Packaging structure based on CFexpress Type B module

Abstract

The utility model discloses a packaging structure based on a CFexpress Type B module group, and relates to the technical field of chip packaging, and the packaging structure based on the CFexpress Type B module group comprises a CFexpress Type B module group, a metal support, a housing, plastic packaging glue, and milky heat dissipation silicone grease. The CFexpress Type B module is fixedly mounted on the top surface of the metal bracket; the shell is fixed with the edge of the metal bracket and is positioned at the top of the CFexpress Type B module; the plastic packaging glue is filled between the shell and the CFexpress Type B module; the space between the metal support and the CFexpress Type B module is filled with the milky heat dissipation silica gel grease. The beneficial effects of the utility model are that: it has good heat dissipation performance, and can prevent mould, moisture and salt mist, thereby improving the user experience.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and more specifically, to a packaging structure based on CFexpressType B module. Background Technology

[0002] CFexpress Card, commonly known as CFE memory card, is a high-performance memory card format designed to meet the high demands of professional photography and video production. CFexpress Card comes in three forms: Type-A, Type-B, and Type-C. CFexpress Card Type-A supports PC I / O x1 and is the smallest in size; CFexpress Card Type-B supports PC I / O x2 and is of moderate size; CFexpress Card Type-C is the largest and has the fastest read / write speeds, supporting PC I / O x4. CFexpress Card Type-B, with its balance of size and read / write speeds and versatility, has become the mainstream form factor among the three.

[0003] PCIe Gen3 x2 can theoretically achieve read and write speeds of up to 2GB / s. The latest mid-to-high-end CFexpress Type-B Card uses PCIe Gen4 Gen2 technology, which can theoretically achieve read and write speeds of up to 4GB / s, and actual tests have exceeded 3.8GB / s. This increased speed also leads to increased heat generation. The original PCBA module and casing-assisted cooling methods cannot sustain full-speed read and write operations. When the safe temperature is exceeded, the CFexpress Type-B Card will actively reduce its frequency and speed, sacrificing read and write performance to reduce heat.

[0004] Secondly, the PCBA module structure exposes components to air, making them prone to oxidation. When used for outdoor photography, it cannot prevent mold, moisture, or salt spray (three-proof protection), leading to damage and unusability.

[0005] Therefore, this utility model provides a packaging structure based on CFexpress Type B modules, which has good heat dissipation performance and can prevent mold, moisture and salt spray, thereby improving the user experience. Utility Model Content

[0006] To overcome the shortcomings of existing technologies, this utility model provides a packaging structure based on CFexpress Type B modules, which has good heat dissipation performance and is also resistant to mold, moisture and salt spray, thereby improving the user experience.

[0007] The technical solution adopted by this utility model to solve its technical problem is: a packaging structure based on a CFexpress Type B module, wherein the improvement is that the packaging structure based on a CFexpress Type B module includes a CFexpress Type B module, a metal bracket, a shell, a molding compound, and a emulsion thermal grease; the CFexpress Type B module is fixedly mounted on the top surface of the metal bracket; the shell is fixed to the edge of the metal bracket and is located on top of the CFexpress Type B module; the molding compound is filled between the shell and the CFexpress Type B module; and the emulsion thermal grease is filled between the metal bracket and the CFexpress Type B module.

[0008] In the above structure, a module mounting position is provided on the top of the metal bracket, and the shape and size of the module mounting position are adapted to the shape and size of the CFexpress Type B module.

[0009] In the above structure, the metal bracket is also provided with a metal filling position, which is close to the module mounting position.

[0010] In the above structure, the CFexpress Type B module includes a substrate, a control chip, and circuit components; the control chip and circuit components are all soldered to the bottom surface of the substrate.

[0011] In the above structure, the CFexpress Type B module also includes a gold finger interface, which is located at the edge of the top surface of the substrate.

[0012] In the above structure, the CFexpress Type B module also includes flash memory chips and WB metal lines; the flash memory chips are stacked in a stepped manner, and one side of each flash memory chip is bonded to the bottom surface of the substrate through WB metal lines.

[0013] In the above structure, the outer shell is provided with a groove structure, which is distributed on the inner side of the outer shell.

[0014] In the above structure, the metal bracket has protruding structures distributed at its edge, and the protruding structures are engaged in the groove structure.

