Semiconductor part cleaning device based on online monitoring technology

Abstract

The semiconductor part cleaning device based on the on-line monitoring technology comprises a main body, an installation groove is formed in the bottom of the main body, a motor is installed at the center of the inner wall of the bottom of the installation groove through a bolt, a rotating rod is installed at the output end of the motor through a coupler, and a stirring plate is installed at the top end of the rotating rod through a bolt. A rotating groove is formed in the inner wall of the top of the mounting groove, a stirring ring is mounted in the rotating groove through a sealing bearing, and a gear is mounted on the outer wall of the rotating rod through a bolt. Through the arrangement of a motor, when the motor is started, the motor can drive a rotating rod to rotate, and a stirring plate can be driven to rotate in the rotating process of the rotating rod, so that the stirring plate can move water flow, and a stirring ring and the water flow can be driven to rotate in opposite directions under the action of a gear and a gear ring in the rotating process of the stirring plate; therefore, the cleaning effect of the water flow on the semiconductor parts is improved, and the practicability of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor spare part technical field especially relates to a kind of semiconductor spare part cleaning device based on online monitoring technology. BACKGROUND

[0002] Semiconductor is a kind of substance between insulator and conductor, its electrical conductivity is easily controlled, can be used as information processing element material, semiconductor is very important, many electronic products, such as computer, mobile phone, digital recorder core unit is using the electrical conductivity variation of semiconductor to process information, and online monitoring technology is the continuous or timing monitoring processing of the condition of equipment under the condition that the equipment to be measured is in operation, so semiconductor spare part is often used.

[0003] A kind of special semiconductor equipment spare part cleaning device of Chinese patent number CN115945431B belongs to semiconductor field, the device includes base, water washing box is fixedly connected in the middle of the top of the base, water washing box is used to carry out pure water cleaning to the piece to be washed, the outer side of water washing box is circumferentially arrayed with multiple groups of processing box, multiple groups of processing box are used for degreasing cleaning, mixed acid cleaning, acid cleaning, high-pressure pure water cleaning and hot water cleaning to the piece to be washed respectively, the top of the base is fixedly connected with support frame, the bottom of support frame is provided with rotating frame for running the piece to be washed, the bottom of rotating frame is provided with cleaning box for placing the piece to be washed;The piece to be washed is sequentially cleaned by water washing box and multiple groups of processing box, so as to reduce the trouble of carrying and moving between multiple processes, improve cleaning efficiency.The above and more common device in market in the process of use, semiconductor spare part cleaning processing is usually realized by the rotation of material, but such structure because the flow direction of water flow is certain, so long time flushing is needed to clean semiconductor spare part, in turn, the practicability and popularization of device can be reduced, therefore, it is urgent to design a kind of semiconductor spare part cleaning device based on online monitoring technology to solve the above problems. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in prior art, and proposes a kind of semiconductor spare part cleaning device based on online monitoring technology.

[0005] To achieve the above object, the utility model adopts the following technical scheme:

[0006] The utility model provides a semiconductor spare cleaning device based on online monitoring technology, including the main part, the bottom of main part is equipped with the installation groove, and the bottom inner wall center of installation groove is installed with motor through bolt, the output of motor is installed with the rotary bar through the shaft coupling, and the top of rotary bar is installed with the stirring board through bolt, the top inner wall of installation groove is equipped with the rotary groove, and the inside of rotary groove is installed with the stirring ring through the sealing bearing, the outer wall of rotary bar is installed with the gear through bolt, and the bottom outer wall of stirring ring is installed with the gear ring through bolt.

[0007] The key idea of the above technical solution is that when the motor is started, the motor can drive the rotary bar to rotate, which can drive the stirring plate to rotate during the rotation of the rotary bar, so that the stirring plate can move the water flow, and the stirring ring and the water flow can be driven to rotate in the opposite direction by the action of the gear and the gear ring during the rotation of the stirring plate, thereby improving the cleaning effect of the water flow on the semiconductor parts and increasing the practicality of the device.

[0008] Further, the top end of the rotary bar extends into the interior of the main body, and the stirring plate is arranged in the interior of the main body, the gear and the gear ring are engaged with each other.

