and good noise immunity, so it is very suitable for high-speed data transmission. In SMD high-speed connector, differential signal can effectively reduce electromagnetic interference and improve signal integrity and reliability.
[0004] The differential signal wiring of high-speed connector is usually drawn by manual drawing, which leads to large workload for PCB designers, and manual operation is prone to errors. The precision of the differential signal wiring drawn is low, which makes the PCB design efficiency low and the quality poor. Therefore, it is necessary to set up an automatic running program to automatically generate differential wiring. On this basis, in order to facilitate the calculation of PCB design program, a specific structure of differential signal wiring needs to be designed. SUMMARY
[0005] In order to provide PCB design program calculation convenient differential signal wiring, the utility model provides a kind of SMD high-speed connector differential signal wiring.
[0006] The technical scheme of the utility model is as follows:
[0007] A kind of SMD high-speed connector differential signal wiring,
[0008] The differential signal wiring is two parallel PCB wirings,
[0009] The differential signal wire includes a differential wire first segment, a differential wire second segment, a differential wire third segment, a differential wire fourth segment, and a differential wire fifth segment, and the end portions of the two wire segments in any one of the differential wire segments are flush,
[0010] The differential wire first segment, the differential wire second segment, the differential wire third segment, the differential wire fourth segment, and the differential wire fifth segment are connected in the above order,
[0011] The end point of the differential wire first segment is connected with the high-speed signal via hole, and the end point of the differential wire fifth segment is connected with the high-speed signal pad of the high-speed connector.
[0012] The differential signal wire of the SMD high-speed connector, one of the ground via holes of the ground pads of the high-speed connector is located on the axis of symmetry of the two differential signal wires.
[0013] The differential signal wire of the SMD high-speed connector, the connection point of the differential wire fourth segment and the differential wire fifth segment, and the ground via hole of the ground pad of the high-speed connector are located on the same straight line.
[0014] The differential signal wire of the SMD high-speed connector, the differential wire fifth segment is a straight segment connecting the high-speed signal pads,
[0015] The differential wire fourth segment connects the differential wire fifth segment and tends to converge,
[0016] The differential wire third segment is a transition segment between the differential wire fourth segment and the differential wire second segment,
[0017] The differential wire first segment is a transition segment between the differential wire second segment and the differential wire first segment.
[0018] The differential wire first segment is a transition segment between the differential wire second segment and the differential wire first segment.
[0019] The differential signal wire of the SMD high-speed connector, four ground via holes are arranged around the high-speed signal via hole, and the ground via holes are distributed in a quadrilateral top corner structure.
[0020] The differential signal wire of the SMD high-speed connector, the ground pads of the high-speed connector are arranged side by side with the high-speed signal pads of the high-speed connector, and the ground via hole is arranged at the end of the ground pad close to the high-speed signal pad.
[0021] The differential signal wire of the SMD high-speed connector, the ground via hole is arranged on the central axis between the ground pads of the high-speed connector, and the ground via hole and the connection point of the differential wire fourth segment and the differential wire fifth segment are located on the same straight line.
[0022] The SMD high-speed connector differential signal trace has an axisymmetric structure.
[0023] The SMD high-speed connector differential signal trace has an axisymmetric structure.
[0024] The SMD high-speed connector differential signal trace has an axisymmetric structure.
[0025] According to the scheme, the differential signal trace has an axisymmetric structure.
[0026] 1. The design content of the differential signal trace is simplified, the wiring of the differential signal trace can be automatically completed according to the input or the PCB design completed in the previous step, the workload of the designer is greatly reduced, the efficiency of the PCB design is improved, and errors are reduced.
[0027] 2. The differential signal trace is combined with simulation, so that the simulation result is directly used as design requirement information of the differential signal trace, and the differential signal trace is automatically generated according to a preset differential signal trace design structure, and the PCB design is simplified.
[0028] 3. The preset differential signal trace structure standardizes and normalizes the structure of the differential signal trace, and facilitates identification and subsequent inspection and confirmation. BRIEF DESCRIPTION OF DRAWINGS
[0029] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0030] Figure 1 The differential signal trace wiring structure of the present application Figure 1 .
[0031] Figure 2 The differential signal trace wiring structure of the present application Figure 2 .
[0032] Figure 3 The differential signal trace wiring structure of the present application Figure 3 .
