Tumor electric field treatment device and electric field generating device thereof

Abstract

The utility model provides a tumor electric field treatment device and an electric field generating device thereof, the electric field generating device comprises a shell, an inner support erected in the shell and a plurality of circuit boards arranged on the inner support, and the inner support and the shell jointly define an accommodating cavity for accommodating part of the circuit boards and a heat dissipation bin for accommodating the other part of the circuit boards. The shell is provided with a plurality of heat dissipation holes communicated with the heat dissipation bin, and the other part of the circuit board contained in the heat dissipation bin is a high-power circuit board provided with a high-power electronic device. According to the electric field generating device of the tumor electric field treatment device, the circuit board provided with the high-power electronic device is independently arranged in the heat dissipation bin, so that other circuit boards are prevented from being influenced by heat of the circuit board provided with the high-power electronic device, and meanwhile, the heat dissipation efficiency of the circuit board provided with the high-power electronic device is also improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a tumor electric field treatment device and electric field generating device thereof. BACKGROUND

[0002] At present, the treatment methods of tumors mainly include surgery, radiotherapy, chemotherapy and the like, but all have corresponding shortcomings, such as side effects of radiotherapy and chemotherapy, and killing of normal cells. The use of electric field to treat tumors is also one of the current research frontiers, and tumor electric field treatment is a tumor treatment method for generating a low-intensity, medium-high frequency alternating electric field by a special electric field generator to interfere with the mitotic process of tumor cells. Studies have shown that electric field treatment has a significant effect in the treatment of diseases such as glioblastoma, non-small cell lung cancer and malignant pleural mesothelioma. The electric field applied by this method can affect the aggregation of tubulin protein, prevent spindle formation, inhibit the mitotic process, and induce apoptosis of cancer cells.

[0003] A common tumor electric field treatment device for tumor electric field treatment includes an electric field generating device and a pair of electrode patches. The electrode patches are attached to the body surface at the tissue region where the patient's lesion is located. The electric field generating device generates an alternating current signal and transmits the alternating current signal to the electrode patches to alternately generate an alternating electric field between each pair of electrode patches, thereby treating the tissue region where the patient's lesion is located. Chinese patent No. CN219290450U discloses an electric field generating device including a shell, an MCU circuit board and a battery, etc. The MCU circuit board and the battery are arranged side by side in the shell. The MCU circuit board is installed with a DC-DC isolation module, an LDO voltage stabilizer, an EEPROM module, a calendar chip, an internal battery, a switching circuit module, a power amplification circuit module, a detection module, a Bluetooth module, etc. Since the MCU circuit board integrates many electronic devices, heat is easily accumulated during operation, which cannot be effectively dissipated, affecting the performance of the electronic devices.

[0004] Therefore, it is necessary to improve the existing tumor electric field treatment device and electric field generating device thereof. UTILITY MODEL CONTENTS

[0005] The present application provides a tumor electric field treatment device and electric field generating device thereof for improving the heat dissipation efficiency of the circuit board.

[0006] Specifically, the present application is realized by the following technical scheme: an electric field generating device for tumor electric field treatment, comprising a shell, an inner support arranged in the shell, and a plurality of circuit boards arranged on the inner support. The inner support and the shell jointly define a receiving cavity for receiving a part of the circuit boards and a heat dissipation compartment for receiving another part of the circuit boards. The shell is provided with a plurality of heat dissipation holes communicating with the heat dissipation compartment. The other part of the circuit boards received in the heat dissipation compartment is a high-power circuit board provided with high-power electronic devices.

[0007] According to one embodiment of the present application, the shell further comprises a battery compartment for accommodating the battery assembly, the battery compartment is arranged correspondingly to the accommodating cavity and is located at two sides of the inner support respectively.

[0008] According to one embodiment of the present application, the inner support comprises a first partition rib, the shell comprises a second partition rib correspondingly to the first partition rib, and the first partition rib and the second partition rib jointly separate the battery compartment and the heat dissipation compartment.

[0009] According to one embodiment of the present application, the inner support comprises a third partition rib, the shell further comprises a fourth partition rib correspondingly to the third partition rib, and the third partition rib and the fourth partition rib jointly separate the accommodating cavity and the heat dissipation compartment.

[0010] According to one embodiment of the present application, the inner support is provided with an opening for the electronic device to pass through and communicate with the heat dissipation compartment.

