Compact laser mold opening machine

Abstract

The utility model discloses a compact laser mold opening machine which comprises a laser module used for providing two groups of laser beams with energy difference, and the two groups of laser beams are respectively used for different processing procedures of workpieces; the adsorption jig is used for adsorbing and fixing the workpiece, the adsorption jig is provided with a first moving module, and the first moving module can drive the adsorption jig to move in the horizontal direction and the longitudinal direction so that the workpiece on the adsorption jig can enter the machining range of the laser beams and can be located in the focal length range of the laser beams. Two groups of laser beams are used for processing different procedures in turn, so that the processing efficiency is effectively improved, and the equipment cost is reduced. Due to the fact that the focal lengths of the laser beams with different energies are different, according to the laser mold opening machine, the adsorption jig is arranged on the first moving module, the position of the adsorption jig is adjusted through the first moving module according to the focal lengths of the laser beams, a workpiece can be moved to the accurate machining position, and the machining precision of products is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser instrument technical field, especially in a compact laser die opening machine. BACKGROUND

[0002] In order to improve the conversion efficiency of battery piece, the contact resistance between silicon wafer and electrode needs to be reduced, and the ohmic contact between silicon wafer and electrode needs to be increased. The current common practice is to carry out high concentration doping on the contact position of silicon wafer and electrode, and after high concentration doping, the silicon wafer needs to be laser grooving.

[0003] But in the prior art, the existing die opening machine only uses a group of light paths to open the die, which leads to poor die opening effect, because part of the coating material on the silicon wafer, such as BSG material, needs a laser with high power to remove, and the die opening machine with a single group of light paths can only remove the BSG material by stacking the power of the laser, and after adding multiple laser modules to the die opening machine, the structure of the whole machine is complex and occupies more space, and the cost of the equipment is also high. But after setting multiple laser modules on the equipment, the requirements of different processes for laser energy are different, and the focal lengths of laser beams with different energies also differ, however, in the prior art, the jig of the die opening machine is fixed relative to the light emitting position of the laser after loading the workpiece and completing the positioning of the workpiece in the first process, and the light emitting position of the workpiece relative to the laser is not adjusted due to the change of laser energy in the subsequent process, which leads to low precision of the silicon wafer in processing and low product quality. Therefore, the present application proposes a technical solution to solve the above problems. SUMMARY

[0004] The utility model at least solves one of the technical problems existing in the prior art. Therefore, the utility model provides a compact laser die opening machine, which uses two groups of laser beams with different energies to process different processes of the workpiece, effectively improves the processing efficiency, and reduces the cost of the equipment. Further, since the focal lengths of laser beams with different energies differ, the laser die opening machine of the present application sets the adsorption jig on the first moving module, adjusts the position of the adsorption jig according to the focal length of the laser beam by using the first moving module, so that the workpiece can be moved to the accurate processing position, and the processing precision of the product is ensured.

[0005] According to the compact laser die opening machine of the utility model embodiment, which comprises:

[0006] The laser module is used to provide two groups of laser beams with energy difference, and the two groups of laser beams are used for different processing processes of the workpiece.

[0007] The adsorption jig is used for adsorbing and fixing a workpiece, and is provided with a first moving module.

[0008] The compact laser mold opening machine has at least the following beneficial effects: the laser module can output two groups of laser beams with energy differences, one group is used for a doping process of boron elements and workpiece surface materials, and the other group is used for a slotting process of the workpiece surface, the laser module can output two groups of laser beams with energy differences, the device can output adaptive laser beams according to processing requirements and processing procedures, so that the diversification of device processing is realized, and the device does not need to be provided with multiple laser output devices, one laser output device is used in cooperation with multiple laser light sources, the cost of the device is reduced, and the production efficiency is effectively improved.

[0009] The compact laser mold opening machine has at least the following beneficial effects: the laser module can output two groups of laser beams with energy differences, one group is used for a doping process of boron elements and workpiece surface materials, and the other group is used for a slotting process of the workpiece surface, the laser module can output two groups of laser beams with energy differences, the device can output adaptive laser beams according to processing requirements and processing procedures, so that the diversification of device processing is realized, and the device does not need to be provided with multiple laser output devices, one laser output device is used in cooperation with multiple laser light sources, the cost of the device is reduced, and the production efficiency is effectively improved.

