Semiconductor lead frame single-particle module cutting device

Abstract

The utility model provides a semiconductor lead frame single-particle module cutting device which comprises an upper die assembly used for pre-positioning and pressing a semiconductor lead frame placed below the upper die assembly; the lower die assembly is used for placing a semiconductor lead frame to be cut; the guide assembly is used for ensuring that the upper die assembly and the lower die assembly are accurately aligned; the air cylinder is connected to the upper die assembly and drives the cutting tool bit to conduct cutting action. And the material receiving box is positioned below the lower die assembly and is used for collecting the cut single-grain modules. The automatic cutting mode is adopted, the problems that in the traditional manual cutting process, frame deformation and adjacent module damage are likely to occur are effectively solved, and the cutting precision and consistency are greatly improved through the pre-positioning and pressing functions of the upper die assembly and the arrangement of the guide assembly.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor lead frame cutting, particularly to a semiconductor lead frame single particle module cutting device. BACKGROUND

[0002] In the field of semiconductor manufacturing, semiconductor lead frame as the key component of chip packaging, in the batch generation, the operator often needs to adopt manual operation to cut and separate the single particle module and then test. However, this manual cutting method has many disadvantages. On the one hand, due to the artificial operation, it is difficult to guarantee the consistency of cutting force and path each time, which easily leads to the deformation of the frame, so that the frame cannot be accurately adapted to the subsequent packaging process, and the scrap rate is increased. On the other hand, the adjacent modules are easily damaged by misoperation in the manual cutting process. Once the adjacent module is damaged, not only the module is scrapped, but also the quality of the surrounding modules may be affected, further reducing the production efficiency and product qualification rate. Moreover, with the development of semiconductor industry towards high precision and large scale, the traditional manual cutting method is low in efficiency and cannot meet the increasing production demand, and it is urgent to replace the traditional manual operation with a high-precision and automatic cutting device. SUMMARY

[0003] In view of the above-mentioned defects of the prior art, the purpose of the utility model is to provide a semiconductor lead frame single particle module cutting device, which solves the problem of manual cutting and separation in the prior art, leading to the deformation of the frame and the damage of the adjacent modules.

[0004] To achieve the above-mentioned purpose and other related purposes, the utility model provides the following technical scheme:

[0005] The semiconductor lead frame single particle module cutting device comprises an upper die assembly for pre-positioning and compressing the semiconductor lead frame placed below; a lower die assembly for placing the semiconductor lead frame to be cut; a guide assembly for ensuring the accurate alignment of the upper die assembly and the lower die assembly; a gas cylinder connected to the upper die assembly and driving the cutting tool bit to perform cutting action; and a material receiving box located below the lower die assembly for collecting the single particle modules cut down.

[0006] The technical scheme is realized as follows: first, the operator places the semiconductor lead frame to be cut on the lower die assembly, then the upper die assembly is driven to descend by the air cylinder, and the semiconductor lead frame placed below is positioned and compressed, while the cutting tool head connected to the air cylinder is driven to move downward, thus completing a precise cutting, the guiding assembly ensures that the upper die assembly and the lower die assembly are accurately aligned, so that the cutting tool head can accurately cut along the predetermined path, and after cutting, the single particle module automatically falls into the receiving box below the lower die assembly, waiting for further processing or testing; the automatic cutting mode adopted by the utility model effectively avoids the problems of frame deformation and damage to adjacent modules in the traditional manual cutting process, and the positioning and compression functions of the upper die assembly and the setting of the guiding assembly greatly improve the cutting precision and consistency.

[0007] In an embodiment of the utility model, the upper die assembly comprises an upper die plate and a positioning assembly arranged on the upper die plate.

[0008] The technical scheme is realized as follows: the positioning assembly is used to preliminarily position the semiconductor lead frame, so that the position of the frame relative to the cutting tool head is accurate, after the preliminary positioning, the upper die plate continues to move downward to apply appropriate compression force to the frame to fix the frame and prevent it from shifting during cutting.

[0009] In an embodiment of the utility model, the positioning assembly comprises a positioning plate below the upper die plate and a positioning pin passing through the upper die plate and connected to the positioning plate at the lower end.

[0010] The technical scheme is realized as follows: the positioning plate is below the upper die plate, and a compression spring can be sleeved on the positioning pin, when the positioning plate first contacts the frame, the compression spring starts to compress, which allows the positioning plate to have a certain buffering effect when contacting the frame, reduces the impact force on the frame and prevents damage, after the preliminary positioning, the upper die plate further applies pressure to compress the frame by the positioning plate, so that the frame remains stable during the entire cutting process.