[0033] In the drawings, various reference signs represent:
[0034] 01. First endpoint; 02. Second endpoint; 03. Third endpoint; 04. Fourth endpoint; 05. Fifth endpoint; 06. Sixth endpoint; 07. Seventh endpoint; 08. Eighth endpoint; 09. Ninth endpoint;
[0035] 10. Zero segment of the first differential signal trace; 11. First segment of the first differential signal trace; 12. Second segment of the first differential signal trace; 13. Third segment of the first differential signal trace; 14. Fourth segment of the first differential signal trace; 15. Fifth segment of the first differential signal trace;
[0036] 20. Zero segment of the second differential signal trace; 21. First segment of the second differential signal trace; 22. Second segment of the second differential signal trace; 23. Third segment of the second differential signal trace; 24. Fourth segment of the second differential signal trace; 25. Fifth segment of the second differential signal trace;
[0037] 31. Grounding pad; 32. High-speed signal pad. Detailed Implementation
[0038] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.
[0039] The generated differential signal traces are as follows Figure 1 As shown, this utility model divides the differential signal trace into six segments. For two paired differential signal traces, there are a total of six groups of differential segments, and the ends of each group of segments are flush.
[0040] The first differential signal routing is as follows: Figure 1The traces on the left side include the first differential signal trace, which comprises a first differential signal trace segment 11, a second differential signal trace segment 12, a third differential signal trace segment 13, a fourth differential signal trace segment 14, a fifth differential signal trace segment 15, and a zeroth differential signal trace segment 10. The zeroth differential signal trace segment 10 is connected to the first differential signal trace segment 11, and their connection point is the first connection point of the differential signal trace. The first differential signal trace segment 11 is connected to the second differential signal trace segment 12. Furthermore, the connection point between the two is the second connection point of the first differential signal trace; the second segment 12 of the first differential signal trace is connected to the third segment 13 of the first differential signal trace, and the connection point between the two is the third connection point of the first differential signal trace; the third segment 13 of the first differential signal trace is connected to the fourth segment 14 of the first differential signal trace, and the connection point between the two is the fourth connection point of the first differential signal trace; the fourth segment 14 of the first differential signal trace is connected to the fifth segment 15 of the first differential signal trace, and the connection point between the two is the fifth connection point of the first differential signal trace.
[0041] Let the second differential signal routing be... Figure 1 The traces on the right side of the middle section include the second differential signal traces: first segment 21, second segment 22, third segment 23, fourth segment 24, fifth segment 25, and zero segment 20. The zero segment 20 is connected to the first segment 21, and their connection point is the first connection point of the differential signal traces. The first segment 21 is connected to the second segment 22. Furthermore, the connection point between the two is the second connection point of the second differential signal trace. The second segment 22 of the second differential signal trace is connected to the third segment 23 of the second differential signal trace, and the connection point between them is the third connection point of the second differential signal trace. The third segment 23 of the second differential signal trace is connected to the fourth segment 24 of the second differential signal trace, and the connection point between them is the fourth connection point of the second differential signal trace. The fourth segment 24 of the second differential signal trace is connected to the fifth segment 25 of the second differential signal trace, and the connection point between them is the fifth connection point of the second differential signal trace.
[0042] Assuming the high-speed connector has a fixed position, its ground pad 31 and high-speed signal pad 32 are also fixed in position. The high-speed signal pad 32 is connected to the fifth segment of the differential signal trace; that is, the fifth segment 15 of the first differential signal trace connects to the high-speed signal pad 32 on the left side of the high-speed connector, and the fifth segment 25 of the second differential signal trace connects to the high-speed signal pad 32 on the right side of the high-speed connector. On the other hand, a third ground via is located at the top endpoint of the ground pad 31 of the high-speed connector, which is the midpoint between the first and second ground vias, and the line connecting the first and second ground vias. Let the first ground via be the fifth endpoint 05, the third ground via be the sixth endpoint 06, and the second ground via be the seventh endpoint 07. For high-speed connectors, their fixed positions result in fixed positions for ground pad 31 and high-speed signal pad 32. In actual design, the size and dimensions of the high-speed connector pads are also fixed, meaning the positions of the first, second, and third ground vias are fixed (meaning the X and Y coordinates are fixed). This also means the positions and coordinates of the fifth endpoint 05, sixth endpoint 06, and seventh endpoint 07 are fixed. By inputting the position and model of the high-speed connector during design, the coordinates of the fifth endpoint 05, sixth endpoint 06, and seventh endpoint 07 can be obtained. (If only the position of the high-speed connector is determined, only the X values of the fifth endpoint 05, sixth endpoint 06, and seventh endpoint 07 are determined; the Y values are not determined due to the influence of the high-speed connector's model and size. The X coordinate of the sixth endpoint 06 is the X coordinate of the midpoint of the high-speed connector.)