[0010] The compact laser mold opening machine has at least the following beneficial effects: the laser module can output two groups of laser beams with energy differences, one group is used for a doping process of boron elements and workpiece surface materials, and the other group is used for a slotting process of the workpiece surface, the laser module can output two groups of laser beams with energy differences, the device can output adaptive laser beams according to processing requirements and processing procedures, so that the diversification of device processing is realized, and the device does not need to be provided with multiple laser output devices, one laser output device is used in cooperation with multiple laser light sources, the cost of the device is reduced, and the production efficiency is effectively improved.

[0011] The compact laser mold opening machine has at least the following beneficial effects: the laser module can output two groups of laser beams with energy differences, one group is used for a doping process of boron elements and workpiece surface materials, and the other group is used for a slotting process of the workpiece surface, the laser module can output two groups of laser beams with energy differences, the device can output adaptive laser beams according to processing requirements and processing procedures, so that the diversification of device processing is realized, and the device does not need to be provided with multiple laser output devices, one laser output device is used in cooperation with multiple laser light sources, the cost of the device is reduced, and the production efficiency is effectively improved.

[0012] According to the compact laser mold opening machine, the Y-axis moving device comprises a first base and a first drive installed on the first base, the first lifting device is connected with the output end of the first drive through a transmission component, and the first drive drives the first lifting device to move along the Y-axis direction.

[0013] According to the compact laser mold opening machine, the adsorption jig comprises an adsorption base with a cavity and an adsorption power device, the adsorption base is provided with an adsorption hole communicating with the cavity, the adsorption power device is connected with the cavity, and the adsorption power device is used to generate negative pressure adsorption force in the cavity to fix the workpiece on the adsorption base.

[0014] According to the compact laser mold opening machine, the laser module comprises a first light source, a second light source and a laser output device, a light path switching device is arranged between the first light source, the second light source and the laser output device, the light path switching device is used to switch the connection of the first light source, the second light source and the laser output device, the laser beams output by the first light source and the second light source can pass through the laser output device to process the product, and the laser beams output by the first light source and the second light source have energy difference.

[0015] According to the compact laser mold opening machine, the first light source and the laser output device have a light propagation line, the light beam of the first light source processes the product through the light propagation line and the laser output device, the light path switching device can be on the light propagation line, and the light path switching device is used to make the light beam of the second light source process the product through the light propagation line and the laser output device.

[0016] According to the compact laser mold opening machine, the light path switching device comprises a movable first reflecting piece, when the first reflecting piece moves to the light propagation line, the first reflecting piece conducts the light beam of the second light source to the laser output device.

[0017] According to the compact laser mold opening machine, the visual positioning device is arranged above the adsorption jig, and the visual positioning device is used to provide positioning information for the processing of the workpiece.

[0018] The additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 It is a structure diagram of the compact laser mold opening machine according to the embodiment of the present application.

[0021] Figure 2 A structure diagram of the laser module of the embodiment of the present application;

[0022] Figure 3 A structure diagram of the adsorption jig of the embodiment of the present application;

[0023] Figure 4 A sectional view of a partial structure of the adsorption jig of the embodiment of the present application.

[0024] Explanation of reference signs:

[0025] Workpiece 1;

[0026] Adsorption jig 100; adsorption base 110; adsorption hole 111;

[0027] X-axis moving device 200;

[0028] Y-axis moving device 300; first base 310; first drive 320;

[0029] First lifting device 400;

[0030] Laser module 500; first light source 510; second light source 520; laser output device 530; light path switching device 540; first reflecting piece 541; second reflecting piece 542;

[0031] Visual positioning device 600;

[0032] Second moving module 700. DETAILED DESCRIPTION

[0033] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0034] In the description of the present application, it should be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by the upper, lower, front, rear, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application.

[0035] In the description of the utility model, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number.If there is a description to the first, second is only used for distinguishing technical features for the purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0036] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installation, connection should be broadly understood, and the person skilled in the art can determine the specific meaning of the above words in the utility model in combination with the specific content of the technical scheme.

[0037] Referring to Figures 1 to 4 The utility model embodiment provides a compact laser mold opening machine, including laser module 500 for providing two groups of output laser beams with energy difference, two groups of laser beams are used for different processing procedures of workpiece respectively;Suction fixture 100 is used for suction fixing workpiece, and suction fixture 100 is provided with first mobile module, and first mobile module can drive suction fixture 100 to move in horizontal direction and longitudinal direction, to make workpiece on suction fixture 100 enter the processing range of laser beam and make workpiece be in the focal length range of laser beam.