[0015] The beneficial effects of this invention are as follows: This solution isolates the CFexpress Type B module from the outside environment by filling the space between the outer shell and the CFexpress Type B module with a plastic sealant, thereby achieving anti-mold, anti-moisture, and anti-salt spray performance; the heat conduction efficiency is enhanced by the metal bracket and the emulsion thermal silicone grease between the CFexpress Type B module and the metal bracket, thereby improving heat dissipation efficiency; therefore, this invention has good heat dissipation performance and can prevent mold, moisture, and salt spray, thus improving the user experience. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a packaging structure based on a CFexpress Type B module according to this utility model;

[0017] Figure 2 This is a schematic diagram of a substrate structure for a CFexpress Type B module packaging structure according to this utility model. Figure 1 ;

[0018] Figure 3 This is a schematic diagram of a substrate structure for a CFexpress Type B module packaging structure according to this utility model. Figure 2 ;

[0019] Figure 4 for Figure 1 Enlarged view of point A in the middle;

[0020] Figure 5 This is a structural diagram of a metal bracket for packaging a CFexpress Type B module according to this utility model.

[0021] Figure 6 This is a schematic diagram of an assembly structure of a substrate and a metal support, as shown in an exemplary embodiment. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0024] Reference Figure 1 As shown, this utility model discloses a packaging structure based on a CFexpress Type B module. The packaging structure includes a CFexpress Type B module, a metal bracket 3, a housing 1, a molding compound 4, and a latex thermal grease. The CFexpress Type B module is fixedly mounted on the top surface of the metal bracket 3. The housing 1 is fixed to the edge of the metal bracket 3 and is located on top of the CFexpress Type B module. The molding compound 4 fills the space between the housing 1 and the CFexpress Type B module. The latex thermal grease fills the space between the metal bracket 3 and the CFexpress Type B module.

[0025] It should be noted that in this embodiment, the CFexpress Type B is a widely used high-speed storage module, particularly suitable for devices requiring high bandwidth and high access speeds, such as cameras, servers, and other professional hardware. The CFexpress Type B module is typically used for data storage and supports fast read / write operations via a high-speed interface (such as PCIe 3.0 x2 or x4) to meet high-performance data transmission requirements. In this example, the CFexpress Type B module acts as a heat-generating component; the metal bracket 3 provides physical support to ensure the stability of the CFexpress Type B module installation. Furthermore, due to the good thermal conductivity of the metal bracket 3, it can provide thermal support for the CFexpress Type B module. The CFexpress Type B module dissipates heat generated during operation. The outer shell 1, typically made of metal or hard plastic, is fixed to the top or exterior of the metal bracket 3, protecting internal components and preventing adverse environmental impacts. The encapsulating adhesive 4 is a material used to fill the gap between the outer shell 1 and the CFexpress module; it is typically made of epoxy resin or other high-performance resins, possessing high adhesion, temperature resistance, and moisture resistance. The emulsion thermal grease is a heat dissipation material filled between the CFexpress module and the metal bracket 3, usually composed of thermally conductive silicone and other chemicals. Its main function is to improve heat conduction efficiency and ensure the module maintains a suitable temperature during operation. In the specific implementation of this invention, the CFexpress Type B module generates more heat and its temperature gradually increases during high-speed read / write tasks. This temperature increase affects the module's efficiency. Therefore, the heat dissipation structure utilizes the good thermal conductivity of the metal bracket 3 and the heat dissipation properties of the emulsion thermal grease to dissipate the heat generated by the CFexpress Type B module, ensuring it maintains a suitable temperature during operation and thus guaranteeing the CFexpress Type B module's performance. The B module can perform high-speed read and write tasks normally. In addition, the design of the encapsulant 4 can prevent the circuit components of the CFexpress Type B module from coming into contact with air, preventing oxidation, and can also prevent mold, moisture and salt spray, making it suitable for outdoor scenarios such as photography. Therefore, the packaging structure of this solution has good heat dissipation performance and can prevent mold, moisture and salt spray, thereby improving the user experience.

[0026] Reference Figure 5 As shown, the top of the metal bracket 3 is provided with a module mounting position 302, the shape and size of which are adapted to the shape and size of the CFexpress Type B module.

[0027] It should be noted that, in this embodiment, the module mounting position 302 is designed to fix the CFexpressType B module to the top of the metal bracket 3.

[0028] Continue to refer to Figure 5 and Figure 6 As shown, the metal bracket 3 is also provided with a metal filling position 301, which is close to the module mounting position 302.