[0011] According to one embodiment of the present application, the high-power circuit board comprises a substrate, and the size of the substrate is greater than the size of the opening.

[0012] According to one embodiment of the present application, the plurality of circuit boards comprise a power board and a main board electrically connected to the power board, and the power board and the main board are located in the accommodating cavity.

[0013] According to one embodiment of the present application, further comprising a fan located in the heat dissipation compartment and arranged correspondingly to the heat dissipation hole.

[0014] According to one embodiment of the present application, further comprising a heat sink fixed on the high-power circuit board.

[0015] The present application further provides the following technical solutions, a tumor electric field treatment device comprising the aforementioned electric field generating device and a plurality of electrode patches directly or indirectly electrically connected to the electric field generating device.

[0016] The electric field generating device of the tumor electric field treatment device of the present application separately places the high-power circuit board in the heat dissipation compartment, which can improve the heat dissipation efficiency and avoid the influence of heat from the high-power circuit board on other circuit boards.

[0017] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective assembly view of the electric field generating device according to one embodiment of the present application;

[0019] Figure 2 for Figure 1 An exploded perspective view of the electric field generating device shown.

[0020] Figure 3 for Figure 2 A three-dimensional assembly diagram of the internal support structure of the electric field generator shown in the figure;

[0021] Figure 4 for Figure 3 An exploded perspective view of the internal support assembly shown in the figure;

[0022] Figure 5 for Figure 4 A perspective view of the inner support of the inner support assembly from another angle;

[0023] Figure 6 for Figure 2 A perspective view of the upper casing of the electric field generating device shown.

[0024] Explanation of reference numerals in the attached figures:

[0025] Electric field generating device 100, battery compartment 101, lower heat dissipation compartment 102, upper heat dissipation compartment 103, heat dissipation hole 104, front cover assembly 10, upper shell 20, fourth partition rib 21, lower shell 30, second battery compartment 31, second heat dissipation compartment 32, second partition rib 33, rear cover assembly 40, battery assembly 50, inner bracket 60, first battery compartment 61, first heat dissipation compartment 62, opening 63, first partition rib 64, third partition rib 65, fan bracket 66, circuit board 70, power board 71, main board 72, high power circuit board 73, substrate 731, electronic components 732, heat sink 74, fan 75, and connector assembly 80. Detailed Implementation

[0026] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses, systems, devices, and methods consistent with some aspects of this application.

[0027] refer to Figure 1 and Figure 2As shown, the electric field generating device 100 of the tumor electric field treatment device according to one embodiment of the present application is used to provide alternating electric signals to electrode patches (not shown) to generate tumor treatment electric fields between each pair of electrode patches (not shown), and the electric field generating device 100 can be directly electrically connected with the electrode patches (not shown) or indirectly electrically connected with the electrode patches (not shown) through an adapter (not shown). The electric field generating device 100 includes at least one open shell (not numbered) and a cover (not numbered) arranged at the opening of the shell (not numbered) and closing the opening. The shell (not numbered) includes a first shell (not numbered) and a second shell (not numbered) arranged with the first shell (not numbered). In this embodiment, the first shell (not numbered) is also referred to as the upper shell 20, and the second shell (not numbered) is also referred to as the lower shell 30. The upper shell 20 and the lower shell 30 are assembled and fixed in a top-to-bottom manner to form a cylindrical structure with front and rear openings. The cover (not numbered) includes a front cover assembly 10 and a rear cover assembly 40. The front cover assembly 10 is fixed at the front end opening of the upper shell 20 and the lower shell 30, and the rear cover assembly 40 is fixed at the rear end opening of the upper shell 20 and the lower shell 30. The front cover assembly 10, the upper shell 20, the lower shell 30, and the rear cover assembly 40 are arranged together to form a cavity (not numbered). The electric field generating device 100 further includes an inner support assembly (not numbered) located in the cavity (not numbered). The inner support assembly (not numbered) includes an inner support 60 and a plurality of circuit boards 70 fixed on the inner support 60. The plurality of circuit boards 70 includes a power supply board 71, a main board 72, and a high-power circuit board 73. The electric field generating device 100 further includes a battery assembly 50 detachably arranged in the shell (not numbered). The battery assembly 50 is used to supply power to the circuit boards 70.