[0011] In an embodiment of the utility model, the lower die assembly comprises a lower die plate, a hollow mounting seat at the lower end of the lower die plate, and a supporting plate symmetrically arranged on both sides of the lower die plate.

[0012] The technical scheme is realized as follows: the symmetrically arranged supporting plates can adapt to frames of different sizes, the hollow mounting seat not only provides a solid support for the lower die plate, but also has a material falling hole on the lower die plate for falling the single particle module cut down into the receiving box.

[0013] In one embodiment of the present invention, the guide assembly includes a guide sleeve disposed on the mounting base and a guide post having one end connected to the upper template and the other end passing through the guide sleeve.

[0014] The above technical solution is achieved by designing guide pillars and guide sleeves to ensure precise alignment between the upper and lower mold components, avoiding cutting errors caused by misalignment and greatly improving cutting accuracy and consistency.

[0015] In one embodiment of the present invention, the piston rod of the cylinder is provided with a mounting block for connecting the upper template; the lower end of the mounting block is provided with a cutting head that passes through the upper template and the prepositioning plate.

[0016] To achieve the above technical solution, when the cylinder drives the piston rod to move downward, the mounting block moves accordingly, causing the cutting head to pass through the upper template and the pre-positioning plate, and directly act on the semiconductor lead frame to perform precise cutting.

[0017] In one embodiment of this utility model, both the receiving box and the lower mold assembly are mounted on a base plate, and the lower end of the base plate is provided with several feet.

[0018] To achieve the above technical solution, the base plate serves as the basic structure of the entire device, ensuring its stability. The design of the feet allows for height adjustment based on ground conditions, ensuring that the entire device remains level at all times. This reduces equipment swaying or tilting caused by uneven ground, thereby improving the stability of the cutting process.

[0019] In one embodiment of this utility model, the base plate is provided with a support for mounting the cylinder. By achieving the above technical solution, the support design allows the cylinder to be securely mounted on the base plate, reducing vibration or displacement caused by cylinder movement, thereby improving the overall stability of the cutting process.

[0020] As described above, the semiconductor lead frame single-module cutting device of this utility model has the following beneficial effects: The semiconductor lead frame single-module cutting device of this application adopts a guiding component. Through the cooperation of guide posts and guide sleeves, it ensures that the upper mold component and the lower mold component are precisely aligned. The cutting head can strictly cut according to the predetermined path, effectively avoiding cutting errors and greatly improving cutting accuracy. This results in precise dimensions of the cut single module, meeting the requirements of high-precision semiconductor packaging. The device adopts an automated cutting method. The operator only needs to place the semiconductor lead frame to be cut, and subsequent cutting, collection and other processes are completed automatically. Compared with traditional manual cutting, it greatly shortens the cutting time of single modules and significantly improves production efficiency. Attached Figure Description

[0021] Fig. 1 The diagram shown is a structural schematic of this utility model.

[0022] Fig. 2 Another structural schematic view of the present application is shown.

[0023] Element number explanation

[0024] 1, cylinder; 2, cutting head; 3, receiving box; 4, upper die plate; 5, pre-positioning plate; 6, positioning pin; 7, lower die plate; 8, mounting seat; 9, supporting plate; 10, guide sleeve; 11, guide column; 12, mounting block; 13, bottom plate; 14, footing; 15, support. DETAILED DESCRIPTION

[0025] The implementation of the present application will be described by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0026] Please refer to Figs. 1-2 The present application provides a semiconductor lead frame single particle module cutting device, comprising: an upper die assembly for pre-positioning and compressing the semiconductor lead frame placed below; a lower die assembly for placing the semiconductor lead frame to be cut; a guide assembly for ensuring the accurate alignment of the upper die assembly and the lower die assembly; a cylinder 1 connected to the upper die assembly and driving the cutting head 2 to perform cutting action; a receiving box 3 located below the lower die assembly for collecting the single particle modules cut down.

[0027] During operation, first, the operator places the semiconductor lead frame to be cut on the lower die assembly, then the upper die assembly is driven by the cylinder 1 to perform a descending action, pre-positioning and compressing the semiconductor lead frame placed below, while the cutting head 2 connected to the cylinder 1 is driven to move downward, completing a precise cutting, and the guide assembly ensures the accurate alignment of the upper die assembly and the lower die assembly, so that the cutting head 2 can accurately cut according to the predetermined path, after cutting, the single particle module will automatically fall into the receiving box 3 located below the lower die assembly, waiting for further processing or testing; the present application adopts an automatic cutting mode, effectively avoiding the problems of frame deformation and adjacent module damage that are prone to occur in the traditional manual cutting process, and through the pre-positioning and compression function of the upper die assembly and the setting of the guide assembly, the cutting precision and consistency are greatly improved.