[0043] The high-speed connector connects to high-speed signal vias via differential signal traces. Two high-speed signal vias connect to the high-speed signal pads 32 of the high-speed connector via first and second differential signal traces, respectively. Four grounding vias arranged in a quadrilateral configuration are positioned around the two high-speed signal vias. Let the high-speed signal via on the left be the eighth endpoint 08, and the high-speed signal via on the right be the ninth endpoint 09. The four grounding vias are designated as the first endpoint 01, the second endpoint 02, the third endpoint 03, and the fourth endpoint 04. The first endpoint 01 is located at the upper left, the second endpoint 02 at the upper right, the third endpoint 03 at the lower left, and the fourth endpoint 04 at the lower right. According to the PCB design requirements, the positions of the high-speed signal vias and their surrounding grounding vias depend on the PCB layout, meaning that when determining the differential signal traces, the positions of the high-speed signal vias and their surrounding grounding vias are fixed and considered known conditions.
[0044] Based on the above structural features, the coordinates and parameter information of each graphic in the PCB design software are as follows.
[0045] For each segment of a differential signal trace, the parameters include line width, radius of curvature (a radius of curvature of zero indicates a straight line), starting point coordinates, ending point coordinates, and direction of curvature (i.e., the positive direction is clockwise).
[0046] For paired differential signal traces, the central axis passes through the sixth endpoint 06.
[0047] Based on the graphic characteristics, the two ends of the third segment of the differential signal trace are tangent to the second and fourth segments of the differential signal trace, respectively. The first segment of the differential signal trace is tangent to the zeroth segment and the second segment of the differential signal trace, respectively. In other words, one end of the third segment 13 of the first differential signal trace is tangent to the fourth segment 14 of the first differential signal trace, and the other end of the third segment 13 of the first differential signal trace is tangent to the second segment 12 of the first differential signal trace. The first segment 11 of the first differential signal trace... One end of the second differential signal trace is tangent to the second segment 12 of the first differential signal trace; the first differential signal trace is tangent to the zero segment 10 of the first differential signal trace; one end of the third segment 23 of the second differential signal trace is tangent to the fourth segment 24 of the second differential signal trace; the other end of the third segment 23 of the second differential signal trace is tangent to the second segment 22 of the second differential signal trace; one end of the first segment 21 of the second differential signal trace is tangent to the second segment 22 of the second differential signal trace; and the second differential signal trace is tangent to the zero segment 20 of the second differential signal trace.
[0048] In addition, the fifth segment of the differential signal trace should be connected to the high-speed signal pad 32 of the high-speed connector. The other parts of the differential signal trace should be set above the ground pad 31 of the high-speed connector. Therefore, the connection point between the fourth segment and the fifth segment of the differential signal trace should be flush with the ground via of the high-speed connector. That is, the Y coordinate value of the connection point between the fourth segment 14 and the fifth segment 15 of the first differential signal trace is equal to the Y coordinate value of the connection point between the fourth segment 24 and the fifth segment 25 of the second differential signal trace, and both are equal to the Y coordinate values of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07.
[0049] When the location and model of the high-speed connector are determined, the coordinates of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are determined (X value and Y value are determined). When the location and model of the high-speed connector are determined but not determined, the X coordinates of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are determined, but the Y coordinates are not determined. The Y coordinate values of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are all equal.
[0050] High-speed signal vias and their surrounding grounding vias are either manually set or required by PCB design. That is, when differential signal routing needs to be determined, the location of the high-speed signal vias and their surrounding grounding vias is determined (X value determined, Y value determined). In this invention, the structure and location information of the high-speed signal vias and their surrounding grounding vias can be obtained through PCB design simulation results or manually set.