[0038] The laser mold opening machine of the application is mainly applied to the grooving processing of silicon wafer.

[0039] The laser module 500 of the laser mold opening machine of the application can output two groups of laser beams with energy difference, one group is used for the doping procedure of boron element and workpiece surface material, and the other group is used for the grooving procedure of workpiece surface, by setting the laser module 500 that can output two kinds of energy laser beams on the same machine, the device can output the adaptive laser beam corresponding to the processing requirement and processing procedure, to realize the diversification of device processing, and the device does not need to be provided with multiple laser output devices 530, by using one laser output device 530 in cooperation with multiple laser light sources, the cost of the device is reduced, and the production efficiency is effectively improved. But because the focal length of laser beams with different energy has difference when output to the processing position of workpiece, the suction fixture 100 of the application is provided with first mobile module, first, the first mobile mold can first move suction fixture 100 to the processing range of laser beam, then according to the interval of laser beam, under the program instruction of device system, suction fixture 100 is lifted or lowered to the focal length of laser beam, so that the processing position of workpiece can be accurately processed by laser beam, and the processing precision of workpiece is ensured. The overall structure of the device is compact, the product processing efficiency is high, and the product processing precision is high.

[0040] According to some embodiments of the present application, the present application provides a first embodiment of a first mobile module. Specifically, the first mobile module comprises a first lifting device 400, and the suction jig 100 is connected to the first lifting device 400, and the first lifting device 400 drives the suction jig 100 into the light beam focusing range of the laser module 500.

[0041] Further, the first mobile module further comprises an X-axis moving device 200, and the suction jig 100 is connected to the first lifting device 400, and the first lifting device 400 is arranged on the X-axis moving device 200, and the X-axis moving device 200 drives the suction jig 100 to move into the processing range of the laser light beam, and the first lifting device 400 drives the suction jig 100 into the light beam focusing range of the laser module 500.

[0042] Optionally, the first lifting device 400 can be a pneumatic cylinder.

[0043] Alternatively, the first lifting device 400 can also be a screw drive to realize the position adjustment of the suction jig 100 in the longitudinal direction.

[0044] The present application provides a second embodiment of the first mobile module. Specifically, the first mobile module comprises a first lifting device 400, an X-axis moving device 200 and a Y-axis moving device 300, and the suction jig 100 is connected to the first lifting device 400, and the first lifting device 400 is arranged on the Y-axis moving device 300, and the Y-axis moving device 300 is arranged on the X-axis moving device 200, and the X-axis moving device 200 and the Y-axis moving device 300 are connected to drive the suction jig 100 to move into the processing range of the laser light beam, and the first lifting device 400 drives the suction jig 100 into the light beam focusing range of the laser module 500.

[0045] Specifically, as shown in the figure, the Y-axis moving device 300 comprises a first base 310 and a first drive 320 mounted on the first base 310, and the first lifting device 400 is connected to the output end of the first drive 320 through a transmission component, and the first drive 320 drives the first lifting device 400 to move along the Y-axis direction. Wherein, in actual application, the transmission component needs to be selected according to the type of the first drive 320. The present application preferably selects the first drive 320 as a motor, and the transmission component as a screw drive assembly, and the screw drive can ensure more accurate position adjustment of the workpiece, which helps to ensure the machining precision of the product.

[0046] Optionally, the X-axis moving device 200 comprises a second base and a second drive, the second drive is mounted on the second base, the first base 310 is connected to the second base, and the second drive is connected to the first base 310 through a transmission component. Specifically, the transmission component can be a screw drive assembly, and the screw drive can ensure more accurate position adjustment of the workpiece, which helps to ensure the machining precision of the product.

[0047] By adjusting the position in the horizontal direction and the longitudinal direction, the workpiece of the adsorption fixture 100 can be moved to the accurate machining position, ensuring the machining precision of the workpiece.

[0048] It should be noted that the adjustment of the machining position of the workpiece needs to be determined according to the type of the laser beam corresponding to the current process.