[0028] In combination Figure 3 And Figure 4 As shown, the power supply board 71, the main board 72, and the high-power circuit board 73 are all installed on the side of the inner support 60 facing the upper shell 20 through screws. The power supply board 71 is arranged at the edge of the inner support 60 close to the front cover assembly 10, and can be connected to an external power source to supply power to the main board 72 and the high-power circuit board 73. The inner support assembly (not numbered) further includes a socket assembly 80. An external power adapter (not shown) passes through the socket assembly 80 and is connected to a power socket (not numbered) on the power supply board 71. The socket assembly 80 can also seal the gap between the front cover assembly 10 and the circuit boards 70, and has a waterproof function. The power supply board 71 and the main board 72 are distributed in a left-to-right manner at one end of the inner support 60 close to the front cover assembly 10. The high-power circuit board 73 is arranged at one end of the inner support 60 close to the rear cover assembly 40 and has a substrate 731 and a plurality of high-power electronic devices 732 arranged on the substrate 731. The inner support assembly (not numbered) further includes a heat sink 74 located on the high-power circuit board 73 and facing the upper shell 20, which is used to help the high-power circuit board 73 dissipate heat quickly.

[0029] In reference Figures 4 to 6and in combination with Figure 2 As shown in the figures, the inner support 60 has a first battery compartment 61 located at the bottom side thereof, and the lower shell 30 is provided with a second battery compartment 31 corresponding to the first battery compartment 61. When the inner support 60 is assembled with the lower shell 30 in an up-down manner, the first battery compartment 61 and the second battery compartment 31 jointly form a battery compartment 101 for accommodating the battery assembly 50. The inner support 60 further has a first heat dissipation compartment 62 located at the bottom side thereof, and the lower shell 30 is provided with a second heat dissipation compartment 32 corresponding to the first heat dissipation compartment 62. When the inner support 60 is assembled with the lower shell 30 in an up-down manner, the first heat dissipation compartment 62 and the second heat dissipation compartment 32 jointly form a lower heat dissipation compartment 102 close to the rear end of the shell (not numbered). The inner support 60 further has an opening 63 penetrating therethrough and located at the rear portion thereof. The opening 63 is arranged corresponding to the high-power circuit board 73 but has a size slightly smaller than that of the substrate 731 of the high-power circuit board 73. The high-power circuit board 73 is fixed to the side of the inner support 60 facing the upper shell 20, and the electronic devices 732 on the side of the high-power circuit board 73 facing the inner support 60 are arranged in the lower heat dissipation compartment 102 through the opening 63.

[0030] The inner support 60 further has a first partition rib 64 located at the bottom side thereof and between the first battery compartment 61 and the first heat dissipation compartment 62, and the lower shell 30 further has a second partition rib 33 located between the second battery compartment 31 and the second heat dissipation compartment 32 and corresponding to the first partition rib 64. The first partition rib 64 and the second partition rib 33 are in up-down abutment, jointly partitioning the battery compartment 101 and the lower heat dissipation compartment 102, i.e., partitioning the high-power circuit board 73 and the battery assembly 50, to avoid heat on the high-power circuit board 73 from being transferred to the battery assembly 50.

[0031] The inner support 60 further has a third partition rib 65 on the top side thereof, and the upper shell 20 further has a fourth partition rib 21 on the bottom side thereof and corresponding to the third partition rib 65. The third partition rib 65 is substantially aligned with the first partition rib 64 in the up-down direction, and the power board 71 and the main board 72 are both on the same side of the third partition rib 65, and the high-power circuit board 73 and the heat sink 74 are both on the other side of the third partition rib 65. After the inner support 60 and the upper shell 20 are assembled, the third partition rib 65 of the inner support 60 and the fourth partition rib 21 of the upper shell 20 together divide the space enclosed by the inner support 60 and the upper shell 20 into an upper heat dissipation compartment 103 on one side of the third partition rib 65 and a receiving cavity (not numbered) on the other side of the third partition rib 65 for receiving the power board 71 and the main board 72. The substrate 731 of the high-power circuit board 73 and the heat sink 74 are located in the upper heat dissipation compartment 103, and the power board 71 and the main board 72 are located in the receiving cavity (not numbered) and isolated from the upper heat dissipation compartment 103. That is, the high-power circuit board 73, the power board 71 and the main board 72 are separated by the third partition rib 65 and the fourth partition rib 21. In this way, heat generated by the high-power circuit board 73 can be prevented from being transferred to the power board 71 and the main board 72. The upper heat dissipation compartment 103 and the lower heat dissipation compartment 102 can be collectively referred to as a heat dissipation compartment (not numbered). The upper heat dissipation compartment 103 is located at the rear side of the receiving cavity (not numbered), and the lower heat dissipation compartment 102 is also located at the rear side of the battery compartment 101.

