Solder mask printing jig for FPC (Flexible Printed Circuit) through hole plate

By designing a solder resist printing fixture for FPC through-hole plates, and utilizing the structure of suction holes and ink leakage holes, the problem of ink leakage was solved, thereby saving consumables and manpower and improving production efficiency.

CN223666566UActive Publication Date: 2025-12-12HENGHE DINGFU (SUZHOU) ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422967593.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-12-12
Estimated Expiration
2034-12-03

AI Technical Summary

Technical Problem

In existing FPC machines, ink seeps through the through-holes to the back side during printing, contaminating the printing table and the copper pad on the back, resulting in exposed copper on the gold surface and rendering the machine unusable. Furthermore, traditional anti-electroplated solutions increase the costs of consumables, labor, and time.

Method used

Design a solder resist printing fixture for FPC through-hole boards, including a base plate, a middle plate and a top plate, with air suction holes and ink leakage holes. The FPC is fixed by the fixture, and the ink enters into the ink leakage holes to avoid contaminating the work surface. By regularly cleaning the ink in the ink leakage holes, the anti-plating adhesive and manpower are saved.

Benefits of technology

It effectively prevents ink from staining the work surface, reduces the use of anti-plating adhesive, lowers material and labor costs, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223666566U_ABST
    Figure CN223666566U_ABST
Patent Text Reader

Abstract

The utility model discloses a solder mask printing jig for an FPC through hole plate. The solder mask printing jig comprises a bottom plate, a middle plate and a top plate which are sequentially stacked on a table top. A hollow second air suction hole is formed in the bottom plate, and the second air suction hole is communicated with a first air suction hole formed in the table top; the middle plate is provided with a third air suction hole penetrating to the second air suction hole, and the third air suction hole and the through hole of the FPC are arranged in a staggered mode. The top plate is provided with fourth air suction holes which are communicated with the third air suction holes in a one-to-one correspondence mode. The top plate is also provided with an ink leakage hole corresponding to the through hole of the FPC, and the diameter of the ink leakage hole is larger than that of the through hole. The jig is placed on the table top, the periphery of the jig is sealed by the adhesive tape, so that the jig and the table top form a whole, air leakage after air suction is started is avoided, the FPC is fixed through the air suction holes in the jig, ink in the through holes enters the ink leakage holes, the table top cannot be polluted, and only the ink in the ink leakage holes needs to be cleaned regularly, so that anti-electroplating glue is saved, and the production efficiency is improved. And the time and labor of adhesive pasting, adhesive pressing and adhesive tearing are saved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to flexible circuit board technical field, concretely is a kind of FPC through-hole board anti-solder printing fixture. BACKGROUND

[0002] Part FPC machine type is designed with through-hole or slot hole in printing area, ink will seep to back through through-hole when printing, pollute printing platform and back copper pad. Trace ink residue is baked dead after pre-baking, cannot develop, cause gold surface copper exposure scrap. Need to wipe platform once every 1pnl printing. Traditional method pastes anti-electroplating glue, through the through-hole is pasted into blind hole and then printed, its disadvantages are as follows:

[0003] A. paste anti-electroplating glue production, cause consumable material cost rise;

[0004] B. after pasting anti-electroplating glue, form blind hole, one printing hole ring false exposure risk, need two printing;

[0005] C. personnel paste / tear anti-electroplating glue, increase labor cost;

[0006] D. paste / tear anti-electroplating glue will also cause hold time overtime, anti-solder ink breakage and other quality risks. INVENTION CONTENTS

[0007] The utility model solves the technical problem of overcoming the defects of the prior art, and provides an FPC through-hole plate anti-solder printing jig, which comprises a bottom plate, a middle plate and a top plate stacked in sequence on a platform.

[0008] The bottom plate is provided with a suction hole two with a hollow, and the suction hole two is communicated with a suction hole one provided on the platform.

[0009] The middle plate is provided with a suction hole three communicated with the suction hole two, and the suction hole three is arranged in a staggered manner with the through hole of the FPC.

[0010] The top plate is provided with a suction hole four communicated with the suction hole three one by one.

[0011] The top plate is also provided with an ink leakage hole corresponding to the through hole of the FPC, and the diameter of the ink leakage hole is greater than that of the through hole.

[0012] The diameter of the ink leakage hole is 1mm larger than the diameter of the through hole.

[0013] The diameter of the suction hole three and the suction hole four is 1mm and the spacing is 5mm.

[0014] The upper surface of the top plate is provided with an elastic silica gel layer to realize close contact with the FPC and avoid air leakage.

[0015] The bottom plate, the middle plate and the top plate are all provided with pin holes penetrating up and down, and are locked integrally by pins arranged in the pin holes, and the part of the pins exposed from the top plate is used for positioning of the FPC.