[0049] According to some embodiments of the present application, as Figure 4 shown, the adsorption fixture 100 of the present application includes an adsorption base 110 with a cavity and an adsorption power device (not shown in the figure), the adsorption base 110 is provided with an adsorption hole 111 communicating with the cavity, the cavity communicates with the outside through the adsorption hole 111, and the adsorption power device (not shown in the figure) is connected with the cavity. The adsorption power device (not shown in the figure) is used to generate negative pressure adsorption force in the cavity to fix the workpiece on the adsorption base 110. When the workpiece is placed on the adsorption base 110 and covers the adsorption hole 111, the adsorption power device (not shown in the figure) is started and the air in the cavity of the adsorption base 110 is discharged, so that the cavity of the adsorption base 110 is in a negative pressure state, thereby the workpiece is firmly adsorbed and fixed on the adsorption base 110. By the adsorption fixing mode, the surface of the workpiece can be prevented from being scratched, and the quality of the product can be ensured.

[0050] It should be noted that the adsorption force generated by the adsorption fixture 100 on the workpiece is adjustable, and the user can control the adjustment of the adsorption force size by adjusting the parameters of the adsorption power device (not shown in the figure).

[0051] According to some embodiments of the present application, as Figure 2 shown, the laser module 500 includes a first light source 510, a second light source 520 and a laser output device 530, and a light path switching device 540 is arranged between the first light source 510, the second light source 520 and the laser output device 530. The light path switching device 540 is used to switch the connection of the first light source 510, the second light source 520 and the laser output device 530. The laser beams output by the first light source 510 and the second light source 520 can both pass through the laser output device 530 to process the product, and the laser beams output by the first light source 510 and the second light source 520 have energy difference.

[0052] Specifically, there is a light propagation line between the first light source 510 and the laser output device 530. The light beam of the first light source 510 processes the product after passing through the light propagation line and the laser output device 530. The light path switching device 540 can be on the light propagation line. The light path switching device 540 is used to make the light beam of the second light source 520 process the product after passing through the light propagation line and the laser output device 530.

[0053] Further, the light path switching device 540 comprises a movable first reflecting piece 541, when the first reflecting piece 541 moves to the light propagation line, the first reflecting piece 541 conducts the light beam of the second light source 520 to the laser output device 530.

[0054] It can be understood that when the user needs to switch the first light source 510 to the second light source 520, the first reflecting piece 541 moves to the light propagation line, at this time, the light beam of the first light source 510 can be blocked and intercepted by the first reflecting piece 541, and the light beam of the first light source 510 cannot enter the laser output device 530 at this time, while the light beam of the second light source 520 is refracted into the laser output device 530 from the reflecting surface of the first reflecting piece 541, and then output to the machining position of the workpiece. Conversely, when the user needs to switch the second light source 520 to the first light source 510, only needs to move the first reflecting piece 541 out of the light propagation line, at this time, the light beam of the first light source 510 is no longer blocked and intercepted by the first reflecting piece 541, and can directly enter the laser output device 530, thereby being output to the machining position of the workpiece. At this time, the light beam of the second light source 520 can be refracted to other places that do not interfere with the current process of the workpiece, or the second light source 520 can be directly turned off until it is needed to start again. The present application switches the two light beams of different energy by using the light path switching device 540, so that one laser output device 530 can output two types of laser beams, effectively reducing the overall volume of the equipment, making the structure of the equipment more compact, and effectively reducing the overall cost of the equipment.

[0055] Further, as a preferred scheme, the first reflecting piece 541 is rotatable, and the refractive angle of the first reflecting piece 541 is rotated to ensure that the light beam of the second light source 520 can smoothly enter the laser output device 530.

[0056] Further, as a preferred scheme, in order to further improve the compactness of the equipment and reduce the overall volume of the equipment, the box body of the light path switching device 540 is an L-shaped box body, and the first light source 510 and the second light source 520 are respectively arranged at the two ends of the L-shaped box body. In order to ensure that the light beam of the first light source 510 can accurately enter the laser output device 530, a second reflecting piece 542 is further arranged to refract the light beam of the first light source 510. Preferably, the second reflecting piece 542 is rotatable, and the refractive angle of the second reflecting piece 542 is rotated to ensure that the light beam of the first light source 510 can smoothly enter the laser output device 530.