[0009] Further, the outer wall of the top of the main body is provided with a plurality of electric cylinders on both sides through bolts, and the output end of the plurality of electric cylinders is provided with a top plate through bolts.

[0010] Further, the outer wall of the bottom of the top plate is provided with a top seat at the center through bolts, and the outer wall of both sides of the top seat is provided with an auxiliary block through bolts.

[0011] Further, the inner wall of both sides of the main body is provided with an auxiliary groove, and the auxiliary block corresponds to the auxiliary groove.

[0012] Further, the outer wall of the bottom of the top seat is provided with a support frame at the four corners through bolts, and one side adjacent to the bottom of the support frame is provided with a placing plate, and the inner wall of the top of the other two sides of the main body is provided with a heating plate through bolts.

[0013] The utility model has the advantages of:

[0014] 1. Through the setting of the motor, when the motor is started, the motor can drive the rotating rod to rotate, and in the process of rotating the rotating rod, the stirring plate can be driven to rotate, so that the stirring plate can move the water flow, and in the process of rotating the stirring plate, the stirring ring and the water flow can be driven to rotate in the opposite direction by the action of the gear and the gear ring, thereby improving the cleaning effect of the water flow on the semiconductor parts and increasing the practicability of the device. 2. Through the setting of the heating plate, when the heating plate is started, the heating plate can effectively dry the materials placed on the top of the placing plate, facilitating the subsequent processing of the materials by the operator, and the mutual matching use of the auxiliary block, the top seat and the auxiliary groove makes the water flow not splash out of the device during the cleaning process of the device. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 A structure diagram of a semiconductor part cleaning device based on online monitoring technology is proposed in the present application.

[0016] Fig. 2 A main body bottom plane structure diagram of a semiconductor part cleaning device based on online monitoring technology is proposed in the present application.

[0017] Fig. 3 A main body top plane structure diagram of a semiconductor part cleaning device based on online monitoring technology is proposed in the present application.

[0018] Fig. 4 A placing plate and support frame structure diagram of a semiconductor part cleaning device based on online monitoring technology is proposed in the present application. In the figure: 1 main body, 2 installation groove, 3 motor, 4 rotating rod, 5 stirring plate, 6 rotating groove, 7 stirring ring, 8 gear, 9 gear ring, 10 multi-section electric cylinder, 11 top plate, 12 top seat, 13 auxiliary block, 14 auxiliary groove, 15 support frame, 16 placing plate, 17 heating plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] It should be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In addition, it should be understood that when an element is referred to as being "connected, coupled, or "disposed" to another element, it can be directly connected, coupled, or disposed to the other element or intervening elements can also be present. As used herein, the terms "vertical", "horizontal", "left", "right", and the like are merely used for the purpose of illustration and description.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0022] Reference will now be made to the drawings, in which Figs. 1 to 4 The application discloses a semiconductor component cleaning device based on online monitoring technology, which comprises a main body 1, a mounting groove 2 is formed in the bottom of the main body 1, a motor 3 is arranged at the center of the inner wall of the bottom of the mounting groove 2 through bolts, a rotating rod 4 is arranged on the output end of the motor 3 through a shaft coupling, a stirring plate 5 is arranged on the top end of the rotating rod 4 through bolts, a rotating groove 6 is formed in the top inner wall of the mounting groove 2, a stirring ring 7 is arranged in the rotating groove 6 through a sealing bearing, a gear 8 is arranged on the outer wall of the rotating rod 4 through bolts, and a gear ring 9 is arranged on the bottom outer wall of the stirring ring 7 through bolts. When the motor 3 is started, the motor 3 can drive the rotating rod 4 and the gear 8 to rotate, the gear 8 can drive the stirring ring 7 to stir the water flow through the mutual meshing with the gear ring 9, and the stirring plate 5 can improve the cleaning function of the semiconductor component.

[0023] Further, the top end of the rotating rod 4 extends to the inside of the main body 1, the stirring plate 5 is arranged in the inside of the main body 1, the gear 8 and the gear ring 9 are mutually meshed, and the rotating rod 4 can drive the stirring plate 5 to stir the water flow in the inside of the main body 1 in the process of rotating the rotating rod 4, and the mutual meshing of the gear 8 and the gear ring 9 can provide power transmission for the rotation of the stirring ring 7.