[0028] The upper die assembly includes an upper die plate 4, and a pre-positioning assembly arranged on the upper die plate 4. The pre-positioning assembly preliminarily positions the semiconductor lead frame, ensuring the accuracy of the position of the frame relative to the cutting knife head 2. After the pre-positioning is completed, the upper die plate 4 continues to move downward, applying appropriate pressing force to the frame to fix the frame and prevent it from shifting during the cutting process.

[0029] The pre-positioning assembly includes a pre-positioning plate 5 located below the upper die plate 4, and a positioning pin 6 penetrating the upper die plate 4 and connected to the pre-positioning plate 5 at the lower end. The pre-positioning plate 5 is located below the upper die plate 4, and a compression spring can be sleeved on the positioning pin 6. When the pre-positioning plate 5 first contacts the frame, the compression spring begins to compress, which allows the pre-positioning plate 5 to have a certain buffering effect when contacting the frame, reducing the impact force on the frame and preventing damage. After the pre-positioning is completed, the upper die plate 4 further applies pressure to the frame through the pre-positioning plate 5, ensuring that the frame remains stable during the entire cutting process.

[0030] The lower die assembly includes a lower die plate 7, a hollow mounting seat 8 located at the lower end of the lower die plate 7, and a supporting plate 9 symmetrically arranged on both sides of the lower die plate 7. The design of the symmetrically arranged supporting plates 9 can adapt to different sizes of frames. The hollow mounting seat 8 not only provides a solid support foundation for the lower die plate 7, but also has a material falling hole on the lower die plate 7 for dropping the cut single module into the material receiving box 3.

[0031] The guide assembly includes a guide sleeve 10 arranged on the mounting seat 8, and a guide column 11 connected to the upper die plate 4 at one end and penetrating the guide sleeve 10 at the other end. The design of the guide column 11 and the guide sleeve 10 ensures the accurate alignment between the upper and lower die assemblies, avoiding cutting errors caused by misalignment and greatly improving cutting accuracy and consistency.

[0032] The piston rod of the air cylinder 1 is provided with a mounting block 12 for connecting the upper die plate 4; the lower end of the mounting block 12 is provided with a cutting knife head 2 penetrating the upper die plate 4 and the pre-positioning plate 5. When the piston rod is driven by the air cylinder 1 to move downward, the mounting block 12 moves with it, driving the cutting knife head 2 to penetrate the upper die plate 4 and the pre-positioning plate 5, directly acting on the semiconductor lead frame to perform precise cutting.

[0033] The material receiving box 3 and the lower die assembly are arranged on the bottom plate 13, and the lower end of the bottom plate 13 is provided with a plurality of footings 14. The bottom plate 13 serves as the basic structure of the entire device, ensuring stability. The design of the footings 14 can adjust the height according to the ground conditions, so that the entire device always remains horizontal, reducing the shaking or tilting of the equipment caused by uneven ground, thereby improving the stability of the cutting process.

[0034] The bottom plate 13 is provided with a support 15 for mounting the air cylinder 1.

[0035] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not intended to limit the present application. Any equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed by the present application shall still be covered by the claims of the present application.

Claims

1. A semiconductor leadframe single die module singulation apparatus, characterized by, The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device.

2. The semiconductor leadframe die singulation apparatus of claim 1, wherein: The application relates to a semiconductor lead frame cutting device.

3. The semiconductor leadframe die singulation apparatus of claim 2, wherein: The application relates to a semiconductor lead frame cutting device.

4. The semiconductor leadframe die singulation apparatus of claim 3, wherein: The application relates to a semiconductor lead frame cutting device.

5. The semiconductor leadframe die singulation apparatus of claim 4, wherein: The application relates to a semiconductor lead frame cutting device.

6. The semiconductor leadframe die singulation apparatus of claim 3, wherein: The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device.

7. The semiconductor leadframe die singulation apparatus of claim 1, wherein: The application relates to a semiconductor lead frame cutting device.

8. The semiconductor leadframe die singulation apparatus of claim 7, wherein: The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application relates to a semiconductor lead frame cutting device. The application

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