[0057] According to some embodiments of the present application, as shown in Figure 1 According to some embodiments of the present application, as shown in

[0058] Further, as a preferred solution, the laser mold opening machine is further provided with a second moving module 700, the visual positioning device 600 is installed on the second moving module 700, and the visual positioning device 600 is driven by the second moving module 700 to adjust the position of the visual positioning device 600 relative to the adsorption jig 100, so as to ensure the machining precision of the workpiece.

[0059] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0060] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A compact laser die cutter characterized by, The application relates to a laser module (500) for providing two groups of laser beams with energy difference, the two groups of laser beams being used for different machining procedures of a workpiece; and an adsorption jig (100) for adsorbing and fixing the workpiece, wherein the adsorption jig (100) is provided with a first moving module, the first moving module can drive the adsorption jig (100) to move in a horizontal direction and a vertical direction, so that the workpiece on the adsorption jig (100) enters a machining range of the laser beams and is located in a focal length range of the laser beams. The first moving module comprises a first lifting device (400), the adsorption jig (100) is connected with the first lifting device (400), and the first lifting device (400) drives the adsorption jig (100) to enter a light beam focusing range of the laser module (500). The first moving module comprises a first lifting device (400) and an X-axis moving device (200), the adsorption jig (100) is connected with the first lifting device (400), the first lifting device (400) is arranged on the X-axis moving device (200), the X-axis moving device (200) drives the adsorption jig (100) to move to the machining range of the laser beams, and the first lifting device (400) drives the adsorption jig (100) to enter the light beam focusing range of the laser module (500).

2. A compact laser die locker as claimed in claim 1, wherein, The first moving module comprises a first lifting device (400), an X-axis moving device (200) and a Y-axis moving device (300), the adsorption jig (100) is connected with the first lifting device (400), the first lifting device (400) is arranged on the Y-axis moving device (300), the Y-axis moving device (300) is arranged on the X-axis moving device (200), the X-axis moving device (200) and the Y-axis moving device (300) are connected and cooperated to drive the adsorption jig (100) to move to the machining range of the laser beams, and the first lifting device (400) drives the adsorption jig (100) to enter the light beam focusing range of the laser module (500).

3. A compact laser die locker as claimed in claim 2, wherein, The Y-axis moving device (300) comprises a first base (310) and a first drive (320) arranged on the first base (310), the first lifting device (400) is connected with an output end of the first drive (320) through a transmission component, and the first drive (320) drives the first lifting device (400) to move along the Y-axis direction.

4. A compact laser die locker as claimed in claim 2, wherein, The adsorption jig (100) comprises an adsorption base (110) with a cavity and an adsorption power device, the adsorption base (110) is provided with an adsorption hole (111) communicating with the cavity, the adsorption power device is connected with the cavity, and the adsorption power device is used for generating negative pressure adsorption force in the cavity to fix the workpiece on the adsorption base (110).

5. A compact laser die locker as claimed in claim 4, wherein, ​ 6. A compact laser mold unscrambler according to any one of claims 2 to 5, characterized in that, ​ 7. The compact laser die locker of claim 1, wherein, The laser module (500) comprises a first light source (510), a second light source (520) and a laser output device (530), an optical path switching device (540) is arranged between the first light source (510), the second light source (520) and the laser output device (530), the optical path switching device (540) is used for switching the connection of the first light source (510), the second light source (520) and the laser output device (530), the laser beams output by the first light source (510) and the second light source (520) can pass through the laser output device (530) to process products, and the laser beams output by the first light source (510) and the second light source (520) have energy difference.

8. A compact laser die locker as claimed in claim 7, wherein, The first light source (510) and the laser output device (530) have an optical propagation line, the light beam of the first light source (510) passes through the optical propagation line and the laser output device (530) to process products, and the optical path switching device (540) can be on the optical propagation line, the optical path switching device (540) is used for making the light beam of the second light source (520) pass through the optical propagation line and the laser output device (530) to process products.

9. A compact laser die locker as claimed in claim 8, wherein, The optical path switching device (540) comprises a movable first reflecting piece (541), when the first reflecting piece (541) moves to the optical propagation line, the first reflecting piece (541) conducts the light beam of the second light source (520) to the laser output device (530).

10. The compact laser die locker of claim 1, wherein, Further comprising a visual positioning device (600), the visual positioning device (600) is arranged above the adsorption jig (100), and the visual positioning device (600) is used for providing positioning information for processing of the workpiece.

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