[0024] Further, a plurality of electric cylinders 10 are arranged on the both sides of the top outer wall of the main body 1 through bolts, and a top plate 11 is arranged on the output end of the plurality of electric cylinders 10 through bolts. When the plurality of electric cylinders 10 are started, the plurality of electric cylinders 10 can drive the top plate 11 to move, so that the top plate 11 can be lifted and lowered.

[0025] Further, the top plate 11 is provided with a top base 12 at the center of the bottom outer wall, and the top base 12 is provided with auxiliary blocks 13 on the two side outer walls by means of bolts, and the top plate 11 drives the top base 12 and the auxiliary blocks 13 to move during the lifting process.

[0026] Further, the main body 1 is provided with auxiliary grooves 14 on the two side inner walls, and the auxiliary blocks 13 correspond to the auxiliary grooves 14, and when the top base 12 is lowered, the auxiliary blocks 13 are inserted into the auxiliary grooves 14, so that the water flow does not splash out of the device during the cleaning process of the materials.

[0027] Further, the top base 12 is provided with support frames 15 at the four corners of the bottom outer wall by means of bolts, and the support frames 15 are provided with placement plates 16 on the adjacent side of the bottom, and the main body 1 is provided with heating plates 17 on the other two side top inner walls by means of bolts, and the support frames 15 limit the installation of the placement plates 16, so that the placement plates 16 can only be arranged between the support frames 15, and the heating plates 17 can heat and dry the cleaned semiconductor components.

[0028] By means of the above, when the heating plates 17 are started, the heating plates 17 can effectively dry the materials on the top of the placement plates 16, which is convenient for the subsequent processing of the materials by the operator, and the auxiliary blocks 13, the top base 12 and the auxiliary grooves 14 are used together, so that the water flow does not splash out of the device during the cleaning process of the materials.

[0029] The following will list several preferred embodiments or application embodiments to help the person skilled in the art better understand the technical content of the utility model and the technical contribution of the utility model compared with the prior art:

[0030] Embodiment 1

[0031] A semiconductor component cleaning device based on online monitoring technology, comprising a main body 1, the bottom of the main body 1 is provided with an installation groove 2, and the center of the bottom inner wall of the installation groove 2 is provided with a motor 3 by means of bolts, the output end of the motor 3 is provided with a rotating rod 4 through a shaft coupling, and the top end of the rotating rod 4 is provided with a stirring plate 5 by means of bolts, the top inner wall of the installation groove 2 is provided with a rotating groove 6, and the inside of the rotating groove 6 is provided with a stirring ring 7 through a sealing bearing, the outer wall of the rotating rod 4 is provided with a gear 8 by means of bolts, and the bottom outer wall of the stirring ring 7 is provided with a gear ring 9 by means of bolts, when the motor 3 is started, the motor 3 can drive the rotating rod 4 and the gear 8 to rotate, the gear 8 drives the stirring ring 7 to stir the water flow by means of the mutual engagement between the gear 8 and the gear ring 9 during the rotating process, and the stirring plate 5 can perfect the cleaning function of the semiconductor components.

[0032] The top end of the rotating rod 4 extends to the inside of the main body 1, and the stirring plate 5 is arranged in the inside of the main body 1, the gear 8 and the gear ring 9 are in mesh with each other, in the process of rotating the rotating rod 4, the rotating rod 4 can drive the stirring plate 5 to stir the water flow in the inside of the main body 1, and the meshing of the gear 8 and the gear ring 9 can provide power transmission for the rotation of the stirring ring 7; a plurality of electric cylinders 10 are arranged on the both sides of the top outer wall of the main body 1 through bolts, and the output end of the plurality of electric cylinders 10 is arranged with a top plate 11 through a bolt, when the plurality of electric cylinders 10 are started, the plurality of electric cylinders 10 will drive the top plate 11 to move, so that the top plate 11 can be lifted; a top seat 12 is arranged on the bottom outer wall center of the top plate 11 through a bolt, and auxiliary blocks 13 are arranged on the both sides of the outer wall of the top seat 12 through bolts, the top plate 11 will drive the top seat 12 and the auxiliary blocks 13 to move in the process of lifting; auxiliary grooves 14 are arranged on the both sides of the inner wall of the main body 1, and the auxiliary blocks 13 correspond to the auxiliary grooves 14, when the top seat 12 is lowered, the auxiliary blocks 13 will be inserted into the inside of the auxiliary grooves 14, so that the water flow will not splash out of the inside of the device in the process of cleaning the materials; support frames 15 are arranged on the four corners of the bottom outer wall of the top seat 12 through bolts, and a placing plate 16 is arranged on the adjacent side of the bottom of the support frame 15, heating plates 17 are arranged on the other two sides of the top inner wall of the main body 1 through bolts, the arrangement of the support frame 15 limits the installation of the placing plate 16, so that the placing plate 16 can only be arranged between the support frames 15, and the heating plates 17 can heat and dry the cleaned semiconductor components.