[0051] Each endpoint, such as the first endpoint 01, the second endpoint 02, the third endpoint 03, the fourth endpoint 04, the fifth endpoint 05, the sixth endpoint 06, the seventh endpoint 07, the eighth endpoint 08, and the ninth endpoint 09, can have its position determined by design requirements (such as manually set positions or the position and model of high-speed connectors based on PCB design requirements) or simulation results of other PCB design content (such as simulation results of high-speed signal via positions obtained through simulation of other requirement factors).
[0052] For each segment of the differential signal trace, the endpoint of the zeroth segment of the differential signal trace coincides with the high-speed signal via, and the endpoint of the fifth segment of the differential signal trace is also connected to the high-speed signal pad 32 of the high-speed connector. According to the connection rules, once the position and model of the high-speed connector are determined, the position of the endpoint of the fifth segment of the differential signal trace is also determined.
[0053] Based on the above known information, the parameters of each segment of the differential signal trace are substituted into the simulation program. The simulation requirements are equal length and impedance balance. Based on this, the parameters of each segment of the differential signal trace are determined, including line width, radius of curvature, coordinates of the starting point, coordinates of the ending point, and direction of curvature.
[0054] In one embodiment, in a PCB design drawing with the same design requirements, except for the second segment of the differential signal trace, the remaining portions of the differential signal trace can be a fixed structure with equal line width, radius of curvature, and arc direction. By copying, such differential signal traces are copied to any required location, thus determining the portions other than the second segment of the differential signal trace. The second segment of the differential signal trace is obtained through simulation, and it is required that the second segment of the differential signal trace avoids existing components in the PCB design drawing, i.e., the second segment 12 of the first differential signal trace and the second differential signal trace... The second segment 22 of the differential signal trace can be arbitrarily shaped according to simulation requirements. The remaining differential signal traces at different locations—first segment 11, third segment 13, fourth segment 14, fifth segment 15, zeroth segment 10, first segment 21, third segment 23, fourth segment 24, fifth segment 25, and zeroth segment 20—have the same parameters. For example... Figure 2 , Figure 3 As shown, the second segment 12 of the first differential signal trace and the second segment 22 of the second differential signal trace are extended and bent as required to avoid existing electronic components while meeting the conditions of equal length and impedance balance.
[0055] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A differential signal trace for an SMD high-speed connector, characterized in that, The differential signal traces are two parallel PCB traces. Differential signal traces include differential trace segment zero, differential trace segment one, differential trace segment two, differential trace segment three, differential trace segment four, and differential trace segment five. The ends of any two segments within a differential trace segment are flush. Differential routing segment zero, differential routing segment one, differential routing segment two, differential routing segment three, differential routing segment four, and differential routing segment five are connected in the above order. The endpoint of the zeroth segment of the differential trace is connected to the high-speed signal via, and the endpoint of the fifth segment of the differential trace is connected to the high-speed signal pad of the high-speed connector.
2. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, One of the grounding vias on the grounding pad of the high-speed connector is located on the axis of symmetry of the two differential signal traces.
3. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, The connection point between the fourth and fifth segments of the differential trace, and the grounding via of the grounding pad of the high-speed connector are all located on the same straight line.
4. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, The fifth segment of the differential trace is a straight line connecting the high-speed signal pads. The fourth segment of the differential route connects to the fifth segment of the differential route and tends to converge. The third segment of the differential routing serves as a transition segment between the fourth segment and the second segment of the differential routing. The zeroth segment of a differential trace is the lead-out segment from a high-speed signal via. The first segment of the differential trace is the transition segment between the second segment of the differential trace and the zeroth segment of the differential trace.
5. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, Four grounding vias are arranged around the high-speed signal via, and the grounding vias are distributed in a quadrilateral apex structure.
6. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, The grounding pad of the high-speed connector is arranged side by side with the high-speed signal pad of the high-speed connector, and a grounding via is provided at the end of the grounding pad closest to the high-speed signal pad.
7. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, A grounding via is provided on the central axis between the grounding pads of the high-speed connector. The connection point of the grounding via, the fourth segment of the differential trace, and the fifth segment of the differential trace are on the same straight line.
8. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, The high-speed connector has an axisymmetric structure.
9. The differential signal trace of an SMD high-speed connector according to claim 1, characterized in that, The differential signal traces have an axisymmetric structure.
10. The SMD high-speed connector differential signal trace according to claim 1, characterized in that, The spacing between the two PCB traces of the second segment of the differential trace is smaller than the spacing between the segments of all other differential signal traces.