Circuit board capable of increasing soldering tin amount of copper bar

Abstract

The utility model relates to a circuit board capable of increasing soldering tin amount of a copper bar. A circuit board capable of increasing the soldering tin amount of a copper bar comprises a circuit board body, the circuit board body is provided with a matching groove penetrating through pins used for being matched with the copper bar, the groove wall of the matching groove is provided with a plurality of tin penetrating notches arranged at intervals, and the tin penetrating notches vertically penetrate through the circuit board body. And the distance between two adjacent tin penetration gaps is at least half of the maximum width of the tin penetration gaps. The utility model has the advantages that the soldering tin feeding quantity can be improved, so that the fixing stability and the electrical connection stability after the copper bar pin is soldered are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of circuit boards, specifically to a kind of circuit board that can increase the tin amount of copper bar welding. BACKGROUND

[0002] Vehicle-mounted DC-DC converter needs to bear larger current, for which larger copper bar will be welded on circuit board, the copper bar has wider pin, and the circuit board has strip-shaped matching groove matched with the pin;During the peak soldering process of copper bar pin, due to the high thermal conductivity of copper bar, the heat of molten solder is quickly transmitted away, which can cause the tin at the copper bar pin to cool down in a short time, resulting in that the tin amount in the matching groove hole cannot meet the design requirements, the copper bar pin and the matching groove wall cannot be fully filled with solder, resulting in poor fixing stability and electrical connection stability of the copper bar, which needs secondary soldering and tin supplement. SUMMARY

[0003] The utility model aims at providing a kind of circuit board that can improve the tin amount of welding, thereby improving the fixing and electrical connection stability of copper bar pin after welding.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a kind of circuit board that can increase the tin amount of copper bar welding, comprising a circuit board body, the circuit board body is provided with a matching groove for matching the pin of copper bar, a plurality of interval arranged tin transparent notches are arranged on the matching groove wall, the tin transparent notch penetrates the circuit board body up and down, and the distance between adjacent two tin transparent notches is at least half of the maximum width of tin transparent notch.

[0005] The utility model sets a plurality of tin transparent notches at the matching groove, thereby increasing the size of the space on the outer wall side of copper bar pin, and when the solder is in a short high-temperature state, the flowability of solder can be increased, thereby increasing the tin amount between the pin and the circuit board, and after the solder is cooled down due to the heat dissipation of copper bar, the tin amount can also be guaranteed, so that the pin and the circuit board are fully filled, and the fixing stability and electrical connection stability of the pin after welding are improved.

[0006] Among them, the distance between adjacent two tin transparent notches is at least half of the maximum width of tin transparent notch, to ensure the flowability of solder, so that solder is more likely to be fully filled between copper bar pin and matching groove, and the situation of large amount of solder and unstable pin positioning caused by too close tin transparent notches is avoided, to improve the firmness of welding and the stability of electrical connection. Among them, the tin transparent notch penetrates up and down, which facilitates the penetration of solder from one side of the circuit board to the other side.

[0007] Preferably, the slot wall of the opposite side of the matching slot is provided with the tin penetrating gap. The above design can ensure that the solder fills the matching slot from both sides at the same time, improve the flowability and filling efficiency of the solder, thereby increasing the tin filling amount of the solder and improving the welding quality.

[0008] Preferably, the tin penetrating gap is an arc-shaped slot with a semicircular cross section. The above design facilitates the tin penetrating gap, and the matching slot can be cut by wire cutting, so that the tin penetrating gap in the form of the arc-shaped slot is obtained in communication with the matching slot.

[0009] Preferably, the distance between the two adjacent tin penetrating gaps is less than the maximum width of the tin penetrating gap. Reducing the distance between the tin penetrating gaps can increase the flow path of the solder, thereby improving the flowability of the solder, making the solder more likely to fully fill between the copper bar pin and the matching slot, and improving the firmness of the welding and the stability of the electrical connection.

[0010] Preferably, the slot wall of the two ends of the length direction of the matching slot is arc-shaped. By making the slot wall of the two sides of the matching slot arc-shaped, wire cutting is facilitated.

[0011] The utility model has the advantages of being capable of improving the tin filling amount of welding, thereby improving the fixing stability and electrical connection stability of the copper bar pin after welding. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a structural schematic view of the copper bar and the circuit board of the utility model.

[0013] Figure 2 It is a structural schematic view of the circuit board of the utility model. DETAILED DESCRIPTION

[0014] The utility model will be further described below according to the drawings and specific embodiments.

[0015] As shown by Figure 1 and Figure 2 The embodiment discloses a circuit board capable of increasing the tin filling amount of copper bar welding, which comprises a circuit board body 1, the circuit board body 1 is provided with a matching slot 10 penetrating up and down and used for matching the pin 21 of a copper bar 2, the slot wall of the width direction of the matching slot 10 is provided with a plurality of tin penetrating gaps 3 arranged at intervals,

[0016] The tin penetrating gap 3 of the embodiment penetrates the circuit board body 1 up and down, the distance between the two adjacent tin penetrating gaps 3 is at least half of the maximum width of the tin penetrating gap 3, and the distance between the two adjacent tin penetrating gaps 3 is less than the maximum width of the tin penetrating gap 3.

[0017] The through-tin gap 3 of the embodiment is an arc-shaped slot with a semicircular cross section, and the slot walls at the two ends of the length direction of the matching slot 10 are arc-shaped. When processing the circuit board of the embodiment, first, drill multiple small holes on the circuit board, and then cut the matching slot through wire cutting, so that the moving track of the cutting line of the wire cutting passes through the diameter of each small hole. In order to facilitate the positioning during the insertion of the pins, the pins 21 of the copper bar 2 of the embodiment are in a stepped structure with a wide upper part and a narrow lower part, and the stepped surface of the pin 21 is supported on the circuit board body 1 to ensure the stability of the soldering.

[0018] The embodiment has the advantages of being able to improve the soldering tin content, thereby improving the fixing stability and electrical connection stability of the copper bar pins after soldering, and after automatic wave soldering, the filling effect of soldering tin can be achieved at one time, without the need for secondary soldering or manual tin supplement.

Claims

1. A circuit board capable of increasing the amount of solder applied to copper busbars, comprising a circuit board body, the circuit board body having a through-hole for mating with the pins of the copper busbar, characterized in that: The tin penetrating gaps are arranged at intervals on the walls of the fitting groove, and penetrate the circuit board body.

2. The circuit board capable of increasing the soldering tin amount on the copper bar according to claim 1, characterized in that: The tin penetrating gaps are arranged on the walls of the opposite sides of the fitting groove.

3. The circuit board of claim 1, wherein: the copper bar is formed by a copper clad laminate; and the copper clad laminate is formed by a copper foil and a resin layer. The tin penetrating gaps are arc-shaped slots with a semicircular cross section.

4. The circuit board according to claim 1 that increases the amount of solder on the copper busbar, characterized in that: The distance between the two adjacent tin penetrating gaps is less than the maximum width of the tin penetrating gap.

5. The circuit board of claim 1, wherein: the copper traces are formed on a first surface of the circuit board; and the solderable pads are formed on a second surface of the circuit board opposite the first surface. The walls of the fitting groove at the two ends in the length direction are arc-shaped.

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