[0033] Working principle: in use, first, the materials are placed on the top outer wall of the placing plate 16, at this time, the plurality of electric cylinders 10 are started, the plurality of electric cylinders 10 will drive the top plate 11 to move, in the process of moving the top plate 11, the top plate 11 can drive the top seat 12 and the auxiliary blocks 13 to move, the top seat 12 can drive the support frame 15 to move, and in the process of continuous movement of the top plate 11, the auxiliary blocks 13 will be inserted into the inside of the auxiliary grooves 14 and contact the water flow, at this time, the motor 3 is started, the motor 3 can drive the rotating rod 4 to rotate, in the process of rotating the rotating rod 4, the rotating rod 4 will drive the stirring plate 5 at the top end to stir the water flow, and in the process of rotating the rotating rod 4, the rotating rod 4 will utilize the meshing of the gear 8 and the gear ring 9, so that the gear ring 9 can drive the stirring ring 7 to stir the water flow in the opposite direction, which improves the cleaning effect of the materials, finally, the plurality of electric cylinders 10 are started and drive the placing plate 16 to move between the heating plates 17, then the heating plates 17 are started, the heating plates 17 can dry the materials. The above is only a preferred specific implementation manner of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A semiconductor component cleaning apparatus based on an online monitoring technique, comprising a main body (1), characterized in that, The bottom of the main body (1) is provided with a mounting groove (2), and the bottom inner wall center of the mounting groove (2) is provided with a motor (3) through bolt mounting, the output end of the motor (3) is provided with a rotating rod (4) through shaft coupling, and the top end of the rotating rod (4) is provided with a stirring plate (5) through bolt mounting, the top inner wall of the mounting groove (2) is provided with a rotating groove (6), and the inside of the rotating groove (6) is provided with a stirring ring (7) through sealing bearing, the outer wall of the rotating rod (4) is provided with a gear (8) through bolt mounting, and the bottom outer wall of the stirring ring (7) is provided with a gear ring (9) through bolt mounting.

2. The semiconductor component cleaning apparatus based on an online monitoring technique according to claim 1, characterized by, The top end of the rotating rod (4) extends to the inside of the main body (1), and the stirring plate (5) is arranged in the inside of the main body (1), the gear (8) and the gear ring (9) are engaged with each other.

3. The semiconductor component cleaning apparatus based on an online monitoring technique according to claim 1, characterized by, The top outer wall of the main body (1) is provided with a plurality of electric cylinders (10) on both sides through bolt mounting, and the output end of the electric cylinder (10) is provided with a top plate (11) through bolt mounting.

4. The semiconductor component cleaning apparatus based on an online monitoring technique according to claim 3, characterized by, The bottom outer wall center of the top plate (11) is provided with a top seat (12) through bolt mounting, and the outer wall on both sides of the top seat (12) is provided with an auxiliary block (13) through bolt mounting.

5. The semiconductor component cleaning apparatus based on an online monitoring technique according to claim 1, characterized by, The inner wall on both sides of the main body (1) is provided with an auxiliary groove (14), and the auxiliary block (13) corresponds to the auxiliary groove (14).

6. The semiconductor component cleaning apparatus based on an online monitoring technique according to claim 4, wherein The bottom outer wall of the top seat (12) is provided with a support frame (15) through bolt mounting at four corners, and the bottom adjacent side of the support frame (15) is provided with a placing plate (16), and the top inner wall on the other two sides of the main body (1) is provided with a heating plate (17) through bolt mounting.

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