[0029] It should be noted that, in this embodiment, the metal filling position 301 is designed to fill with metal to increase the metal bracket 3 and the CFexpress Type B module, thereby improving heat dissipation performance.

[0030] Reference Figures 2-4 and Figure 6 As shown, the CFexpress Type B module includes a substrate 2, a control chip 5, circuit components 6, a gold finger interface 9, a flash memory chip 7, and a WB metal line 8; the control chip 5 and the circuit components 6 are all soldered to the bottom surface of the substrate 2; the gold finger interface 9 is located at the edge of the top surface of the substrate 2; the flash memory chips 7 are stacked in a stepped manner, and one side of each flash memory chip 7 is bonded to the bottom surface of the substrate 2 through the WB metal line 8.

[0031] It should be noted that, in this embodiment, the substrate 2 is the supporting structure for the entire CFexpress Type B module. All other electronic components (such as the control chip 5, circuit components 6, flash memory chip 7, etc.) are mounted on the substrate 2 to support and connect the circuit components 6. The control chip 5 is responsible for managing the reading, writing, transmission, and processing of data, receiving requests from host devices (such as cameras, computers, etc.), and transmitting data between the flash memory chip 7 and the host. The circuit components 6 include various passive components (such as resistors, capacitors, filters, etc.) and possible additional integrated circuits. These components assist the control chip 5 in signal processing, power management, etc. The gold finger interface 9 is a CFexpress Type B module. The part of the B module that connects to the host device (such as a camera or computer) transmits data and power through contact with the host device's slot. The flash memory chip 7 is the core component for data storage, and it adopts a stepped stacking design to improve storage density and efficiency, reduce space occupation, and improve data processing speed. The WB metal line 8 is an electrical wire connecting the flash memory chip 7 and the substrate 2, ensuring that the control chip 5 can communicate effectively with the flash memory chip 7. In the specific implementation of this utility model, through the design of the above components, the CFexpress Type B module can achieve efficient, large-capacity data storage and high-speed data transmission in a compact size, and is widely used in fields that require high-performance storage, such as digital cameras, video equipment, and computer storage.

[0032] Reference Figure 1 , Figure 5 and Figure 6 As shown, the outer shell 1 is provided with a groove structure, which is distributed on the inner side of the outer shell 1; the metal bracket 3 has a protrusion structure 303 distributed on the edge, which is engaged in the groove structure.

[0033] It should be noted that, in this embodiment, the groove structure and the protrusion structure 303 are designed to ensure the stability of the installation of the outer shell 1 and the metal bracket 3.

[0034] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A packaging structure based on CFexpress Type B modules, characterized in that, The packaging structure based on the CFexpress Type B module includes a CFexpress Type B module, a metal bracket, a housing, a molding compound, and a thermal grease. The CFexpress Type B module is fixedly mounted on the top surface of the metal bracket. The housing is fixed to the edge of the metal bracket and is located on top of the CFexpress Type B module. The molding compound fills the space between the housing and the CFexpress Type B module. The thermal grease fills the space between the metal bracket and the CFexpress Type B module.

2. The packaging structure based on CFexpress Type B module according to claim 1, characterized in that, The top of the metal bracket is provided with a module mounting position, the shape and size of which are adapted to the shape and size of the CFexpress Type B module.

3. The packaging structure based on CFexpress Type B module according to claim 2, characterized in that, The metal bracket is also provided with a metal filling position, which is close to the module mounting position.

4. The packaging structure based on CFexpress Type B module according to claim 1, characterized in that, The CFexpress Type B module includes a substrate, a control chip, and circuit components; the control chip and circuit components are all soldered to the bottom surface of the substrate.

5. The packaging structure based on the CFexpress Type B module according to claim 4, characterized in that, The CFexpress Type B module also includes a gold finger interface, which is located at the edge of the top surface of the substrate.

6. The packaging structure based on the CFexpress Type B module according to claim 5, characterized in that, The CFexpress Type B module also includes flash memory chips and WB metal lines; the flash memory chips are stacked in a stepped manner, and one side of each flash memory chip is bonded to the bottom surface of the substrate through WB metal lines.

7. The packaging structure based on CFexpress Type B module according to claim 1, characterized in that, The outer shell is provided with a groove structure, which is distributed on the inner side of the outer shell.

8. The packaging structure based on CFexpress Type B module according to claim 1, characterized in that, The metal bracket has raised structures distributed along its edge, and these raised structures are engaged in the groove structure.

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