[0016] Compared with the prior art, the jig is placed on the table top and sealed by adhesive tape around to make the jig and the table top become a whole to avoid air leakage after the suction is opened, the FPC is fixed through the suction holes on the jig after the printing suction is opened, the ink in the through holes enters the ink leakage holes and cannot pollute the table top, and the ink in the ink leakage holes can be cleaned regularly, so that the time and manpower for preventing electroplating glue, pasting glue, pressing glue and tearing glue are saved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 is a cross-sectional structure schematic view of the utility model;

[0018] Fig. 2 is a cross-sectional structure schematic view of the utility model combined with the FPC;

[0019] Fig. 3 is a cross-sectional structure schematic view of the printing ink state of the utility model combined with the FPC.

[0020] The numbers in the figure represent: 10, table top; 11, suction hole one; 20, bottom plate; 21, suction hole two; 30, middle plate; 31, suction hole three; 40, top plate; 41, suction hole four; 42, ink leakage hole; 50, FPC; 51, through hole; 60, ink; 70, pin. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model.

[0022] Embodiment 1:

[0023] Please refer to Figs. 1-3The embodiment 1 provides a FPC through-hole plate anti-soldering printing jig, which comprises a bottom plate 20, a middle plate 30 and a top plate 40 which are stacked on a table top 10 in sequence; the bottom plate 20 is provided with a suction hole two 21 which is hollowed out, and the suction hole two 21 is communicated with a suction hole one 11 which is provided on the table top 10; the middle plate 30 is provided with a suction hole three 31 which is communicated with the suction hole two 21, and the suction hole three 31 is arranged in a dislocation mode with a through hole 51 of an FPC 50; the top plate 40 is provided with a suction hole four 41 which is communicated one by one with the suction hole three 31, and the diameter of the suction hole three 31 and the suction hole four 41 is 1mm and the interval is 5mm; the top plate 40 is further provided with an ink leakage hole 42 which corresponds to the through hole 51 of the FPC 50, and the diameter of the ink leakage hole 42 is 1mm larger than the diameter of the through hole 51; the bottom plate 20, the middle plate 30 and the top plate 40 are all provided with pin holes which are communicated up and down, and are locked into an integrated whole through a pin 70 which is arranged in the pin hole and is exposed on the top plate 40 and is used for positioning the FPC 50.

[0024] The utility model discloses a jig is placed on the table top 10, and the jig and the table top become a whole by the adhesive tape of four around and avoid the air leakage after suction, after printing suction, the FPC 50 is positioned through the pin 70 of the jig and is fixed through the suction hole, and the ink 60 of the through hole 51 enters the ink leakage hole 42 and does not pollute the table top 10, and only the ink 60 in the ink leakage hole 42 is cleaned regularly, so that the anti-electroplating adhesive tape is saved, and the time and manpower of pasting, pressing and tearing adhesive tape are saved.

[0025] Embodiment 2

[0026] Based on the embodiment 1, the upper surface of the top plate 40 is provided with an elastic silica gel layer in the embodiment 2, so as to realize close adhesion with the FPC 50 and avoid air leakage.

[0027] The above is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent flow conversion which utilizes the contents of the utility model specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection range of the utility model.

Claims

1. A solder resist printing fixture for FPC through-hole plates, characterized in that: Includes a bottom plate (20), a middle plate (30) and a top plate (40) stacked sequentially on the tabletop (10); The bottom plate (20) is provided with a second suction hole (21) for scooping out air, and the second suction hole (21) is connected to the first suction hole (11) opened on the table surface (10); The middle plate (30) has a third suction hole (31) that extends through the second suction hole (21), and the third suction hole (31) is offset from the through hole (51) of the FPC (50); The top plate (40) is provided with a suction hole four (41) that corresponds to and communicates with the suction hole three (31); The top plate (40) is also provided with an ink leakage hole (42) corresponding to the through hole (51) of the FPC (50), and the diameter of the ink leakage hole (42) is larger than the diameter of the through hole (51).

2. The FPC through-hole plate solder resist printing fixture according to claim 1, characterized in that: The diameter of the ink leakage hole (42) is 1 mm larger than the diameter of the through hole (51).

3. The FPC through-hole plate solder resist printing fixture according to claim 1, characterized in that: The diameter of the three suction holes (31) and the four suction holes (41) is 1 mm and the spacing is 5 mm.

4. The FPC through-hole plate solder resist printing fixture according to claim 1, characterized in that: The upper surface of the top plate (40) is provided with an elastic silicone layer to achieve a tight fit with the FPC (50) and prevent air leakage.

5. The FPC through-hole plate solder resist printing fixture according to claim 1, characterized in that: The bottom plate (20), middle plate (30) and top plate (40) are all provided with pin holes that run vertically through each other, and are locked together as one unit by pins (70) set in the pin holes. The part of the pins (70) that protrudes from the top plate (40) is used for positioning the FPC (50).