[0032] Returning to Figure 2 As shown in the drawings, the upper shell 20 and the lower shell 30 are respectively provided with a plurality of heat dissipation holes 104 located on the left and right opposite sides thereof and close to the rear cover assembly 40. The heat dissipation holes 104 are in communication with the corresponding lower heat dissipation compartment 102 or upper heat dissipation compartment 103. External air enters from one side of the heat dissipation holes 104, flows through the high-power circuit board 73 and the heat sink 74, and flows out from the other side of the heat dissipation holes 104, thereby carrying away the heat generated by the high-power circuit board 73 during operation. The electric field generating device 100 further includes a waterproof pad (not shown) provided in the heat dissipation compartment (not numbered) and corresponding to the heat dissipation holes 104, so as to prevent external water vapor, dust and the like from entering the heat dissipation compartment (not numbered) through the heat dissipation holes 104 and affecting the performance of the high-power circuit board 73. The electric field generating device 100 further includes a fan 75 provided on the inner support 60. The inner support 60 further has a fan holder 66 for fixing the fan 75. The fan 75 is fixed in the fan holder 66 and close to the heat dissipation holes 104, so as to accelerate the exchange of air in the lower heat dissipation compartment 102 and the upper heat dissipation compartment 103 with external air, thereby improving the heat dissipation efficiency of the high-power circuit board 73.

[0033] The electric field generating device 100 of the present application separately locates the high-power circuit board 73 in the heat dissipation compartment (not numbered), so as to prevent the power board 71 and the main board 72 from being affected by the heat generated by the high-power circuit board 73, and at the same time improve the heat dissipation efficiency of the high-power circuit board 73.

[0034] The above merely provides preferred implementation of the present application, and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An electric field generating device for tumor electric field therapy, characterized in that: It includes a housing, an inner support frame mounted inside the housing, and several circuit boards mounted on the inner support frame. The inner support frame and the housing together form a receiving cavity for receiving part of the circuit boards and a heat dissipation chamber for receiving another part of the circuit boards. The housing is provided with several heat dissipation holes communicating with the heat dissipation chamber. The other part of the circuit boards housed in the heat dissipation chamber is a high-power circuit board on which high-power electronic devices are mounted.

2. The electric field generating device according to claim 1, characterized in that: The housing also has a battery compartment for housing the battery assembly, which is correspondingly arranged with the receiving cavity and located on both sides of the inner support.

3. The electric field generating device according to claim 2, characterized in that: The inner support has a first partition rib, and the housing has a second partition rib corresponding to the first partition rib. The first partition rib and the second partition rib together separate the battery compartment and the heat dissipation compartment.

4. The electric field generating device according to claim 1, characterized in that: The inner support has a third partition rib, and the housing also has a fourth partition rib corresponding to the third partition rib. The third partition rib and the fourth partition rib together separate the receiving cavity and the heat dissipation chamber.

5. The electric field generating device according to claim 1, characterized in that: The inner support has an opening that communicates with the heat dissipation chamber and allows the electronic components to pass through.

6. The electric field generating device according to claim 5, characterized in that: The high-power circuit board includes a substrate, the size of which is larger than the size of the opening.

7. The electric field generating device according to claim 1, characterized in that: The circuit boards include a power board and a main board electrically connected to the power board, the power board and the main board being located within the receiving cavity.

8. The electric field generating device according to claim 1, characterized in that: It also includes a fan located inside the heat dissipation chamber and arranged corresponding to the heat dissipation holes.

9. The electric field generating device according to claim 1, characterized in that: It also includes a heat sink fixed to the high-power circuit board.

10. A tumor electric field therapy device, characterized in that: It includes an electric field generating device as described in any one of claims 1 to 9 and a plurality of electrode patches that are directly or indirectly electrically connected to the electric field generating device.

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